JPH05110002A - Complementary type semiconductor integrated circuit device - Google Patents
Complementary type semiconductor integrated circuit deviceInfo
- Publication number
- JPH05110002A JPH05110002A JP3268042A JP26804291A JPH05110002A JP H05110002 A JPH05110002 A JP H05110002A JP 3268042 A JP3268042 A JP 3268042A JP 26804291 A JP26804291 A JP 26804291A JP H05110002 A JPH05110002 A JP H05110002A
- Authority
- JP
- Japan
- Prior art keywords
- region
- guard ring
- external
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 230000000295 complement effect Effects 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000012535 impurity Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000969 carrier Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は相補型半導体集積回路装
置の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a complementary semiconductor integrated circuit device.
【0002】[0002]
【従来の技術】相補型半導体集積回路装置(以下CMO
S−ICと略す)は、例えば図4に示すCMOS−IC
断面図の例のように、P型半導体基板20上にNウェル
領域40を形成し、Nウェル領域40内にPチャネルM
OSトランジスタを、またP型半導体基板20上にNチ
ャネルMOSトランジスタを設けCMOSインバータ回
路を構成している。2. Description of the Related Art Complementary semiconductor integrated circuit devices (hereinafter referred to as CMOs)
S-IC) is a CMOS-IC shown in FIG. 4, for example.
As in the example of the sectional view, the N well region 40 is formed on the P type semiconductor substrate 20, and the P channel M is formed in the N well region 40.
A CMOS inverter circuit is provided by providing an OS transistor and an N-channel MOS transistor on the P-type semiconductor substrate 20.
【0003】この構造は図4中Q1,Q2,R1,R
2、で示す等価回路で表すことができる。つまり、サイ
リスタと同じであり、ラッチアップを起こすことがよく
知られている。図4の例では、入出力回路などが形成さ
れる外部領域12からキャリア(電子)が注入されたと
き、キャリアはNウェル40に到達してN+ 領域41か
らVDD端子に流れる。このとき、Nウェルの抵抗R1で
電位降下が生じ、この電位がトランジスタQ1のベース
・エミッタ間にバイアスを与え、トランジスタQ1が導
通するとトランジスタQ2も導通しラッチアップに至る
のである。This structure is represented by Q1, Q2, R1 and R in FIG.
It can be represented by an equivalent circuit shown by 2. In other words, it is the same as the thyristor, and it is well known that it causes latch-up. In the example of FIG. 4, when carriers (electrons) are injected from the external region 12 where an input / output circuit is formed, the carriers reach the N well 40 and flow from the N + region 41 to the V DD terminal. At this time, a potential drop occurs in the resistance R1 of the N-well, and this potential gives a bias between the base and emitter of the transistor Q1, and when the transistor Q1 becomes conductive, the transistor Q2 also becomes conductive and latches up.
【0004】そこで、特開昭61−280648では、
図3に示すように、外部領域と内部領域の間に一導電型
の高濃度不純物領域と反対導電型ウェル領域とからなる
ガードリング領域を設けた。つまり、図3(a),
(b)では、P型シリコン基板上に、内部領域10と外
部領域12との間にガードリング領域11がある。この
ガードリング領域11は、アースに接続されたP+ 型領
域29と、VDDまたはアースに接続されたN型ウェル領
域21により構成される。このガードリングが外部領域
から注入されたキャリアを吸収するので、内部領域に到
達するキャリアが少なくなり内部領域でラッチアップし
にくくなるのである。図3(a)は外部領域から正孔が
注入された場合であり、正孔はP+ 領域29に吸収され
る。図3(b)は外部領域から電子が注入された場合で
あり、電子はN型ウェル領域21に吸収される。Therefore, in JP-A-61-280648,
As shown in FIG. 3, a guard ring region including a high-concentration impurity region of one conductivity type and a well region of the opposite conductivity type was provided between the outer region and the inner region. That is, as shown in FIG.
In (b), the guard ring region 11 is provided between the inner region 10 and the outer region 12 on the P-type silicon substrate. The guard ring region 11 is composed of a P + type region 29 connected to the ground and an N type well region 21 connected to V DD or the ground. Since this guard ring absorbs the carriers injected from the outer region, the number of carriers reaching the inner region is reduced and it is difficult to latch up in the inner region. FIG. 3A shows the case where holes are injected from the external region, and the holes are absorbed in the P + region 29. FIG. 3B shows the case where electrons are injected from the external region, and the electrons are absorbed in the N-type well region 21.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、外部領
域からのキャリアの注入量が増え、例えば、外部領域1
箇所から100mA以上の注入量になると、このガード
リングだけでは吸収しきれなくなり、ラッチアップに至
り易くなる。従って、内部領域でのNウェル及び基板電
位の取り方にも十分注意を払う必要があるという問題が
ある。However, the injection amount of carriers from the external region increases, and, for example, the external region 1
When the injection amount is 100 mA or more from a location, the guard ring alone cannot absorb the amount, and latch-up easily occurs. Therefore, there is a problem that it is necessary to pay sufficient attention to how to take the N well and the substrate potential in the internal region.
