JPH05166992A - Semiconductor device - Google Patents

Abstract

(57) [Summary] [Object] The present invention relates to a semiconductor device shipped in a state of being attached to a protective frame, and an object thereof is to perform highly accurate positioning by the protective frame. [Structure] Semiconductor device body 16 and outer leads 14b
A frame body portion 18 is provided at a more outer position so as to surround the semiconductor device body 16, and the semiconductor device body 16 is provided between the frame body portion 18 and the semiconductor device body 16. The protective frame 17 has a supporting portion 19 to be supported by 18, and the frame body portion 18 and the supporting portion 19 are integrally formed of a metal material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, it relates to a semiconductor device which is shipped while attached to a protective frame.

In general, a semiconductor device is shipped as a product with the lead frame cut off and the outer leads bent into a predetermined shape.

However, the pitch of the outer leads is becoming narrower with the recent trend toward higher integration and higher pin count of semiconductor devices, and the mechanical strength thereof is becoming weaker.

Therefore, in order to protect the outer lead formed in a predetermined shape, a protective frame is provided so as to surround the outer periphery of the semiconductor device body, and the protective frame and the semiconductor device body are connected by a support bar. The outer leads are protected by.

[0005]

2. Description of the Related Art FIG. 14 shows a conventional semiconductor device 1. In the figure, 2 is a semiconductor device main body, and 3 is a protective frame made of resin for protecting the semiconductor device main body.

The semiconductor device main body 2 has a structure in which a plurality of leads 5 extend from a side portion of a resin package 4 for encapsulating a semiconductor chip (not shown in the figure). Also, the protective frame 3
Is arranged outside the leads 5 so as to surround the semiconductor device body 2.

Support bars 6 extending toward the protective frame 3 are formed from the four corners of the package 4 having a rectangular shape in plan view, and the support bars 6 are connected to the protective frame 3. As a result, the semiconductor device main body 2 is supported by the protective frame 3. Thereby, even if the leads 5 have a narrow pitch, the leads 5 can be protected by the protection frame 3. Further, reference numeral 7 in the drawing denotes a positioning guide hole described later.

Conventionally, the resin package 4, the protective frame 3, and the support bar 6 are formed integrally with each other when the resin package 4 is molded.

[0009]

However, in the above-described conventional semiconductor device 1, since the protective frame 3 and the support bar 6 are made of resin, there are the following problems.

As described above, in the semiconductor device 1 having the structure in which the semiconductor device body 2 is protected by the protective frame 3, the support bar 6 is cut off before the semiconductor device body 2 is mounted on an electronic device to protect the semiconductor device body 2. It is necessary to mount the electronic device in a state of being separated from the frame 3. Further, in the press cutting step of separating the semiconductor device main body 2 from the protective frame 3, the bending process of the leads 5 is simultaneously performed (the leads 5 are horizontal in the shipping state).

The bending process of the lead 5 is a highly accurate process, and therefore it is necessary to mount the semiconductor device 1 on the mold of the pressing device in a highly accurately positioned state. This positioning is performed using the guide hole 7 formed in the protective frame 3, but in the configuration in which the protective frame 3 and the support bar 6 are formed of resin, the guide hole 7 is formed by contraction of the resin.
There is a problem in that a positional deviation occurs in the position, and highly accurate positioning cannot be performed.

The resin package 4 is formed by resin-sealing the semiconductor chip mounted on the die pad connected to the lead frame.
Lead frame and molded resin (resin package 4,
There is a problem that the semiconductor device main body 2 cannot be positioned with the protective frame 3 as a reference because of a mold deviation between the protective frame 3 and the support bar 6).

Further, as described above, the conventional semiconductor device 1
Then, since the semiconductor device 1 is provided with the protective frame 3 and the leads 5 are in a horizontal state at the time of shipment,
There is a problem that the user side needs to remove the protective frame 3 and the support bar 6 and bend the highly accurate lead 5 to increase the work load on the user side.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a semiconductor device capable of performing highly accurate positioning with a protective frame.

