JPH05117854A - Preparation of article by chemical vapor deposition and supporting member used in the preparation - Google Patents
Preparation of article by chemical vapor deposition and supporting member used in the preparationInfo
- Publication number
- JPH05117854A JPH05117854A JP4101490A JP10149092A JPH05117854A JP H05117854 A JPH05117854 A JP H05117854A JP 4101490 A JP4101490 A JP 4101490A JP 10149092 A JP10149092 A JP 10149092A JP H05117854 A JPH05117854 A JP H05117854A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- article
- etching
- support member
- fragments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005229 chemical vapour deposition Methods 0.000 title claims abstract description 11
- 238000002360 preparation method Methods 0.000 title description 3
- 238000005530 etching Methods 0.000 claims abstract description 47
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 11
- 239000011733 molybdenum Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 12
- 239000012634 fragment Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 150000001722 carbon compounds Chemical class 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 239000008246 gaseous mixture Substances 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000007865 diluting Methods 0.000 claims 1
- 239000010432 diamond Substances 0.000 abstract description 42
- 229910003460 diamond Inorganic materials 0.000 abstract description 41
- 238000007740 vapor deposition Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241001486234 Sciota Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001723 carbon free-radicals Chemical class 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/12—Gaseous compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、化学蒸着法による物品
の製造方法に関し、特に、ダイヤモンド製のウォ―タ―
ジェットノズル及びミキシングチュ―ブを製造する際に
使用される支持部材(サポートマンドレル)に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an article by a chemical vapor deposition method, and more particularly to a diamond water heater.
The present invention relates to a support member (support mandrel) used when manufacturing a jet nozzle and a mixing tube.
【0002】[0002]
【従来の技術】ダイヤモンドは、原子間の距離が1.5
45オングストロ―ムで均一な四面体状に配列している
共有結合した脂肪族sp3 混成炭素原子から専ら構成さ
れる結晶学的網目構造を示す炭素の同素体である。ダイ
ヤモンドは極めて硬く、モ―ス高度は10である。熱伝
導率は銅の4倍であり、しかも電気絶縁体である。その
硬さと熱的性質は、各種産業部品に有用なダイヤモンド
の特性の2つに過ぎない。初期には、宝石としての品質
のない天然のダイヤモンドが各種研磨用途に用いられた
が、高温/高圧法による合成ダイヤモンドが発明されて
以来、一連の付加的な製品が市場で好評を博している。
しかし、合成に高温と高圧が必要なことが合成ダイヤモ
ンドの広範囲な使用を妨げる要因となっている。2. Description of the Related Art Diamond has an interatomic distance of 1.5.
It is an allotrope of carbon showing a crystallographic network composed exclusively of covalently bonded aliphatic sp 3 hybridized carbon atoms arranged in a uniform tetrahedral shape at 45 angstroms. Diamond is extremely hard and has a moth height of 10. It has four times the thermal conductivity of copper and is an electrical insulator. Its hardness and thermal properties are just two of the properties of diamond that are useful in various industrial parts. In the early days, natural diamonds without gem quality were used for various polishing applications, but since the invention of synthetic diamond by the high temperature / high pressure method, a series of additional products have been well received in the market. There is.
However, the requirement of high temperature and high pressure for the synthesis is a factor that prevents the widespread use of synthetic diamond.
【0003】ところが、ダイヤモンドの低圧成長に関す
る工業的努力が積重ねられた結果、各種工業用途にダイ
ヤモンドを使用する可能性が劇的に開けてきた。ダイヤ
モンドの低圧成長は、この分野で「化学蒸着(化学的気
相成長)」または「CVD」とよばれている。このCV
Dプロセスの場合、ダイヤモンドは原子状水素の存在下
低圧で炭化水素ガスから成長する。準安定にダイヤモン
ドを成長させる多くの方法がすでに開示されているが、
一般にそれらの方法は鍵となる反応体である原子状水素
を発生させて系内に搬送する方法がそれぞれ異なってい
る。それらの方法のうち「フィメラント法」といわれる
ものでは、メタンのような気体状炭素化合物と水素との
混合物を使用する。このガス混合物は、熱いフィラメン
トの直上に位置する石英管を介して、実質的に排気され
た反応チャンバ中に導入される。ガス混合物からの水素
がフィラメント表面で解離して原子状水素になり、次に
これが炭素化合物と反応して、加熱された基体(基板)
上への元素状炭素を始めとして凝縮可能な炭素ラジカル
を形成する。However, as a result of accumulated industrial efforts on low pressure growth of diamond, the possibility of using diamond for various industrial applications has been dramatically opened up. Low pressure growth of diamond is referred to in the art as "chemical vapor deposition" or "CVD". This CV
For the D process, diamond grows from hydrocarbon gas at low pressure in the presence of atomic hydrogen. Many methods have already been disclosed for metastable diamond growth,
Generally, these methods differ in the method of generating atomic hydrogen, which is a key reactant, and transferring it into the system. Among those methods, the so-called "Fimelant method" uses a mixture of a gaseous carbon compound such as methane and hydrogen. This gas mixture is introduced into the substantially evacuated reaction chamber via a quartz tube located directly above the hot filament. Hydrogen from the gas mixture dissociates at the filament surface into atomic hydrogen, which then reacts with the carbon compounds to form a heated substrate (substrate).
