JPH05100239A - Liquid crystal display device and production thereof - Google Patents

Abstract

PURPOSE:To constitute the liquid crystal display device in such a manner that an anisotropically conductive film can be simultaneously and tentatively compression bonded to one side on the glass substrate of a liquid crystal display plate and a tentative compression bonding stage can be stably executed in a short period of time. CONSTITUTION:The anisotropically conductive sheet 17 is first thermocompression bonded onto one side of the glass substrate 14 of the liquid crystal display plate (b). Both ends of the anisotropically conductive sheet 17 are then lowered toward an arrow 18, by which only the thermosetting anisotropically conductive film 13 of the anisotropically conductive sheet 17 is cut at both end edges of the glass substrate 14 (c). One end of a protective film 16 is then clamped and the protective film 16 is parted from the glass substrate 14. The thermosetting anisotropically conductive film 13 is tentatively compression bonded onto one side of the glass substrate 14 (d). The tentatively compression bonding stage of the thermosetting anisotropically conductive film 13 is repeated with the respective desired sides of the glass substrate 14 to be outer lead-bonded with a tape carrier mounted with an IC.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display device, and more particularly to a tape carrier (hereinafter TAB) on which an integrated circuit for driving liquid crystal (hereinafter abbreviated as IC) is mounted using an anisotropic conductive film. -IC) is mounted on a glass substrate of a liquid crystal display panel, and particularly to a connection method.

[0002]

2. Description of the Related Art As a method for mounting a driving IC on a liquid crystal display device, for example, "Flat Panel.
Display '91 ", p. 181, (1990), the TAB (Tape Automated Bonding) method is mainly used.

A mounting method by the TAB method is applied to a large-sized thin film transistor driven liquid crystal display device (hereinafter, referred to as TFT-LCD).
Abbreviated. ) Will be described as an example. A plan view of the tape carrier 1 is shown in FIG. Base made of polyimide
A patterned lead electrode 4 made of tin-plated copper is formed on the film 6. base·
The film 6 is provided with a device hole 9 for mounting the liquid crystal driving IC 2 (FIG. 6) and a hole 5 for soldering.

A liquid crystal driving IC 2 is mounted on the tape carrier 1 as shown in FIG. Therefore, the electrode 41 at the tip of the lead electrode 4 and the bump 8 made of gold on the IC 2 are metallurgically connected (ILB: Inner Lead Bonding) using a bonder (not shown). Thereafter, the IC 2 is resin-sealed (not shown), and subsequently punched into a desired shape 3 as shown in FIG.

Next, as shown in FIG. 6 which is a sectional view and FIG. 7 which is a plan view of the whole thereof, the IC output side electrode 42 of the lead electrode 4 and the wiring formed on the periphery of the liquid crystal display panel 11. The electrode (ITO electrode) 12 is electrically connected (OLB: Outer Lead Bonding) through the anisotropic conductive film 13. When the adhesive layer of the anisotropic conductive film 13 is made of a thermosetting resin (referred to as a thermosetting anisotropic conductive film), the OLB process has conventionally been composed of the following three processes.

A temporary pressure bonding step (FIG. 7) of temporarily bonding the anisotropic conductive film 13 to the TAB-IC 20 is performed, and the lead electrode 42 of the TAB-IC 20 is connected to the liquid crystal display panel 11 through the anisotropic conductive film 13.
Align the wiring electrode 12 on the glass substrate 14 of
An alignment step for temporarily attaching the B-IC onto the glass substrate 14 and a main pressure bonding step for firmly adhering the anisotropic conductive film 13 to each other.

As shown in FIG. 8, a plurality of TAB-IC2
By temporarily attaching 1 and 22 or by permanently pressure-bonding, TA
B-ICs 21 and 22 are mounted on the liquid crystal display board 11. After that, the IC input side electrode 43 of the lead electrode 4 and the electrode on a printed circuit board (hereinafter abbreviated as PCB) (not shown) are connected.
Connect by soldering. Where tape carrier 1
The upper lead electrode 4 is protected by a solder resist 7 (FIG. 6) in a desired pattern. Through the above steps, the OLB step and the PCB connecting step are completed, as shown in FIG.

When the quality of the TAB-IC is stable and the yield is high, a liquid crystal display device with a large number of outputs is usually used as the size of the liquid crystal display device increases, but it is said that the quality is stable at present. It is difficult, and it is not always the case that multiple outputs are used. In the case of a large 10.4 inch TFT LCD, for example, the number of outputs of the multi-output driving IC 2 is 240
It is a book.

That is, the X side (horizontal axis side) TAB-IC21
The number of outputs is 240, and the pitch of the OLB portion is, for example, 200 μm. As shown in FIG. 8, the number of TAB-ICs 21 per one liquid crystal display panel 11 is four on the upper side,
Four on the lower side, eight in total. In addition, Y side (vertical axis side) TA
The B-IC 22 has 240 outputs, the OLB portion has a pitch of 200 μm, and a total of two are mounted.

