JPH05152482A - Manufacture of ic chip loaded components - Google Patents

Abstract

PURPOSE:To reduce the time which is capable of forming a conductor pattern with high density and which is required to carry out etching work during the manufacture of an outer lead or TAB. CONSTITUTION:In a manufacturing process of an IC chip-loaded component which prepares the IC chip loaded components, such as a lead frame having a specified pattern by etching a conductor metal base material or TAB tape or the like, a penetration hole 12, which penetrates in the thickness direction is formed by the application of laser light or electron beams on a spot where the conductor metal base material is removed by etching before or after the formation of a resist pattern 10 based on the conductor pattern of the conductor metal base material. The conductor metal base material is etched so as to form an IC chip loaded component having a specified conductor pattern by etching the conductor metal base material.

Description

Detailed Description of the Invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an IC chip mounted component such as a lead frame or a TAB tape.

[0002]

2. Description of the Related Art A lead frame having an IC chip mounted thereon is becoming more and more pinned as the IC chip is highly integrated.
The method of manufacturing a lead frame by etching a thin plate material and having a predetermined lead pattern is widely used for producing a lead frame having a large number of pins because the lead pattern can be formed at a high density. In the manufacturing of the lead frame by this etching method, the plate thickness of the lead frame material used regulates the minimum lead pitch interval,
When forming the leads with high density, a thinner lead frame material must be used. By supporting the conductive metal base material with an insulating film, the TAB tape makes it possible to use a conductive metal base material that is much thinner than ordinary lead frame materials. It is possible to form a pattern. TAB tapes are used in products that require extremely high density lead patterns that cannot be formed by ordinary lead frames.

[0003]

In the above lead frame or TAB tape, a conductive metal base material is provided with a resist pattern corresponding to the lead pattern, and the conductive metal base material is chemically etched to remove unnecessary portions. To form a lead pattern. By the way, in the usual chemical etching method, since the etching proceeds isotropically in the depth direction, the sidewalls of the groove formed by the etching are gradually etched (side etching). Etch). As the side etching progresses in this way, etching is performed to the inside of the boundary line position of the resist pattern, so that the product after etching becomes a product having a lead pattern different from the resist pattern. As described above, since the side etching affects the processing accuracy of the product, the amount of the side etching is expected in advance to form a drawn image of the resist pattern.

However, the manufacturing method of forming the leads by etching has a problem that when the lead pattern becomes extremely high in density, the liquid around the etching solution deteriorates and the etching time becomes long. For example, it takes a long time to etch the tips of the inner leads because the lead interval is narrow. Since the side etch changes depending on the lead spacing, that is, the liquid circumference,
It also affects the processing accuracy when forming a high-density lead pattern. Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to enable formation of a conductor pattern at a high density and to perform etching during manufacturing of a lead frame or a TAB tape component. An object of the present invention is to provide a method of manufacturing an IC chip mounted component that can reduce the time required.

[0005]

The present invention has the following constitution in order to achieve the above object. That is, in a method of manufacturing an IC chip mounted component such as a lead frame having a predetermined conductor pattern or an IC chip mounted component such as a TAB tape having a predetermined conductor pattern by etching the conductive metal substrate, the conductor pattern of the conductive metal substrate is Accordingly, a through hole that penetrates in the thickness direction is previously formed by using a laser beam or an electron beam at a portion to be removed by etching, and a resist film is attached to the conductor metal base material to form a resist pattern. It is characterized in that the base material is etched to form an IC chip mounting component having a predetermined conductor pattern. In addition, a resist pattern is formed according to the conductor pattern to be formed on the conductor metal base material, and a portion to be removed by etching in the conductor metal base material on which the resist pattern is formed is removed in the thickness direction by using a laser beam or an electron beam. It is characterized in that a through hole is provided and a conductor metal base material provided with the through hole is etched to form an IC chip mounting component having a predetermined conductor pattern.

[0006]

When the resist pattern is formed on the conductor metal base material and the conductor metal base material is etched, through holes are previously formed in the conductor metal base material at portions to be removed by etching. As a result, when the conductive metal base material is etched, the liquid around the etching solution is improved at the place where the through hole is provided, and the etching property is improved. By providing a through hole in a portion where a conductor pattern is formed with high density, such as the tip of the inner lead, etching can be efficiently performed.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings. In the method of manufacturing an IC chip mounted component according to the present invention, a through hole is formed in advance according to a conductor pattern to be formed on a conductor metal base material to be etched, and then the conductor metal base material is etched to form a lead pattern. Is characterized by. In the production of ordinary lead frames, a resist is applied to a long conductor metal base material, a drawn image is exposed according to a predetermined conductor pattern, and a portion to be removed by etching is exposed on the conductor metal base material by resist etching. After forming the resist pattern, the conductor metal base material is etched in an etching process to form a lead frame.