Form condensable carbon radicals starting with elemental carbon on top.
【0004】別の方法ではフィラメントに加えてプラズ
マ放電を使用する。このプラズマ放電は核生成密度と成
長速度を増大させる働きをし、分散したダイヤモンド粒
子ではなくダイヤモンド薄膜の生成を促進すると考えら
れる。斯かる分野で使用されているプラズマシステムに
は3つの基本的なシステムがある。ひとつはマイクロ波
プラズマシステムであり、ふたつめはRF(誘導結合ま
たは容量結合)プラズマシステムであり、三番目はd.
c.ア―クプラズマシステムである。Another method uses a plasma discharge in addition to the filament. It is believed that this plasma discharge acts to increase the nucleation density and growth rate and promotes the formation of diamond thin films rather than dispersed diamond particles. There are three basic systems in the plasma system used in such fields. One is a microwave plasma system, the second is an RF (inductively coupled or capacitively coupled) plasma system, and the third is d.
c. It is an arc plasma system.
【0005】自立形のダイヤモンド薄膜が必要な場合
は、下層となる基体をエッチング用の酸に露出する如き
通常のエッチング(食刻)技術によって基体を除去する
こともある。CVD法も含めたいろいろなダイヤモンド
蒸着法の概論についてはバッハマン(Bachmann)らの「ダ
イヤモンド薄膜(Diamond Thin Films)」、化学と工学の
ニュ―ス(Chemical & Engineering News)、第67(2
0)巻、第24〜39頁(1989年5月15日)(援
用する)を参照されたい。If a free-standing diamond film is required, the substrate may be removed by conventional etching techniques such as exposing the underlying substrate to an acid for etching. For an overview of various diamond deposition methods, including the CVD method, see Bachmann et al., "Diamond Thin Films," Chemistry and Engineering News, 67th (2).
0), pages 24-39 (May 15, 1989), incorporated by reference.
【0006】[0006]
【発明が解決しようとする課題】自立形のCVDダイヤ
モンド蒸着膜を製造するにはさまざまな問題がある。た
とえば、ダイヤモンドチュ―ブを形成するための下層と
なる直径が約0.102cmで長さが約15.24cmのモ
リブデン製中実心棒のような基体を食刻除去するには1
0日にも及ぶ長いエッチング時間が必要である。この長
いエッチング時間に加えて、除去される心棒と、該心棒
上に蒸着されたダイヤモンドとの界面に形成された反応
生成物がダイヤモンドチュ―ブに隆起と亀裂を生じさせ
ることも判明した。There are various problems in producing a self-supporting CVD diamond vapor deposition film. For example, to etch away a substrate, such as a solid molybdenum mandrel having a diameter of about 0.102 cm and a length of about 15.24 cm, which is the underlying layer for forming a diamond tube, 1
A long etching time of 0 days is required. In addition to this long etching time, it has also been found that reaction products formed at the interface of the removed mandrel and diamond deposited on the mandrel cause ridges and cracks in the diamond tube.
【0007】[0007]
【課題を解決するための手段】本発明は、内面と外面を
有する中空構造体から成る支持部材であって、化学蒸着
法により物品を製造するために使用される支持部材を提
供する。本発明はまた、化学蒸着により物品を製造する
ための方法であって、水素と炭素化合物との気体状混合
物をCVD反応チャンバ中に搬送し、前記混合物にエネ
ルギ―を与えて断片に分解し、内面と、前記物品の形状
と実質的に類似する形状をもつ外面とを有する熱的に安
定な中空基体の表面上に前記断片を析出させ、前記表面
上で前記断片を凝縮させ、形成された前記物品を有する
前記基体をエッチング浴に入れ、前記エッチング浴を撹
拌して前記基体の内面に沿って前記基体を食刻除去して
前記物品を生成せしめる製造法を提供する。所望によ
り、断片を基体の内側表面に蒸着してもよいが、該内側
表面のいずれかの部分はエッチング液に露出するものと
する。SUMMARY OF THE INVENTION The present invention provides a support member comprising a hollow structure having an inner surface and an outer surface, the support member being used to manufacture an article by a chemical vapor deposition process. The present invention is also a method for manufacturing an article by chemical vapor deposition, wherein a gaseous mixture of hydrogen and a carbon compound is conveyed into a CVD reaction chamber, and the mixture is energized to decompose into fragments. Formed by depositing the fragments on a surface of a thermally stable hollow substrate having an inner surface and an outer surface having a shape substantially similar to the shape of the article, condensing the fragments on the surface A manufacturing method is provided in which the substrate having the article is placed in an etching bath, and the etching bath is agitated to etch away the substrate along the inner surface of the substrate to produce the article. If desired, fragments may be deposited on the inner surface of the substrate, but any portion of the inner surface should be exposed to the etchant.
