JPH05121468A - Apparatus and method for dealing with abnormality - Google Patents

Abstract

PURPOSE:To achieve that even an operator not skilled can deal with the abnormality of a manufacturing apparatus when the abnormality is caused. CONSTITUTION:Individual units of a die bonder apparatus 1 are always monitored by a monitor part 2; the state of the apparatus is displayed on a display part 4 as the typical figure of the apparatus on the basis of the information. When the apparatus becomes abnormal, the operator can release its abnormal state when he inputs an instruction selected from a menu displayed on the display part 4 through a keyboard 5 in such a way that the display of the display part 4 is set to the state of the actual die bonder apparatus 1 and of a work.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an abnormality processing apparatus and an abnormality processing method for canceling an abnormality in a semiconductor manufacturing apparatus or the like.

[0002]

2. Description of the Related Art A conventional semiconductor manufacturing apparatus is provided with a lamp indicating a normal operation and a lamp indicating an abnormality as means for indicating an operating state. FIG. 4 is a front view showing an apparatus state display portion of a conventional semiconductor manufacturing apparatus.

Reference numeral 26 is a unit status indicator lamp that lights up when each part of the semiconductor manufacturing apparatus is operating, 27 is an abnormality occurrence indicator lamp that lights up when an abnormality occurs in each part of the semiconductor manufacturing apparatus, and 28 is an abnormality occurrence indicator lamp. Is a reset switch for canceling the lighting of.

When an abnormality occurs in the semiconductor manufacturing apparatus, the abnormality occurrence indicator lamp 27 of the generated unit is turned on to inform the operator that the abnormality has occurred. The worker who recognizes the abnormality moves to a position where the abnormality has occurred in the semiconductor manufacturing apparatus to cancel the cause of the abnormality, and then presses the reset switch 28 to start the work.

[0005]

Since the conventional semiconductor manufacturing apparatus has the above-mentioned configuration, when an abnormality occurs, a person manually investigates the details of the abnormality and eliminates the cause of the abnormality. Therefore, the abnormality processing must be performed by a person who is familiar with the semiconductor manufacturing apparatus, and there is a problem that the abnormal state cannot be released without going to the abnormality generating section, which is troublesome.

The present invention has been made in order to solve the above problems, and an object of the present invention is to make it possible for an abnormal operation of a semiconductor manufacturing apparatus to be carried out rapidly even by an unskilled operator. To do.

[0007]

In order to solve the above-mentioned problems, the present invention constantly monitors the state of each unit of a semiconductor manufacturing apparatus by a monitoring means, and normally, the state of each unit and the position of a work are monitored. It is schematically displayed on the display unit. When an abnormality occurs, the location where the abnormality occurs is clearly indicated on the display unit, and the work state of the display unit is changed so that it becomes the same as the actual work state on the semiconductor manufacturing equipment where the abnormality occurred by the instruction input from the keyboard. , This releases the abnormal condition.

[0008]

When an abnormality occurs in the device, the operator can immediately recognize the state and can recover from the abnormal state without moving to the place where the abnormality occurs in the device.

[0009]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing an abnormality processing device of a die bonder device which is an embodiment of the present invention. Reference numeral 1 is a die bonder device, 2 is a monitoring unit that monitors the state of each unit of the die bonder device 1 and a work, and 3 is a control unit that controls the die bonder device 1 based on information from the monitoring unit 2.

A display unit 4 is controlled by the control unit 3 and displays information from the monitoring unit 2 by the control unit 3 as an image of the state of each unit of the die bonder apparatus 1 and the work, and 5 is displayed on the display unit 4. And a keyboard for inputting an instruction to change the state of each unit and the work of the die bonder device 1, an operation instruction of the control unit 3, and the like.

FIG. 2 is a schematic diagram showing a display on the display unit of FIG. 6 is a package display showing a package, 7 is a package pallet display showing a pallet for containing the package, 8 is a loader unit display showing a loader unit for transporting the package, and 9 is a first stage display showing the first stage.