【0006】[0006]
【課題を解決するための手段】本発明によれば、一導電
型半導体基板上に、内部回路が形成された内部領域と入
出力回路等が形成された外部領域とを有する相補型半導
体集積回路装置に於いて、前記内部領域と前記外部領域
との間と、前記外部領域の外側に、一導電型の高濃度不
純物領域と反対導電型ウェル領域とからなるガードリン
グ領域を設けた相補型半導体集積回路装置を得る。According to the present invention, a complementary semiconductor integrated circuit having, on a semiconductor substrate of one conductivity type, an internal region in which an internal circuit is formed and an external region in which an input / output circuit and the like are formed. In the device, a complementary semiconductor having a guard ring region composed of a high-concentration impurity region of one conductivity type and a well region of the opposite conductivity type between the inner region and the outer region and outside the outer region. Obtain an integrated circuit device.
【0007】[0007]
【実施例】次に本発明の実施例を説明する。EXAMPLES Next, examples of the present invention will be described.
【0008】図2は、本発明の相補型半導体集積回路装
置の平面図である。内部回路が形成された内部領域10
と、入出力回路などが形成された外部領域12との間に
は幅約20μmのガードリング領域11が形成されてお
り、外部領域12の外側にもガードリング領域13が形
成されている。これらガードリング近傍の断面図を現し
たものが図2(a)(b)である。FIG. 2 is a plan view of the complementary semiconductor integrated circuit device of the present invention. Internal region 10 in which internal circuit is formed
And a guard ring region 11 having a width of about 20 μm is formed between the outer region 12 and the external region 12 in which the input / output circuit is formed, and the guard ring region 13 is also formed outside the outer region 12. 2 (a) and 2 (b) are sectional views showing the vicinity of these guard rings.
【0009】図2(a)に於いて、P型シリコン基板2
0上に、内部領域10と外部領域12との間にガードリ
ング領域11がある。このガードリング領域11は、ア
ースに接続されたP+ 型領域29と、VDDまたはアース
に接続されたN型ウェル領域21により構成される。外
部領域12の外側にもガードリング領域11と同じ構成
のガードリング13が配置されている。In FIG. 2A, a P type silicon substrate 2 is provided.
0, there is a guard ring region 11 between the inner region 10 and the outer region 12. The guard ring region 11 is composed of a P + type region 29 connected to ground and an N type well region 21 connected to V DD or ground. A guard ring 13 having the same structure as the guard ring region 11 is also arranged outside the outer region 12.
【0010】このような構成では、外部領域12から正
孔が注入された場合、注入された正孔はガードリング領
域のP+ 領域28と29の両方に吸収される。従って、
内部領域の方向に流れる正孔は図3の従来の例に比べ約
半分程度になる。内部領域に到達する正孔もその分減少
するので、ラッチアップしにくくなる。In such a structure, when holes are injected from the external region 12, the injected holes are absorbed by both the P + regions 28 and 29 of the guard ring region. Therefore,
The number of holes flowing in the direction of the internal region is about half that in the conventional example of FIG. The number of holes reaching the internal region is also reduced by that amount, which makes latch-up difficult.
【0011】図2(b)も同図(a)と同様の構造であ
る。この図は外部領域12から電子が注入された場合で
ある。注入された電子はガードリング領域のN型領域2
1と22の両方に吸収される。従って、内部領域の方向
に流れる電子は従来の例に比べ約半分程度になる。内部
領域に到達する電子もその分減少するので、ラッチアッ
プしにくくなる。FIG. 2B also has the same structure as that of FIG. This figure shows the case where electrons are injected from the external region 12. The injected electrons are the N-type region 2 of the guard ring region.
It is absorbed by both 1 and 22. Therefore, the number of electrons flowing in the direction of the internal region is about half that in the conventional example. The number of electrons reaching the internal region is also reduced by that amount, which makes latch-up difficult.
【0012】[0012]
【発明の効果】以上説明したように、内部領域と外部領
域の間と、外部領域の外側にガードリング領域をそれぞ
れ設けることにより、外部領域からのキャリアを両ガー
ドリングが吸収し、内部領域への漏れを小さくするの
で、極めてラッチアップしにくい相補型半導体集積回路
装置を実現することができる。また、内部領域と関係な
くガードリングのレイアウト作業が行えるので、特に、
コンピュータを利用したレイアウトでの作業性に大きな
メリットがある。As described above, by providing the guard ring region between the inner region and the outer region and outside the outer region, both guard rings absorb the carriers from the outer region and reach the inner region. Since the leakage of is reduced, it is possible to realize a complementary semiconductor integrated circuit device which is extremely unlikely to latch up. Also, since the layout work of the guard ring can be performed regardless of the internal area, especially,
There is a great merit in workability in the layout using a computer.
