JPH05136463A - Led lead frame - Google Patents
Led lead frameInfo
- Publication number
- JPH05136463A JPH05136463A JP3321234A JP32123491A JPH05136463A JP H05136463 A JPH05136463 A JP H05136463A JP 3321234 A JP3321234 A JP 3321234A JP 32123491 A JP32123491 A JP 32123491A JP H05136463 A JPH05136463 A JP H05136463A
- Authority
- JP
- Japan
- Prior art keywords
- cup
- lead
- light emitting
- tip
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 24
- 229910052742 iron Inorganic materials 0.000 description 12
- 238000000465 moulding Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 2
- 239000006060 molten glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はＬＥＤ用リードフレーム
であり、更に詳細には、リードの先端部分にカップが形
成され、且つ前記カップの平坦な底面に発光素子が搭載
されるＬＥＤ用リードフレームに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED lead frame, more specifically, an LED lead frame in which a cup is formed at the tip of the lead and a light emitting element is mounted on the flat bottom surface of the cup. Regarding
【０００２】[0002]
【従来の技術】近年、発光ダイオード等の発光素子をレ
ンズ中に封入したＬＥＤが汎用されている。このＬＥＤ
は、図５に示す如く、リード１００の先端部に形成され
たカップ１０２の平坦な底面部に搭載された発光素子１
０６がレンズ１１２中に封入されているものであるかか
る発光素子１０６は、リード１００の近傍に位置するセ
カンドボンディング用リード１０８の端面にワイヤ１１
０がボンディングされており、このセカンドボンディン
グ用リード１０８の先端部もレンズ１１２中に封入され
ている。2. Description of the Related Art In recent years, LEDs in which a light emitting element such as a light emitting diode is enclosed in a lens have been widely used. This LED
As shown in FIG. 5, the light emitting element 1 mounted on the flat bottom surface of the cup 102 formed at the tip of the lead 100 is shown in FIG.
Such a light emitting element 106, in which 06 is encapsulated in the lens 112, has the wire 11 on the end face of the second bonding lead 108 located near the lead 100.
0 is bonded, and the tip portion of the second bonding lead 108 is also enclosed in the lens 112.
【０００３】この様なカップ１０２を先端部に形成され
たリード１００はプレス加工によって形成される。先
ず、板状体を板状体の面に対して直角方法から打ち抜い
てリード１００を形成し、その後、リード１００の端面
をリード１００の長軸方向にプレス加工を施してカップ
１０２を形成する。図６に、かかるプレス加工によって
形成されたＬＥＤ用リードフレームを示す。図６に示す
様に、プレス加工によってリード１００と同時にセカン
ドボンディング用リード１０８も形成される。このセカ
ンドボンディング用リード１０８とリード１００とは、
両リードの一端がフレーム１１６に連結されていると共
に、両リードの途中もバー１１４によって連結され、ば
らつき防止が図られている。A lead 100 having such a cup 102 formed at the tip thereof is formed by pressing. First, the plate-shaped body is punched by a method perpendicular to the surface of the plate-shaped body to form the lead 100, and then the end surface of the lead 100 is pressed in the longitudinal direction of the lead 100 to form the cup 102. FIG. 6 shows an LED lead frame formed by such press working. As shown in FIG. 6, the second bonding lead 108 is formed simultaneously with the lead 100 by press working. The second bonding lead 108 and the lead 100 are
One end of both leads is connected to the frame 116, and the middle of both leads is also connected by the bar 114 to prevent variation.
【０００４】図６に示すＬＥＤ用リードフレームを用い
たＬＥＤの製造は、カップ１０２の平坦な底面に搭載さ
れた発光素子１０６とセカンドボンディング用リード１
０８の先端とをワイヤボンディングする。その後、リー
ド１００のカップ１０２を含む先端部及びセカンドボン
ディング用リード１０８の先端部をレンズ形成用金型の
溶融ガラス溜め中に挿入し冷却して、両リードの先端部
にレンズ１１２を形成する。尚、両リードを連結するバ
ー１１４及びフレーム１１６は、レンズ１１２が形成さ
れた後、両リードと切り離される。An LED using the LED lead frame shown in FIG. 6 is manufactured by manufacturing the light emitting element 106 mounted on the flat bottom surface of the cup 102 and the second bonding lead 1.
