JPH05183250A - Thick film circuit board and thick film circuit board device - Google Patents
Thick film circuit board and thick film circuit board deviceInfo
- Publication number
- JPH05183250A JPH05183250A JP3358494A JP35849491A JPH05183250A JP H05183250 A JPH05183250 A JP H05183250A JP 3358494 A JP3358494 A JP 3358494A JP 35849491 A JP35849491 A JP 35849491A JP H05183250 A JPH05183250 A JP H05183250A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- thick film
- film circuit
- electrode
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Coils Or Transformers For Communication (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】 （修正有）
【目的】 電気部品の端部側面に形成された電極と、厚
膜回路基板の接続部との電気的接続を良好にする。
【構成】 本発明の厚膜回路基板は、端部側面に電極部
７が形成された電気部品８に半田付けされる接続部４を
備える。絶縁性基板上１に離間して形成された一対の絶
縁体層と、絶縁体層11を各々被覆するように形成された
一対の導体層からなる接続部に半田付けされる電極部７
が形成される。絶縁性基板１の凹部を跨ぐように導体層
からなる接続部と、凹部内に収容され、導体層と平面的
に交差する一対の電極部を有する電気部品８とを備え
る。
(57) [Summary] (Modified) [Purpose] To improve the electrical connection between the electrode formed on the side surface of the end of the electric component and the connection portion of the thick film circuit board. [Structure] The thick film circuit board of the present invention includes a connection portion 4 to be soldered to an electric component 8 having an electrode portion 7 formed on a side surface of an end portion. An electrode portion 7 to be soldered to a connection portion composed of a pair of insulator layers formed on the insulating substrate 1 at a distance from each other and a pair of conductor layers formed so as to cover the insulator layer 11 respectively.
Is formed. The insulating substrate 1 is provided with a connecting portion formed of a conductor layer so as to straddle the recessed portion, and an electric component 8 housed in the recessed portion and having a pair of electrode portions that intersect the conductor layer in a plane.
Description
【０００１】［発明の目的］[Object of the Invention]
【０００２】[0002]
【産業上の利用分野】本発明は、例えばチップ形状の高
周波用チョークコイル等のチップ電気部品が実装された
厚膜回路基板装置およびチップ電気部品を実装するため
の厚膜回路基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film circuit board device on which a chip electric component such as a chip-shaped high frequency choke coil is mounted and a thick film circuit board for mounting the chip electric component.
【０００３】[0003]
【従来の技術】例えば高周波用チョークコイル等のチッ
プ電気部品は、供給される電気信号の損失や反射の増大
を防止するため、その部品の入出力端子となる電極は、
部品の両端部側面に形成されている。2. Description of the Related Art In a chip electric component such as a high frequency choke coil, an electrode serving as an input / output terminal of the component is provided in order to prevent loss or reflection of an electric signal supplied.
It is formed on the side surfaces of both ends of the component.
【０００４】つまり、チップ電気部品内における信号電
送路と入出力部となる電極部との間で、その信号経路が
大きく折曲すると、特に高周波信号の損失が顕著となる
ために、部品の端部側面に電極が直接形成されている。That is, if the signal path is greatly bent between the signal transmission path and the electrode section serving as the input / output section in the chip electric component, the loss of high-frequency signals becomes particularly remarkable, and therefore, the end of the component. An electrode is directly formed on the side surface of the part.
【０００５】しかしながら、この種のチップ電気部品を
回路基板に実装する場合には、例えば図５に図示するよ
うに、表面実装用のチップコンデンサやチップ抵抗体の
如き下面電極を有する電気部品と同様、その部品の端面
が回路基板側の半田が被着されたランド等の接続部上に
位置するように実装し、リフローすることによって、チ
ップ電気部品と回路基板との電気的接続を行っていた。However, when this type of chip electric component is mounted on a circuit board, it is similar to an electric component having a lower surface electrode such as a chip capacitor for surface mounting or a chip resistor as shown in FIG. 5, for example. The chip electrical components were electrically connected to the circuit board by mounting the components so that the end surfaces of the components were located on the connection parts such as lands on the circuit board side to which the solder was applied and by reflowing. .