The anisotropic conductive film is roughly classified into a thermoplastic one and a thermosetting one, depending on the kind of resin used for the adhesive layer. Thermoplastic anisotropic conductive films have been widely used because they are easy to handle, but thermosetting anisotropic conductive films have been used because of the demand for highly reliable connection.

Conventionally, in the temporary pressure-bonding step of the thermosetting anisotropic conductive film, as shown in FIG. 7, the thermosetting anisotropic conductive film 13 is used.
Was temporarily bonded to the TAB-IC20 side. In this method, the TAB-IC 20 is punched into the shape 3, and then the thermosetting anisotropic conductive film 13 is temporarily press-bonded onto the TAB-IC 20. Therefore, for one liquid crystal display panel 11, as many temporary TAB-IC bonding steps as necessary are generated. In the case of FIG. 8, the number of steps of temporary pressure bonding of the thermosetting anisotropic conductive film 13 is 10.

This problem is caused by the TAB-IC having a small number of outputs.
Is especially serious when using. For example, when the TAB-ICs 21 and 22 have 120 outputs each, the total number of temporary pressure bonding steps is 20, and when the TAB-ICs 21 and 22 have 80 outputs respectively, the number of temporary pressure bonding steps is 20. It will be 30 times in total.

In the method of temporarily press-bonding the thermosetting anisotropic conductive film 13 to the punched TAB-IC side, in mass production, the punched TAB-ICs are collected and arranged. A step such as setting of the conductive film on a temporary press-bonding machine is required, and there is a drawback that the step is complicated and long.

The above-mentioned problems are the same even when the thermosetting anisotropic conductive film 13 is temporarily pressure-bonded before punching out the TAB-IC 20, that is, in the state of a tape. There is a drawback in that the number of times of the temporary pressure bonding step is the same as the required number of TAB-ICs.

Next, the mounting method by the TAB method will be described taking the case of a color simple matrix liquid crystal display device as an example, as in the case of the large-sized thin film transistor driven (TFT driven) liquid crystal display device (TFT-LCD). In addition,
3. Temporary pressure bonding of the anisotropic conductive film 13 to the glass substrate 14 of the liquid crystal display panel 11 as shown in FIG. 3 or to the tape carrier (TAB-IC) on which the IC 2 is mounted as shown in FIG. Connection is performed by the OLB method including a process, the alignment process, and the final pressure bonding process. This OL
By repeating the process B, a plurality of TAB-ICs 21 and 22 are mounted on the liquid crystal display panel 11 as shown in FIG.

When the liquid crystal display device is a color simple matrix, the number of outputs of the X side (horizontal axis side) driving ICs 21 is 80, and the pitch of the OLB portion is 110 μm. The number of TAB-IC21 is omitted in FIG.
There are two, 12 on the lower side, for a total of 24. Further, the Y-side (vertical axis side) TAB-IC 22 has 80 outputs, the pitch of the OLB portion is 220 μm, and a total of 5 pieces are mounted.

A color filter (not shown) is formed on the lower glass substrate 14 shown in FIG. A top coat layer 19 made of polyimide is formed on the color filter. Therefore, the ITO electrode 12 on the lower glass substrate 14 is, as shown in FIG.
It is formed on the top coat layer 19. On the other hand, on the upper glass substrate 15, there is no color filter or top coat layer, and an ITO electrode (not shown) is directly formed.

As the method for temporarily pressure-bonding the anisotropic conductive film 13, as described above, the method of temporarily pressure-bonding to the glass substrate 14 side and TA
There are two types of methods, that is, temporary crimping on the B-IC side.

In the method shown in FIG. 13 in which the anisotropic conductive film 13 is temporarily pressure-bonded to one side of the glass substrate side, the anisotropic conductive film 13 is made of a highly reliable thermosetting resin or a thermosetting resin. When it is made of a mixture of a curable resin and a thermoplastic resin, the anisotropic conductive film 13 has gaps 25 on both sides of the TAB-IC 21.
Exposed to (Fig. 12) and TA as shown in Fig. 17
Part 13b not covered with B-IC21 is 150 ° C to 1
It adheres to the heater head 31 in the main pressure bonding step performed at 70 ° C. If the main pressure bonding is continued while the anisotropic conductive film is still pressure bonded to the heater head 31, the parallelism of the heater head 31 cannot be obtained, and the pressure bonding becomes uneven.

In order to prevent this, it is conceivable to clean the heater head 31 every time the main pressure bonding is completed, or to lay the sheet of Teflon or Kapton and perform the main pressure bonding. Film adhesion occurs,
It is always necessary to expose the new side of the sheet and perform the main crimping. Therefore, there are drawbacks such as a long production process and high material costs.

On the other hand, not one side of the glass substrate side but T
It is conceivable that the anisotropic conductive film 13 is temporarily pressure-bonded only on the ITO electrode 12 of the glass substrate 14 at a desired position so as to correspond to the lead electrode 42 of the OLB portion of the AB-IC.
It is very difficult to temporarily press-fit the anisotropic conductive film 13 with high positional accuracy. Even if you can compare it, as described below, TA
There is a problem that the anisotropic conductive film 13 flows out of the B-IC 21 and adheres to the heater head 31. Therefore, the TAB on the X side, which has a fine pitch of 110 μm
-For the OLB of IC21, the anisotropic conductive film 13 must be temporarily pressure-bonded to the TAB-IC side.

