JPH0494881A - Laser marking device - Google Patents

Abstract

PURPOSE:To expand a marking line width without requiring an exclusive line by dividing laser light from a laser light source, then, paralleling those divided laser lights with each other and condencing them on a material to be worked. CONSTITUTION:A laser beam 100 from a YAG laser oscillator 3 is divided by a half mirror 10 into two parts, then, those two laser beams 101, 102 are paralleled by total reflection mirrors 11,12 to each other and scanned by an X-axis scanner mirror 15 and a Y-axis scanner mirror 17 at the same time to irradiate the working surface of the material 4 to be worked. In this way, the diameter of a spot does not change but the number of spots increases, therefore, the line width of the marking can be enlarged by two times without increasing the frequency of the marking, the time for processing to enlarge the line width of the marking can be reduced drastically.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a laser marking device, and more particularly to a method of marking a workpiece with a laser beam.

BACKGROUND ART Conventionally, in this type of marking method, a workpiece was marked by scanning a single laser beam.

In such conventional marking methods, the workpiece was marked by scanning a single laser beam, so the line width of the marking was determined by the spot diameter of the laser beam, so the line width could be very short. It was thin.

When the dimension of the marking is small, contrast can be obtained even with a thin line width, but when the 1J method of the marking becomes large,
Contrast deteriorates with thin line widths.

Therefore, in order to increase the line width of the marking, it is necessary to increase the number of times of masking and overlap the marking lines, which poses a problem of increasing processing time.

Alternatively, as shown in Figure 4, there is a method of scanning the laser beam in a spiral to increase the line width of the marking, but in this case, the marking processing time becomes longer and the laser beam is scanned in a spiral. There is a problem in that a dedicated circuit for scanning is required.

Purpose of the Invention The present invention was made in order to eliminate the problems of the conventional ones as described above, and it is possible to increase the line width of the marking without the need for a dedicated circuit, thereby significantly shortening the processing time. The purpose of the present invention is to provide a laser marking device that can perform

Structure of the Invention A laser marking device according to the present invention is a laser marking device that marks a workpiece with a laser beam from a laser light source, and the laser marking device divides the laser beam from the laser light source into first and second laser beams. a dividing means for dividing;
means for collimating the first and second laser beams separated by the dividing means; and condensing the first and second laser beams, which have been parallelized, onto the workpiece. It is characterized by having a light condensing means.

Embodiment Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a partially enlarged view of the embodiment of the present invention.

In these figures, when a laser beam 100 is emitted from a YAG laser oscillator 3 under the control of a control unit 2, this laser beam 100 is transmitted through a 50% transmitting 50% reflecting half mirror (hereinafter referred to as a half mirror) of an optical unit 1. 10, it is divided into two laser beams 101 and 102.

The laser beam 102 reflected by the half mirror 10 is reflected by the total reflection mirror 11 at 90° in the vertical direction, and is reflected by the total reflection mirror 12 at 90° so as to be parallel to the optical path of the laser beam 101 that has passed through the half mirror 10. Ru.

Thereby, a height difference is provided between the optical path of the laser beam 101 and the optical path of the laser beam 102.

The laser beam 101 is incident on the expander 13 after passing through the half mirror 1o, and the laser beam 102 is reflected by the total reflection mirror 12 by 90'' and then incident on the expander 14 (see FIG. 2).

Laser beams 101.102 are connected to expanders 13.14
Upon exiting, the light is scanned by an X-axis scanner mirror 15 and a Y-axis scanner mirror 17, and after being focused by an fθ lens 19, it is guided to the processing surface of the workpiece 4 by a total reflection mirror 20.

Here, the X-axis scanner mirror 15 and the Y-axis scanner mirror 17 are rotated by the X-axis galvanometer 16 and the Y-axis galvanometer 8, respectively, and the laser beams 102 are scanned by the rotation.

Therefore, the same mark is drawn on the processing surface of the workpiece 4 by the two simultaneously scanned laser beams 101 and 102.

For example, when marking "1" on the processing surface of the workpiece 4, as shown in FIG. 3, two laser beams 101 and 102 mark "1" simultaneously, so the number of markings It is now possible to double the marking line width without increasing the
Processing time when increasing the line width of markings can be significantly reduced.

In this way, the laser beam 1 from the YAG laser oscillator 3
00 is divided into two by the half mirror 10, and then the two laser beams 101 and 102 are transferred to the total reflection mirror 11.
．． 12 to make the beams parallel to each other, and the X-axis scanner mirror 1
5 and Y-axis scanner mirror 17 to simultaneously scan and irradiate the processing surface of the workpiece 4, the spot diameter itself does not change, but the number of spots increases, so the number of marking operations can be done without increasing the number of markings. The line width of the marking can be made twice as thick, and the processing time when making the line width of the marking thick can be significantly reduced.

Further, when increasing the line width of the marking, there is no need for a dedicated circuit for making the laser beam spiral as in the past.

In one embodiment of the present invention, a case has been described in which the laser beam 100 is divided into two by the half mirror 10, but it is also possible to divide the laser beam into three by combining optical systems, and the invention is not limited to this.

DETAILED DESCRIPTION OF THE INVENTION According to the present invention, a laser beam from a laser light source is divided, the divided laser beams are made parallel to each other, and then focused onto a workpiece using the same optical system. By doing so, the line width of the masking can be increased without requiring a dedicated circuit, and the processing time can be significantly shortened.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing an embodiment of the present invention, FIG. 2 is a partially enlarged view of an embodiment of the present invention, FIG. 3 is a diagram showing an example of marking according to an embodiment of the present invention, and FIG. 4 is a diagram showing an example of conventional marking. Explanation of symbols of main parts 1... Optical section 3... YAG laser oscillator 4... Workpiece 10... 50% transmission 50% reflection half mirror 1. 1.12 20... Total reflection mirror 13.14... Expander 15... X-axis scanner mirror 17... Y-axis scanner mirror 19...・・・fθ lens

Claims (1)

[Claims] (1) A laser marking device that marks a workpiece with a laser beam from a laser light source, comprising a dividing means for dividing the laser beam from the laser light source into first and second laser beams; means for collimating the first and second laser beams separated by the means; and condensing means for condensing the first and second laser beams, which have been parallelized to each other, onto the workpiece. A laser marking device comprising: means.