[0015]

SUMMARY OF THE INVENTION The above-mentioned problems are solved by a semiconductor element, a die pad on which the semiconductor element is mounted, a resin package for sealing the semiconductor element, an inner lead connected to the semiconductor element, and a resin package. A semiconductor device main body having a plurality of leads formed by outer leads extending to the outside, a frame body portion provided outside the outer leads so as to surround the semiconductor device main body, and this frame The semiconductor device body has a support portion disposed between the body portion and the semiconductor device body and supporting the semiconductor device body on the frame body portion, and the frame body portion and the support portion are integrally formed with the die pad by a metal material. It is possible to solve the problem by a semiconductor device characterized in that it is configured by a protective frame formed in.

Further, by forming a guide hole for positioning the semiconductor device body in the protective frame,
Further, by forming a bent portion in the protective frame,
In addition, by bending the outer lead into a predetermined shape and bending the bent portion in a direction that protects the outer lead, an insulating resin member is further provided in a part of the frame body portion. By doing so, it can be solved more effectively.

Further, the above-mentioned problem is to provide a semiconductor element, a die pad on which the semiconductor element is mounted, a resin package for encapsulating the semiconductor element, an inner lead connected to the semiconductor element, and an external resin package. A semiconductor device main body having a plurality of leads configured by extending outer leads, a metal support member formed so as to integrally extend outward from the semiconductor device main body, and the outer lead A metal protective frame member that is disposed at an outer position so as to surround the semiconductor device body and that supports the semiconductor device body via the support member by fixing the support member. This can be solved by a semiconductor device characterized by the above.

Further, by forming a guide hole for positioning the semiconductor device body in the protective frame member or the supporting member, and by forming a bent portion in the protective frame member, the outer member is also formed. By forming a lead into a predetermined shape and bending the bent portion in a direction that protects the outer lead, and by disposing an insulating resin member in a part of the protection frame member, Further, by fixing the support member to the protective frame member by welding means, the problem can be solved more effectively.

Further, the above-mentioned problem is that a semiconductor element, a die pad on which the semiconductor element is mounted, a resin package for encapsulating the semiconductor element, an inner lead connected to the semiconductor element, and an external resin package are provided. A semiconductor device body having a plurality of leads including extended outer leads, a frame body portion provided outside the outer leads so as to surround the semiconductor device body, and the frame body portion. And a supporting portion for supporting the semiconductor device main body on a frame body portion, the frame body portion and the supporting portion being integrally formed of a metal material. 1. A semiconductor comprising: a first protective frame member; and second and third protective frame members that are arranged so as to overlap with each other on the upper and lower sides of the frame body portion. It can be solved by location.

Further, by forming a guide hole for positioning the semiconductor device main body in the first to third protective frame members or supporting members, the second or third protective frame member is also provided. By forming a bent portion on at least one side of the outer lead by bending the outer lead into a predetermined shape and bending the bent portion in a direction that protects the outer lead. By arranging an insulative resin tape on a part of the third protection frame member, and by fixing the first to third protection frame members integrally by welding means, a more effective solution is provided. You can Furthermore, the welding position between the first protection frame member and the second protection frame member and the welding position between the first protection frame member and the third protection frame member are selected at different positions, The first protection frame member of the third protection frame member is located at a position facing the welding position between the first protection frame member and the second protection frame member.
To form a second escape hole at a position facing the welding position of the first protection frame member and the third protection frame member of the second protection frame member, and A configuration in which laser light is irradiated so as to pass through the second escape hole, and the first protection frame member and the second protection frame member, and the first protection frame member and the third protection frame member are laser welded. Also good.

[0021]

In the semiconductor device having the above structure, since the protective frame member and the support member are made of a metal material, the contraction of the protective frame member can be reduced as compared with the conventional resin protective frame. Therefore, the position of the guide hole can be determined with high accuracy, and the semiconductor device can be positioned with high accuracy during automatic press working or the like.

