JPH05109870A - Die bonding apparatus - Google Patents

Abstract

PURPOSE:To prevent a semiconductor chip from being pushed up defectively and to prevent the semiconductor chip from being damaged by a method wherein a plurality of pushing-up needles are situated in such a way that the plane including tips of the pushing-up needles forms a definite angle to a horizontal plane. CONSTITUTION:An angle theta which is formed by a straight line L connecting tips of pushing-up needles 10 and by a horizontal plane H is set at 1 to 15 deg. the pushing-up needles 10 are attached to a needle holder 12. The needle holder 12 is situated at the lower part of a semiconductor chip 20 which has been attached to an adhesive sheet 30; it is moved upward. Then, the pushing-up needles pierce through the adhesive sheet 30; they push up the semiconductor chip 20. In a state that only one end part 22 of the semiconductor chip 20 has adhered to the adhesive sheet 30, the semiconductor chip 20 is stripped from the adhesive sheet 30. The semiconductor chip 20 which has been pushed up is picked up easily and sent to a die bonding process. Thereby, the semiconductor chip 20 can be pushed without affecting an adjacent semiconductor chip 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved die bonding apparatus having a plurality of protruding needles.

[0002]

2. Description of the Related Art A back surface bumping method is used in a die bonding process. According to this method, after a dicing process in which an adhesive sheet is attached to the back surface of the wafer to separate the wafer into semiconductor chips, the push-up needle 110 is pushed up from the back surface of the adhesive sheet 130 as shown in FIG. This is a method in which the semiconductor chip 120 is directly picked up by (not shown). The semiconductor chip picked up is sent to the next die bonding step.

[0003]

In the conventional die bonding apparatus, the plane 112 including the tips of the plurality of protruding needles 110 is parallel to the horizontal plane 114, as schematically shown in FIG. Therefore, the semiconductor chip is pushed up substantially horizontally. Therefore, the thrust needle 11
When the semiconductor chip 120 is pushed up by 0, as shown in FIG.
There is a problem that a semiconductor chip push-up failure as schematically shown in (A) or (B) occurs, and it becomes difficult to pick up the semiconductor chip 120 with a pickup tool.

Therefore, it is an object of the present invention to provide a die bonding apparatus which improves the thrust needle and does not cause the semiconductor chip push-up failure as shown in FIG. 7A or 7B, for example. ..

[0005]

According to the first aspect of the present invention, there is provided a die bonding apparatus having a plurality of projecting needles arranged in a straight line, wherein the tip of the projecting needles is connected. This can be achieved by a die bonding apparatus characterized in that the straight line forms a constant angle with the horizontal plane.

Further, according to the second aspect of the present invention, there is provided a die bonding apparatus having a plurality of protruding needles which are not arranged in a straight line, and a plane including a tip of the protruding needle is a horizontal plane. Can be achieved by a die bonding apparatus characterized by forming a constant angle with.

In the second aspect of the present invention, it is preferable that the plurality of protruding needles are arranged in a staggered pattern.

In the first and second aspects, considering the stability of the semiconductor chip in the state of being pushed up by the thrusting needle, the above-mentioned constant angle (hereinafter also referred to as the thrusting needle inclination angle) is 1 to 15 degrees. Is desirable.

[0009]

In the die bonding apparatus of the present invention, when the semiconductor chip 20 is pushed up by the push-up needle 10, as shown in FIG.
Only one end 22 of 0 is attached to the adhesive sheet 30.
Therefore, the posture of the pushed up semiconductor chip is extremely stable. Further, the semiconductor chip can be peeled off from the adhesive sheet with a slight force. Further, it is not necessary to make the push-up position accuracy of the push-up needle as high as that of the conventional die bonding apparatus.