By the way, the lead electrode 44 at the end portion of the OLB portion shown in FIG. 10C portion or FIG. 14 which is an enlarged view of the X side TAB-IC 21 of the color simple matrix liquid crystal display device, and the base film 6 are shown. The distance L from the punched end 45 is usually 1 mm or less (about 0.5 mm). The width of the anisotropic conductive film 13 is usually about 2 mm to 3 mm, but in the case of such a high density pattern, the edge of the anisotropic conductive film 13 is formed by the lead electrode 44 and the base film 6. Punched edge
It was difficult to perform the temporary pressure-bonding of the anisotropic conductive film 13 to the TAB-IC side with good reproducibility so that the anisotropic conductive film 13 could be positioned between the position 45 and 45, not only by hand but also by using a machine.

Even if the anisotropic conductive film 13 can be temporarily press-bonded so that the end of the anisotropic conductive film is located between the lead electrode 44 and the punching end 45, as shown in FIG. In the process, the end portions 13b of the anisotropic conductive film 13 flowed out from both ends of the TAB-IC 21 and adhered to the heater head 31.

[0024]

As described above, in the process of temporarily pressing the thermosetting anisotropic conductive film in the conventional TFT-LCD manufacturing, the thermosetting anisotropic conductive film is replaced with the TAB-IC.
A method of temporarily pressure-bonding to the side was used. Therefore, 1
There is a drawback in that a temporary pressure bonding step is required for each liquid crystal display panel, and the number of necessary TAB-ICs is increased, and the temporary pressure bonding step becomes long.

In addition, a conventional TAB method for mounting a liquid crystal display device, particularly high-density mounting is required as in the case of a liquid crystal display device for a color simple matrix.
In the pitch OLB, the distance between the lead electrodes 44 at both ends of the OLB portion and the end 45 of the punched base film 6 is designed to be very small, so that the anisotropy during the main pressure bonding As shown in FIG. 17, the ends of the conductive film are TAB-IC.
There was a problem that it flows out from both ends of 21 and adheres to the heater head 31. Therefore, O with good reproducibility
There was a drawback that LB could not be performed.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and TAs for performing OLB such as large TFT-LCDs, simple matrix LCDs, and MIM-LCDs.
An object of the present invention is to provide a method for manufacturing a liquid crystal display device, which can perform a process of temporarily press-bonding an anisotropic conductive film in a short time and stably with a high yield even when the number of B-ICs is large. .. Also,
The present invention has a fine pitch O, which requires high-density mounting such as a liquid crystal display device for a color simple matrix.
Even for LB, without using unnecessary materials and jigs,
The anisotropic conductive film does not adhere to the heater head,
It is an object of the present invention to provide a method for manufacturing a liquid crystal display device which can stably perform an OLB process and thus can achieve a high yield.

[0027]

According to a first aspect of the present invention, there is provided a method for manufacturing a liquid crystal display device, comprising:
The anisotropic conductive film supported by the protective film is thermocompression bonded, only the anisotropic conductive film is cut at both edges of the glass substrate, and then the protective film is peeled from the glass substrate. The above steps are repeated. Accordingly, the anisotropic conductive film is temporarily pressure-bonded to each desired side of the liquid crystal display panel, and the IC
The alignment step of aligning the lead electrode of the tape carrier on which the tape carrier is mounted with the wiring electrode on the glass substrate through the anisotropic conductive film, and temporarily attaching the tape carrier to the glass substrate; The main pressure bonding step of firmly bonding the anisotropic conductive film.

According to a second aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, wherein the anisotropic conductive film according to the first aspect is caused to flow outward from both ends of the tape carrier, and the height of the anisotropic conductive film which has flowed out is increased. Is less than the thickness of the tape carrier.

[0029]

In the manufacturing method according to the first aspect, the temporary compression bonding of the anisotropic conductive film is performed for each side of the glass substrate of the liquid crystal display panel. Therefore, it is possible to provide a stable temporary pressure-bonding step or OLB step in a short time.

In the manufacturing method according to the second aspect, the height of the anisotropic conductive film that has flowed out from both ends of the tape carrier after the main pressure bonding through the temporary pressure bonding, the alignment step and the main pressure bonding step is the tape carrier. Since it is lower than the thickness of
The flowing out anisotropic conductive film does not adhere to the heater head. In addition, even if the heater head is long and the OLB portion is struck twice by the heater head over two TAB-ICs or more, the anisotropic conductive film that has already flown to the outside has a high height. Is less than the thickness of the tape carrier,
Does not adhere to the heater head. Therefore, stable OLB
Therefore, the liquid crystal display device can be provided with high yield.

[0031]

Embodiments of the present invention will be described in detail below with reference to the drawings. As the liquid crystal display device, a case of a large TFT-LCD having a diagonal of 10.4 inches will be described as an example. There are 480 gate lines (X side) and 480 signal lines (Y side).

