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JPH05178436A - Conveying/treating device for printed wiring board - Google Patents

Conveying/treating device for printed wiring board

Info

Publication number
JPH05178436A
JPH05178436A JP35723291A JP35723291A JPH05178436A JP H05178436 A JPH05178436 A JP H05178436A JP 35723291 A JP35723291 A JP 35723291A JP 35723291 A JP35723291 A JP 35723291A JP H05178436 A JPH05178436 A JP H05178436A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
parallel moving
moving body
conveying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35723291A
Other languages
Japanese (ja)
Inventor
Fumiji Nagaya
不三二 長屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP35723291A priority Critical patent/JPH05178436A/en
Publication of JPH05178436A publication Critical patent/JPH05178436A/en
Pending legal-status Critical Current

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  • Chain Conveyers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To provide a conveying/treating device for a printed wiring board which is excellent in workability of transportation and surface treatment. CONSTITUTION:The conveying/treating device carries out surface treatment on the surface of a printed wiring board 7 by jetting fluid such as etching treatment solution 81 as fluid while conveying the printed wiring board 7 by means of a conveyor 1. The conveyor 1 is composed of left and right parallel movable bodies 11 making a pair in the advancing direction F, and locking pins 2 as a fixing tool to fix the edge parts of the printed wiring board 7 is provided in the parallel movable bodies 11. A clamp can also be used as the fixing tool.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は,搬送及び表面処理の作
業性に優れた,プリント配線板の搬送処理装置に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board transfer processing apparatus which is excellent in transfer and surface processing workability.

【0002】[0002]

【従来技術】図9に示すごとく,プリント配線板7は,
各種の表面処理を施すために,搬送用のローラー9によ
り搬送されることが多い。そして,例えば,図10に示
すごとく,プリント配線板7は,ローラー9により搬送
されながら上下方向からスプレーノズル8によりエッチ
ング処理液81が噴霧される。これにより,プリント配
線板7の表面において,銅箔等の金属被膜75がエッチ
ング処理液81によりエッチングされ,導体回路が形成
される。
2. Description of the Related Art As shown in FIG.
In order to perform various surface treatments, it is often carried by a carrying roller 9. Then, for example, as shown in FIG. 10, the printed wiring board 7 is conveyed by the rollers 9 and the etching treatment liquid 81 is sprayed from the vertical direction by the spray nozzles 8. As a result, on the surface of the printed wiring board 7, the metal coating 75 such as a copper foil is etched by the etching treatment liquid 81 to form a conductor circuit.

【0003】その後,上記プリント配線板7は,次工程
においても搬送されながら,その表面を洗浄水により洗
浄したり,熱風を吹き付けて乾燥することが行われてい
る。このように,上記プリント配線板7を製造するに際
しては,プリント配線板7の表面に対し各種の表面処理
を施しながら,該プリント配線板7が連続的に搬送され
ることが多い。このとき,上記プリント配線板7は,ロ
ーラー9上において,摩擦力を利用して搬送されること
になる。
Thereafter, the printed wiring board 7 is washed in the next step as well while being conveyed, and the surface thereof is washed with washing water or dried by blowing hot air. As described above, when manufacturing the printed wiring board 7, the printed wiring board 7 is often continuously conveyed while various surface treatments are applied to the surface of the printed wiring board 7. At this time, the printed wiring board 7 is conveyed on the roller 9 by utilizing the frictional force.

【0004】[0004]

【解決しようとする課題】しかしながら,上記従来技術
には,次の問題点がある。即ち,図10に示すごとく,
プリント配線板7に対して特に下方のスプレーノズル8
よりエッチング処理液81が噴射されるとき,ローラー
9が当接しているプリント配線板7の裏面部分751に
はエッチング処理液81が噴霧されない。そのため,プ
リント配線板7の裏面部分751においては,エッチン
グ処理液81の塗布ムラを生じ,これに起因してエッチ
ング不良を生じることがある。
However, the above-mentioned conventional technique has the following problems. That is, as shown in FIG.
The spray nozzle 8 particularly below the printed wiring board 7
When the etching treatment liquid 81 is further sprayed, the etching treatment liquid 81 is not sprayed on the back surface portion 751 of the printed wiring board 7 with which the roller 9 is in contact. Therefore, in the back surface portion 751 of the printed wiring board 7, uneven coating of the etching treatment liquid 81 may occur, which may cause etching failure.