【０００６】[0006]
【発明が解決しようとする課題】ところで、上記のよう
に端部側面に電極が形成されているチップ電気部品にあ
っては、その電極と半田との接触面積が著しく少なくな
るため、電極と回路基板のランド等の接続部間の接触不
良が発生し易いという支障があった。By the way, in the chip electric component having the electrodes formed on the side surfaces of the end portions as described above, the contact area between the electrodes and the solder is remarkably reduced. There is a problem that a contact failure between the connecting portions such as the land of the substrate is likely to occur.
【０００７】また、リフローの際、溶融した半田の表面
張力に起因すると推察されるチップ電気部品の移動や自
立も発生し易く、良好な半田付を行なうことは困難であ
った。Further, during reflow, movement and self-sustaining of the chip electric parts, which are presumed to be caused by the surface tension of the melted solder, are likely to occur, and it is difficult to perform good soldering.
【０００８】本発明は、このような事情に基づきなされ
たもので、チップ電気部品の端部側面に形成された電極
と、厚膜回路基板の接続部との電気的接続を良好にでき
る厚膜回路基板および厚膜回路基板装置を提供すること
を目的とする。The present invention has been made in view of the above circumstances, and is a thick film capable of making good electrical connection between the electrode formed on the side surface of the end portion of the chip electric component and the connecting portion of the thick film circuit board. It is an object to provide a circuit board and a thick film circuit board device.
【０００９】［発明の構成］[Structure of Invention]
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
に、本請求項１記載の厚膜回路基板は、チップ電気部品
の電極を形成する端部側面と対向する壁面部を接続部と
することを特徴とするものである。In order to solve the above problems, in the thick film circuit board according to the present invention, a wall surface portion facing an end side surface forming an electrode of a chip electric component is used as a connection portion. It is characterized by that.
【００１１】また、本請求項２記載の厚膜回路基板装置
は、絶縁性基板上に離間して形成された一対の絶縁体層
と、絶縁体層を各々被覆するように形成された一対の導
体層と、導体層間に実装され、端部側面に導体層と半田
付けされる電極部が形成されたチップ電気部品とを備え
たことを特徴とするものである。According to another aspect of the thick film circuit board device of the present invention, a pair of insulating layers are formed on the insulating substrate so as to be spaced apart from each other, and a pair of insulating layers are formed to cover the insulating layers. It is characterized in that it is provided with a conductor layer and a chip electric component mounted between the conductor layers and having electrode portions to be soldered to the conductor layer formed on the side surfaces of the end portions.
【００１２】さらに、本請求項３記載の厚膜回路基板装
置は、凹部を有する絶縁性基板と、この凹部を跨ぐよう
に形成された導体層と、凹部内に収容され、導体層と平
面的に交差する一対の電極部を有するチップ電気部品と
を備えたことを特徴とするものである。Further, in the thick film circuit board device according to the present invention, the insulating substrate having the concave portion, the conductor layer formed so as to straddle the concave portion, and the conductor layer accommodated in the concave portion and being planar with the conductor layer are provided. And a chip electric component having a pair of electrode portions intersecting with each other.
【００１３】[0013]
【作用】本請求項１記載の厚膜回路基板によれば、その
接続部がチップ電気部品の電極と対向する壁面部を有し
ているため、電極と半田との接触面積が増大し、厚膜回
路基板の接続部との電気的接続を良好にできる。According to the thick film circuit board of the present invention, since the connecting portion has the wall surface portion facing the electrode of the chip electric component, the contact area between the electrode and the solder increases, and Good electrical connection with the connection portion of the membrane circuit board can be achieved.
