JPH05136220A - Prober for semiconductor device - Google Patents

Abstract

PURPOSE:To completely automate the initial work of P/W, which had to be done attended at least once by a main in the past, by performing the alignment between a probe and a pad in the check value of P/W automatically. CONSTITUTION:The probe caught by a CCD camera 6 is replaced as the data on the coordinates with a probe card position correction controller 7, and the deviation from the coordinate of the pad is detected, and the positional correction of the prove card 3 is performed, by having said CCD camera 6 and prove card position correction controller 7 in addition to the conventional prober constitution.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probing device for connecting a pellet and a test device when manufacturing a semiconductor device (hereinafter referred to as "pellet"), and particularly to automatically correcting the position of a probe on a probe guard. Regarding the function to do.

[0002]

2. Description of the Related Art A conventional probing apparatus has a metal microscope 12 in a probing apparatus 1 as shown in FIG. 6 showing an overall schematic view (A) and a plan view of a wafer stage (B). It is controlled by the device 2.

Next, the operation will be described with reference to the flowchart of FIG.

Start the prober first (START)
Then, the semiconductor wafer is placed on the stage, parallel line alignment of the semiconductor wafer (wafer parallel line alignment, wafer setting) is performed, and the wafer center is set at the card center. After that, the prober temporarily stops (STO
P), manually align the position of the probe and the position of the terminal (pad) including the input / output terminal (probe card position correction), and store the position in the prober (pellet position memory), and the function and electrical characteristics (hereinafter , P / W check) is started (P / W, START). From the next semiconductor wafer, P / W is carried out by aligning the pellet with the first stored position.

[0005]

In this conventional probing device, since the position of the probe card is manually corrected, a person must perform the alignment at least once. It was difficult to do.

Further, since the P / Ws of the second and subsequent sheets are adjusted to the positions stored in the first sheet, there is a possibility that probe misalignment may occur.

[0007]

In the probing apparatus of the present invention, a CCD camera for detecting the position of the probe and a CCD
It is provided with a probe card position correction control device that obtains probe card correction data from the image of the camera and the pad coordinate data and sends the data to the prober.

[0008]

The present invention will be described below with reference to the drawings.

FIG. 1 is a schematic view (A) showing an entire embodiment of the present invention and a plan view (B) of a wafer stage.
In addition to the conventional probing device, a CCD camera 6,
The probe card position correction control device 7 of the present invention is connected.

That is, the probing device is composed of the prober body 1 and the probe card position correction control device 7. The prober main body 1 is provided with a wafer stage 5 on which the semiconductor wafer 12 is mounted on an XY stage, and the probe card 3 having a large number of probes 4 for its information.
Are mounted and provided with a prober control device 2 for controlling them. A large number of pads (terminals including input / output terminals) 14 of each pellet in the semiconductor wafer 13 and the probe 4 are brought into contact with each other to electrically measure the pellet. on the other hand,
The probe card position correction control device 7 is provided with a pattern recognition circuit 8, a storage circuit 9, a logic circuit 10 and a prober interface 11. Then, signals are transmitted between the prober main body 1 and the probe card position correction controller 7 as indicated by arrows 12 and 13. Further, a CCD is provided on the upper surface side (front surface side) of the wafer stage 5.
The camera 6 is mounted toward the probe 4 of the probe card 3.

The probe card position correction method will be described with reference to the flow charts of FIGS. 2 and 3.

First, the probe 4 is started ((START) in FIG. 3), and first the CCD camera 6 identifies the probe 4 ((A) in FIG. 2) (probe identification) in FIG. The pattern recognition circuit 8 converts it into a point for the X and Y coordinates on the prober ((B) of FIG. 2) and obtains the coordinates of the tip of the probe 4. In the example of FIG. 2C, the coordinates are X1 and Y1 ((probe tip coordinate) of FIG. 3). Next, the coordinate shift between the putt coordinates X2 and Y2 stored in the rough storage circuit 9 and the probe coordinates X1 and Y1 is X2-X1 and Y-2-.
Y1 is determined ((D) of FIG. 2 and (comparison with pad coordinates) of FIG. 3). This coordinate comparison is performed for all the probes, X2-X1 and Y2-1 of all pins are almost the same, and X2-X1 and Y2-Y1 are within the standard range initially set (see FIG. 3). Of (is the gap with the pad coordinates within the standard))
The condition that becomes is determined by 10 logic circuits, and is sent as probe card position correction value ((probe card position correction) in FIG. 3) to the prober control device 2 by 11 prober face, and the position of the probe card is determined. decide.
At this time, if the probe 4 and the pad do not match due to the above reasons of the probe card, an alarm signal is sent to the prober control device 2.
To stop the prober ((alarm ST
OP)). When the positions are matched, the inspection is started ((P / W, START) in FIG. 3).

The flowcharts of FIGS. 4 and 5 show an embodiment in which the position of the tip of the probe can be shifted by the amount of overdrive.

In this embodiment, the direction of the probe is obtained by approximating it to a temporary formula, and the probe position correction value previously stored in the memory circuit 9 is set to a, and the tip X of the probe is calculated by the following formula (1).
The correction values X11, Y11 from 1, 1, Y1 are determined.

[0015]

[0016]

As described above, in the probing device of the present invention, the CCD camera and the probe card position correction controller can automatically recognize the position of the probe on the probe card with respect to the pad coordinates. Since this is done, there is an effect that the position of the probe card can be automatically aligned with the pad.

[Brief description of drawings]

1A and 1B are views showing an embodiment of the present invention, in which FIG. 1A is an overall schematic view and FIG. 1B is a plan view of a wafer stage.

FIG. 2 is a diagram showing a correction value detection method according to an embodiment of the present invention.

FIG. 3 shows the probing device shown in FIG.
The figure which shows the flowchart at the time of implementing by the method of.

FIG. 4 is a diagram showing a correction value detection method according to another embodiment of the present invention.

FIG. 5 shows the probing apparatus shown in FIG.
The figure which shows the flowchart at the time of implementing by the method of.

6A and 6B are views showing a conventional technique, in which FIG. 6A is an overall schematic view and FIG. 6B is a plan view of a wafer stage.

FIG. 7 is a diagram showing a flowchart of a conventional technique.

[Explanation of symbols]

 1 Prober main body 2 Prober control device 3 Probe card 4 Probe 5 Wafer stage 6 CCD camera 7 Probe card position correction control device 8 Pattern recognition circuit 9 Memory circuit 10 Logic circuit 11 Prober interface 12 Metallurgical microscope 13 Semiconductor wafer 14 Bad (terminal)

Claims (1)

[Claims] 1. A function of automatically detecting the position of a probe connecting a terminal in a semiconductor device and a test device for testing the function and electrical characteristics of a semiconductor device manufactured in a semiconductor wafer, and A probing device for a semiconductor device, which has a function of automatically adjusting the position of a terminal and the position of the probe.