[0010]

1 is an enlarged front view of a preferred embodiment according to the first aspect of the present invention. Further, an enlarged plan view of the embodiment according to FIG. 2 is shown. Seven protruding needles 10 are attached to a needle holder 12. These protruding needles 10 are arranged in a straight line. 2 in FIG.
Reference numeral 0 is a semiconductor chip, and 30 is an adhesive sheet. The angle θ formed by the straight line L connecting the tips of the protruding needles and the horizontal plane H is about 3.8 degrees. The angle θ in FIG. 1 is exaggeratedly drawn.

In the second aspect of the present invention, the plurality of projecting needles 10 are not arranged in a straight line. The plurality of protrusion needles 10 are preferably arranged in a staggered pattern. 3A to 3E are enlarged plan views illustrating the staggered arrangement of the protruding needles 10.

The needle holder 12 shown in FIG. 1 is mounted on an XY table (not shown) for the protruding needle. The needle holder 12 is positioned below the semiconductor chip 20 attached to the adhesive sheet 30 by moving the XY table for the protruding needle. Then, the semiconductor chip around the semiconductor chip to be picked up is fixed by a vacuum holder (not shown).

Next, the needle holder 12 is moved upward by a micrometer head (not shown). When the needle holder 12 is moved upward, the protruding needle 10 penetrates the adhesive sheet 30 and the semiconductor chip 2
Push up 0. As schematically shown in FIG. 4, the semiconductor chip 20 is peeled from the adhesive sheet 30 with only one end 22 of the semiconductor chip 20 attached to the adhesive sheet 30. In FIG. 4, the angle of the semiconductor chip 20 with respect to the peeled adhesive sheet 30 is exaggerated. The semiconductor chip 20 pushed up is picked up by a pickup tool (not shown) and sent to the next die bonding step.

Although the present invention has been described based on the preferred embodiments, the die bonding apparatus of the present invention is not limited to these embodiments. Number of thrust needles,
Plunge needle inclination angle, staggered arrangement of the thrust needles,
It can be appropriately changed depending on the size of the semiconductor chips, the arrangement state of the semiconductor chips, the size of the die bonding apparatus, and the like.

[0015]

In the die bonding apparatus of the present invention, the posture of the semiconductor chip pushed up by the push-up needle is extremely stable. Further, since the semiconductor chips can be pushed up without affecting adjacent semiconductor chips, the semiconductor chips can be picked up reliably and easily. Furthermore, since the semiconductor chip can be peeled off from the adhesive sheet with a slight force, damage to the semiconductor chip can be prevented and the yield can be improved. Moreover, it is not necessary to make the push-up position accuracy of the push-up needle as high as that of the conventional die bonding apparatus.

[Brief description of drawings]

FIG. 1 is an enlarged front view of a preferred embodiment according to the first aspect of the present invention.

FIG. 2 is an enlarged plan view of the embodiment shown in FIG.

FIG. 3 is an enlarged plan view of a staggered arrangement of protrusion needles.

FIG. 4 is a schematic view showing a state where a semiconductor chip is pushed up.

FIG. 5 is a schematic view showing a protruding state of a semiconductor chip by a protruding needle of a conventional die bonding apparatus.

FIG. 6 is a schematic view showing a positional relationship between tips of the protruding needles of a conventional die bonding apparatus.

FIG. 7 is a schematic diagram showing a push-up failure of a semiconductor chip in a conventional die bonding apparatus.

[Explanation of symbols]

 10,110 Projection needle 12 Needle holder 20,120 Semiconductor chip 30,130 Adhesive sheet

Claims (5)

[Claims] 1. A die bonding apparatus having a plurality of projecting needles arranged in a straight line, wherein a straight line connecting the tips of the projecting needles forms a constant angle with a horizontal plane. .. 2. The die bonding apparatus according to claim 1, wherein the constant angle is 1 to 15 degrees. 3. A die bonding apparatus having a plurality of protruding needles which are not arranged on a straight line, wherein a plane including a tip of the protruding needle forms a constant angle with a horizontal plane. .. 4. The die bonding apparatus according to claim 1, wherein the plurality of protruding needles are arranged in a staggered pattern. 5. The die bonding apparatus according to claim 3, wherein the constant angle is 1 to 15 degrees.