【0005】上記プリント配線板7が,比較的厚くて重
い場合においては,上記ローラー9の送りが不充分とな
り,プリント配線板7との間にスリップを生じ搬送速度
が一定にならないことがある。一方,上記プリント配線
板7が,比較的薄くて軽い場合においては,上記ローラ
ー7間にプリント配線板7が巻き込まれて,ラインより
落下してしまうことがある。本発明は,かかる従来の問
題点に鑑みてなされたもので,搬送及び表面処理の作業
性に優れた,プリント配線板の搬送処理装置を提供しよ
うとするものである。
If the printed wiring board 7 is relatively thick and heavy, the feed of the roller 9 may be insufficient, and slip may occur between the printed wiring board 7 and the printed wiring board 7, resulting in an inconstant conveyance speed. On the other hand, when the printed wiring board 7 is relatively thin and light, the printed wiring board 7 may be caught between the rollers 7 and fall from the line. The present invention has been made in view of the above conventional problems, and an object of the present invention is to provide a transfer processing apparatus for a printed wiring board, which has excellent workability in transfer and surface treatment.

【0006】[0006]

【課題の解決手段】本発明は,プリント配線板をコンベ
アにより搬送しながら,該プリント配線板の表面に流体
を噴射して表面処理を行う搬送処理装置において,上記
コンベアは,進行方向に対して左右一対に設けた平行移
動体よりなり,該平行移動体にはプリント配線板の端部
を固定するための固定具を設けてなることを特徴とする
プリント配線板の搬送処理装置にある。本発明において
最も注目すべきことは,コンベアは進行方向に対して左
右一対に設けた平行移動体よりなり,該平行移動体には
プリント配線板の端部を固定するためのコンベアを設け
たことにある。
According to the present invention, there is provided a conveyor processing apparatus for carrying out surface treatment by injecting a fluid onto a surface of a printed wiring board while conveying the printed wiring board by a conveyor, wherein the conveyor is arranged in a traveling direction. A conveyance processing apparatus for a printed wiring board, comprising a pair of left and right parallel moving bodies, wherein the parallel moving body is provided with a fixture for fixing an end portion of the printed wiring board. What is most noticeable in the present invention is that the conveyor is composed of a pair of parallel moving bodies provided on the left and right with respect to the traveling direction, and the parallel moving body is provided with a conveyor for fixing the end portion of the printed wiring board. It is in.

【0007】上記平行移動体は,チェーンコンベア,ベ
ルトコンベア等により構成する。該平行移動体は,進行
方向に対して左右一対にエンドレス状に配置する。上記
固定具としては,例えば実施例1に示すごとく,上記平
行移動体上に一定間隔に配設した突起状の係止ピンを用
いる。また,該固定具としては,例えば実施例2,3に
示すごとく,上記平行移動体上に一定間隔に配設した自
動開閉可能な,クランプを用いる。
The parallel moving body is composed of a chain conveyor, a belt conveyor or the like. The parallel moving bodies are arranged endlessly in a pair with respect to the traveling direction. As the fixing device, for example, as shown in the first embodiment, a projecting locking pin arranged at a constant interval on the parallel moving body is used. As the fixture, for example, as shown in Examples 2 and 3, a clamp which is arranged on the parallel moving body at a constant interval and which can be automatically opened and closed is used.

【0008】上記プリント配線板としては,例えば比較
的薄くて軽いフィルム製チップキャリア,比較的厚くて
重いチップ搭載用基板がある。上記流体としては,例え
ばエッチング処理液,洗浄水,触媒溶液などがある。ま
た,上記表面処理としては,例えばプリント配線板のエ
ッチング処理,洗浄処理,熱風乾燥処理,触媒塗付処理
がある。
The printed wiring board includes, for example, a relatively thin and light film chip carrier and a relatively thick and heavy chip mounting substrate. Examples of the fluid include etching solution, cleaning water, and catalyst solution. The surface treatment may be, for example, a printed wiring board etching treatment, a cleaning treatment, a hot air drying treatment, or a catalyst coating treatment.