Further, the resin molding is carried out only for forming the resin package, and the resin is not molded on the protective frame member and the supporting member which require dimensional accuracy, so that the dimensional deviation due to the resin does not occur.

Further, the supporting member is connected to the semiconductor device main body, the protective frame member is formed separately from the supporting portion, and the supporting member is fixed to the protective frame member so that the semiconductor device main body is supported by the protective frame member. With this, the protection frame member can be selected regardless of the material of the support member.
The support member needs to be made of the same material as the lead frame, die pad, and the like. On the other hand, the protective frame member needs to be made of a material having high mechanical strength. By forming the support member and the protective frame member as separate members, it is possible to select a material suitable for the function of each member. Further, since the bent portion can be formed in the protective frame member before fixing the support member, the bent portion can be easily processed.

Further, by sandwiching the frame portion of the first protective frame member on which the semiconductor device main body is disposed, the second and third protective frame members are disposed so as to overlap the upper and lower portions thereof. The mechanical strength can be further improved.

Further, by forming the bent portion in the protective frame or the protective frame member, the rigidity of the protective frame or the protective frame member is increased and the mechanical strength can be improved. As a result, the semiconductor device body can be protected more reliably.

Further, by setting the bending direction of the bent portion to be the same as the bending direction of the outer lead, the outer lead which is bent upward or downward and protrudes can be protected by the bent portion.

Further, by disposing the insulating resin tape on a part of the frame portion, the semiconductor device can be easily handled.

[0028]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 shows a semiconductor device 10 according to a first embodiment of the present invention.
3A is a plan view showing a part of the semiconductor device 10, and FIG. 2B is a front view showing a part of the semiconductor device. The semiconductor device 10 roughly includes a semiconductor device body 16 and a protective frame 17.
It is composed of and.

First, the structure of the semiconductor device body 16 will be described. In the figure, 11 is a semiconductor element, which is die-bonded on the die pad 12. The semiconductor element 11 is protected by being sealed with a resin package 13.

In the figure, 14 is a lead, which is composed of an inner lead 14a and an outer lead 14b. The inner leads 14a are the bonding pads (not shown) formed on the semiconductor element 11 and the wires 1
5, the outer leads 14b extend outside the package 13 and are formed in a gull wing shape. The semiconductor device body 16 includes the lead 1
4 is the QFP (Qu
It is an ad flat package type semiconductor device. The semiconductor device main body 16 is configured by the above-described components.

On the other hand, the protective frame 17 has a frame body portion 18 arranged so as to surround the semiconductor device body 16 at a position outside the tip portion of the outer lead 14b described above, the frame body portion 18 and the semiconductor device. The semiconductor device main body 16 is provided between the main body 16 and the supporting portion 19 for supporting the semiconductor device main body 16 on the frame body portion 18.

The frame body portion 18 and the support portion 19 are constructed integrally with each other, and the frame body portion 18 and the support portion 19 are also constructed integrally with the die pad 12. Therefore,
The semiconductor device body 16 is surely supported by the support portion 19 so that the frame body portion 1
Supported by 8. Further, since the support portion 19 is configured to extend from the four corner positions of the semiconductor device body 16,
It does not interfere with the lead 14 in which a plurality of supporting portions 19 are arranged.

Further, the frame body portion 18 and the support portion 19 are both flat plates, and the width dimensions of the frame body portion 18 and the support portion 19 are the semiconductor device main body 1 after the semiconductor device 10 is shipped.
6 Selected to be sufficiently durable to support and protect. In the figure, 20 is a guide hole, which is formed at each of the four corners of the frame body portion 18.