【００１４】また、本請求項２記載の厚膜回路基板装置
によれば、接続部である導体層が絶縁層上に形成されて
いるため、その導体層間に実装されたチップ電気部品の
端部側面は、その導体層に対向することになり、したが
って電極と半田との接触面積が増大し、電気的接続を良
好にできる。Further, according to the thick film circuit board device of the present invention, since the conductor layer as the connecting portion is formed on the insulating layer, the end portion of the chip electric component mounted between the conductor layers is formed. Since the side surface faces the conductor layer, the contact area between the electrode and the solder increases, and good electrical connection can be achieved.
【００１５】さらに、本請求項３記載の厚膜回路基板装
置によれば、凹部を跨ぐように形成された導体層と、チ
ップ電気部品の電極部とが平面的に交差するように構成
させたため、電極と半田との接触面積が増大し、電気的
接続を良好にできる。Further, according to the thick film circuit board device of the present invention, the conductor layer formed so as to straddle the recess and the electrode portion of the chip electric component are configured to intersect in a plane. The contact area between the electrode and the solder is increased, and good electrical connection can be achieved.
【００１６】[0016]
【実施例】以下、本発明の詳細を図示の実施例によって
説明する。The details of the present invention will be described below with reference to the illustrated embodiments.
【００１７】（実施例１）図１は、本請求項１記載の厚
膜回路基板の一実施例を示すものであり、例えばセラミ
ック等からなる絶縁性基板１上には、所定の間隔で離間
するように、銅等の導電性金属粉末が混練された導電ペ
ーストを印刷焼成して形成された下層導体層２が配設さ
れている。また、この下層導体層２の上にも、同材料か
らなる下層導体層２に比べて僅かに小さな大きさの上層
導体層３が形成されており、これら上層３及び下層導体
層２によって、接続部４が構成されている。(Embodiment 1) FIG. 1 shows an embodiment of the thick film circuit board according to the present invention. For example, a thick film circuit board is provided on an insulating substrate 1 made of, for example, ceramic or the like at a predetermined interval. As described above, the lower conductor layer 2 formed by printing and firing a conductive paste in which a conductive metal powder such as copper is kneaded is provided. An upper conductor layer 3 of a size slightly smaller than that of the lower conductor layer 2 made of the same material is also formed on the lower conductor layer 2, and the upper conductor layer 3 and the lower conductor layer 2 connect to each other. The part 4 is configured.
【００１８】また、これら導体層２，３の間には、例え
ば棒状のフェライトコア５の外周面に導線６を巻回し、
そのフェライトコア５の両端側面に電極部７が形成され
たチップ電気部品８が実装されている。Between the conductor layers 2 and 3, a conductor wire 6 is wound around the outer peripheral surface of a rod-shaped ferrite core 5,
Chip electrical components 8 having electrode portions 7 formed on both side surfaces of the ferrite core 5 are mounted.
【００１９】つまり、上記実施例によれば、導体２，３
が積層されてなる接続部４の膜厚に対応する端部面は、
チップ電気部品８の両端側面に形成された電極７と対向
する壁面部を構成することになるため、電極７と半田９
との接触面積が増大し、通常のリフロー加熱によっても
両者間の間隙に溶融半田が流れ込み、厚膜回路基板の接
続部４との電気的接続を良好にできるものである。That is, according to the above embodiment, the conductors 2, 3
The end surface corresponding to the film thickness of the connecting portion 4 formed by stacking
Since the wall surface portion that faces the electrodes 7 formed on both side surfaces of the chip electric component 8 is formed, the electrodes 7 and the solder 9 are formed.
The contact area between the thick film circuit board and the connection portion 4 of the thick film circuit board can be improved by allowing the molten solder to flow into the gap between the two even by ordinary reflow heating.
【００２０】また、リフローの際、半田の溶融・固着に
伴う表面張力が発生しても、この張力は、接続部４の壁
面部方向にチップ電気部品８を引張るものであるから、
チップ電気部品８は、それら接続部４間から移動するこ
とはなく、また部品８が自立することもない。Further, even if surface tension is generated due to melting and fixing of solder during reflow, this tension pulls the chip electric component 8 toward the wall surface of the connection portion 4,
The chip electric component 8 does not move from between the connecting portions 4 and the component 8 does not stand by itself.