As shown in FIG. 6, wiring electrodes 12 are formed on the periphery of the glass substrate 14 of the liquid crystal display panel 11. The wiring electrode 12 is formed of chromium and aluminum in this order, and has a film thickness of 500 angstrom and 4000 angstrom, respectively. TAB-IC
As an example, a case where the TAB-IC 21 on the X side is OLB will be described as an example. The number of outputs is 240, and the pitch of the OLB portion is 200 μm. The base film 6 of the tape carrier 1 is, for example, a polyimide film having a thickness of 75 μm. A copper lead electrode 4 having a thickness of, for example, 35 μm is formed thereon, and a desired circuit pattern is drawn. On the surface of the copper lead electrode 4, tin is about 0.
It is plated to a thickness of 4 μm.

As the anisotropic conductive sheet 17 shown in FIG. 1 (a), a case where nickel particles are dispersed in a thermosetting resin (trade name CP-4121) manufactured by Sony Chemicals is used. Let us take an example. The particle size of nickel particles is about 3
It is about μm. The anisotropic conductive sheet 17 usually has two or three layers. In the case of two layers, the thermosetting anisotropic conductive film 13 made of a thermosetting resin in which nickel particles are dispersed is supported by the protective film 16. The material of the protective film 16 is Teflon or the like. The anisotropic conductive sheet 17 has a width of 2 mm, and although not shown, it is wound in a reel shape.

Next, the temporary pressure bonding step according to the present invention will be described in detail. First, on one side of the glass substrate 14 of the liquid crystal display board 11,
Using a temporary pressure bonding machine (not shown), as shown in FIG.
The anisotropic conductive sheet 17 is thermocompression bonded. The conditions for pressure bonding were a temperature of 90 ° C., a time of 5 seconds, and a pressure of 4 kg / cm ² . Next in FIG.
As shown in (c), both ends of the anisotropic conductive sheet 17 are indicated by arrows.
By lowering in the direction of 18, the thermosetting anisotropic conductive film of the anisotropic conductive sheet 17 at the edges of both ends of the glass substrate 14
Cut only 13. Next, although not shown, one end of the protective film 16 is grasped by a chuck provided in the temporary press machine and the protective film 16 is peeled off from the glass substrate 14. Then, as shown in FIG. 1D, the thermosetting anisotropic conductive film 13 is temporarily pressure-bonded onto one side of the glass substrate 14.

For each desired side of the glass substrate 14 on which the TAB-ICs 21 and 22 are to be OLB, the above-mentioned temporary pressure-bonding step of the thermosetting anisotropic conductive film 13 is repeated. FIG. 2 shows a plan view at the stage when the temporary pressure bonding step is completed.

Next, the alignment process / temporary mounting process is performed. TAB while interposing the thermosetting anisotropic conductive film 13
-IC lead electrode 42 and glass substrate 14 of liquid crystal display panel 11
The upper wiring electrode 12 is aligned. Next, the TAB-IC is temporarily attached to the glass substrate 14 using a pressing jig (not shown). The thermosetting anisotropic conductive film 13 has adhesiveness,
The temporary attachment process is performed by applying pressure from above the base film 6 at room temperature.

In the alignment / temporary attaching process of a plurality of TAB-ICs, first a total of 8 TAB-ICs 21 on the upper and lower sides of the X side are performed, and then a total of 2 TAB-ICs 22 on the Y side are performed.
FIG. 4 is a plan view showing a state in which the alignment process and the tacking process are completed.

Next, the main pressure bonding step is carried out. The main compression bonding is performed using a thermocompression bonding device (not shown). The thermocompression bonding device is equipped with a heater head. The heating method used was a pulse heating method. Before actually performing the main pressure bonding, the parallelism of the heater head is checked in advance by a press scale (a sheet for determining whether or not the pressure is uniformly applied). In the case of the thermosetting anisotropic conductive film 13 made by Sony Chemical Co., Ltd., the conditions for the main compression bonding are a temperature of 170 ° C., a pressure of 4 kg / cm ² , and a time of 20.
Seconds The plan view at the stage when the above-mentioned main pressure bonding step is completed is the same as that in FIG.

The embodiment of the present invention has been described in detail by taking as an example the conditions of temporary pressure bonding, the temperature is 90 ° C., the time is 5 seconds, and the pressure is 4 kg / cm ² . The optimum temperature for thermocompression bonding the thermosetting anisotropic conductive film 13 supported by the protective film 16 onto one side of the glass substrate 14 is in the range of 60 ° C to 100 ° C. That is, the present inventor found the following experimental fact. When the temperature is high, for example, in the range of 150 ° C. to 200 ° C., a) The anisotropic conductive sheet 17 cannot be temporarily pressure-bonded to a desired position.

B) When the protective film 16 is peeled from the glass substrate 14, the thermosetting anisotropic conductive film 13 is broken by being pulled by a chuck (not shown).

When the temperature range is 100 ° C. to 150 ° C., c) As shown in FIG. 3, both end portions 13a of the thermosetting anisotropic conductive film 13 float from the glass substrate 14.