10 is a bonding head display showing a bonding head, 11 is a bonding stage display showing a bonding stage, 12 is a laser unit display showing a laser unit for bonding, 13 is an unloader unit display showing an unloader unit for carrying a package, 14 is a second stage display showing the second stage, 15 is a substrate display showing the substrate on which the package is mounted,
Reference numeral 16 is a board pallet display showing a board pallet for accommodating boards.

FIG. 3 is a flow chart showing the operation of the abnormality processing device. The operation of the abnormality processing apparatus will be described with reference to FIG. 3 by taking an example in which an abnormality has occurred.

First, when the abnormality processing device is activated, the display unit 4
A title and a fixed screen as shown in FIG. 2 are displayed (step 17). Next, the monitoring unit 2 checks the operation status of each unit of the die bonder device 1 (step 1
8) The operating unit displays the operating display on the unit section on the display unit 4 (step 19), and the stopped unit displays the stopped display on the unit unit on the display unit 4. Display (step 20).

When the loader unit causes a pickup error between the package pallet and the first stage, the pickup error of the loader unit is as follows:
First, the package that is the work from the package pallet
It happened because I didn't move to the stage, so there is no package that should be on the first stage.

On the abnormal processing device side, the loader unit moves to the first stage and places the work, so that the work is displayed as being on the first stage.
This is different from the state of the work in the die bonder device reported from the monitoring unit 2.

In this state, the control unit 3 judges that there is an abnormality (step 21), and causes the display unit 4 to display that the abnormality has occurred on the loader unit display 3 along with the operating status of each unit (step 22).

At this time, the operator observes the state of the package and inputs it from the keyboard 5 so as to match the state on the display unit 4 with the state of each unit in which an abnormality has occurred and the state of the work (step 23). The display state of the section 4 is changed (step 24). As a result, the loader unit recognizes that the package, which is the work, is not carried on the first stage and is still on the package pallet.
The operation of conveying the package again occurs.

Thereafter, the input of the "ESC" key from the keyboard 5 is monitored (step 25). If there is an input, the abnormal processing operation is terminated, and if there is no input, the operation returns to step 18 to repeat a series of operations.

In the present invention, the work state on the display unit 4 is arbitrarily changed to cause the die bonder device 1 to carry out a pseudo work transfer operation so that the operation of the unit can be confirmed. Also available for.

[0021]

As described above, in the present invention, the device status is displayed on the display unit as a device configuration diagram for each unit of the device,
When an abnormality occurs, it is possible to check on the display of the abnormality occurrence unit and to cancel the abnormality by inputting instructions from the keyboard without moving to the abnormality part, so even an unskilled operator can quickly handle the abnormality. There is an effect that can be done.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of an abnormality processing device of a die bonder device which is an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a display on a display unit 4 of FIG.

FIG. 3 is a flowchart showing the operation of the abnormality processing device of the first embodiment of the present invention.

FIG. 4 is a front view showing an example of a state display section of a conventional manufacturing apparatus.

[Explanation of symbols]

 1 Die bonder device 2 Monitoring part 3 Control part 4 Display part 5 Keyboard

Claims (2)

[Claims] 1. A display unit for displaying characters and images showing a configuration of a semiconductor manufacturing apparatus, a keyboard for inputting instructions to be executed, and a monitoring unit for monitoring the state of each part of the semiconductor manufacturing apparatus and the state of a work. A control unit that controls the semiconductor manufacturing apparatus, displays an abnormality of the semiconductor manufacturing apparatus based on information from the monitoring unit on the display unit, and cancels the abnormality according to an instruction input from the keyboard. An abnormality processing device comprising: 2. The state of each unit of the semiconductor manufacturing apparatus and the state of the work monitored by the monitoring unit are displayed on the display unit as a configuration diagram of the semiconductor manufacturing apparatus, and the state of each unit and the work state of the semiconductor manufacturing apparatus. When is different from the display on the display unit, this is regarded as an abnormality, and when the abnormality occurs, the detected abnormality is displayed on the display unit, and the state of each unit on the display unit is abnormal An abnormality processing method that cancels the abnormal state by changing the state of each unit of the device.