【0008】[0008]
【作用】物品の基体が、その内面に沿って食刻除去され
る。本発明の他の利点は、以下の詳細な説明と添付の特
許請求の範囲の記載および添付の図面から明らかとなる
であろう。本発明をさらに完全に理解するには、添付の
図面と以下の詳細な説明に記載する本発明の具体例を参
照されたい。The substrate of the article is etched away along its inner surface. Other advantages of the invention will be apparent from the following detailed description, the appended claims and the accompanying drawings. For a more complete understanding of the present invention, reference may be made to the embodiments of the invention which are set forth in the accompanying drawings and the detailed description which follows.
【0009】以下では好ましい態様に関して本発明を説
明するが、本発明は以下の態様に限定されることはない
ものと理解されたい。逆に、添付の特許請求の範囲によ
って定義される本発明の思想と範囲内に入る代替、修正
および均等物はすべて包含されるものである。Although the present invention is described below with reference to preferred embodiments, it should be understood that the invention is not limited to the following embodiments. On the contrary, the alternatives, modifications and equivalents are intended to be within the spirit and scope of the invention as defined by the appended claims.
【0010】[0010]
【実施例】近年、ダイヤモンド薄膜から作成される自立
形物品の合成が広く研究されている。このような自立形
物品を製造する際に伴う主要な問題のひとつは、下地層
の基体を除去する方法である。この基体の除去は、ウォ
―タ―ジェットを利用する高圧の切削機械に使われるダ
イヤモンドチュ―ブの如き中空物品を製造する場合に一
層困難になる。好ましいエッチング浴は加熱されたエッ
チング浴からなり、該エッチング浴は、水中濃度が約3
6〜約38重量%の塩酸と、水中濃度が約69〜約71
重量%の硝酸と、水中濃度が約49〜約51重量%のフ
ッ酸とを等量部で含む混合物からなるのが好ましい。こ
のエッチング浴は約110〜約120℃に加熱するのが
好ましい。これに代わる別のエッチング液は、約69〜
約71%の濃度を有する硝酸3重量部と約36〜約38
%の濃度を有する塩酸1重量部との混合物からなる。し
かしながら、エッチングしようとする基体と反応するよ
うに適切に適合させたその他のエッチング液で代替する
ことは当業者には明らかである。エッチング浴は選択し
たエッチング液の沸点より約5〜約10℃低い温度に保
つのが好ましい。EXAMPLES Recently, the synthesis of free-standing articles made from diamond thin films has been extensively studied. One of the major problems with producing such free-standing articles is the method of removing the underlying substrate. Removal of this substrate becomes more difficult when manufacturing hollow articles such as diamond tubes used in high pressure cutting machines utilizing water jets. A preferred etching bath comprises a heated etching bath, the etching bath having a concentration in water of about 3
6 to about 38% by weight hydrochloric acid and a concentration in water of about 69 to about 71
It preferably consists of a mixture containing equal parts by weight of nitric acid and hydrofluoric acid having a concentration in water of about 49 to about 51% by weight. The etching bath is preferably heated to about 110 to about 120 ° C. Another alternative etching solution is about 69-
3 parts by weight nitric acid having a concentration of about 71% and about 36 to about 38
It consists of a mixture with 1 part by weight of hydrochloric acid having a concentration of%. However, it will be apparent to those skilled in the art to substitute other etchants that are suitably adapted to react with the substrate to be etched. The etching bath is preferably maintained at a temperature of about 5 ° C to about 10 ° C below the boiling point of the selected etchant.
【0011】エッチング浴は、エッチングされる基体の
面に沿って形成された泡を除去するために撹拌する。こ
の泡がエッチングされる面から除去されないとエッチン
グ作用は止まってしまう。したがって、泡を除去するこ
とによってエッチング作用を持続させる。泡を除去する
にはエッチング浴に超音波撹拌を施してもよい。典型的
には、エッチング時間は次の拡散方程式に従って決定さ
れる。The etching bath is agitated to remove bubbles formed along the surface of the substrate being etched. If this bubble is not removed from the etched surface, the etching action will stop. Therefore, the etching action is sustained by removing the bubbles. The etching bath may be subjected to ultrasonic agitation to remove bubbles. Typically, the etching time is determined according to the diffusion equation:
【0012】X2 =Dt ここで、Xは拡散距離(cm)、Dは液体の拡散係数(cm
2 /秒)、tは基体の長さXをエッチングして除去する
のに必要なエッチング時間(秒)である。但し、本発明
はこの拡散方程式に頼るものでなく、故に、この式に依
存しない。図1及び図2には、中実のコアを有する従来
技術の心棒即ち支持部材10が示されており、該支持部
材10上には、CVDプロセスによりダイヤモンドチュ
―ブ12が形成されている。図1と図2から分かるよう
に、エッチング作用が働く面がダイヤモンドチュ―ブ1
2の管状形状内に幽閉され、したがってエッチングされ
る面にエッチング液を自由に循環させることが難しいの
で、中実のコアをエッチングして除去することは困難で
ある。X 2 = Dt where X is the diffusion distance (cm) and D is the diffusion coefficient of the liquid (cm
2 / sec), t is the etching time (sec) required to remove the length X of the substrate by etching. However, the present invention does not rely on this diffusion equation and therefore does not rely on this equation. 1 and 2 show a prior art mandrel or support member 10 having a solid core on which a diamond tube 12 is formed by a CVD process. As can be seen from FIGS. 1 and 2, the surface on which the etching action works is the diamond tube 1.