Further, when the temperature range is 60 ° C. or lower, there is a drawback that d) the adhesive force of the thermosetting anisotropic conductive film 13 becomes weak.

In order to smoothly carry out the temporary pressure bonding step,
It does not largely depend on the time and pressure of the temporary pressure bonding conditions. The time is as short as possible, and it is possible without applying a large pressure.

The present inventor has found that the thermosetting anisotropic conductive film 13
If the film thickness is 20 μm, the height of the thermosetting anisotropic conductive film 13 flowing out from the both ends of the tape carrier after the main press bonding of the OLB becomes lower than the thickness of the tape carrier, and the heater It was found that the OLB process can be performed stably without adhering to the head. Further, the thickness of the thermosetting anisotropic conductive film 13 existing outside the TAB-ICs 21 and 22 from the beginning is, of course, lower than that of the TAB-ICs 21 and 22, so that the OLB process can be performed without adhering to the head. is there. Regarding the film thickness of this thermosetting anisotropic conductive film 13,
A detailed description will be given later with reference to FIGS. 9 to 17.

In the above examples, the thermosetting anisotropic conductive film is used.
Although the case where 13 is used is described in detail, the present invention is also applicable to the case where a semi-thermosetting / semi-thermoplastic anisotropic conductive film such as an anisotropic conductive film AC-6072 manufactured by Hitachi Chemical Co., Ltd. is used. The invention is likewise applicable.

Further, in the embodiment, the OLB process is separated from the temporary pressure bonding process, the alignment / temporary bonding process, and the main pressure bonding process, and detailed description has been made taking as an example the case where they are performed using different machines. Needless to say, the present invention can be applied to the case where the above process is performed as one process using the same machine.

In the embodiment, the liquid crystal display device is
Although the description has been made by taking a case of a 0.4-inch large-sized TFT LCD as an example, it goes without saying that the present invention can be applied to other liquid crystal display devices such as liquid crystal display devices and simple matrix liquid crystal display devices.

Next, referring to FIGS. 9 to 17, by adjusting the film thickness of the thermosetting anisotropic conductive film 13, the thermosetting anisotropy flowing out from both ends of the tape carrier will be described. The height of the conductive film 13 will be lower than the thickness of the tape carrier 1, will not adhere to the heater head during pressure bonding, and the OLB process can be stably performed, which will be described in detail.

As the liquid crystal display device, a color simple matrix liquid crystal display device will be described as an example. The size is 1 diagonal
1 inch class, data line (X side) 640 x 3 (RGB)
The number of scanning lines and scanning lines (Y side) is 480.

As shown in FIG. 11, on the periphery of the glass substrate 14 of the liquid crystal display panel 11, the wiring electrode 12 made of ITO having a thickness of about 1300 angstroms is formed on the polyimide layer 19 having a thickness of about 1 μm. Has been done. Taking the TAB-IC21 on the X side as an example of the TAB-IC, the number of outputs is 80.
In the book, the pitch of the OLB portion is 110 μm. tape·
The base film 6 of the carrier 1 has, for example, a thickness of 125
A μm polyimide film was used. A copper lead electrode 4 having a thickness of, for example, 35 μm is formed thereon,
A desired circuit pattern is drawn. The surface of the copper lead electrode 4 is plated with tin to a thickness of about 0.4 μm.

The distance 25 between the adjacent TAB-IC21 shown in FIG. 12 is designed to be 2 mm to 4 mm. As the anisotropic conductive film 13, a thermosetting resin made by Sony Chemicals in which solder particles are dispersed will be described as an example. The particle size of the solder particles is about 20 μm.

Further, as shown in FIG. 15, the anisotropic conductive film 13 is attached to the tape carrier 1 in which the IC 2 is mounted.
Temporarily crimp to the side. The length of the anisotropic conductive film 13 is made slightly larger than the shape 3 to be punched. The temporary pressure bonding condition is, for example, 80
C., 3 seconds. Next, the desired shape 3 is punched with a die.
Then, the TAB-IC21 having the shape shown in FIG. 16 can be obtained.

Next, the OLB process will be described in detail. First, the TAB-IC 21 to which the anisotropic conductive film 13 is temporarily pressure-bonded in the shape shown in FIG. 16 is temporarily attached to the glass substrate 14 of the liquid crystal display panel 11. When temporarily attached, the ITO on the glass substrate 14
The electrode 12 and the lead electrode 42 on the base film 6 are aligned at the same time. As the anisotropic conductive film 13, a sticky one is used. This alignment / temporary attaching step is performed at room temperature and is performed by applying pressure from above the base film 6 using a pressing jig (not shown). Figure 1
As shown in FIG. 5, when the anisotropic conductive film 13 is temporarily pressure-bonded to the tape carrier side, it is sufficient to temporarily bond the anisotropic conductive film 13 to a size slightly larger than the punched shape without considering the bonding accuracy. The temporary pressure bonding step can be performed with high yield.