【図1】本発明の一実施例の平面図FIG. 1 is a plan view of an embodiment of the present invention.
【図2】図2(a),図2(b)はいずれも第1図のガ
ードリング領域近傍の拡大図で、それぞれ異なる応用例
を示した断面図2 (a) and 2 (b) are enlarged views in the vicinity of the guard ring region of FIG. 1, and are cross-sectional views showing different application examples.
【図3】図3(a),図3(b)はいずれも従来例のガ
ードリング領域の近傍の拡大図でそれぞれ異なる例を示
した断面図FIG. 3A and FIG. 3B are enlarged views of the vicinity of a guard ring region of a conventional example, and are cross-sectional views showing different examples.
【図4】従来のCMOS−ICの断面図FIG. 4 is a sectional view of a conventional CMOS-IC.
10 内部領域 11,13 ガードリング領域 12 外部領域 20 P型シリコン基板 12,22,23 N型ウェル領域 25,26,30 N+ 型領域 27,28,29 P+ 型領域10 internal region 11, 13 guard ring region 12 external region 20 P type silicon substrate 12, 22, 23 N type well region 25, 26, 30 N + type region 27, 28, 29 P + type region
Claims (1)
成された内部領域と入出力回路等が形成された外部領域
とを有する相補型半導体集積回路装置に於いて、前記内
部領域と前記外部領域との間と、前記外部領域の外側
に、一導電型の高濃度不純物領域と反対導電型ウェル領
域とからなるガードリング領域を設けたことを特徴とす
る相補型半導体集積回路装置。1. A complementary semiconductor integrated circuit device having an internal region in which an internal circuit is formed and an external region in which an input / output circuit or the like is formed on a semiconductor substrate of one conductivity type. A complementary semiconductor integrated circuit device, characterized in that a guard ring region consisting of a high-concentration impurity region of one conductivity type and a well region of opposite conductivity type is provided between the external region and outside the external region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3268042A JPH05110002A (en) | 1991-10-17 | 1991-10-17 | Complementary type semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3268042A JPH05110002A (en) | 1991-10-17 | 1991-10-17 | Complementary type semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05110002A true JPH05110002A (en) | 1993-04-30 |
Family
ID=17453074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3268042A Pending JPH05110002A (en) | 1991-10-17 | 1991-10-17 | Complementary type semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05110002A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0870357B2 (en) † | 1995-12-29 | 2009-04-08 | EM Microelectronic-Marin SA | Active rectifier having minimal energy losses |
-
1991
- 1991-10-17 JP JP3268042A patent/JPH05110002A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0870357B2 (en) † | 1995-12-29 | 2009-04-08 | EM Microelectronic-Marin SA | Active rectifier having minimal energy losses |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6469354B1 (en) | Semiconductor device having a protective circuit | |
JP3228583B2 (en) | Semiconductor integrated circuit device | |
JP2959528B2 (en) | Protection circuit | |
CN110660810B (en) | Latch-up Immunity Technology for Integrated Circuits | |
US5828110A (en) | Latchup-proof I/O circuit implementation | |
US5087579A (en) | Method for fabricating an integrated bipolar-CMOS circuit isolation for providing different backgate and substrate bias | |
JPS6245706B2 (en) | ||
KR100749231B1 (en) | Semiconductor devices | |
JPH0654797B2 (en) | CMOS semiconductor device | |
US5357126A (en) | MOS transistor with an integrated protection zener diode | |
CN101226939A (en) | Semiconductor device | |
JPH0691200B2 (en) | Bidirectional input / output cell | |
JPH07193195A (en) | CMOS integrated circuit device | |
JPS60247959A (en) | Latch-up prevention circuit | |
US6084272A (en) | Electrostatic discharge protective circuit for semiconductor device | |
US5892263A (en) | CMOS device connected to at least three power supplies for preventing latch-up | |
JP3521321B2 (en) | Semiconductor device | |
JPH05110002A (en) | Complementary type semiconductor integrated circuit device | |
JP3184168B2 (en) | Semiconductor device protection device | |
JPH044755B2 (en) | ||
JPH11251533A (en) | Semiconductor integrated circuit device and its manufacture | |
JPH08162539A (en) | Data output buffer | |
JPS63252464A (en) | semiconductor equipment | |
JP3038744B2 (en) | CMOS type semiconductor integrated circuit device | |
JPH11135645A (en) | Semiconductor integrated circuit device |