According to the method of the present invention, a through hole is formed at a required position of the conductor metal base material before the conductor metal base material is etched so that the fine pattern portion of the lead pattern can be easily etched. The step of forming the through holes in the conductive metal base material may be set before the step of etching the conductive metal base material, but in terms of the process, the case where the through holes are formed after the resist pattern is formed and the resist pattern is formed. There are two methods of forming through holes before

The former method is performed as follows. First, a resist pattern is formed on a conductor metal base material according to the conductor pattern to be formed in the same manner as in the above-mentioned conventional method, and through holes are formed in this state. FIG. 1 shows that after forming a resist pattern 10 on a conductive metal base material, a through hole 12 is formed.
Is formed. The resist pattern 10 is a pattern of the inner leads or the stage portion 10 as shown in the figure.
It is formed on the conductive metal base material according to the pattern of a. The resist pattern 10 covers a portion which will be an inner lead or a stage portion on a conductive metal base material,
The conductor metal base material is exposed at the other portions.

The through hole 12 is provided in the portion of the resist pattern 10 where the conductive metal base material is exposed so as to penetrate therethrough in the thickness direction, and in the embodiment shown in FIG. .. The through hole 12 is provided by using a laser beam or an electron beam. By using the laser beam or an electron beam, the through hole can be provided with a width of about several tens μm. Since the lead spacing on the lead frame or TAB tape is about 100 μm at minimum,
By using a laser beam or an electron beam, it is possible to easily form the through hole in the space portion between the leads. These through holes 12 are lead frames or TAB.
It may be formed at an appropriate position according to the conductor pattern of the tape for use, but it is particularly effective if it is provided in the vicinity of the tip of the inner lead where the spacing between the leads becomes narrow and the liquid flow of the etching solution deteriorates.

When the resist pattern is provided after forming the through holes on the conductor metal base material separately from the above method, first, the through holes are formed on the conductor metal base material based on the conductor pattern, and the resist film is formed on the conductor metal base material. After sticking to the material, a resist pattern is formed by patterning. FIG. 2 shows a state in which the through holes 12 are formed in the conductive metal base material. In this embodiment, the through holes 12 are set in the shape of spots of round holes. You may form in a slit shape like the said Example. The through-holes 12 are provided at the same positions as the conductor pattern formation positions on the conductor metal base material, and are formed at the space between the leads as shown in the figure, that is, at the portion where the conductor metal base material is removed by etching. ..

When the conductor metal base material is etched, the through hole 12 must be completely penetrated. Therefore, in the case of the method of forming the through holes in the conductor metal substrate in advance, it is necessary to prevent the resist from remaining in the through holes after the resist pattern is formed. Therefore, in the embodiment, the resist film is attached to the conductive metal base material so that the resist does not enter the through holes 12 to form the resist pattern. After forming the resist pattern,
The conductor metal substrate may be etched by a usual etching method for the conductor metal substrate.

FIG. 3 shows a state in which the conductor metal base material having the through holes 12 is etched. 14 is a conductive metal base material,
16 is a resist pattern. As shown in the figure, by forming the through holes 12 in advance, the etching solution easily flows in the thickness direction of the conductive metal base material, the etching solution is not retained, and the etching property is improved. The etching can be performed efficiently and the etching time can be shortened. Further, by providing the through holes 12, the cross section of the etching becomes closer to the vertical surface, so that the lead interval can be made narrower. This makes it possible to further increase the density of the lead pattern. Although the manufacturing method of the lead frame has been described in the above example, the same can be applied to the case of the TAB tape in which the conductive thin film is supported on the insulating film, and the same can be applied to the manufacturing of other IC chip mounted parts. It can be used as well.

[0014]

As described above, according to the method of manufacturing an IC chip mounted component according to the present invention, the etching property is improved in the portion where the conductor pattern is formed at a high density such as the inner lead, and the etching time is improved. It is possible to shorten the length, and it is possible to effectively etch the narrow area, and further, it is possible to form the conductor pattern at a high density, which is a remarkable effect.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a method of manufacturing an IC chip mounted component.

FIG. 2 is an explanatory diagram showing another method of manufacturing an IC chip mounted component.

FIG. 3 is an explanatory diagram showing a state of etching a conductive metal base material.

[Explanation of symbols]

 10 Resist Pattern 12 Through Hole 14 Conductor Metal Base Material

Claims (2)

[Claims] 1. A method of manufacturing an IC chip mounting component, such as a lead frame having a predetermined conductor pattern, or an IC chip mounting component such as a TAB tape, which is formed by etching a conductive metal substrate. A through hole that penetrates in the thickness direction is previously formed using a laser beam or an electron beam at a portion to be removed by etching according to the conductor pattern, and a resist film is attached to the conductor metal base material to form a resist pattern, A method of manufacturing an IC chip mounted component, characterized in that the conductive metal base material is etched to form an IC chip mounted component having a predetermined conductor pattern. 2. A method of manufacturing an IC chip mounted component, wherein a conductive metal substrate is etched to produce an IC chip mounted component such as a lead frame or a TAB tape having a predetermined conductor pattern. A resist pattern is formed in accordance with the conductor pattern to be formed, and a through hole penetrating in the thickness direction using a laser beam or an electron beam is provided in a portion of the conductive metal base material on which the resist pattern is formed to be removed by etching. A method for manufacturing an IC chip mounted component, comprising forming an IC chip mounted component having a predetermined conductor pattern by etching a conductor metal base material provided with holes.