JPH0448090A - Etching device - Google Patents

Abstract

PURPOSE:To uniformly etch even a large-sized substrate by arranging a group of spray nozzles separately at the center and both ends of a material to be etched to the direction orthogonal to the traveling direction and spraying a liq. etchant having a different temp. to the nozzles at the time of conveying the material in a chamber provided with the many spray nozzles. CONSTITUTION:Plural spray nozzles 2, e.g. four, are arranged to the direction orthogonal to the traveling direction of a substrate 6, a high-temp. liq. etchant 3 is supplied as shown by the array B to the nozzle 2a among the nozzles 2 on the upper surface side of the substrate 6 at the center (the center in the direction orthogonal to the substrate traveling direction), and a low-temp. etchant 3 is supplied as shown by the arrow C to the nozzle 2b on both ends on the upper surface side of the substrate 6 (both ends in the direction orthogonal to the substrate traveling direction) and to the nozzle 2b on the lower surface side of the substrate 6.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an apparatus for etching printed wiring boards and the like by spraying an etching liquid, and particularly for etching large-sized objects (hereinafter referred to as substrates) uniformly over the entire surface. This invention relates to a method for obtaining industrially fine and highly accurate wiring boards by performing highly accurate etching.

[Prior Art] A conventional etching apparatus is constructed as shown in FIG. Spray nozzles 2 are arranged above and below in the chamber 1, and the etching liquid 3 in the chamber 1 is supplied to the spray nozzles 2 by a spray pump P1.The etching liquid 3 in the chamber 1 is supplied to the spray nozzles 2 by a circulation pump P2. It is designed to circulate. Inside the chamber 1 are a cooler 4 for cooling the etching liquid 3 and an etching liquid 3.
A temperature control heater 5 is arranged to heat the temperature. A plurality of spray nozzles 2 are lined up in a direction perpendicular to the paper plane of FIG. 3 to form two groups of spray nozzles, and a plurality of spray nozzles 2 are lined up in a left-right direction (direction in which the substrate is conveyed) in FIG. 3. When the substrate is fed in the direction indicated by the arrow in FIG. 3, the etching liquid 3 is sprayed from the spray nozzle 2 on the top and bottom of the substrate, thereby etching the substrate.

[Problems to be Solved by the Invention] However, when performing etching by spraying the etching liquid 3 from the spray nozzle 2 with a conventional etching device,
When the board becomes large, the top surface, the bottom surface, the center of the board (the center in the direction perpendicular to the board transport direction),
There was a problem in that the etching speed was different at both ends (both ends in the direction perpendicular to the direction of transport of the substrate), and the line width varied depending on the position on the substrate surface.

That is, for large-sized substrates, etching was performed by swinging the spray nozzle 2 in a direction perpendicular to the conveying direction so that the etching solution uniformly applied to the entire surface of the substrate. However, even if you can spray the entire surface of the board uniformly as shown in step 2. Etching is delayed at the center of the upper surface of the substrate, and at both ends of the lower surface, resulting in a thick line. Further, when the substrate is thin, it is necessary to install a large number of conveyance rollers to ensure the conveyance of the substrate. In such a case, the rollers become a physical obstacle, and the above-mentioned drawbacks are especially noticeable. This problem was particularly severe on the top surface of the substrate.

The reason for this is that on the top surface, the etching solution that hits the substrate travels along the top surface of the substrate and falls from the edge, so it tends to accumulate in the center, whereas on the bottom surface, it does not necessarily fall from the i part of the substrate. On the contrary, there is a tendency for the etching solution to accumulate at both ends. Therefore, it is difficult for fresh etching solution to come into contact with the substrate surface in the pooled area of the etching solution, and this is considered to be the reason for the delay in etching in this area, resulting in thick lines.

The present invention has been made in view of the above points, and the purpose of the present invention is to perform uniform etching over the entire surface even on large-sized boards, and to form fine, high-precision circuit boards through etching processing. It is possible to provide a suitable etching device.

[,! Means for Solving Problem 1] In order to achieve the above object, the etching apparatus of the present invention transports the object to be etched in a channel/e equipped with a large number of spray nozzles and continuously etches the object to be etched. The present invention is characterized in that the spray nozzle group is divided into the central part and both ends of the object to be etched in a direction perpendicular to the direction of transport of the object, and etching liquids having different temperatures are supplied to each part.

Another feature is that the high-temperature etching solution is sprayed onto the center of the upper surface of the object to be etched in the direction perpendicular to the conveyance direction, and the low-temperature etching solution is sprayed onto the remaining portion of the object. preferable. Furthermore, the high-temperature etching solution is sprayed onto the central part of the top surface of the object to be etched and the lower surface of the object to be etched, and the low-temperature etching solution is sprayed onto the remaining portion of the object. It is also preferable to

[Function] By spraying a high temperature etching solution onto the areas where etching delays are likely to occur, uniform etching can be achieved over the entire surface of the object to be etched (substrate).