The tip of 08 is wire-bonded. After that, the tip portion of the lead 100 including the cup 102 and the tip portion of the second bonding lead 108 are inserted into the molten glass reservoir of the lens forming mold and cooled to form the lens 112 at the tip portions of both leads. The bar 114 and the frame 116 connecting the leads are separated from the leads after the lens 112 is formed.
【０００５】[0005]
【発明が解決しようとする課題】この様な図５及び図６
に示す従来のＬＥＤ用リードフレームによれば、発光素
子１０６による発光をカップ１０２の内壁面によって集
光して所定の方向に強い光を放射するＬＥＤを製造する
ことができる。ところで、最近、従来の発光素子よりも
大型で且つ高輝度の発光素子が使用されつつあり、発光
素子が搭載されるカップも従来よりも大径で且つ深さも
深いものが要求されるようになってきた。一方、リード
１００の先端部に高輝度タイプの発光素子を搭載できる
大型のカップ１０２をプレス加工によって形成するため
には、板厚の厚い板状体にプレス加工を施すことが必要
である。5 and 6 as described above.
According to the conventional LED lead frame shown in (1), it is possible to manufacture an LED in which the light emitted from the light emitting element 106 is condensed by the inner wall surface of the cup 102 to emit strong light in a predetermined direction. By the way, recently, a light emitting element having a larger size and higher brightness than a conventional light emitting element is being used, and a cup on which the light emitting element is mounted is also required to have a larger diameter and a deeper depth. Came. On the other hand, in order to form a large cup 102 capable of mounting a high-luminance type light emitting element at the tip of the lead 100 by pressing, it is necessary to press a thick plate-shaped body.
【０００６】しかしながら、通常、プレス加工してＬＥ
Ｄ用リードフレームを形成する板状体は鉄板であって、
銅板等に比較してプレス加工性（打ち抜き性）が劣るた
め、プレス加工に供する鉄板の板厚を厚くすることには
限界がある。また、発光素子を搭載するカップの底面
は、発光素子とレンズとの光軸を一致させることを要す
るために平坦性が要求される。ところが、打ち抜き性の
劣る板厚の厚い鉄板をプレス加工に供すると、カップ底
面となるリード端面を平坦に保つことが困難となる。他
方、良好な打ち抜き性を維持するため、板厚の薄い鉄板
をプレス加工に供するならば、発光素子を搭載するカッ
プ底面の面積を確保すべく、カップの板厚を可及的に薄
くする必要がある。この場合、金型のポンチとダイとの
クリアランスを可及的に狭くしてカップの板厚を薄くす
ることを要するが、金型部品等の磨耗が激しくなるため
に部品交換周期が短期間となる欠点がある。[0006] However, normally, LE
The plate-like body forming the D lead frame is an iron plate,
Since press workability (punching property) is inferior to that of a copper plate or the like, there is a limit to increasing the thickness of the iron plate used for press working. Further, since the bottom surface of the cup on which the light emitting element is mounted needs to have the optical axes of the light emitting element and the lens aligned with each other, flatness is required. However, when a thick iron plate having a poor punchability is subjected to press working, it becomes difficult to keep the lead end surface, which is the bottom surface of the cup, flat. On the other hand, in order to maintain good punchability, if a thin iron plate is used for press working, it is necessary to make the plate thickness of the cup as thin as possible to secure the area of the bottom surface of the cup on which the light emitting element is mounted. There is. In this case, it is necessary to reduce the clearance between the die punch and the die as much as possible to reduce the plate thickness of the cup, but the wear of die parts and the like becomes severe and the part replacement cycle is short. There is a drawback.
【０００７】そこで、本発明の目的は、プレス加工に供
する鉄板の板厚を厚くすることなく大型の発光素子を搭
載できるＬＥＤ用リードフレームを提供することにあ
る。Therefore, an object of the present invention is to provide an LED lead frame on which a large-sized light emitting element can be mounted without increasing the thickness of an iron plate used for press working.