It is difficult to etch away the solid core, as it is difficult to freely circulate the etchant over the surface to be entrapped within the tubular shape of 2 and thus to be etched.
【0013】本発明の好適実施例は、図3及び図4に示
されるように、滑かな内面16と外面18とを有する中
空の心棒即ち支持部材(サポートマンドレル)14であ
る。典型的には、外面18は良く磨かれた研磨面であ
る。ダイヤモンド薄膜20は外面18上に形成される。
中空の支持部材14を使用することにより、部材14を
除去するエッチング時間が大幅に短縮され得ることが発
見された。図3に矢印で示されているように、エッチン
グ液は部材14の内面16に沿って効率よく通過するこ
とができ、それによってエッチング作用を向上すること
ができる。図5に好ましいエッチング浴(全体を参照番
号1で示す)を示す。エッチング浴1は、エッチング浴
容器34に入れられたエッチング液32を備えている。
図3の中空支持部材14はエッチング液32中に垂直に
沈めるのが好ましい。エッチング液32が中空支持部材
14を構成する金属と反応すると、部材14の内面16
に沿って形成された泡36が該部材14の上端を通って
広がっていき、したがって部材14の内面16に沿った
エッチング液32の自然な対流が誘発される。このよう
な条件下ではエッチング液の超音波撹拌は必要ないであ
ろう。しかし、場合によって所望であれば、エッチング
浴1に、エッチング液32を撹拌するに適した超音波撹
拌装置30を備えてもよい。図1に示したような中実の
部材10と比較し、中空部材14の別の利点は、エッチ
ングする必要がある金属の量が少なくなるということで
ある。例えば、前述の好ましいエッチング液を用いて、
直径が約0.102cmで、長さが約15.24cmである
従来技術のモリブデン製中実支持部材を食刻除去するに
は、約7.5〜約10日が必要であった。この中実部材
を該中実部材と同じ外寸を有する中空支持部材、たとえ
ば長さ約15.24cm、直径約0.102cm、内径約
0.061cmの中空支持部材と交換すると、エッチング
時間は約10分に短縮された。従って、図3の中空部材
14を使用すると、エッチング時間が相当に短縮され
る。尚、中空部材14の両開放端を、エッチング液が流
入/流出する取入管と排出管とに夫々連結することによ
り、中空部材14を食刻除去することも考えられる。更
に、一連の中空部材14の内面16に沿ってエッチング
液を同時に輸送すべく、一連の中空部材14の各々の開
放端を取入接続箱及び排出接続箱に夫々連結し、エッチ
ング作用の生産性を増大しても良い。The preferred embodiment of the present invention is a hollow mandrel or support mandrel 14 having a smooth inner surface 16 and an outer surface 18, as shown in FIGS. Outer surface 18 is typically a well-polished, polished surface. The diamond thin film 20 is formed on the outer surface 18.
It has been discovered that by using a hollow support member 14, the etching time to remove the member 14 can be significantly reduced. As shown by the arrow in FIG. 3, the etching liquid can efficiently pass along the inner surface 16 of the member 14, thereby improving the etching action. A preferred etching bath (generally designated by reference numeral 1) is shown in FIG. The etching bath 1 includes an etching solution 32 contained in an etching bath container 34.
