JPH0454703Y2 - - Google Patents

Description

[Detailed description of the invention] [Summary] The purpose of this invention is to provide a connector device that is simple, highly reliable, and requires little force during operation, regarding electrical connectors between connected objects. A connector for electrically connecting two connected objects, one of which is provided with a connecting pad, the other connected object is provided with a contact with a spring means, and the connection between the connecting pad and the contact is provided. A layer made of a porous material that is difficult to diffuse and fuse is formed on each opposing surface, and each layer is impregnated with first and second low melting point metals that become eutectic extremely low melting point metals at room temperature. It is configured so that

[Industrial application field]

The present invention relates to an electrical connection connector.

[Conventional technology]

In recent years, as computers have improved in performance, circuit boards have become more dense and smaller, and a large number of input/output I/O pins have come to be installed on the circuit boards.
In order to electrically connect these circuit boards, connecting the large number of I/O pins provided on the circuit boards with conventional male/female connectors requires too much connection force, and the male・A large burden is placed on the circuit board when mating the female. To solve this problem, we have developed a ZIF with very low insertion and removal force.
Although a mechanism called LIF is sometimes used, connection using liquid metal is also one method for the multi-pin connection described above.

As an example of the prior art of connecting I/O pins using liquid metal, Japanese Patent Application Laid-open No. 1986-52 by the same applicant as the subject matter
Publication No. 73392 and JP-A-60-253177 by another applicant
There is a publication number. In the former, a flexible material is impregnated with liquid metal and used as a contact, and a male
Connect each female terminal. In the latter method, a metal that is solid when not in use is heated to become a liquid metal when in use, and an electrode is inserted into the liquid metal for connection.

[The problem that the idea attempts to solve]

However, in the former, the metal used for the contacts is always liquid, and if the terminal is repeatedly inserted and removed, the liquid metal will scatter and become unusable, while in the latter, the metal used for the contacts is liquid only during use. , as above, liquid metal is scattered as the electrode is inserted and removed,
In addition to being expendable, there is a risk of spillage if it is moved while in a liquid state, and furthermore, a heating device and the like are required, resulting in high costs.

Therefore, this invention aims to solve such problems,
An object of the present invention is to provide a connector device that is simple, highly reliable, and requires little force during operation.

[Means to solve the problem]

In view of the above object, the present invention provides a connector for electrically connecting opposing connected objects, wherein one connected object is provided with a connecting pad, and the other connected object is provided with a contact having a spring means. a layer made of a porous material that is difficult to diffuse and fuse is formed on each opposing surface of the connection pad and the contact, and in the layer are first and second low melting point metals that are eutectic ultra low melting point metals. Provided is a connector device impregnated with the following.

[Effect]

The eutectic very low melting point metals are each solid at normal room temperatures. However, when the two are brought into contact, they diffuse into each other and form an alloy, and since this alloy has a melting point of about 20° C. or less, it is a liquid at normal room temperature, and therefore the connection pad and the contact are in good electrical contact. In this case, since each diffusion metal is impregnated into a porous layer, diffusion fusion occurs only in the vicinity of the contact area between the two.

〔Example〕

The present invention will be described in more detail below based on embodiments shown in the accompanying drawings.

Referring to FIG. 1, there is shown a connector device for electrically connecting two circuit boards 10 and 12 that are arranged opposite to each other. One of these circuit boards 12
However, it may be a motherboard on which a plurality of circuit boards are mounted. The circuit board 10 has connection pads 1
4, and the other circuit board 12 is provided with an electrically conductive base 20 at a position facing the connection pad 14, and on the base 20 is provided an electrically conductive base 20 with a small spring constant. A coil spring 16 is attached, and a contact 18 for contacting the connection pad 14 is attached to the upper end of the coil spring 16. Of course, this contact 18 is also made of an electrically conductive material. In this embodiment, the coil spring 16 is housed in a tube 22 and can expand and contract in the longitudinal direction of the tube 22. The action of this coil spring 16 allows the contact 18 to come into contact with the connecting pad 14.

2 and 3 are enlarged views of the contact area A between the contact 18 and the connection pad 14. The connection pad 14 has a porous silver plating layer 26 on the surface of the copper base material 24, and the contact 18 has a copper A porous silver plating layer 30 is formed on the surface of the base material 32, respectively. Furthermore, further enlarged views are shown in FIGS. 4 and 5, and each porous silver plating layer 26, 3
0 contains tin-zinc alloy 34 and gallium 36, respectively.
It shows that it is impregnated.

When the connection pad 14 and the contact come into contact,
Each silver plating layer 26, 30 is blocked by a silver member, and the fifth
As shown in the figure, biporous silver plating layers 26 and 30
Of the metals 34 and 36 impregnated with the metal, only those in the vicinity of the contact area diffuse into each other, resulting in an alloy 38 having a melting point of approximately 10°C, which becomes liquid and forms an electrical connection between the connection pad 14 and the contact 18. can be ensured.

When the contact 18 is separated from the connection pad 14, the liquefied alloy 38 leaves the remaining impregnated metal having a very large volume compared to the volume of the alloy 38, i.e., the tin-zinc alloy 34 on the connection pad 14 side. Then, diffusion occurs between the contact 18 side and the gallium 36, and the tin-zinc alloy or gallium is restored to its original state, so that electrical connection and disconnection can be made many times. Further, a porous silver plating layer can be obtained by overcurrent plating.

The above explanation uses a silver plating layer as an example of a porous layer, but any metal that does not easily cause diffusion fusion with a low melting point metal such as gallium may be used;
Palladium and the like can also be used. In addition, as a combination of low melting point metals, gallium-indium,
A combination of gallium-indium-tin alloy can also be used.

[Effect of idea]

As is clear from the above explanation, according to the present invention,
Since electrical connection is possible with only light contact between the connection pad and the contact, no excessive load force is applied to each circuit board and no damage is caused. Also,
Since the amount of the alloy that becomes liquid when electrically connected is small, it is naturally restored many times, making it possible to provide a simple connector device that can be used for a long period of time and is highly reliable.

[Brief explanation of the drawing]

Fig. 1 is a diagram of the connector device according to the present invention, Fig. 2 is an enlarged view of part A in Fig. 1 in a melted state, and Fig. 3 is a diagram of the connector device according to the present invention.
FIG. 4 is an enlarged view of section B in FIG. 2, and FIG. 5 is an enlarged view of section C in FIG. 2. 10, 12... Circuit board, 14... Connection pad, 16... Coil spring, 18... Contact,
26, 30... Porous silver plating layer, 34...
Tin-zinc alloy, 36...Gallium.

Claims (1)

[Scope of utility model registration request] A connector that electrically connects opposing objects 10 and 12, in which one object 10 is provided with a connection pad 14, and the other object 12 is provided with a contact 18 having a spring means 16. A layer 2 of a porous diffusion-fused material is provided on each opposing surface of the connection pad 14 and the contact 18.
6 and 30, and the layers 26 and 30 are respectively impregnated with first and second low melting point metals that become eutectic extremely low melting point metals at room temperature.