【0009】[0009]

【作用及び効果】本発明においては,平行移動体上には
左右一対の固定具が多数設けてある。そこで,プリント
配線板を平行移動体によって搬送するに当たっては,プ
リント配線板の端部を固定具により固定する。そのた
め,上記プリント配線板は,厚みや重さの大小にかかわ
らず,平行移動体上でスリップしたり,平行移動体間に
巻き込まれて落下したりすることがない。 また,コン
ベアは進行方向に対して左右一対の平行移動体よりなる
ため,その下方よりプリント配線板の表面(裏面)に流
体を噴射して表面処理を行うに当たって,平行移動体が
邪魔になることがない。
In the present invention, a large number of left and right fixtures are provided on the parallel moving body. Therefore, when the printed wiring board is transported by the parallel moving body, the end portion of the printed wiring board is fixed by a fixing tool. Therefore, the printed wiring board is prevented from slipping on the parallel moving body or being caught between the parallel moving bodies and falling regardless of the size and weight of the printed wiring board. In addition, since the conveyor consists of a pair of left and right parallel moving bodies with respect to the traveling direction, the parallel moving bodies interfere with the surface treatment by jetting the fluid from below to the front surface (back surface) of the printed wiring board. There is no.

【0010】また,プリント配線板の表面において,流
体の噴射ムラを生ずることがない。それ故,プリント配
線板の搬送速度は一定になり,表面処理が円滑に行わ
れ,製品不良を生ずることがない。したがって,本発明
によれば,搬送及び表面処理の作業性に優れた,プリン
ト配線板の搬送処理装置を提供することができる。
Further, the ejection unevenness of the fluid does not occur on the surface of the printed wiring board. Therefore, the conveyance speed of the printed wiring board is constant, the surface treatment is smoothly performed, and product defects do not occur. Therefore, according to the present invention, it is possible to provide a transfer processing apparatus for a printed wiring board, which has excellent workability in transfer and surface treatment.

【0011】[0011]

【実施例】【Example】

実施例1 本発明の実施例にかかるプリント配線板の搬送処理装置
につき,図1〜図3を用いて説明する。本例の搬送処理
装置は,図1に示すごとく,プリント配線板7をコンベ
ア1により搬送しながら,該プリント配線板7の表面に
流体としてのエッチング処理液81を噴射して表面処理
を行うものである。上記コンベア1は,進行方向に対し
て左右一対に設けた平行移動体11,11よりなり,該
平行移動体11にはプリント配線板7の端部71を固定
するための固定具としての係止ピン2を設けてなる。
Example 1 A printed wiring board transfer processing apparatus according to an example of the present invention will be described with reference to FIGS. As shown in FIG. 1, the transfer processing apparatus of this example carries out surface treatment by spraying an etching treatment liquid 81 as a fluid onto the surface of the printed wiring board 7 while the printed wiring board 7 is being conveyed by the conveyor 1. Is. The conveyor 1 is composed of a pair of parallel moving bodies 11 and 11 provided on the left and right with respect to the traveling direction, and the parallel moving body 11 is locked as a fixture for fixing an end 71 of the printed wiring board 7. It is provided with a pin 2.

【0012】上記平行移動体11は,チタン製の耐薬品
性,耐摩耗性に優れたチェーンを用いる。上記平行移動
体11は,図2に示すごとく,エンドレス状に連結され
ており,回動ロール110によって環状に回動するよう
構成してある。また,上記平行移動体11の上方及び下
方においては,一定の間隔毎に,輸液管に設けたスプレ
ーノズル8が配設してある。上記スプレーノズル8は,
図2,図3に示すごとく,上記平行移動体11により搬
送されるプリント配線板7に対して,上下方向より流体
としてのエッチング処理液81を噴射するよう構成して
ある。
As the parallel moving body 11, a chain made of titanium having excellent chemical resistance and wear resistance is used. As shown in FIG. 2, the parallel moving body 11 is connected in an endless shape and is configured to rotate in an annular shape by a rotating roll 110. Further, above and below the parallel moving body 11, spray nozzles 8 provided in the infusion tube are arranged at regular intervals. The spray nozzle 8 is
As shown in FIGS. 2 and 3, the etching treatment liquid 81 as a fluid is jetted from above and below onto the printed wiring board 7 conveyed by the parallel moving body 11.

【0013】また,上記プリント配線板7は,図2に示
すごとく,多数の基板が積み上げられた基板ステージ7
5から,吸着機を有するロボット(図示略)によって一
枚づつ平行移動体11上に載置される。上記平行移動体
11は,図3に示すごとく,上記スプレーノズル8の両
側に,左右一対に配設してある。上記搬送処理装置は,
図2,図3に示すごとく,その全体が流体飛散防止壁8
0により覆ってある。
Further, as shown in FIG. 2, the printed wiring board 7 is a substrate stage 7 in which a large number of substrates are stacked.
From 5 on, a robot (not shown) having an adsorption device is placed on the parallel moving body 11 one by one. As shown in FIG. 3, the parallel moving bodies 11 are arranged in pairs on both sides of the spray nozzle 8. The transfer processing device is
As shown in FIGS. 2 and 3, the entire fluid scattering prevention wall 8 is provided.
Covered by 0.