In the above structure, the protective frame 17 is used in the present invention.
Is characterized by being composed of metal. As a specific material for the protective frame 17, an iron-nickel alloy (Fe
-Ni alloy: 42 alloy) and the like are conceivable. As described above, by using the metal as the protective frame 17, the contraction of the protective frame 17 can be extremely reduced as compared with the conventional resin protective frame. Therefore, the position of the guide hole 20 can be determined with high accuracy, and the semiconductor device 10 can be positioned with high accuracy during the automatic press working performed by the user (implemented to remove the protective frame 17). Therefore, the processing accuracy can be improved and the yield can be improved.

Further, the resin molding is performed only for forming the package 13, and since the guide hole 20 serving as a positioning reference is formed, the resin is not molded on the protective frame 17 which requires dimensional accuracy. As a result, unlike the protective frame made of resin, dimensional deviation does not occur during resin molding, and the reliability of the semiconductor device 10 can be improved.

2A and 2B show a semiconductor device 21 which is a modification of the first embodiment. FIG. 2A is a plan view of the semiconductor device 21, and FIG. 2B is a partially cutaway front view. In the figure, the same components as those shown in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

In the semiconductor device 10 shown in FIG. 1, the frame body portion 18 and the support portion 19 constituting the protective frame 17 are both flat plates. As described above, when the frame body portion 18 and the support portion 19 are formed into a flat plate shape, the mechanical strength thereof is weak and the frame body portion 18 and the support portion 19 are easily bent when an external force is applied, so that the semiconductor device body 16 may not be sufficiently protected. is there.

Therefore, in the semiconductor device 21, the frame portion 23
The bent portion 22 is formed by bending a predetermined range of the outer side position and the inner side position. By forming the bent portion 22 in the frame body portion 23 in this way, the rigidity of the frame body portion 23 can be increased, and the protection frame 24
The mechanical strength of the semiconductor device can be improved, and the semiconductor device body 16 can be protected more reliably.

Further, as described above, the semiconductor device body 16
Since the lead 14 constituting the above is formed in a gull wing shape, it projects downward. In the semiconductor device 10 shown in FIG. 1, since the protection frame 17 has a flat plate shape, the semiconductor device body 16 can be protected in the plane direction,
It was not possible to reliably protect the portion of the lead 14 that protruded downward.

However, in the semiconductor device 21, the bent portion 22 is bent in the same direction as the protruding direction of the lead 14, and the bending depth is set to be slightly longer than the protruding amount of the lead 14. There is. Therefore, even when another object contacts the semiconductor device 21 from the lower side to the upper side in FIG.
It does not come into contact with the lead 14 and the lead 14. Therefore, the lead 14 molded into a predetermined shape can be reliably protected.

FIG. 3A shows a cross section taken along the line AA in FIG. In the semiconductor device 21 shown in FIG. 2, the bent portion 22 has a U-shaped cross section as shown in FIG. 2, but the shape of the bent portion 22 is not limited to this, and As shown in B), both side portions of the frame body portion 23 may be bent in the vertical direction, respectively, or only one side portion of the frame body portion 23 is bent as shown in FIG. It may be shaped.

FIG. 4 shows the semiconductor device 21 in which the frame 2
3 shows a structure in which insulating tapes 25 made of polyimide or the like are arranged at predetermined four positions in FIG. 3, FIG. 7A is a plan view of the semiconductor device 21 in which the insulating tapes 25 are arranged, and FIG. 3 is a sectional view taken along line BB in FIG.

By disposing the insulating tape 25 at a predetermined position of the frame portion 23 as described above, it is possible to prevent electrical breakdown during handling. That is, when the semiconductor device 21 is gripped by the arm during handling,
The arm may be charged, and when the metal frame body portion 23 is held by such an arm, the semiconductor element 11
May be destroyed. However, by disposing the insulating tape 25 at the portion gripped by the arm, such breakage can be reliably prevented.

FIG. 5 is a diagram showing a semiconductor device 30 according to a second embodiment of the present invention, and FIG. 6 is a semiconductor device 30.
It shows the state of disassembling. In addition, in each drawing, FIG.
The same components as those of the semiconductor device 10 according to the first embodiment described with reference to FIGS.