【００２１】尚、上記実施例のとおり、上層導体層３を
下層導体層２よりも小さく形成しておけば、スクリーン
印刷時に印刷ズレが生じても、上層導体層３のにじみ
（絶縁基板表面方向への垂下）を軽減でき、したがっ
て、隣接した他の印刷配線（図示せず）の短絡等を防止
できる利点がある上、上層導体層３の焼成時に発生する
下層導体層２の収縮に起因した導体層内部の歪応力を低
減でき、その結果、絶縁基板１の湾曲（そり）や、導体
層の被着強度の低下等の支障を防止することができる利
点がある。If the upper conductor layer 3 is formed smaller than the lower conductor layer 2 as in the above-mentioned embodiment, even if a printing deviation occurs during screen printing, the bleeding of the upper conductor layer 3 (the surface direction of the insulating substrate) Has a merit that it is possible to prevent a short circuit of other adjacent printed wiring (not shown), and also due to the contraction of the lower conductor layer 2 that occurs during firing of the upper conductor layer 3. There is an advantage that strain stress inside the conductor layer can be reduced, and as a result, troubles such as the bending (warpage) of the insulating substrate 1 and the reduction of the adhesion strength of the conductor layer can be prevented.
【００２２】また、上記実施例においては、導体層２，
３を積層することにより、チップ電気部品８の電極７を
形成する端部側面と対向する壁面部を構成させたものに
ついて説明したが、例えば図２に図示するように、下層
導体２上に、表面が導電化処理された棒状のセラミック
基体10を実装して、電極７を形成する端部側面と対向す
る壁面部を構成させてもよい。In the above embodiment, the conductor layers 2,
Although the case where the wall surface portion facing the end side surface forming the electrode 7 of the chip electric component 8 is configured by stacking 3 has been described, for example, as shown in FIG. 2, on the lower layer conductor 2, A rod-shaped ceramic substrate 10 whose surface is made conductive may be mounted to form a wall surface portion facing the end side surface forming the electrode 7.
【００２３】（実施例２）次に、図３を用いて本請求項
２記載の厚膜回路基板装置の一実施例を説明する。(Embodiment 2) Next, an embodiment of the thick film circuit board device according to the present invention will be described with reference to FIG.
【００２４】同図に図示するように、例えばセラミック
等からなる絶縁性基板１上には、所定の間隔で離間する
ように、ガラスフリットを主体とする絶縁性ペーストを
印刷焼成して形成された一対の絶縁体層11が配設されて
いる。As shown in the figure, on an insulating substrate 1 made of, for example, ceramic, an insulating paste mainly composed of glass frit is formed by printing and firing so as to be spaced at a predetermined interval. A pair of insulator layers 11 is provided.
【００２５】また、この一対の絶縁体層11上には、各々
銅等の導電性金属粉末が混練された導電ペーストを印刷
焼成して形成された一対の導体層12が配設されている。
そして、これら一対の導体層12間には、前述の実施例と
同じく、例えば棒状のフェライトコア５の外周面に導線
６を巻回し、そのフェライトコア５の両端側面に電極部
７が形成されたチップ電気部品８が実装されている。A pair of conductor layers 12 formed by printing and firing a conductive paste in which a conductive metal powder such as copper is kneaded are disposed on the pair of insulator layers 11.
Then, between the pair of conductor layers 12, the conductor wire 6 is wound around the outer peripheral surface of the rod-shaped ferrite core 5 and the electrode portions 7 are formed on both side surfaces of the ferrite core 5, as in the above-described embodiment. A chip electric component 8 is mounted.