【0014】次に,作用効果につき説明する。本例にお
いては,図1に示すごとく,上記平行移動体11上に
は,左右一対の固定具としての係止ピン2が多数設けて
ある。そこで,プリント配線板7を平行移動体11より
搬送するに当たっては,プリント配線板7の端部71の
係止穴710内に上記係止ピン2を嵌挿して固定する。
そのため,上記プリント配線板7は,厚みや重さの大小
にかかわりなく,平行移動体11上でスリップしたり,
平行移動体11間に巻き込まれてラインより落下するこ
とがない。
Next, the function and effect will be described. In this example, as shown in FIG. 1, a large number of locking pins 2 as a pair of left and right fixtures are provided on the parallel moving body 11. Therefore, when the printed wiring board 7 is conveyed from the parallel moving body 11, the locking pin 2 is fitted and fixed in the locking hole 710 of the end portion 71 of the printed wiring board 7.
Therefore, the printed wiring board 7 slips on the parallel moving body 11 regardless of the size and weight of the printed wiring board 7,
It will not be caught between the parallel moving bodies 11 and fall from the line.

【0015】また,コンベア1は,図1,3に示すごと
く,プリント配線板7の進行方向に対して左右一対の平
行移動体11を有するため,その下方よりプリント配線
板7の裏面にエッチング処理液81を噴射して表面処理
を行うに当り,コンベア1が邪魔になることがない。そ
のため,プリント配線板7の裏面において,エッチング
処理液81の噴射ムラを生ずることがない。
Further, as shown in FIGS. 1 and 3, the conveyor 1 has a pair of left and right parallel moving bodies 11 with respect to the traveling direction of the printed wiring board 7, so that the back surface of the printed wiring board 7 is etched from below. The conveyor 1 does not get in the way when the surface treatment is performed by jetting the liquid 81. Therefore, the ejection unevenness of the etching treatment liquid 81 does not occur on the back surface of the printed wiring board 7.

【0016】それ故,プリント配線板7の搬送速度は一
定となって安定し,表面処理を一定の速度で円滑に行う
ことができる。また,エッチング処理液81の噴射ムラ
を生じないため,プリント配線板7の製品不良を生ずる
ことが少なくなる。したがって,本例によれば,プリン
ト配線板7の搬送及びエッチング処理等の表面処理の作
業性が向上する。
Therefore, the conveying speed of the printed wiring board 7 is constant and stable, and the surface treatment can be smoothly performed at a constant speed. Further, since the unevenness of the jetting of the etching treatment liquid 81 does not occur, product defects of the printed wiring board 7 are less likely to occur. Therefore, according to this example, the workability of the conveyance of the printed wiring board 7 and the surface treatment such as the etching treatment is improved.

【0017】実施例2 本例は,図4〜図7に示すごとく,上記実施例1にかか
る搬送処理装置の係止ピン2に代えて,自動的にプリン
ト配線板7の着脱が可能な,クランプ3を平行移動体1
2上に配設したものである。その他は,上記実施例1と
同様である。上記クランプ3は,図6,図7に示すごと
く,頭部31と,該頭部31より下方に配置した係止部
33と,棒状本体32と,該棒状本体32に嵌挿したス
プリングコイル34と,棒状本体32の下方に配置した
キャスター部35とよりなる。 そして,上記棒状本体
32は,平行移動体12に配設した取付穴120内に上
下動可能に嵌挿する。なお,図中の符号351は,キャ
スター取付部を示す。
Embodiment 2 In this embodiment, as shown in FIGS. 4 to 7, the printed wiring board 7 can be automatically attached and detached in place of the locking pin 2 of the transfer processing apparatus according to the first embodiment. Clamp 3 is parallel moving body 1
It is arranged on top of 2. Others are the same as those in the first embodiment. As shown in FIGS. 6 and 7, the clamp 3 includes a head portion 31, a locking portion 33 disposed below the head portion 31, a rod-shaped main body 32, and a spring coil 34 fitted and inserted in the rod-shaped main body 32. And a caster portion 35 arranged below the rod-shaped body 32. The rod-shaped main body 32 is vertically movably fitted into the mounting hole 120 provided in the parallel moving body 12. Reference numeral 351 in the figure indicates a caster mounting portion.