Next, the main pressure bonding step is carried out. The main compression bonding is performed using a thermocompression bonding device. The thermocompression bonding device is shown in FIG.
The heater head 31 shown in FIG. The heating method used was a pulse heating method. Before actually performing the main pressure bonding, the parallelism of the heater head is checked in advance by a press scale (a sheet for determining whether or not the pressure is uniformly applied). The thermosetting anisotropic conductive film manufactured by Sony Chemicals (product type name:
In the case of CP-3131FTR), the conditions for main pressure bonding were a temperature of 170 ° C., a pressure of 3.5 kg / cm ² , and a time of 20 seconds. The width of the anisotropic conductive film 13 was 2 mm.

When the thickness of the anisotropic conductive film 13 is 30 μm,
As shown in FIG. 17, the height of the anisotropic conductive film 13b flowing out from both ends of the TAB-IC 21 during the main pressure bonding becomes higher than the thickness of the tape carrier, and
Attach to 31. On the other hand, the thickness of the anisotropic conductive film 13 is 20 μm.
Then, after the main pressure bonding, as shown in FIGS. 9 (a) and 9 (b),
The present inventor has found that the anisotropic conductive film 13b, which flows out from both ends of the TAB-IC21, is lower than the thickness of the tape carrier and does not adhere to the heater head during pressure bonding. OL of the liquid crystal display device according to the present invention
A cross-sectional view of the B connection part and an enlarged view thereof are respectively shown in FIG.
Shown in (b) and (c).

The amount of the anisotropic conductive film 13b flowing out seems to depend not only on the film thickness of the anisotropic conductive film 13 but also on the width. When the width is fixed to 2 mm, the film thickness is 25 μm. But it did not adhere to the heater head 31. In addition, if the film thickness is too thin, for example, 17 μm or less, the space 32 between the adjacent copper lead electrodes 42 cannot be sufficiently filled, and the adhesive strength is lowered.

As described above, the OLB process can be stably performed without the anisotropic conductive film 13 adhering to the heater head 31, and a liquid crystal display device can be provided with a high yield.

Although the conductive particles in the anisotropic conductive film 13 are the solder particles as an example, the embodiment has been described in detail.
As the fine-pitch OLB-compatible conductive particles that require high-density mounting, for example, plastic balls plated with nickel and gold may be used.

In this embodiment, the case where the wiring electrode 12 on the liquid crystal display panel 11 is an ITO electrode has been described in detail, but other materials such as an aluminum electrode and molybdenum / aluminum / molybdenum can be used. The present invention can be applied to the case of a metal electrode.

In this embodiment, the case where the wiring electrode 12 is formed on the top coat layer 19 of the color filter has been described in detail as an example, but the top coat layer does not exist and the glass substrate is not present. Of course, the present invention can be applied to the case where the wiring electrode 12 is directly formed on the wiring electrode 12.

That is, although the color simple matrix liquid crystal display device has been described as an example of the liquid crystal display device in this embodiment, another liquid crystal display device, for example, a large-sized thin film transistor driven (TFT driven) liquid crystal display device (TFT). -L
Of course, the present invention can be applied to CD).

[0062]

According to the invention as set forth in claim 1, the anisotropic conductive film can be temporarily pressure-bonded to one side of the glass substrate of the liquid crystal display plate at a time, which is stable in a short time. A temporary pressure bonding step can be performed. Therefore, the liquid crystal display device can be manufactured at low cost and high yield.

According to the second aspect of the present invention, even if the anisotropic conductive film flows out from both ends of the tape carrier,
Since the height is controlled to be lower than the thickness of the tape carrier, the OLB process can be stably performed without adhering to the heater head. Therefore, a liquid crystal display device can be manufactured with a high yield.

[Brief description of drawings]

FIG. 1A is a side view showing an anisotropic conductive sheet used in a method for manufacturing a liquid crystal display device of the present invention, and FIG.
(C) and (d) are side views of the liquid crystal display panel showing the temporary pressure bonding step in the method of the present invention.

FIG. 2 is a plan view of a liquid crystal display panel showing a state in which a temporary pressure bonding step according to the present invention has been completed.

FIG. 3 is a side view showing a liquid crystal display panel when an anisotropic conductive film is temporarily pressure-bonded under a condition outside the optimum range.

FIG. 4 is a plan view at the end of OLB when the method for manufacturing a liquid crystal display device according to the present invention is used.

FIG. 5 is a plan view showing a tape carrier used for the above-mentioned OLB.

FIG. 6 is a cross-sectional view showing a connection portion of the OLB portion of the above.

FIG. 7 is a plan view showing a case where an anisotropic conductive film is temporarily pressure-bonded to the TAB-IC side by hitting the same OLB.

FIG. 8 is a plan view at the end of OLB in the case where a conventional method for manufacturing a liquid crystal display device is used.

9A is a plan view showing an OLB connection portion of the color simple matrix liquid crystal display device according to claim 2, FIG. 9B is a sectional view taken along line bb of FIG. 9A, and FIG. FIG.

10 is a plan view showing the tape carrier according to FIG. 9. FIG.

11 is a cross-sectional view showing a connection portion in the OLB process according to FIG.