The present embodiment is characterized in that the frame body portion 18 and the support portion 19 constituting the protection frame 17 which are integrated in the semiconductor device 10 according to the first embodiment are separated. .. Specifically, a metal supporting member 31 formed integrally with the semiconductor device body 16 to extend outward is provided, and the semiconductor device body 16 is protected at a position outside the outer leads 14b. A frame member 32 is provided, and the support member 31 and the protective frame member 32 are integrated by welding or the like.

Also in this embodiment, the support member 31 and the protective frame member 32 are made of a metal material. Further, the supporting member 31 is integrated with the die pad (not shown in the figure), so that the material thereof is the die pad and the leads 14.
It is made of the same material (42alloy, etc.). On the other hand, as shown in FIG. 6, the protective frame member 32 includes four frame constituent members 32a to 3a.
It is composed of 2d. In this embodiment, the support member 3
By separating 1 and the protective frame member 32 into a separate structure, the material of the protective frame member 32 can be selected regardless of the material of the support member 31.

As described above, since the protective frame member 32 needs to support the semiconductor device body 16, it must have a predetermined mechanical strength. Therefore, with the above configuration, a material having high strength can be selected as the material of the protective frame member 32, the semiconductor device main body 16 can be protected more reliably, and the reliability of the semiconductor device 30 is improved. Can be made

On the other hand, the semiconductor device 30 shown in FIG.
Then, the protective frame member 32 is replaced with four frame component members 32a to 32.
Although it is configured by d, the protective frame member 32 does not necessarily have to be configured by the four frame component members 32a to 32d,
For example, as shown in FIG. 7, a protective frame member 33 having a frame shape in advance may be used. With this configuration, 4
Compared to the protective frame member 32 formed by the frame frame members 32a to 32d, the number of welding points is reduced, so that the semiconductor device manufacturing process can be simplified.

Further, the protective frame member 3 shown in FIGS. 6 and 7
In Nos. 2 and 33, since the shapes of both are flat, even if the material strength is improved, the shape strength is still weak. Therefore, by forming the bent portion 35 like the protection frame member 34 shown in FIG. 8, the rigidity of the protection frame member 34 may be increased and the mechanical strength may be further improved.
Further, as described above, by appropriately selecting the bending direction and the bending depth of the bent portion 35, the lead 14 can be protected more reliably. Furthermore, the protective frame member 3
Since 4 is a structure separated from the support member 31, the bent portion 35 can be easily processed and the workability can be improved. It is to be noted that FIG. 6B shows a cross section taken along the line C-C in FIG.

On the other hand, in each of the semiconductor devices shown in FIGS. 5 to 8, since the protective frame members 32 to 34 are manufactured as separate components different from the lead frame, the protective frame members 32 to 34 are formed. The positioning in the case of joining the support members 31 was troublesome, and the accuracy after assembly might be reduced.

FIG. 9 shows a structure for coping with the above problem, which is characterized in that both the supporting member 36 and the protective frame member 37 are composed of lead frames 38, 39. In the figure, (B) shows the cross section of (A), and (D) shows the cross section of (C).

In order to align the support member 36 and the protective frame member 37 with the above structure, each lead frame 3
The guide holes 40 and 41 formed in the holes 8 and 39 may be aligned. Therefore, the support member 36 and the protective frame member 37 can be easily aligned with high accuracy, and the reliability of the semiconductor device manufactured by this method can be improved. Since the lead frames 38 and 39 can be easily manufactured by the conventional semiconductor manufacturing technique, it is difficult to form the support member 36 and the protective frame member 37 with the lead frames 38 and 39. is not.

FIG. 10 shows a semiconductor device 50 which is a third embodiment of the present invention. In the figure, (B) is (A)
3A is a cross section taken along line FF in FIG. 3A, and FIG. 3C is a cross section taken along line GG in FIG.