【0018】上記頭部31は,プリント配線板7と当接
する面にシリコンゴム製の弾性体311を有する。係止
部33は,該弾性体311と対面する位置に配置してあ
る。上記平行移動体12は,ゴム等の弾性細長状の搬送
ベルトよりなる。該平行移動体12には,図4,図5に
示すごとく,一定間隔をおいて,上記クランプ3が多数
配設してある。上記平行移動体12の下方には,図4に
示すごとく,プリント配線板7を供給する部分の近く
に,クランプ3の開閉用ガイド部13を帯状に設ける。
該開閉用ガイド部13は,前方側においてテーパ部13
1を有する。該テーパ部131の近傍は,図5に示すご
とく,平行移動体12が位置しており,その近傍にプリ
ント配線板7を待機させておくための基板ステージ75
が配置してある。
The head portion 31 has an elastic body 311 made of silicon rubber on the surface that contacts the printed wiring board 7. The locking portion 33 is arranged at a position facing the elastic body 311. The parallel moving body 12 is composed of an elastic elongated conveyance belt made of rubber or the like. As shown in FIGS. 4 and 5, the parallel moving body 12 is provided with a large number of the clamps 3 at regular intervals. Below the parallel moving body 12, as shown in FIG. 4, an opening / closing guide portion 13 for the clamp 3 is provided in the shape of a strip near the portion for supplying the printed wiring board 7.
The opening / closing guide portion 13 has a tapered portion 13 on the front side.
Has 1. As shown in FIG. 5, the parallel moving body 12 is located in the vicinity of the taper portion 131, and the substrate stage 75 for keeping the printed wiring board 7 on standby in the vicinity thereof.
Is arranged.

【0019】上記平行移動体12及び開閉用ガイド部1
3の上方には,プリント配線板7を吸着し供給するため
のロボット4が配置してある。該ロボット4は,下方側
に吸着部41と,上方側に回動部42を有する。そこ
で,プリント配線板7を搬送するに当たっては,図4,
図5に示すごとく,まず上記ロボット4が基板ステージ
75より,プリント配線板7を1枚づつ吸着して,平行
移動体12上へ載置する。
The parallel moving body 12 and the opening / closing guide portion 1
A robot 4 for adsorbing and supplying the printed wiring board 7 is arranged above 3. The robot 4 has a suction unit 41 on the lower side and a rotating unit 42 on the upper side. Therefore, when the printed wiring board 7 is conveyed, as shown in FIG.
As shown in FIG. 5, first, the robot 4 picks up the printed wiring boards 7 one by one from the substrate stage 75 and places them on the parallel moving body 12.

【0020】このとき,上記クランプ3のうちプリント
配線板7を把持すべきクランプ3が,上記開閉用ガイド
部13のテーパ部131上を上昇し始める。該クランプ
3のキャスタ部35が,図4に示すごとく,上記開閉用
ガイド部13の頂上まで昇り終わったとき,上記スプリ
ングコイル34がその付勢力に抗して収縮する。これに
より,図4に示すごとく,上記頭部31及び棒状本体3
2が,平行移動体12の上方へ突き出て開口部30を形
成する。
At this time, of the clamps 3, the clamp 3 for gripping the printed wiring board 7 starts to rise above the taper portion 131 of the opening / closing guide portion 13. When the caster portion 35 of the clamp 3 reaches the top of the opening / closing guide portion 13 as shown in FIG. 4, the spring coil 34 contracts against the urging force thereof. As a result, as shown in FIG. 4, the head 31 and the rod-shaped body 3 are
2 projects above the parallel moving body 12 to form an opening 30.

