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JPH0511365B2 - - Google Patents

Info

Publication number
JPH0511365B2
JPH0511365B2 JP60284339A JP28433985A JPH0511365B2 JP H0511365 B2 JPH0511365 B2 JP H0511365B2 JP 60284339 A JP60284339 A JP 60284339A JP 28433985 A JP28433985 A JP 28433985A JP H0511365 B2 JPH0511365 B2 JP H0511365B2
Authority
JP
Japan
Prior art keywords
silver powder
paste
conductive resin
weight
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60284339A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62145602A (ja
Inventor
Mitsuo Waki
Akinobu Kusuhara
Shigenori Yamaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP60284339A priority Critical patent/JPS62145602A/ja
Publication of JPS62145602A publication Critical patent/JPS62145602A/ja
Publication of JPH0511365B2 publication Critical patent/JPH0511365B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP60284339A 1985-12-19 1985-12-19 導電性樹脂ペ−スト Granted JPS62145602A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60284339A JPS62145602A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60284339A JPS62145602A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Publications (2)

Publication Number Publication Date
JPS62145602A JPS62145602A (ja) 1987-06-29
JPH0511365B2 true JPH0511365B2 (de) 1993-02-15

Family

ID=17677291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60284339A Granted JPS62145602A (ja) 1985-12-19 1985-12-19 導電性樹脂ペ−スト

Country Status (1)

Country Link
JP (1) JPS62145602A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016011406A (ja) * 2014-06-03 2016-01-21 太陽インキ製造株式会社 導電性接着剤およびそれを用いた電子部品

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0611842B2 (ja) * 1987-12-23 1994-02-16 住友ベークライト株式会社 導電性樹脂ペースト
JP2688692B2 (ja) * 1988-06-01 1997-12-10 旭化成工業株式会社 金属粉含有エポキシ樹脂組成物
JPH0777086B2 (ja) * 1990-09-20 1995-08-16 住友金属鉱山株式会社 導電性樹脂ペースト
JPH04198251A (ja) * 1990-11-27 1992-07-17 Mitsui Mining & Smelting Co Ltd 導電性組成物
JP3526183B2 (ja) * 1997-09-18 2004-05-10 住友ベークライト株式会社 導電性樹脂ペースト及びこれを用いて製造された半導体装置
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
JP4427374B2 (ja) * 2004-04-05 2010-03-03 アルプス電気株式会社 プリント配線基板およびこの製造方法
JP4600429B2 (ja) * 2007-05-28 2010-12-15 日立化成工業株式会社 樹脂ペースト組成物及びこれを用いた半導体装置
JP5375067B2 (ja) * 2008-12-15 2013-12-25 住友ベークライト株式会社 樹脂組成物および樹脂組成物を使用して作製した半導体装置
JP2018009112A (ja) * 2016-07-14 2018-01-18 タツタ電線株式会社 導電性塗料及びそれを用いたシールドパッケージの製造方法
JPWO2019111778A1 (ja) * 2017-12-04 2019-12-12 住友ベークライト株式会社 ペースト状接着剤組成物、および半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016011406A (ja) * 2014-06-03 2016-01-21 太陽インキ製造株式会社 導電性接着剤およびそれを用いた電子部品

Also Published As

Publication number Publication date
JPS62145602A (ja) 1987-06-29

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term