The semiconductor device 50 comprises the semiconductor device body 16
A first protection frame member 51 having the same configuration as the protection frame 17 of the semiconductor device 10 according to the first embodiment shown in FIG.
It is composed of second and third protective frame members 52 and 53 having the same configuration as the protective frame member 34 shown in FIG. Then, the second and third protective frame members 52 and 53 are arranged so as to sandwich the first protective frame member 51 and then joined by welding.

In the semiconductor device 50 having the above structure, the second and third protective frame members 52 and 53 are arranged with the first protective frame member 51 interposed therebetween, so that the mechanical strength is further improved. You can Further, similarly to the semiconductor device 30 according to the second embodiment, the first to third protection frame members 51 to 53 can be selected from materials suitable for their respective functions, which also leads to the semiconductor device main body 16 The protection can be performed more reliably.

Here, the first to third protective frame members 51 to
The welding method of 53 will be described. In this embodiment, the first
The welding position between the protective frame member 51 and the second protective frame member 52 and the welding position between the first protective frame member 51 and the third protective frame member 53 were selected at different positions.

Then, a first relief hole 54 is formed in the third protective frame member 53 at a position facing the welding position of the first protective frame member 51 and the second protective frame member 52, and The second escape hole 55 is formed in the second protective frame member 52 at a position facing the welding position between the first protective frame member 51 and the third protective frame member 53, and the first and second protective frame members 52 are formed. Escape hole 5
Laser light is radiated so as to pass through 4, 55, and the first protective frame member 51 and the second protective frame member 52, and the first protective frame member 51 and the third protective frame member 53 are laser-welded. As a result, the first to third protective frame members 51 to 53 are joined together.

In the case of laser welding, it is difficult to weld the first to third protective frame members 51 to 53 collectively, and it is assumed that the first to third protective frame members 51 to 53 are welded collectively. However, welding failure will occur and the reliability of the semiconductor device 50 will be greatly reduced.

However, by joining the first to third protective frame members 51 to 53 by the above-mentioned welding method, the protective frame members 51 to 53 can be securely joined, and the reliability of the semiconductor device 50 is improved. Can be improved. Also,
As a means for that, the escape holes 54,
Since it is only necessary to form 55, there is no difficulty in performing the above welding method.

11 to 13 show examples in which the present invention is applied to semiconductor devices having various structures. FIG. 11 shows an example in which the present invention is applied to a normal dip type semiconductor device, and FIG. 12 shows an example in which the present invention is applied to a chip on board type semiconductor device.
Shows an example in which the present invention is applied to a TAB (Tape Automatic Bonding) type semiconductor device. In each figure,
(A) shows a structure according to a modification of the first embodiment of the present invention, and (B) shows a structure according to the third embodiment of the present invention.

Although not described in detail in the above-mentioned second and third embodiments, various effects that can be realized in the first embodiment can be realized also in the second and third embodiments from the above description. It's obvious.

[0062]

As described above, according to the present invention, since the protective frame member and the supporting member are made of a metal material, the contraction of the protective frame member can be reduced as compared with the conventional resin. Therefore, the position of the guide hole can be determined with high accuracy, and the semiconductor device can be positioned with high accuracy during automatic press working or the like.

Further, the resin molding is performed only for forming the resin package, and the resin is not molded on the protective frame member and the supporting member which require dimensional accuracy, so that the dimensional deviation due to the resin does not occur.

Further, the supporting member is connected to the semiconductor device main body, the protective frame member is formed separately from the supporting portion, and the supporting member is fixed to the protective frame member so that the semiconductor device main body is supported by the protective frame member. With this, the protection frame member can be selected regardless of the material of the support member.
The support member needs to be made of the same material as the lead frame, die pad, and the like. On the other hand, the protective frame member needs to be made of a material having high mechanical strength. By forming the support member and the protective frame member as separate members, it is possible to select a material suitable for the function of each member. Further, since the bent portion can be formed in the protective frame member before fixing the support member, the bent portion can be easily processed.