FIG. 12 is a plan view showing a connecting portion in the OLB process of the above.

FIG. 13 is a plan view showing a case where an anisotropic conductive film is temporarily pressure-bonded to the glass substrate side.

FIG. 14 is a part C of FIG. 10 (end of the TAB-IC OLB part).
FIG.

FIG. 15 is a plan view showing a case where an anisotropic conductive film is temporarily pressure-bonded to the tape carrier side of FIG.

16 is a plan view showing the TAB-IC after punching the one shown in FIG.

FIG. 17 is a cross-sectional view showing an OLB connection portion of a conventional liquid crystal display device.

[Explanation of symbols]

1 tape carrier 2 driving integrated circuit 4, 41, 42, 43 lead electrode 11 liquid crystal display panel 12 wiring electrode 13, anisotropic conductive film 13b drained anisotropic conductive film 14 glass substrate 16 protective film 21, 22 Tape carrier (TAB-IC) with integrated drive circuit

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[Procedure amendment]

[Submission date] December 22, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Title of invention

[Correction method] Change

[Correction content]

[Title of the Invention A liquid crystal display device and its method of manufacture

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction content]

[0001]

The present invention relates relates to a method of manufacturing a liquid crystal display device and its, in particular a thermosetting anisotropic conductive film, tape liquid crystal driving integrated circuit (hereinafter abbreviated as IC) is mounted・A liquid crystal display device in which a carrier (abbreviated as TAB-IC hereinafter) is mounted on a glass substrate of a liquid crystal display plate, and
The present invention relates to a manufacturing method in the case of mounting , and particularly to a connection method.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0004

[Correction method] Change

[Correction content]

A liquid crystal driving IC 2 is mounted on the tape carrier 1 as shown in FIG. Therefore, the lead and the electrode 41 of the tip of the electrode 4, and a bump 8 made of gold on the IC 2, connected 冶 KimuManabu manner using a bonder (not shown) (ILB: Inner Lead Bonding) to. Thereafter, the IC 2 is resin-sealed (not shown), and subsequently punched into a desired shape 3 as shown in FIG. At this stage,
The conductive film 13 is not attached.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction content]

Next, as shown in FIG. 6 which is a sectional view and FIG. 8 which is a plan view of the whole thereof, the IC output side electrode 42 of the lead electrode 4 and the wiring formed on the periphery of the liquid crystal display panel 11. The electrode (ITO electrode) 12 is electrically connected (OLB: Outer Lead Bonding) through the anisotropic conductive film 13. When the adhesive layer of the anisotropic conductive film 13 is made of a thermosetting resin (referred to as a thermosetting anisotropic conductive film), the OLB process has conventionally been composed of the following three processes.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction content]

When the liquid crystal display device is a color simple matrix, the number of outputs of the X-side (horizontal axis side) TAB- IC21 is 80, and the pitch of the OLB portion is 110 μm. TAB
Although the number of ICs 21 is omitted in FIG. 12, there are 24 ICs on the upper side and 12 on the lower side. The Y-side (vertical axis side) TAB-IC22 has 80 outputs and
The pitch of the B portion is 220 μm, and a total of 5 pieces are mounted.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction content]

The invention of claim 1 has been made in view of the above-mentioned drawbacks of the prior art, and has a large number of TAB-ICs that perform OLB, such as a large TFT LCD, a simple matrix LCD, or an MIM-LCD. Also in this case, it is an object of the present invention to provide a method for manufacturing a liquid crystal display device in which the temporary pressure bonding step of the anisotropic conductive film can be stably performed with a high yield in a short time. The invention of claim 2 is as color passive matrix liquid crystal display device, even for fine pitch OLB those high-density mounting is required, use the unwanted materials, jigs Engineering <br/> instrument without without anisotropic conductive film is attached to the heater head, stability can be done OLB process, and to provide a liquid crystal display equipment that can achieve a high yield Te following.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Name of item to be corrected] 0027

[Correction method] Change

[Correction content]

[0027]

According to a first aspect of the present invention, there is provided a method for manufacturing a liquid crystal display device, comprising:
The thermosetting anisotropic conductive film supported by the protective film is thermocompression bonded, only the thermosetting anisotropic conductive film is cut at both edges of the glass substrate, and then the protective film is peeled off from the glass substrate. by repeating the above steps, the desired each side of the panel, a step of temporarily pressure bonding the thermosetting anisotropic conductive film, the lead electrodes of the tape carrier on which the IC is mounted, the heat An alignment step of aligning with a wiring electrode on a glass substrate through a curable anisotropic conductive film and temporarily attaching the tape carrier on the glass substrate;
And a final press-bonding step of firmly adhering the thermosetting anisotropic conductive film.

[Procedure Amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0028

[Correction method] Change

[Correction content]

A liquid crystal display device according to a second aspect is a drive driver.
Output side lead voltage of tape carrier with integrated circuit
The pole is the glass of the liquid crystal display panel through the thermosetting anisotropic conductive film.
The patterned wiring electrodes formed on the substrate.
The outer lead bonding part that is connected
The liquid crystal display device having the thermosetting anisotropic conductive material
The membrane is flushed out beyond the ends of the tape carrier.
Height of the thermosetting anisotropic conductive film
Is set lower than the thickness of the tape carrier .

