JPH0454153U - - Google Patents
Info
- Publication number
- JPH0454153U JPH0454153U JP9643290U JP9643290U JPH0454153U JP H0454153 U JPH0454153 U JP H0454153U JP 9643290 U JP9643290 U JP 9643290U JP 9643290 U JP9643290 U JP 9643290U JP H0454153 U JPH0454153 U JP H0454153U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- board
- terminal
- glass
- glass portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第１図は、この考案の一実施例に係るハーメチ
ツクシール構造を示す断面図である。第２図は、
従来のハーメチツクシール構造の一例を示す断面
図である。
２……ステム、４ａ……ガラス部、６……端子
、８……基板、１６……半田、１８……カバー。
FIG. 1 is a sectional view showing a hermetic seal structure according to an embodiment of this invention. Figure 2 shows
FIG. 2 is a sectional view showing an example of a conventional hermetic seal structure. 2... Stem, 4a... Glass portion, 6... Terminal, 8... Board, 16... Solder, 18... Cover.
Claims (1)
引き出した金属製のステム上に、回路部品を搭載
した基板を載せてそれと前記端子とを半田付けし
、更にステム上に金属製のカバーを被せて両者間
を接合して内部を気密封止したハーメチツクシー
ル構造において、前記ステムのガラス部を、その
上段側が広く下段側が狭い二段構成にしたことを
特徴とするハーメチツクシール構造。 A board on which circuit components are mounted is placed on a metal stem having a glass part and a terminal is pulled out through the glass part, and the terminal is soldered to the board, and a metal cover is placed on the stem. 1. A hermetic seal structure in which the glass portion of the stem has a two-tiered structure in which the glass portion of the stem is wide on the upper side and narrow on the lower side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9643290U JPH0454153U (en) | 1990-09-12 | 1990-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9643290U JPH0454153U (en) | 1990-09-12 | 1990-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0454153U true JPH0454153U (en) | 1992-05-08 |
Family
ID=31835966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9643290U Pending JPH0454153U (en) | 1990-09-12 | 1990-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0454153U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283556A (en) * | 1994-04-08 | 1995-10-27 | Toshiba Corp | Airtight terminal structure of package |
| WO2010117000A1 (en) * | 2009-04-08 | 2010-10-14 | エヌイーシー ショット コンポーネンツ株式会社 | High-voltage airtight terminal and method for producing the same |
-
1990
- 1990-09-12 JP JP9643290U patent/JPH0454153U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283556A (en) * | 1994-04-08 | 1995-10-27 | Toshiba Corp | Airtight terminal structure of package |
| WO2010117000A1 (en) * | 2009-04-08 | 2010-10-14 | エヌイーシー ショット コンポーネンツ株式会社 | High-voltage airtight terminal and method for producing the same |
| JP2010244927A (en) * | 2009-04-08 | 2010-10-28 | Nec Schott Components Corp | High pressure-resistant and airtight terminal and manufacturing method thereof |
| CN102388508A (en) * | 2009-04-08 | 2012-03-21 | 恩益禧肖特电子零件有限公司 | High-voltage airtight terminal and method for producing the same |