The hollow support member 14 of FIG. 3 is preferably vertically submerged in the etchant 32. When the etching liquid 32 reacts with the metal forming the hollow support member 14, the inner surface 16 of the member 14 is
Bubbles 36 formed along and spread through the upper end of the member 14, thus inducing natural convection of the etchant 32 along the inner surface 16 of the member 14. Under such conditions ultrasonic agitation of the etchant would not be necessary. However, if desired, the etching bath 1 may be equipped with an ultrasonic stirring device 30 suitable for stirring the etching liquid 32, if desired. Another advantage of hollow member 14 over solid member 10 as shown in FIG. 1 is that less metal needs to be etched. For example, using the preferred etchant described above,
It took about 7.5 to about 10 days to etch away a prior art solid molybdenum support member having a diameter of about 0.102 cm and a length of about 15.24 cm. If this solid member is replaced with a hollow support member having the same outer dimensions as the solid member, for example, a hollow support member having a length of about 15.24 cm, a diameter of about 0.102 cm, and an inner diameter of about 0.061 cm, the etching time is about the same. It was shortened to 10 minutes. Therefore, using the hollow member 14 of FIG. 3 reduces the etching time considerably. It is also conceivable to etch and remove the hollow member 14 by connecting both open ends of the hollow member 14 to an intake pipe and an exhaust pipe through which the etching liquid flows in / out. Further, in order to simultaneously transport the etching liquid along the inner surface 16 of the series of hollow members 14, each open end of the series of hollow members 14 is connected to an inlet connection box and an outlet connection box, respectively, to improve the productivity of the etching operation. May be increased.
【0014】本発明は更に、ダイヤモンド薄膜を蒸着す
るタ―ゲットとして中空の基体を使用する、CVDプロ
セスによって独立したダイヤモンド物品を製造するため
の方法も提供する。本発明に有用なCVDプロセスで
は、水素と炭素化合物の気体状混合物をCVD反応チャ
ンバ内に搬送する。この気体状炭素化合物としては、メ
タン、エタン、プロパンのような飽和炭化水素、および
エチレン、アセチレン、シクロヘキセンのような不飽和
炭化水素がある。また、ベンゼンのような炭素化合物を
その気化状態で使用することも考えられる。しかしメタ
ンが好ましい。炭化水素と水素のモル比は約1:10か
ら約1:1000まで広範囲に変化するが、1:100
が好ましい。この気体状混合物は場合によりアルゴンや
ヘリウムのような不活性ガスで希釈してもよい。CVD
チャンバ内の圧力は約0.01〜約1000トルの範
囲、好ましくは約1〜約800トルの圧力が当業界では
一般的である。The present invention further provides a method for making a freestanding diamond article by a CVD process using a hollow substrate as a target for depositing a diamond film. The CVD process useful in the present invention conveys a gaseous mixture of hydrogen and a carbon compound into a CVD reaction chamber. The gaseous carbon compounds include saturated hydrocarbons such as methane, ethane and propane, and unsaturated hydrocarbons such as ethylene, acetylene and cyclohexene. It is also conceivable to use a carbon compound such as benzene in its vaporized state. However, methane is preferred. The molar ratio of hydrocarbon to hydrogen varies widely from about 1:10 to about 1: 1000, but is 1: 100.
Is preferred. This gaseous mixture may optionally be diluted with an inert gas such as argon or helium. CVD
Pressures in the chamber are in the range of about 0.01 to about 1000 Torr, preferably about 1 to about 800 Torr are common in the art.
【0015】次にこの気体状混合物にエネルギ―を与え
て断片に分解する。混合物にエネルギ―を与えるには、
この混合物を加熱された非反応性のフィラメントの上に
通し、約1750〜約2400℃の温度範囲に加熱する
のが好ましい。このようなフィラメントはタングステ
ン、モリブデン、タンタルまたはこれらの合金で形成さ
れており、タングステンが好ましい。米国特許第4,7
07,384号(援用する)にはこのプロセスが例示さ
れている。場合により、CVDプロセスの間米国特許第
4,740,263号(援用する)に従って基体に電子
衝撃を与えても良い。Next, energy is applied to the gaseous mixture to decompose it into fragments. To give energy to the mixture,
The mixture is preferably passed over heated, non-reactive filaments and heated to a temperature range of about 1750 to about 2400 ° C. Such filaments are formed of tungsten, molybdenum, tantalum or alloys thereof, with tungsten being preferred. U.S. Pat. No. 4,7
No. 07,384 (incorporated) illustrates this process. Optionally, the substrate may be electron bombarded during the CVD process according to US Pat. No. 4,740,263 (incorporated).