【００２６】したがって、この実施例によれば、導体層
12の下に位置する絶縁体層11が前述の実施例における下
層導体層と同様な作用を成すため、電極７と半田９との
接触面積が増大し、通常のリフロー加熱によっても両者
間の間隙に溶融半田が流れ込み、導体層12と電極部７と
の電気的接続を良好にできるものである。Therefore, according to this embodiment, the conductor layer
Since the insulator layer 11 located under 12 has the same function as the lower conductor layer in the above-mentioned embodiment, the contact area between the electrode 7 and the solder 9 is increased, and the gap between the electrodes 7 and the solder 9 is increased even by the normal reflow heating. The molten solder flows into the conductor layer 12 to improve the electrical connection between the conductor layer 12 and the electrode portion 7.
【００２７】（実施例３）次に、図４を用いて本請求項
３記載の厚膜回路基板装置の一実施例を説明する。(Embodiment 3) Next, an embodiment of the thick film circuit board device according to the present invention will be described with reference to FIG.
【００２８】同図に図示するように、例えばセラミック
等を材料とした絶縁性基板１には、凹部13が形成されて
おり、この凹部13を跨ぐように、銅等の導電性金属粉末
が混練された導電ペーストを印刷焼成して形成された導
体層12が配設されている。また、絶縁性基板１の凹部13
内には、例えば棒状の両端側面に電極部７が形成された
メルフ抵抗14からなるコアの外周面に導線６を巻回して
なるチップ電気部品８が、その電極部７の一部が絶縁基
板１表面上に露出するように収容されている。As shown in the figure, a concave portion 13 is formed in the insulating substrate 1 made of, for example, ceramic or the like, and a conductive metal powder such as copper is kneaded so as to straddle the concave portion 13. A conductor layer 12 formed by printing and baking the formed conductive paste is provided. In addition, the concave portion 13 of the insulating substrate 1
In the inside, for example, a chip electric component 8 in which a conductive wire 6 is wound around an outer peripheral surface of a core made of a melf resistor 14 in which electrode portions 7 are formed on both side surfaces of a rod is provided. It is housed so as to be exposed on one surface.
【００２９】つまり、凹部13を跨ぐように形成された導
体層12は、その凹部13に収容されているチップ電気部品
８の電極部７と平面的に交差しているため、通常のリフ
ロー加熱によっても両者間の間隙に溶融半田が流れ込
み、導体層12と電極部７との電気的接続を良好にするこ
とができる。That is, since the conductor layer 12 formed so as to straddle the recess 13 intersects the electrode portion 7 of the chip electric component 8 housed in the recess 13 in a plane, the conductor layer 12 is subjected to ordinary reflow heating. Also, the molten solder flows into the gap between them, and the electrical connection between the conductor layer 12 and the electrode portion 7 can be improved.
【００３０】[0030]
【発明の効果】以上述べてきたように、本発明によれ
ば、チップ電気部品の端部側面に形成された電極と、厚
膜回路基板の接続部との電気的接続を良好にできる厚膜
回路基板および厚膜回路基板装置を提供することができ
る。As described above, according to the present invention, the thick film capable of making good electrical connection between the electrode formed on the end side surface of the chip electric component and the connecting portion of the thick film circuit board. A circuit board and a thick film circuit board device can be provided.
【図１】本請求項１に係る厚膜回路基板の一実施例を示
す概略図FIG. 1 is a schematic view showing an embodiment of a thick film circuit board according to the present invention.
【図２】本請求項１に係る厚膜回路基板の他の実施例を
示す概略図FIG. 2 is a schematic view showing another embodiment of the thick film circuit board according to the present invention.
【図３】本請求項２に係る厚膜回路基板装置の一実施例
を示す概略図FIG. 3 is a schematic view showing an embodiment of the thick film circuit board device according to the present invention.
【図４】本請求項３に係る厚膜回路基板装置の一実施例
を示す概略図FIG. 4 is a schematic view showing an embodiment of the thick film circuit board device according to the present invention.
【図５】従来の厚膜回路基板装置を示す概略図FIG. 5 is a schematic view showing a conventional thick film circuit board device.
１・・絶縁性基板， ２・・下層導体層， ３・・
上層導体層 ４・・接続部， ５・・フェライトコア， ６・・
導線 ７・・電極部， ８・・チップ電気部品， ９・・
半田 10・・セラミック基体， 11・・絶縁体層， 12・・
導体層 13・・凹部， 14・・メルフ抵抗1 ... Insulating substrate, 2 ... Lower conductor layer, 3 ...