【０００８】[0008]
【課題を解決するための手段】本発明者は、前記目的を
達成すべく検討を重ねた結果、プレス加工で板状体を打
ち抜いて形成したリード先端部に、前記打ち抜き方向の
面にプレス加工によってカップを形成することによっ
て、プレス加工に供する鉄板の板厚さを薄くしても大型
のカップを形成できることを見出し、本発明に到達し
た。即ち、本発明は、プレス加工によって板状体を打ち
抜いて形成されたリードの先端部分にカップが形成さ
れ、且つ前記カップの平坦な底面に発光素子が搭載され
るＬＥＤ用リードフレームおいて、該板状体の打ち抜き
方向の面に形成されたリード先端部のカップが、前記カ
ップの開放口が所望の光放射方向に向くように、リード
との境界近傍で曲折されていることを特徴とするＬＥＤ
用リードフレームにある。かかる構成の本発明におい
て、カップの平坦な平面に搭載される発光素子とワイヤ
ボンディングされるセカンドボンディング用リードの先
端部に形成されたボンディング部が曲折されていること
が、発光素子とのワイヤボンディングエリヤを広くとる
ことができる。As a result of repeated studies to achieve the above-mentioned object, the present inventor has found that the tip of the lead formed by punching a plate-like body by press working presses the surface in the punching direction. The present invention has been found out that a large-sized cup can be formed by forming a cup by the method even if the thickness of the iron plate used for press working is thin. That is, the present invention provides an LED lead frame in which a cup is formed at the tip of a lead formed by punching a plate-shaped body by press working, and a light emitting element is mounted on the flat bottom surface of the cup. The cup at the tip of the lead formed on the surface of the plate-shaped body in the punching direction is bent in the vicinity of the boundary with the lead so that the opening of the cup faces the desired light emission direction. LED
On the lead frame. In the present invention having such a configuration, the wire bonding with the light emitting element is that the bonding portion formed at the tip of the second bonding lead wire-bonded with the light emitting element mounted on the flat plane of the cup is bent. You can take a wide area.
【０００９】[0009]
【作用】本発明によれば、プレス加工によって板状体を
打ち抜いて形成されたリード先端部に、その打ち抜き方
向の面にカップを形成できるため、プレス加工に供する
板状体としてプレス加工性が良好な薄板を使用でき、し
かも任意の大きさのカップを形成できる。このため、搭
載する発光素子の大きさに適合した面積の平坦面をカッ
プ底面に確保でき、大型の高輝度タイプの発光素子を搭
載できるＬＥＤ用リードフレームをプレス加工によって
容易に成形できるのである。According to the present invention, a cup can be formed on the surface in the punching direction at the tip of the lead formed by punching a plate-shaped body by press working, so that the plate-shaped body used for press working has high press workability. A good thin plate can be used, and a cup of any size can be formed. Therefore, a flat surface having an area suitable for the size of the mounted light emitting element can be secured on the bottom surface of the cup, and the LED lead frame on which the large-sized high-luminance type light emitting element can be mounted can be easily formed by press working.
【００１０】[0010]
【実施例】本発明を図面を用いて更に詳細に説明する。
図１は、本発明の一実施例を示す斜視図である。図１に
示すＬＥＤ用リードフレーム１０は、リード１６の先端
部において、リード１６との境界近傍で直角に曲折され
たカップ１２が形成され、カップ１２の平坦な底面に発
光素子２２が搭載される。このカップ１２の内周面には
めっきが施されており、発光素子２２からの光をカップ
１２の開放口方向に集光して放射する。発光素子２２
は、セカンドボンディング用リード１４（以下、リード
１４と称することがある）の先端部に幅広に形成された
ボンディング部１８にワイヤ２０によってワイヤボンデ
ィングされている。本実施例のボンディング部１８は、
リード１４との境界近傍において、リード１４に対して
直角に且つカップ１２と同一方向に曲折されているた
め、発光素子２２とのボンディングエリヤを広く取るこ
とができる。この様に曲折されたカップ１２及びボンデ
ィングエリヤ１８は、リード１４、１６の一部分と共に
レンズ２４中に封入されてＬＥＤを構成する。The present invention will be described in more detail with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of the present invention. In the LED lead frame 10 shown in FIG. 1, a cup 12 bent at a right angle is formed in the vicinity of the boundary with the lead 16 at the tip of the lead 16, and a light emitting element 22 is mounted on the flat bottom surface of the cup 12. .. The inner peripheral surface of the cup 12 is plated so that the light from the light emitting element 22 is condensed and emitted toward the opening of the cup 12. Light emitting element 22
Is wire-bonded by a wire 20 to a bonding portion 18 formed wide at the tip of the second bonding lead 14 (hereinafter, also referred to as the lead 14). The bonding portion 18 of this embodiment is
Since it is bent at a right angle to the lead 14 and in the same direction as the cup 12 in the vicinity of the boundary with the lead 14, a wide bonding area with the light emitting element 22 can be secured. The cup 12 and the bonding area 18 bent in this manner are enclosed in a lens 24 together with a part of the leads 14 and 16 to form an LED.