[Embodiment] Since the overall structure of the etching apparatus is basically the same as the conventional example shown in FIG. 3, the explanation will be omitted and only the different points will be described. In the case of an embodiment in which a plurality of spray nozzles 2 (four in this embodiment) are arranged in a direction perpendicular to the conveyance direction of the substrate 6, the central part of the spray nozzles 2 on the upper surface side of the substrate 6 is arranged. Spray nozzle 2aL (at the center @ in the direction perpendicular to the substrate conveyance direction): High temperature etching e, 3 is supplied as shown by arrow B in FIG.
Low-temperature etching liquid 3 is supplied to the spray nozzles 2b at both ends (in a direction perpendicular to the direction of substrate transport) and to the spray nozzles 2b on the lower surface of the substrate 6, as indicated by arrow C in FIG. Low-temperature etching liquid 3 is supplied to spray pump P to nozzle 2b of spray nozzle 7, and high-temperature etching liquid 3 is supplied to spray nozzle 2a via heating tank 7 and spray pump Pc. ing. For example, the temperature of high temperature etching wL3 is 48
℃, and the temperature of the low-temperature etching solution 3 is, for example, 4℃.
It is 0°C. However, when the substrate 6 is transported and etched by spraying the etching liquid 3 on the upper and lower surfaces of the substrate 6, the high temperature etching liquid 3 is sprayed on the center part of the upper surface of the substrate 6 where the etching liquid 3 tends to accumulate. Etching of the central portion of the upper surface of the substrate 6 can be promoted, and as a result, uniform etching can be achieved over the entire surface of the substrate 6.

In the case of the above embodiment, the high temperature etching solution was sprayed from the spray nozzle 2 corresponding to the center part of the upper surface of the substrate 6, but the spray nozzle 2 corresponding to both ends of the lower surface of the substrate 6 sprayed the high temperature etching solution.
By spraying a high-temperature etching solution from above to promote etching at both ends of the lower surface of the substrate 6 where the etching solution 3 tends to accumulate, more uniform etching can be achieved over the entire surface. In addition, the temperature of etching [3] sprayed on the center of the top surface of the substrate 6 and the temperature of etching wL3 sprayed on both parts of the bottom surface of the substrate 6 may be changed. Temperature of liquid 3 is 4
The temperature of the etching liquid 3 sprayed onto both ends of the lower surface of the substrate 6 is set to 44°C, and the temperature of the etching liquid 3 sprayed onto other parts is set to 40°C. In this way, adjust the amount of etching solution 3 depending on how easily the etching solution 3 accumulates.
Even more uniform etching can be achieved by changing the temperature.

[Effects of the Invention] As described above, the present invention divides the spray nozzle group into the center and both ends of the object to be etched in a direction perpendicular to the direction of conveyance of the object to be etched, and supplies etching liquids having different temperatures to each part. This makes it possible to accelerate etching by spraying high-temperature etching solution on areas where etching solution accumulates and slows down etching, and even large-sized objects (substrates) can be etched uniformly. Etching is possible, and fine, high-precision printed boards for industrial use can be manufactured by etching.

In the second aspect of the present invention, a high temperature etching solution is sprayed onto the center of the upper surface of the object to be etched in a direction perpendicular to the conveying direction, and a low temperature etching solution is applied to the remaining part of the object to be etched. Since the etching solution is sprayed onto a portion, the hot etching solution is sprayed onto the upper surface of the object to be etched where the etching solution tends to accumulate, thereby promoting etching and uniformly etching the entire surface of the object to be etched. Furthermore, in the invention described in claim 3 of the present invention, a high temperature etching solution is sprayed onto the center of the upper surface of the object to be etched and both ends of the lower surface of the object to be etched, and a low temperature etching solution is sprayed onto the object to be etched. By spraying the hot etching solution onto the remaining part of the object, the hot etching solution is sprayed onto the center of the top surface and both ends of the bottom surface of the object, where etching solution tends to accumulate. It can be etched.

[Brief explanation of the drawing]

FIG. 1 is a perspective view illustrating an embodiment of the present invention, FIG. 2 is a schematic side sectional view of the same, and FIG. 3 is a schematic front sectional view of a conventional example, where 1 is a chamber and 2 is a spray nozzle. be. Agent Patent Attorney Ishi 1) Choshichi

Claims (1)

[Scope of Claims] [1] In an apparatus for conveying and continuously etching an object to be etched in a chamber equipped with a large number of spray nozzles, a group of spray nozzles is arranged in a direction perpendicular to the direction of conveyance of the object to be etched. An etching apparatus characterized in that an etching solution is divided into a central part and both ends of an object to be etched, and etching liquids having different temperatures are supplied to each part. [2] A high-temperature etching solution is sprayed onto the central part of the upper surface of the object to be etched in a direction perpendicular to the conveying direction, and a low-temperature etching solution is sprayed onto the remaining part of the object to be etched. An etching apparatus according to claim 1. [3] High temperature etching solution is sprayed onto the center of the top surface of the object to be etched and both ends of the bottom surface of the object to be etched, while low temperature etching solution is sprayed onto the remaining portion of the object to be etched. Claim 1
Etching apparatus described.