Upper conductor layer 4 ... Connection part, 5 ... Ferrite core, 6 ...
Conductor 7 ... Electrode part, 8 ... Chip electrical component, 9 ...
Solder 10 ... Ceramic base, 11 ... Insulator layer, 12 ...
Conductor layer 13 ... Concave, 14 ... Melf resistance
Claims (3)
気部品を実装し、前記電極部が半田付けされる接続部を
備えた厚膜回路基板であって、 前記接続部は、前記チップ電気部品の電極を形成する端
部側面と対向する壁面部を有することを特徴とする厚膜
回路基板。1. A thick film circuit board having a connecting portion on which a chip electric component having an electrode portion formed on an end side surface is mounted and the electrode portion is soldered, wherein the connecting portion is the chip. A thick film circuit board having a wall surface portion facing an end side surface forming an electrode of an electric component.
の絶縁体層と、 前記絶縁体層を各々被覆するように形成された一対の導
体層からなる接続部と、 前記一対の導体層間に実装され、端部側面に前記導体層
と半田付けされる電極部が形成されたチップ電気部品、 とを備えたことを特徴とする厚膜回路基板装置。2. A pair of insulator layers formed on an insulating substrate so as to be spaced apart from each other, a connecting portion formed of a pair of conductor layers formed so as to cover the insulator layers, and the pair of conductors. A thick film circuit board device, comprising: a chip electric component mounted between layers and having an electrode portion to be soldered to the conductor layer formed on an end side surface.
層からなる接続部と、 前記凹部内に収容され、前記導体層と平面的に交差する
一対の電極部を有したチップ電気部品、 とを備えたことを特徴とする厚膜回路基板装置。3. An insulating substrate having a concave portion, a connecting portion made of a conductor layer formed on the insulating substrate so as to straddle the concave portion, and accommodated in the concave portion and intersecting the conductor layer in a planar manner. A thick film circuit board device, comprising: a chip electric component having a pair of electrode parts,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3358494A JPH05183250A (en) | 1991-12-28 | 1991-12-28 | Thick film circuit board and thick film circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3358494A JPH05183250A (en) | 1991-12-28 | 1991-12-28 | Thick film circuit board and thick film circuit board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05183250A true JPH05183250A (en) | 1993-07-23 |
Family
ID=18459610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3358494A Pending JPH05183250A (en) | 1991-12-28 | 1991-12-28 | Thick film circuit board and thick film circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05183250A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007028009A (en) * | 2005-07-13 | 2007-02-01 | Pioneer Electronic Corp | Frame for loudspeaker, loudspeaker cabinet and loudspeaker device |
| JP2009231518A (en) * | 2008-03-23 | 2009-10-08 | Ogawa Electric Inc | Wire-wound inductor and mounting method therefor |
| JP2011243796A (en) * | 2010-05-19 | 2011-12-01 | Denso Corp | Electronic equipment and attachment structure of electronic equipment |
| JP2014239262A (en) * | 2014-09-25 | 2014-12-18 | 株式会社デンソー | Electronic equipment and attachment structure of electronic equipment |
-
1991
- 1991-12-28 JP JP3358494A patent/JPH05183250A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007028009A (en) * | 2005-07-13 | 2007-02-01 | Pioneer Electronic Corp | Frame for loudspeaker, loudspeaker cabinet and loudspeaker device |
| JP2009231518A (en) * | 2008-03-23 | 2009-10-08 | Ogawa Electric Inc | Wire-wound inductor and mounting method therefor |
| JP2011243796A (en) * | 2010-05-19 | 2011-12-01 | Denso Corp | Electronic equipment and attachment structure of electronic equipment |
| JP2014239262A (en) * | 2014-09-25 | 2014-12-18 | 株式会社デンソー | Electronic equipment and attachment structure of electronic equipment |
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