【0021】そこで,上記ロボット4により吸着された
プリント配線板7が,上記開口部30内に挿入される。
上記クランプ3のキャスタ部35が,上記開閉用ガイド
部13上から外れることにより,上記開口部30が上記
スプリングコイル34の付勢力により閉止する。これに
より,プリント配線板7がクランプ3により,自動的に
把持され固定される。搬送終了場所には,上記と同様の
開閉用ガイド部13,ロボット4が設けられており,上
記と逆の作用によりプリント配線板7が取り出される。
したがって,本例によれば,実施例1に比してプリント
配線板7を自動的にかつ確実に,平行移動体12上へ載
置したり取り外したりできる。そのため,プリント配線
板7の平行移動体12への着脱が容易となる。その他,
実施例1と同様の効果を得ることができる。
Then, the printed wiring board 7 attracted by the robot 4 is inserted into the opening 30.
When the caster portion 35 of the clamp 3 is disengaged from the opening / closing guide portion 13, the opening 30 is closed by the biasing force of the spring coil 34. As a result, the printed wiring board 7 is automatically gripped and fixed by the clamp 3. An open / close guide unit 13 and a robot 4 similar to those described above are provided at the transfer end location, and the printed wiring board 7 is taken out by the action opposite to the above.
Therefore, according to the present example, the printed wiring board 7 can be placed and removed on the parallel moving body 12 automatically and reliably as compared with the first embodiment. Therefore, the printed wiring board 7 can be easily attached to and detached from the parallel moving body 12. Other,
The same effect as that of the first embodiment can be obtained.

【0022】実施例3 本例は,図8に示すごとく,上記実施例2における平行
移動体12において,開閉用ガイド部13の直前に上昇
用曲線部121を設けたものである。その他は,上記実
施例2と同様である。上記上昇用曲線部121は,図8
に示すごとく,クランプ3の開閉用ガイド部13のテー
パ部131の形状に沿って配置してある。そのため,ロ
ボット4により,プリント配線板7を吸着してクランプ
3に把持させるに当り,該クランプ3の開口部30の開
口が迅速円滑に行われる。したがって,本例によれば,
上記実施例2に比して,上記クランプ3によるプリント
配線板7の把持が容易となる。その他,実施例1と同様
の効果を得ることができる。
Third Embodiment In this embodiment, as shown in FIG. 8, the parallel moving body 12 in the second embodiment is provided with an ascending curve portion 121 immediately before the opening / closing guide portion 13. Others are the same as those in the second embodiment. The rising curve portion 121 is shown in FIG.
As shown in FIG. 4, the clamp 3 is arranged along the shape of the taper portion 131 of the opening / closing guide portion 13. Therefore, when the robot 4 sucks the printed wiring board 7 and causes the clamp 3 to hold the printed wiring board 7, the opening of the opening 30 of the clamp 3 is quickly and smoothly performed. Therefore, according to this example,
As compared with the second embodiment, the printed wiring board 7 can be easily gripped by the clamp 3. In addition, the same effect as that of the first embodiment can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例1にかかるプリント配線板の搬送処理装
置の斜視図。
FIG. 1 is a perspective view of a printed wiring board transfer processing apparatus according to a first embodiment.

【図2】実施例1にかかるプリント配線板の搬送処理装
置の側面図。
FIG. 2 is a side view of the printed wiring board transport processing apparatus according to the first embodiment.

【図3】実施例1にかかるプリント配線板の搬送処理装
置の正面図。
FIG. 3 is a front view of the printed wiring board transport processing apparatus according to the first embodiment.

【図4】実施例2にかかるプリント配線板の搬送処理装
置の側面図。
FIG. 4 is a side view of the printed wiring board transport processing apparatus according to the second embodiment.

【図5】実施例2にかかるプリント配線板の搬送処理装
置の平面図。
FIG. 5 is a plan view of the printed wiring board transport processing apparatus according to the second embodiment.

【図6】実施例2における,クランプの正面図。FIG. 6 is a front view of the clamp according to the second embodiment.

【図7】実施例2における,クランプの側面図。FIG. 7 is a side view of the clamp according to the second embodiment.

【図8】実施例3にかかるプリント配線板の搬送処理装
置の側面図。
FIG. 8 is a side view of the printed wiring board transport processing apparatus according to the third embodiment.

【図9】従来のプリント配線板の搬送処理装置の斜視
図。
FIG. 9 is a perspective view of a conventional printed wiring board transport processing device.

【図10】従来のプリント配線板の搬送処理装置の側面
図。
FIG. 10 is a side view of a conventional printed wiring board transport processing device.