[Procedure Amendment 10]

[Document name to be amended] Statement

[Name of item to be corrected] 0029

[Correction method] Change

[Correction content]

[0029]

In the manufacturing method according to the first aspect, the thermosetting anisotropic conductive film is temporarily pressed on each side of the glass substrate of the liquid crystal display plate. Therefore, it is possible to provide a stable temporary pressure-bonding step or OLB step in a short time.

[Procedure Amendment 11]

[Document name to be amended] Statement

[Name of item to be corrected] 0030

[Correction method] Change

[Correction content]

The liquid crystal display device according to claim 2, wherein the tape-
Since the height of the thermosetting anisotropic conductive film that has flowed outward from both ends of the carrier is lower than the thickness of the tape carrier, the flow out of the thermosetting anisotropic conductive film adheres to the heater head. There is no such thing. In addition, even if the heater head is long and the OLB portion is struck twice by the heater head over two TAB-ICs or more, the anisotropic conductive film that has already flown to the outside has a high height. Is less than the thickness of the tape carrier so it will not stick to the heater head .

[Procedure Amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0031

[Correction method] Change

[Correction content]

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, referring to FIG. 1 to FIG.
The embodiment corresponding to the description will be described in detail. As the liquid crystal display device, a case of a large TFT-LCD having a diagonal of 10.4 inches will be described as an example. 480 gate lines (X side),
There are 480 signal lines (Y side). Conventional technology
Since the items explained in section 2 are duplicated, the explanation is omitted.
It

[Procedure Amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0044

[Correction method] Change

[Correction content]

The present inventor has found that the thermosetting anisotropic conductive film 13
When the film thickness is 20 μm, the height of the thermosetting anisotropic conductive film 13 flowing out from the both ends of the tape carrier after the main OLB pressure bonding becomes lower than the thickness of the tape carrier, and the heater It was found that the OLB process can be performed stably without adhering to the head. Further, the thickness of the thermosetting anisotropic conductive film 13 existing outside the TAB-ICs 21 and 22 from the beginning is, of course, lower than that of the TAB-ICs 21 and 22, so that the OLB process can be performed without adhering to the head. is there. Regarding the film thickness of this thermosetting anisotropic conductive film 13,
A detailed description will be given later with reference to FIGS. 9 to 17. In addition,
Thermosetting anisotropic conductive film is a mixture of thermosetting and thermoplastic
It includes the resin of the product.

[Procedure Amendment 14]

[Document name to be amended] Statement

[Correction target item name] 0048

[Correction method] Change

[Correction content]

[0048] Next, referring to FIGS. 9 to 17, by a proper thickness of the thermosetting anisotropic conductive film 13, the thermosetting anisotropic flowing out to the outside from the tape carrier at both ends An embodiment corresponding to the invention of claim 2, wherein the height of the conductive film 13 becomes lower than the thickness of the tape carrier 1, does not adhere to the heater head during pressure bonding, and the OLB process can be stably performed.
An example will be described in detail.

[Procedure Amendment 15]

[Document name to be amended] Statement

[Correction target item name] 0062

[Correction method] Change

[Correction content]

[0062]

According to the invention of claim 1, the thermosetting anisotropic conductive film can be temporarily press-bonded to one side of the glass substrate of the liquid crystal display plate at one time. A stable temporary pressure bonding step can be performed in a short time. Therefore, the liquid crystal display device can be manufactured at low cost and high yield.

[Procedure 16]

[Document name to be amended] Statement

[Correction target item name] 0063

[Correction method] Change

[Correction content]

According to the second aspect of the present invention, even if the thermosetting anisotropic conductive film flows out from both ends of the tape carrier, its height is controlled to be lower than the thickness of the tape carrier. Therefore, outer lead bonding can be performed stably without adhering to the heater head.
Thus, a liquid crystal display device can be provided with a high yield.

Claims (2)

[Claims] 1. An anisotropic conductive film supported by a protective film is thermocompression bonded onto one side of a glass substrate of a liquid crystal display panel, and only the anisotropic conductive film is cut at both edge portions of the glass substrate. Then, the protective film is peeled off from the glass substrate, and the above steps are repeated to temporarily press-bond the anisotropic conductive film to each desired side of the liquid crystal display panel, and a tape on which a driving integrated circuit is mounted. An alignment step of aligning a lead electrode on the output side of the carrier with a wiring electrode on the glass substrate through the anisotropic conductive film, and temporarily attaching the tape carrier to the glass substrate; A method for manufacturing a liquid crystal display device, comprising: a main pressure bonding step of firmly adhering the film. 2. The anisotropic conductive film is caused to flow outward from both ends of the tape carrier, and the height of the anisotropic conductive film flowed out is made lower than the thickness of the tape carrier. Item 2. A method for manufacturing a liquid crystal display device according to item 1.