【0016】基体を約500〜約1100℃、好ましく
は約850〜約950℃の高温に保つ。基体は、チタ
ン、ジルコニウム、ハフニウム、バナジウム、ニオブ、
タンタル、クロム、モリブデン、タングステン、マンガ
ン、レニウム、鉄、ルビジウム、オスミウム、コバル
ト、ロジウム、インジウム、ニッケル、パラジウム、白
金、銅、銀、金およびこれらの合金のように熱的に安定
な金属、炭化ケイ素、窒化ホウ素、窒化アルミニウムの
ようなセラミックス、炭素(たとえばグラファイト)ま
たはケイ素で作成できる。モリブデンが好ましい。モリ
ブデンのような基体材料とは違ってクロムのようないく
つかの基体材料はダイヤモンド蒸着の前に調製する必要
がある。その調製ステップは、例えば、約1ミクロンの
サイズを有するダイヤモンド粒子をアルカン系アルコ―
ルに懸濁させて撹拌した懸濁液と基体を約5分間接触さ
せることからなる。ダイヤモンド粒子をエチルアルコ―
ルに懸濁させて超音波で撹拌した懸濁液が好ましい。あ
るいは、約1ミクロンのサイズを有するダイヤモンド粒
子を炭化水素油に懸濁させた懸濁液を、基体の表面が曇
るまで基体に擦りつけてもよい。薄いチュ―ブのような
基体の場合、その内部を通るロッドのようなサポ―トに
よって支持し、チュ―ブの外面に沿って断片を析出させ
る間のチュ―ブの変形を防止しなければならないことが
ある。CVDプロセスの詳細については、アンガス(Ang
us)らの「ダイヤモンドおよび「ダイヤモンド様」相の
低圧準安定成長(Low-Pressure, Metastable Growth of
Diamond and ´Diamondlike´ Phases)」、サイエンス
(Science)、第241巻(1988年8月19日)、第
913〜921頁(援用する)を参照されたい。The substrate is maintained at an elevated temperature of about 500 to about 1100 ° C, preferably about 850 to about 950 ° C. The substrate is titanium, zirconium, hafnium, vanadium, niobium,
Thermally stable metals such as tantalum, chromium, molybdenum, tungsten, manganese, rhenium, iron, rubidium, osmium, cobalt, rhodium, indium, nickel, palladium, platinum, copper, silver, gold and their alloys, carbonization It can be made of silicon, ceramics such as boron nitride, aluminum nitride, carbon (eg graphite) or silicon. Molybdenum is preferred. Unlike substrate materials such as molybdenum, some substrate materials such as chromium need to be prepared prior to diamond deposition. The preparation step is performed, for example, by adding diamond particles having a size of about 1 micron to alkane-based alcohols.
The substrate is contacted with the stirred suspension for about 5 minutes. Diamond particles with ethyl alcohol
Preference is given to suspensions which have been suspended in a flask and ultrasonically stirred. Alternatively, a suspension of diamond particles having a size of about 1 micron in a hydrocarbon oil may be rubbed onto the substrate until the surface of the substrate becomes cloudy. In the case of a thin tube-like substrate, it must be supported by a rod-like support running through it to prevent deformation of the tube during deposition of fragments along the tube's outer surface. Sometimes it doesn't. For more information on the CVD process, see Angus (Ang
(US) et al. "Low-Pressure, Metastable Growth of
Diamond and ´Diamondlike´ Phases) 」, Science
(Science), Volume 241 (August 19, 1988), pages 913-921 (incorporated by reference).
【0017】本発明の別実施例を図6に示す。心棒即ち
支持部材40はその外面44上に蒸着されたダイヤモン
ド薄膜46を有している。内面42は、図5に示したエ
ッチング液32のエッチング作用を促進するように鋸歯
状になっている。本発明の更なる別実施例を図7に示
す。心棒即ち支持部材50はその外面54上に蒸着され
たダイヤモンド薄膜56を有している。内面52は多角
形状になっている。Another embodiment of the present invention is shown in FIG. The mandrel or support member 40 has a diamond film 46 deposited on its outer surface 44. The inner surface 42 has a sawtooth shape so as to promote the etching action of the etching solution 32 shown in FIG. Yet another embodiment of the present invention is shown in FIG. The mandrel or support member 50 has a diamond film 56 deposited on its outer surface 54. The inner surface 52 has a polygonal shape.
【0018】本発明の更なる別実施例を図8に示す。心
棒即ち支持部材60は多角形状の外面64上に蒸着され
たダイヤモンド薄膜66を有している。内面62も多角
形状になっており、均一な壁厚をもつ支持部材60を形
成している。本発明の更なる別実施例を図9に示す。基
体70は球形状であり、基体70の外面74上には蒸着
されたダイヤモンド薄膜76がある。内面72をエッチ
ングするには、取込みオリフィス78と排出オリフィス
80とを通し、図5に示したエッチング液32を流す。FIG. 8 shows another embodiment of the present invention. The mandrel or support member 60 has a diamond film 66 deposited on a polygonal outer surface 64. The inner surface 62 is also polygonal and forms the support member 60 having a uniform wall thickness. Yet another embodiment of the present invention is shown in FIG. The substrate 70 is spherical in shape and has an evaporated diamond thin film 76 on the outer surface 74 of the substrate 70. To etch the inner surface 72, the etchant 32 shown in FIG. 5 flows through the intake orifice 78 and the discharge orifice 80.
【0019】本発明は、たとえば流体ノズル、流体ミキ
シングチュ―ブ、集積回路チップ用ヒ―トシンク(heat
sink) 、電気放電機械のワイヤガイド、繊維機械用糸案
内および試験管の製造にも適用され得る。また本発明
は、ダイヤモンドの他に、ケイ素、ゲルマニウム、ホウ
素、アルミニウム、ジルコニウム、タングステン、チタ
ンおよびモリブデンの蒸着にも利用できる。The present invention is applicable to, for example, a fluid nozzle, a fluid mixing tube, and a heat sink for an integrated circuit chip.