Further, the second and third protective frame members are disposed so as to overlap the upper and lower portions of the frame body portion of the first protective frame member on which the semiconductor device main body is disposed, respectively. Thereby, the mechanical strength can be further improved.

Further, by forming the bent portion in the protective frame or the protective frame member, the rigidity of the protective frame or the protective frame member is increased and the mechanical strength can be improved. As a result, the semiconductor device body can be protected more reliably.

By setting the bending direction of the bent portion to be the same as the bending direction of the outer lead, the outer lead protruding upward or downward from the protective frame or the protective frame member due to the bending is bent at the bent portion. Can be protected by.

By disposing the insulating resin tape on a part of the frame portion, the semiconductor device can be easily handled.

[Brief description of drawings]

FIG. 1 is a diagram showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a modification of the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is a diagram showing an example of a bent portion.

FIG. 4 is a diagram showing a state in which an insulating tape is arranged on the semiconductor device shown in FIG.

FIG. 5 is a diagram showing a semiconductor device according to a second embodiment of the present invention.

FIG. 6 is an exploded view showing a semiconductor device according to a second embodiment of the present invention.

FIG. 7 is a diagram showing another configuration example of the protection frame member.

FIG. 8 is a diagram showing another configuration example of the protection frame member.

FIG. 9 is a diagram showing an example in which a support member and a protection frame member have a lead frame structure.

FIG. 10 is a diagram showing a semiconductor device according to a third embodiment of the present invention.

FIG. 11 is a diagram showing an example in which the present invention is applied to semiconductor devices having various structures.

FIG. 12 is a diagram showing an example in which the present invention is applied to semiconductor devices having various structures.

FIG. 13 is a diagram showing an example in which the present invention is applied to semiconductor devices having various structures.

FIG. 14 is a diagram for explaining an example of a conventional semiconductor device.

[Explanation of symbols]

 10, 21, 30, 50 Semiconductor device 11 Semiconductor element 12 Die pad 13 Package 14 Lead 14a Inner lead 14b Outer lead 15 Wire 16 Semiconductor device main body 17,24 Protective frame 18,23 Frame part 19 Support part 20,40,41 Guide Hole 22, 35 Bent portion 25 Insulating tape 31, 36 Support member 32, 33, 34, 37 Protective frame member 38, 39 Lead frame 51 First protective frame member 52 Second protective frame member 53 Third protective frame member 54 first escape hole 55 second escape hole

Claims (18)