【００１１】かかる図１に示すＬＥＤ用リードフレーム
１０（以下、リードフレーム１０と称することがある）
は、図２に示す様にして成形することができる。先ず、
図２ａに示す様に、プレス加工によって鉄板を打ち抜き
リード１４、１６が平行になるように成形する。その際
に、リード１４の先端部に形成するボンディグ部１８を
リード１４の本体よりも幅広に成形し、リード１６の先
端部にプレス加工によって底面２６が平坦なカップ１２
を形成する。尚、リード１４、１６は、ばらつきを防止
すべく、バー２８によって連結されている。次に、図２
ａのボンディング部１８とカップ１２との各々は、図２
ｂに示す如く、曲折方向が同一方向となるように、各リ
ードに対して直角に曲折する。その後、底面に発光素子
２２が搭載されたカップ１２、及び発光素子２２とワイ
ヤボンディングされたボンディング部１８は、レンズ成
形用金型の溶融ガラス溜め中にリード１４、１６の一部
分と共に浸漬・冷却される。尚、リード１４、１６を連
結するバー２８は、レンズ２４が成形された後、リード
１４、１６から切り離される。The LED lead frame 10 shown in FIG. 1 (hereinafter sometimes referred to as the lead frame 10)
Can be molded as shown in FIG. First,
As shown in FIG. 2a, a punched iron plate is formed by pressing so that the leads 14 and 16 are parallel to each other. At this time, the bonding portion 18 formed at the tip of the lead 14 is formed wider than the body of the lead 14, and the tip of the lead 16 is pressed to form a cup 12 having a flat bottom surface 26.
To form. The leads 14 and 16 are connected by a bar 28 to prevent variations. Next, FIG.
Each of the bonding portion 18 and the cup 12 of FIG.
As shown in b, the leads are bent at right angles so that they are bent in the same direction. After that, the cup 12 having the light emitting element 22 mounted on the bottom surface and the bonding portion 18 wire-bonded to the light emitting element 22 are immersed and cooled together with a part of the leads 14 and 16 in the molten glass reservoir of the lens molding die. It The bar 28 connecting the leads 14 and 16 is separated from the leads 14 and 16 after the lens 24 is molded.
【００１２】本実施例においては、カップ１２及びボン
ディング部１８を鉄板の打ち抜き方向の面に成形するた
め、プレス加工に供する鉄板を薄板とすることができ、
プレス加工性を維持でき且つ鉄板の厚肉化による金型部
品等の交換周期の短期化を防止できる。また、カップ１
２を曲折するため、カップ１２の開放口の方向を任意に
変更することができ、成形するレンズ２４の光軸とカッ
プ１２の光放射方向とを容易に一致させることができ
る。In the present embodiment, since the cup 12 and the bonding portion 18 are formed on the surface of the iron plate in the punching direction, the iron plate to be subjected to the press working can be a thin plate.
It is possible to maintain press workability and prevent shortening of the replacement cycle of mold parts and the like due to thickening of the iron plate. Also, cup 1
Since 2 is bent, the direction of the opening of the cup 12 can be arbitrarily changed, and the optical axis of the lens 24 to be molded and the light emission direction of the cup 12 can be easily matched.