It can also be applied to the production of sinks, wire guides for electric discharge machines, yarn guides for textile machines and test tubes. In addition to diamond, the present invention can also be used for vapor deposition of silicon, germanium, boron, aluminum, zirconium, tungsten, titanium and molybdenum.
【0020】上述の特定の実施例は例示のために挙げた
だけであり、本発明の最大の範囲に制限を加えるものと
解してはならない。上記に於いては、本発明の特定実施
例を示して来たが、当業者であれば、特に上記教示に照
らして改変を為し得ることから、本発明は上記実施例に
限定されるものでない。従って、添付の特許請求の範囲
は、本発明の本質的特徴を構成し本発明の真の精神と範
囲内に入る特徴を含む一切の改変を包含するものと解さ
れる。The particular embodiments described above are given by way of illustration only and should not be construed as limiting the maximum scope of the invention. Although specific embodiments of the present invention have been shown above, the present invention is limited to the above embodiments, since those skilled in the art can make modifications in light of the above teachings. Not. Accordingly, the appended claims are to be construed to cover any modification which includes essential features of the invention and which fall within the true spirit and scope of the invention.
【0021】[0021]
【発明の効果】化学蒸着による物品製造方法において、
蒸着が為される支持部材を食刻除去する為の時間が大幅
に短縮され、同時に、物品の隆起乃至亀裂の発生が防止
される。INDUSTRIAL APPLICABILITY In an article manufacturing method by chemical vapor deposition,
The time for etching away the support member to be vapor-deposited is greatly reduced, and at the same time, the formation of ridges or cracks in the article is prevented.
【図1】従来技術に係る中実の支持部材の断面図であ
る。FIG. 1 is a cross-sectional view of a solid support member according to a conventional technique.
【図2】図1の従来技術の中実支持部材の2−2線断面
図である。2 is a sectional view taken along line 2-2 of the conventional solid support member of FIG.
【図3】本発明の好適実施例の断面図である。FIG. 3 is a cross-sectional view of the preferred embodiment of the present invention.
【図4】図3の好適実施例の4−4線断面図である。4 is a sectional view taken along line 4-4 of the preferred embodiment of FIG.
【図5】支持部材の除去に使用するエッチング装置の一
例である。FIG. 5 is an example of an etching apparatus used for removing a support member.
【図6】本発明の別実施例の断面図である。FIG. 6 is a sectional view of another embodiment of the present invention.
【図7】本発明の更なる別実施例の断面図である。FIG. 7 is a sectional view of still another embodiment of the present invention.
【図8】本発明の更なる別実施例の断面図である。FIG. 8 is a sectional view of still another embodiment of the present invention.
【図9】本発明の更なる別実施例の断面図である。FIG. 9 is a sectional view of still another embodiment of the present invention.
1 エッチング浴 10 従来技術の心棒即ち支持(サポートマンドレル) 12 ダイヤモンドチュ―ブ 14、40、50、60、70 本発明による中空の支
持部材 16、72 滑かな内面 18、44、54、74 外面 20、46、56、66、76 ダイヤモンド薄膜 30 超音波撹拌装置 32 エッチング液 36 泡 42 鋸歯状の内面 52、62 多角形状の内面 64 多角形状の外面。 78 取り込みオリフィス 80 排出オリフィスDESCRIPTION OF SYMBOLS 1 Etching bath 10 Prior art mandrel or support (support mandrel) 12 Diamond tube 14, 40, 50, 60, 70 Hollow support member according to the invention 16, 72 Smooth inner surface 18, 44, 54, 74 Outer surface 20 , 46, 56, 66, 76 Diamond thin film 30 Ultrasonic stirrer 32 Etching liquid 36 Foam 42 Serrated inner surface 52, 62 Polygonal inner surface 64 Polygonal outer surface. 78 intake orifice 80 discharge orifice
───────────────────────────────────────────────────── フロントページの続き (72)発明者 ジエームス・フルトン・フライシヤー アメリカ合衆国、ニユーヨーク州、スコテ イア、ウツドサイド・ドライブ、4番 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor James Fulton Flyshear Woodside Drive, 4th, Scotia, New York, USA
Claims (10)
る、化学蒸着による物品製造に使用される支持部材。1. A support member used in the manufacture of articles by chemical vapor deposition, which comprises a hollow structure having an inner surface and an outer surface.
または多角形の形状の内面を有するチュ―ブである、請
求項1記載の支持部材。2. The support member according to claim 1, wherein the support member is a tube having an inner surface having a smooth shape, a sawtooth shape, or a polygonal shape.
1記載の支持部材。3. The support member according to claim 1, wherein the member is made of molybdenum.