【符号の説明】[Explanation of symbols]

1...コンベア, 11,12...平行移動体, 2...係止ピン, 3...クランプ, 7...プリント配線板, 71...端部, 8...スプレーノズル, 81...エッチング処理液, 1. . . Conveyor, 11, 12. . . Parallel moving body, 2. . . Locking pin, 3. . . Clamp, 7. . . Printed wiring board, 71. . . Edge, 8. . . Spray nozzle, 81. . . Etching solution,

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H05K 3/26 7511−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 3/26 7511-4E

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 プリント配線板をコンベアにより搬送し
ながら,該プリント配線板の表面に流体を噴射して表面
処理を行う搬送処理装置において,上記コンベアは,進
行方向に対して左右一対に設けた平行移動体よりなり,
該平行移動体にはプリント配線板の端部を固定するため
の固定具を設けてなることを特徴とするプリント配線板
の搬送処理装置。
1. A transport processing apparatus for carrying out surface treatment by injecting a fluid onto the surface of a printed wiring board while transporting the printed wiring board by a conveyor, wherein the conveyors are provided in a pair on the left and right with respect to the traveling direction. It consists of parallel moving objects,
A conveyance processing apparatus for a printed wiring board, wherein the parallel moving body is provided with a fixture for fixing an end portion of the printed wiring board.
JP35723291A 1991-12-24 1991-12-24 Conveying/treating device for printed wiring board Pending JPH05178436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35723291A JPH05178436A (en) 1991-12-24 1991-12-24 Conveying/treating device for printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35723291A JPH05178436A (en) 1991-12-24 1991-12-24 Conveying/treating device for printed wiring board

Publications (1)

Publication Number Publication Date
JPH05178436A true JPH05178436A (en) 1993-07-20

Family

ID=18453063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35723291A Pending JPH05178436A (en) 1991-12-24 1991-12-24 Conveying/treating device for printed wiring board

Country Status (1)

Country Link
JP (1) JPH05178436A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175497A (en) * 2003-12-10 2005-06-30 Hoellmueller Maschinenbau Gmbh Method and apparatus for conveying and processing flat materials in continuous equipment without contact
JP2005175496A (en) * 2003-12-10 2005-06-30 Hoellmueller Maschinenbau Gmbh Method and apparatus for processing flat materials in continuous equipment
US7293683B2 (en) 2003-06-13 2007-11-13 Multivac Sepp Haggenmuller Gmbh & Co. Kg Packaging machine
KR100881333B1 (en) * 2007-08-31 2009-02-02 주식회사 케이씨텍 Feeding device of thin printed circuit board
JP2009141321A (en) * 2007-12-10 2009-06-25 Samsung Electro-Mechanics Co Ltd Substrate transfer apparatus
KR100977395B1 (en) * 2008-06-18 2010-08-24 에스티에스반도체통신 주식회사 Semiconductor package clamping method using conveyor belt for conveying semiconductor package, conveyor device and conveying device for conveying semiconductor package
CN109607052A (en) * 2019-02-16 2019-04-12 湖南城市学院 Conveyor chain
JP2020012131A (en) * 2018-07-13 2020-01-23 日立化成株式会社 Etching apparatus, etching method, and method of manufacturing printed wiring board
JP2020152483A (en) * 2019-03-19 2020-09-24 久米機電工業株式会社 Carrier machine

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7293683B2 (en) 2003-06-13 2007-11-13 Multivac Sepp Haggenmuller Gmbh & Co. Kg Packaging machine
JP2005175497A (en) * 2003-12-10 2005-06-30 Hoellmueller Maschinenbau Gmbh Method and apparatus for conveying and processing flat materials in continuous equipment without contact
JP2005175496A (en) * 2003-12-10 2005-06-30 Hoellmueller Maschinenbau Gmbh Method and apparatus for processing flat materials in continuous equipment
KR100881333B1 (en) * 2007-08-31 2009-02-02 주식회사 케이씨텍 Feeding device of thin printed circuit board
JP2009141321A (en) * 2007-12-10 2009-06-25 Samsung Electro-Mechanics Co Ltd Substrate transfer apparatus
KR100977395B1 (en) * 2008-06-18 2010-08-24 에스티에스반도체통신 주식회사 Semiconductor package clamping method using conveyor belt for conveying semiconductor package, conveyor device and conveying device for conveying semiconductor package
JP2020012131A (en) * 2018-07-13 2020-01-23 日立化成株式会社 Etching apparatus, etching method, and method of manufacturing printed wiring board
CN109607052A (en) * 2019-02-16 2019-04-12 湖南城市学院 Conveyor chain
JP2020152483A (en) * 2019-03-19 2020-09-24 久米機電工業株式会社 Carrier machine

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