[Claims] 1. A semiconductor element (11), a die pad (12) for mounting the semiconductor element (11), a resin package (13) for sealing the semiconductor element (11), and the semiconductor element (11). ) Inner lead (14)
a) and a semiconductor device body (16) having a plurality of leads (14) composed of outer leads (14b) extending to the outside of the resin package (13), and the outer leads (14b) A frame portion (1) arranged so as to surround the semiconductor device body (16) at an outer position.
8, 23), and the semiconductor device body (16) is disposed between the frame body portion (18, 23) and the semiconductor device body (16). The die pad (1) has a supporting part (19) for supporting the frame part (18, 23) and the supporting part (19) made of a metal material.
2) Protective frame (17, 24) formed integrally with
A semiconductor device comprising: 2. A guide hole (20) for positioning the semiconductor device body (16) in the protective frame (17).
The semiconductor device according to claim 1, wherein the semiconductor device is formed. 3. A bent portion (2) is provided on the protective frame (24).
2. The semiconductor device according to claim 1 or 2, characterized in that 4. The outer lead (14b) is bent and formed in a predetermined shape, and the bent portion (22) has a bending direction selected so as to protect the outer lead (14b). The semiconductor device according to claim 3, wherein the semiconductor device is a semiconductor device. 5. The semiconductor device according to claim 1, wherein an insulating resin tape (25) is provided on a part of the frame portion (18, 24). .. 6. A semiconductor element (11), a die pad (12) for mounting the semiconductor element (11), a resin package (13) for sealing the semiconductor element (11), and the semiconductor element (11). Inner lead (14)
a) and a semiconductor device body (16) having a plurality of leads (14) composed of outer leads (14b) extending to the outside of the resin package (13), and the semiconductor device body (16) The support member (31) made of metal is formed so as to extend more integrally toward the outside, and the semiconductor device main body (16) is arranged at a position outside the outer lead (14b). And a metal protective frame member (32 to 34, 37) for supporting the semiconductor device body (16) through the support member (31) by fixing the support member (31). A semiconductor device characterized by the following. 7. A guide hole (20) for positioning the semiconductor device body (16) is formed in the protective frame member (32 to 34, 37) or the support member (31). The semiconductor device according to claim 6, wherein the semiconductor device is a semiconductor device. 8. The semiconductor device according to claim 6, wherein a bent portion (35) is formed on the protective frame member (34). 9. The outer lead (14b) is bent and formed in a predetermined shape, and the bent portion (35) has a bending direction selected so as to protect the outer lead (14b). The semiconductor device according to claim 8, wherein the semiconductor device is a semiconductor device. 10. The semiconductor device according to claim 6, wherein an insulating resin tape (25) is provided on a part of the protective frame member (32 to 34, 37). 11. The support member (31) is a protective frame member (3).
2. The semiconductor device according to claim 6, wherein the semiconductor device is fixed to the second to 34, 37) by welding means. 12. A semiconductor element (11), a die pad (12) for mounting the semiconductor element (11), a resin package (13) for sealing the semiconductor element (11), and the semiconductor element (11). Inner lead (14)
a) and a semiconductor device body (16) having a plurality of leads composed of outer leads (14b) extending to the outside of the resin package (13), and a semiconductor device main body (16) at a position outside the outer leads (14b). A frame portion (1) arranged so as to surround the semiconductor device body (16).
8), the frame portion (18) and the semiconductor device body (16)
And a supporting portion (19) disposed between the frame body portion (18) and the frame body portion (18) for supporting the semiconductor device main body (16) on the frame body portion (18). ) And a first protective frame member (5
1) and second and third protective frame members (52, 52) which are arranged so as to overlap the upper and lower parts of the frame body part (18), respectively.
53) and a semiconductor device. 13. The first to third protective frame members (51 to 51)
53) or the supporting portion (19), a guide hole (20) for positioning the semiconductor device body (16).
13. The semiconductor device according to claim 12, wherein the semiconductor device is formed. 14. The second or third protective frame member (5)
The semiconductor device according to claim 12 or 13, characterized in that a bent portion (35) is formed on at least one of (2, 53). 15. The outer lead (14b) is bent and formed in a predetermined shape, and the bent portion (35) has a bending direction selected to protect the outer lead (14b). 15. The semiconductor device according to claim 14, wherein the semiconductor device is a semiconductor device. 16. The first to third protective frame members (51 to 51)
The semiconductor device according to any one of claims 12 to 15, characterized in that an insulating resin tape (25) is provided on a part of (53). 17. The first to third protective frame members (51 to 51)
17. The semiconductor device according to claim 12, wherein 53) is integrally fixed by welding means. 18. The first protection frame member (51) and the second protection frame member (51).
The welding position of the first protection frame member (51) and the welding position of the third protection frame member (53) are selected to be different from each other, and the third protection frame member (52) is welded to the third protection frame member (52). A first relief hole (54) is formed in the frame member (53) at a position facing a welding position between the first protection frame member (51) and the second protection frame member (52); A second relief hole (55) is formed in the second protective frame member (52) at a position facing the welding position between the first protective frame member (51) and the third protective frame member (53). And irradiating it with laser light so as to pass through the first and second escape holes (54, 55) to form the first protective frame member (51) and the second protective frame member (52), and The first protection frame member (5
18. The semiconductor device according to claim 17, wherein 1) and the third protective frame member (53) are laser-welded.