【００１３】図１及び図２に示すリードフレームにおい
て、キャップ１２及びボンディング部１８は、同一方向
に曲折されているが、図３に示す様に、キャップ１２及
びボンディング部１８が互いに対向するように曲折され
ていてもよい。また、図３に示すリードフレーム１０
は、キャップ１２及びボンディング部１８がレンズ２４
中に封入されているが、リード１４、１６はレンズ２４
の外部に在る。この様な図３に示すリードフレーム１０
は、鉄板をプレス加工することによって図４に示すフレ
ームを成形することによって得ることができる。つま
り、プレス加工によって鉄板を打ち抜いて枠体３０内の
互いに対向する位置にリード１４及びリード１６を成形
し、更にリード１４の先端部の打ち抜き方向の面にリー
ド１４よりも幅広のボンディング部１８を形成すると共
に、リード１６の先端部の打ち抜き方向の面にカップ１
２を成形する。この際に、リード１４同士を連結するバ
ー３４及びリード１６同士を連結するバー３２を形成
し、リード１４、１６のばらつきを防止する。In the lead frame shown in FIGS. 1 and 2, the cap 12 and the bonding portion 18 are bent in the same direction, but as shown in FIG. 3, the cap 12 and the bonding portion 18 face each other. It may be bent. In addition, the lead frame 10 shown in FIG.
Is the lens 24 with the cap 12 and the bonding portion 18.
Although enclosed inside, the leads 14 and 16 are the lens 24.
Outside of. Such a lead frame 10 shown in FIG.
Can be obtained by forming a frame shown in FIG. 4 by pressing an iron plate. That is, the iron plate is punched out by press working to form the leads 14 and the leads 16 at positions facing each other in the frame body 30, and further, a bonding portion 18 wider than the lead 14 is formed on the surface of the leading end of the lead 14 in the punching direction. In addition to forming the cup 1 on the surface of the lead 16 in the punching direction,
Mold 2. At this time, a bar 34 connecting the leads 14 to each other and a bar 32 connecting the leads 16 to each other are formed to prevent variations in the leads 14 and 16.
【００１４】かかる形状のフレームは、直線状に延びて
いるリード１４の先端部に形成されたカップ１２の底面
２６に発光素子２２に搭載し、ボンディング部１８との
間にワイヤボンディングを施した後、インサート成形に
供する。インサート成形においては、発光素子２２が搭
載されたカップ１２とボンディング部１８とが封入され
たレンズ２４を成形する。その後、枠体３０及びバー３
２、３４から切り離されたリード１４、１６を、ボンデ
ィング部１８及びカップ１２とを、各リードとの境界近
傍で曲折することによって、図３に示すリードフレーム
１０を得ることができる。The frame having such a shape is mounted on the light emitting element 22 on the bottom surface 26 of the cup 12 formed at the tip of the lead 14 extending linearly, and after wire bonding with the bonding portion 18. , Subject to insert molding. In the insert molding, the lens 24 in which the cup 12 in which the light emitting element 22 is mounted and the bonding portion 18 are enclosed is molded. After that, the frame 30 and the bar 3
By bending the leads 14 and 16 separated from the wires 2 and 34 together with the bonding portion 18 and the cup 12 in the vicinity of the boundary with each lead, the lead frame 10 shown in FIG. 3 can be obtained.
【００１５】[0015]
【発明の効果】本発明によれば、薄板を用いて高輝度タ
イプの大型の発光素子を搭載できるＬＥＤ用リードフレ
ームを容易に形成でき、且つ金型の管理等の負担も軽減
できるため、ＬＥＤ用リードフレームの製造コストの低
減を図ることができる。According to the present invention, a lead frame for an LED capable of mounting a large-sized light emitting element of high brightness type can be easily formed by using a thin plate, and the burden of mold management and the like can be reduced. It is possible to reduce the manufacturing cost of the lead frame for use.
【図１】本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
【図２】図１のリードフレームの成形方法を説明する説
明図である。FIG. 2 is an explanatory diagram illustrating a method for molding the lead frame in FIG.
【図３】他の実施例を示す斜視図である。FIG. 3 is a perspective view showing another embodiment.
【図４】図３のリードフレームの成形方法を説明する説
明図である。FIG. 4 is an explanatory diagram illustrating a method for molding the lead frame in FIG.
【図５】従来のリードフレームを示す斜視図である。FIG. 5 is a perspective view showing a conventional lead frame.
【図６】図５の従来のリードフレームの成形方法を説明
する説明図である。FIG. 6 is an explanatory diagram illustrating a method of molding the conventional lead frame of FIG.
