JPH049584Y2 - - Google Patents
Info
- Publication number
- JPH049584Y2 JPH049584Y2 JP6022686U JP6022686U JPH049584Y2 JP H049584 Y2 JPH049584 Y2 JP H049584Y2 JP 6022686 U JP6022686 U JP 6022686U JP 6022686 U JP6022686 U JP 6022686U JP H049584 Y2 JPH049584 Y2 JP H049584Y2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric plate
- base
- double
- adhesive tape
- sided adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、インピーダンス測定用テーブルに関
するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an impedance measurement table.
たとえば、プリント基板のパターン検査を行な
う検査装置として特開昭59−168375号に開示され
た装置が提案されている。
For example, an apparatus disclosed in Japanese Patent Laid-Open No. 168375/1983 has been proposed as an inspection apparatus for inspecting patterns of printed circuit boards.
この検査装置では、導電性基準面を有するイン
ピーダンス測定用テーブル（以下単にテーブルと
いう）上にプリント基板を載置し、各回路の端子
と導電性基準面の間のインピーダンス及び回路の
端子間の抵抗値を測定することにより、電気接続
回路綱の欠陥を短時間で検出するようになつてい
る。 In this inspection device, a printed circuit board is placed on an impedance measuring table (hereinafter simply referred to as a table) having a conductive reference surface, and the impedance between each circuit terminal and the conductive reference surface and the resistance between the circuit terminals are measured. By measuring the values, defects in electrical connection circuits can be detected in a short time.
前記テーブルは、厚さ1.6mmの銅張積層板に、
厚さ10mmの塩化ビニール製の誘電板を接着したも
のである。そして、この接着は、銅張積層板と誘
電板との間に気泡が残らないようにする必要があ
る。 The table is made of copper-clad laminate with a thickness of 1.6 mm.
It is made by gluing dielectric plates made of vinyl chloride with a thickness of 10 mm. This adhesion must be performed so that no air bubbles remain between the copper clad laminate and the dielectric plate.
従来、接着工程では、銅張積層板の表面に接着
剤を塗布し、誘電板を気泡が残らないように接着
したのち、40℃の加熱雰囲気中で、約500Kgで加
圧した状態で数時間かけて接着剤を硬化させてい
た。
Conventionally, in the bonding process, adhesive is applied to the surface of the copper-clad laminate, the dielectric plate is bonded without leaving any air bubbles, and then the dielectric plate is bonded to the copper-clad laminate in a heated atmosphere at 40°C under pressure of about 500 kg for several hours. to harden the adhesive.
このため、作業製が悪いだけでなく、銅張積層
板と誘電板の密着性が悪く、気泡の発生や接着部
が剥離し易い問題があつた。 This not only resulted in poor workmanship, but also poor adhesion between the copper-clad laminate and the dielectric plate, causing problems such as the generation of bubbles and easy peeling of the bonded portion.
本考案は、製作が容易で、密着性の良いテーブ
ルを提供することを目的をする。 The present invention aims to provide a table that is easy to manufacture and has good adhesion.
上記目的を達成するための本考案の構成を図に
基づいて説明すると、１は金属箔、２は両面接着
テープ。３は誘電板である。
The structure of the present invention for achieving the above object will be explained based on the drawings. 1 is a metal foil, and 2 is a double-sided adhesive tape. 3 is a dielectric plate.
このようなテーブルは、誘電板３の一面に、両
面接着テープ２を貼り、金属箔のベース１をその
上から貼付けて構成する。
Such a table is constructed by pasting double-sided adhesive tape 2 on one side of a dielectric plate 3, and pasting a metal foil base 1 thereon.
このような構成にすると、ベース１は、その柔
軟性により誘電板３の面に倣うので、ベース１と
誘電板３の密着性が向上し、かつ製作も容易にな
る。 With this configuration, the base 1 follows the surface of the dielectric plate 3 due to its flexibility, so the adhesion between the base 1 and the dielectric plate 3 is improved, and manufacturing is also facilitated.
以下本考案の一実施例を図に基づいて説明す
る。図において、１は銅、アルミニウム、鉄等の
金属箔で、形成されたベースで厚さは0.05mm〜
0.1mm。２は両面接着テープで、厚さ0.1〜0.3mm程
度のものを用いる。３は誘電板で、塩化ビニー
ル、アクリル樹脂等合成樹脂材で形成され、厚さ
は10mm程度のものを用いる。
An embodiment of the present invention will be described below based on the drawings. In the figure, 1 is a metal foil made of copper, aluminum, iron, etc., and the thickness is 0.05 mm ~
0.1mm. 2 is a double-sided adhesive tape with a thickness of about 0.1 to 0.3 mm. 3 is a dielectric plate, which is made of synthetic resin material such as vinyl chloride or acrylic resin, and has a thickness of about 10 mm.
誘電板３の一面に、その全面を覆うように両面
接着テープ２を貼り、その上にベース１を貼付け
る。 A double-sided adhesive tape 2 is pasted on one surface of a dielectric plate 3 so as to cover the entire surface, and a base 1 is pasted thereon.
このような構成であるから、誘電板３あるいは
両面接着テープ２の表面にうねり等があつても、
ベース１はその柔軟性によつてうねりに沿つて貼
ることができる。 With such a configuration, even if there are undulations on the surface of the dielectric plate 3 or the double-sided adhesive tape 2,
Due to its flexibility, the base 1 can be applied along the undulations.
また、温度の変化によつて伸縮する場合にも、
ベース１は誘電板３の伸縮に倣うため、反りや剥
離が発生することがない。 Also, when it expands and contracts due to temperature changes,
Since the base 1 follows the expansion and contraction of the dielectric plate 3, warping and peeling do not occur.
〔考案の効果〕
以上述べた如く、本考案によれば、ベースと誘
電板を両面接着テープで貼合せるようにしたので
製作が容易である。また、ベースが金属箔である
から、温度変化による反りや剥離が発生しない等
の効果がある。[Effects of the Invention] As described above, according to the present invention, the base and the dielectric plate are bonded together using double-sided adhesive tape, so manufacturing is easy. Furthermore, since the base is made of metal foil, there are advantages such as no warping or peeling due to temperature changes.
図は本考案の一実施例を示すテーブルの側面図
である。
１……ベース、２……両面接着テープ、３……
誘電板。
The figure is a side view of a table showing an embodiment of the present invention. 1...Base, 2...Double-sided adhesive tape, 3...
dielectric plate.
Claims (1)
両面接着テープと、この両面接着テープ上に貼ら
れた誘電板を設けたことを特徴とするインピーダ
ンス測定用テーブル。 An impedance measuring table comprising a base made of metal foil, a double-sided adhesive tape pasted on the base, and a dielectric plate pasted on the double-sided adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6022686U JPH049584Y2 (en) | 1986-04-23 | 1986-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6022686U JPH049584Y2 (en) | 1986-04-23 | 1986-04-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62173071U JPS62173071U (en) | 1987-11-04 |
| JPH049584Y2 true JPH049584Y2 (en) | 1992-03-10 |
Family
ID=30892450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6022686U Expired JPH049584Y2 (en) | 1986-04-23 | 1986-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH049584Y2 (en) |
-
1986
- 1986-04-23 JP JP6022686U patent/JPH049584Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62173071U (en) | 1987-11-04 |
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