バ中に搬送し、 前記混合物にエネルギ―を与えて断片に分解し、 前記物品の形状と実質的に類似する形状をもつ外面と内
面とを有する熱的に安定な中空基体の表面上に前記断片
を析出させ、 前記表面上で前記断片を凝縮させ、 形成された前記物品を有する前記基体をエッチング浴に
入れ、 前記エッチング浴を撹拌して前記基体の前記内面に沿っ
て前記基体を食刻除去して前記物品を生成せしめること
からなる方法。4. A method for manufacturing an article by chemical vapor deposition, comprising transporting a gaseous mixture of hydrogen and a carbon compound into a CVD reaction chamber, applying energy to the mixture to decompose it into fragments, and the shape of the article. Depositing the fragments on a surface of a thermally stable hollow substrate having an outer surface and an inner surface having a shape substantially similar to, condensing the fragments on the surface, and having the article formed A method comprising placing a substrate in an etching bath and stirring the etching bath to etch away the substrate along the inner surface of the substrate to produce the article.
で希釈することを含む、請求項4記載の方法。5. The method of claim 4, further comprising diluting the gaseous mixture with an inert gas.
に充分に加熱された非反応性のフィラメント上に前記混
合物を通過させることによって前記混合物にエネルギ―
を与える、請求項4記載の方法。6. The mixture is energized by passing the mixture over a non-reactive filament sufficiently heated to pyrolyze the mixture into fragments.
The method of claim 4, wherein
せる間前記基体を支持して前記基体の変形を防止するこ
とを含む、請求項4記載の方法。7. The method of claim 4, further comprising supporting the substrate to prevent deformation of the substrate during deposition of the fragments on the substrate.
り、このチュ―ブがその中を通過するロッドによって支
持されている、請求項7記載の方法。8. The method of claim 7 wherein said substrate is a molybdenum tube supported by a rod passing therethrough.
沈めて、前記内面に沿って泡立たせて前記内面に沿った
前記エッチング液の対流を誘導する、請求項4記載の方
法。9. The method of claim 4, wherein the article is vertically submerged in the etching bath and bubbled along the inner surface to induce convection of the etchant along the inner surface.
て、前記基体の前記内面に沿って形成された泡を除去す
る、請求項4記載の方法。10. The method of claim 4, wherein the etching bath is ultrasonically agitated to remove bubbles formed along the inner surface of the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69417091A | 1991-05-01 | 1991-05-01 | |
US694170 | 1991-05-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05117854A true JPH05117854A (en) | 1993-05-14 |
Family
ID=24787699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4101490A Withdrawn JPH05117854A (en) | 1991-05-01 | 1992-04-22 | Preparation of article by chemical vapor deposition and supporting member used in the preparation |
Country Status (9)
Country | Link |
---|---|
US (1) | US5869133A (en) |
EP (1) | EP0511874B1 (en) |
JP (1) | JPH05117854A (en) |
KR (1) | KR920021736A (en) |
CA (1) | CA2065724A1 (en) |
DE (1) | DE69208509D1 (en) |
ES (1) | ES2084280T3 (en) |
IE (1) | IE921371A1 (en) |
ZA (1) | ZA922837B (en) |
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JP2010090417A (en) * | 2008-10-06 | 2010-04-22 | Denso Corp | Die for forming honeycomb structure and method of producing the same |
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-
1992
- 1992-04-09 CA CA002065724A patent/CA2065724A1/en not_active Abandoned
- 1992-04-16 ZA ZA922837A patent/ZA922837B/en unknown
- 1992-04-22 JP JP4101490A patent/JPH05117854A/en not_active Withdrawn
- 1992-04-30 DE DE69208509T patent/DE69208509D1/en not_active Expired - Lifetime
- 1992-04-30 KR KR1019920007371A patent/KR920021736A/en not_active Application Discontinuation
- 1992-04-30 EP EP92303954A patent/EP0511874B1/en not_active Expired - Lifetime
- 1992-04-30 ES ES92303954T patent/ES2084280T3/en not_active Expired - Lifetime
- 1992-07-01 IE IE137192A patent/IE921371A1/en unknown
-
1993
- 1993-09-09 US US08/119,448 patent/US5869133A/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0565645A (en) * | 1991-09-04 | 1993-03-19 | Seiko Epson Corp | Diamond molded body |
JP2010090417A (en) * | 2008-10-06 | 2010-04-22 | Denso Corp | Die for forming honeycomb structure and method of producing the same |
Also Published As
Publication number | Publication date |
---|---|
EP0511874B1 (en) | 1996-02-28 |
ES2084280T3 (en) | 1996-05-01 |
DE69208509D1 (en) | 1996-04-04 |
IE921371A1 (en) | 1992-11-04 |
ZA922837B (en) | 1993-04-28 |
CA2065724A1 (en) | 1992-11-02 |
US5869133A (en) | 1999-02-09 |
KR920021736A (en) | 1992-12-18 |
EP0511874A1 (en) | 1992-11-04 |
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