JPH0444174U - - Google Patents
Info
- Publication number
- JPH0444174U JPH0444174U JP8674690U JP8674690U JPH0444174U JP H0444174 U JPH0444174 U JP H0444174U JP 8674690 U JP8674690 U JP 8674690U JP 8674690 U JP8674690 U JP 8674690U JP H0444174 U JPH0444174 U JP H0444174U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- substrate
- pattern
- mounting structure
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の第１実施例を示す断面図、第
２図は第１図の基板の底面図、第３図は基板の他
の例を示す図、第４図は本考案の第２実施例を示
す断面図、第５図は第４図の基板の底面図、第６
図は従来技術を示す図である。 １０……基板、１２……ＲＡＭ、１４……ＲＯ
Ｍ、１６，１８……ピン、２４……ソケツト、５
０，５２……パターン。
２図は第１図の基板の底面図、第３図は基板の他
の例を示す図、第４図は本考案の第２実施例を示
す断面図、第５図は第４図の基板の底面図、第６
図は従来技術を示す図である。 １０……基板、１２……ＲＡＭ、１４……ＲＯ
Ｍ、１６，１８……ピン、２４……ソケツト、５
０，５２……パターン。
Claims (1)
- 基板と、該基板の上に配置された第１の集積回
路と、該第１の集積回路の上方に重畳して配置さ
れた第２の集積回路と、該基板に設けられたパタ
ーンとからなり、該基板のパターンが該第１の集
積回路及び該第２の集積回路の対応するピンに共
通的に接続されるようにした集積回路取りつけ構
造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8674690U JPH0444174U (ja) | 1990-08-21 | 1990-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8674690U JPH0444174U (ja) | 1990-08-21 | 1990-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444174U true JPH0444174U (ja) | 1992-04-15 |
Family
ID=31818566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8674690U Pending JPH0444174U (ja) | 1990-08-21 | 1990-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444174U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316606A (ja) * | 1995-05-24 | 1996-11-29 | Nec Corp | Ｌｓｉパッケージの実装構造 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146792A (ja) * | 1988-11-28 | 1990-06-05 | Nec Corp | 半導体装置の実装構造 |
-
1990
- 1990-08-21 JP JP8674690U patent/JPH0444174U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146792A (ja) * | 1988-11-28 | 1990-06-05 | Nec Corp | 半導体装置の実装構造 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316606A (ja) * | 1995-05-24 | 1996-11-29 | Nec Corp | Ｌｓｉパッケージの実装構造 |