１０ ＬＥＤ用リードフレーム １２ カップ １４ セカンドボンディング用リード １６ リード １８ ボンディング部 ２２ 発光素子 ２６ カップ１２の底面 10 LED Lead Frame 12 Cup 14 Second Bonding Lead 16 Lead 18 Bonding Part 22 Light Emitting Element 26 Bottom of Cup 12
Claims (2)
形成されたリードの先端部にカップが形成され、且つ前
記カップの平坦な底面に発光素子が搭載されるＬＥＤ用
リードフレームおいて、 該板状体の打ち抜き方向の面に形成されたリード先端部
のカップが、前記カップの開放口が所望の光放射方向に
向くように、リードとの境界近傍で曲折されていること
を特徴とするＬＥＤ用リードフレーム。1. An LED lead frame in which a cup is formed at a tip of a lead formed by punching a plate-like body by press working, and a light emitting element is mounted on a flat bottom surface of the cup. An LED characterized in that a cup at the tip of the lead formed on the surface of the strip in the punching direction is bent near the boundary with the lead so that the opening of the cup faces the desired light emission direction. For lead frame.
子とワイヤボンディングされるセカンドボンディング用
リードの先端部に形成されたボンディング部が曲折され
ている請求項１記載のＬＥＤ用リードフレーム。2. The LED lead frame according to claim 1, wherein a bonding portion formed at a tip portion of a second bonding lead wire-bonded to the light emitting element mounted on the flat plane of the cup is bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3321234A JPH05136463A (en) | 1991-11-08 | 1991-11-08 | Led lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3321234A JPH05136463A (en) | 1991-11-08 | 1991-11-08 | Led lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05136463A true JPH05136463A (en) | 1993-06-01 |
Family
ID=18130314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3321234A Pending JPH05136463A (en) | 1991-11-08 | 1991-11-08 | Led lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05136463A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010108939A (en) * | 2000-06-01 | 2001-12-08 | 유무친 | Light emitting diode and manufacturing process thereof with blank |
| WO2004107443A1 (en) * | 2003-06-03 | 2004-12-09 | Asetronics Ag | Insulated metal substrate with at least one light diode, light diode matrix and production method |
| US20110081736A1 (en) * | 2009-10-02 | 2011-04-07 | Chuang Chien-Te | Method for manufacturing light-emitting diode devices |
| JP2011082420A (en) * | 2009-10-09 | 2011-04-21 | Stanley Electric Co Ltd | Light emitting diode and method of manufacturing the same |
| JP2012190917A (en) * | 2011-03-09 | 2012-10-04 | Stanley Electric Co Ltd | Light emitting diode and manufacturing method of the same |
| CN107910421A (en) * | 2017-10-13 | 2018-04-13 | 上海隆因诺光电有限公司 | A kind of material and method that LED support is prepared by imprint lithography techniques |
-
1991
- 1991-11-08 JP JP3321234A patent/JPH05136463A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010108939A (en) * | 2000-06-01 | 2001-12-08 | 유무친 | Light emitting diode and manufacturing process thereof with blank |
| WO2004107443A1 (en) * | 2003-06-03 | 2004-12-09 | Asetronics Ag | Insulated metal substrate with at least one light diode, light diode matrix and production method |
| US20110081736A1 (en) * | 2009-10-02 | 2011-04-07 | Chuang Chien-Te | Method for manufacturing light-emitting diode devices |
| US8318513B2 (en) * | 2009-10-02 | 2012-11-27 | Everlight Electronics Co., Ltd. | Method of encapsulating light-emitting diode devices using bent frames |
| TWI385835B (en) * | 2009-10-02 | 2013-02-11 | Everlight Electronics Co Ltd | Method for manufacturing light emitting diode device |
| JP2011082420A (en) * | 2009-10-09 | 2011-04-21 | Stanley Electric Co Ltd | Light emitting diode and method of manufacturing the same |
| JP2012190917A (en) * | 2011-03-09 | 2012-10-04 | Stanley Electric Co Ltd | Light emitting diode and manufacturing method of the same |
| CN107910421A (en) * | 2017-10-13 | 2018-04-13 | 上海隆因诺光电有限公司 | A kind of material and method that LED support is prepared by imprint lithography techniques |
| CN107910421B (en) * | 2017-10-13 | 2021-06-01 | 上海芯邦新材料科技有限公司 | A kind of material and method for preparing LED bracket by imprint lithography technology |
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