[go: up one dir, main page]

JPH04364404A - Electronic parts lighting method - Google Patents

Electronic parts lighting method

Info

Publication number
JPH04364404A
JPH04364404A JP3138775A JP13877591A JPH04364404A JP H04364404 A JPH04364404 A JP H04364404A JP 3138775 A JP3138775 A JP 3138775A JP 13877591 A JP13877591 A JP 13877591A JP H04364404 A JPH04364404 A JP H04364404A
Authority
JP
Japan
Prior art keywords
electronic component
illumination
light
function
lighting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3138775A
Other languages
Japanese (ja)
Inventor
Keizo Izumida
圭三 泉田
Akio Okada
岡田 昭男
Takashi Shimizu
隆 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3138775A priority Critical patent/JPH04364404A/en
Publication of JPH04364404A publication Critical patent/JPH04364404A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Image Input (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To enable generation of noise image to be minimized for reducing recognition error and achieve a more reliable position/attitude recognition by lighting a light-emitting body at a position which is determined by a function and then illuminating a needed portion by controlling an illumination angle, an illumination position. and a light-emitting intensity of an illumination light. CONSTITUTION:An illumination light-emitting control portion 2 receives shape characteristic data such as a type, a dimension, the number of electrodes, and a direction of electrode of electronic parts 10 to be illuminated, and then performs processing with a previously set function. An LED is turned on or off and a light-emitting intensity of the entire LED to be lit is determined by a function of the control portion 2. The illumination position control portion 4 receives a shape characteristic data of parts from the control portion 3, a distance between the LED and electronic parts and a lighting irradiation angle are determined for each side of four sides by a preset function, and then only a needed portion of the parts 10 is lit. A recognition error is reduced without achieving lighting with a brightness exceeding a required level and by minimizing generation of an unneeded noise image.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は視覚認識装置を用い電子
部品の位置・姿勢を認識し、位置,姿勢のずれを補正し
て電子回路基板の所定の位置に電子部品を実装する機能
を備えた電子部品実装装置の電子部品照明方法に関する
[Industrial Application Field] The present invention has a function of recognizing the position and orientation of an electronic component using a visual recognition device, correcting deviations in position and orientation, and mounting the electronic component at a predetermined position on an electronic circuit board. The present invention relates to an electronic component lighting method for an electronic component mounting apparatus.

【0002】0002

【従来の技術】所定の電子部品を電子回路基板上に実装
する電子部品実装設備において、部品供給部から電子回
路基板上に電子部品を移載する際、視覚認識装置を用い
移載中の電子部品の位置・姿勢を認識し、位置,姿勢ず
れを補正して高精度に電子部品を電子回路基板上に実装
する方法がよく用いられている。電子部品実装装置に用
いられている視覚認識方法には、照明方法からみて次の
2種がある。第1は対象物である電子部品の背景側から
照明光をあて電子部品の輪郭画像を得、処理する透過照
明認識方法である。第2は対象物である電子部品の表面
側から照明光をあて電子部品のボディ、および電極部の
電極部の画像を得、処理する反射照明認識方法である。 透過照明認識方法は従来より電子部品実装設備にはよく
用いられており、反射照明認識方法は近年用いられつつ
ある。それぞれの例を図7と図8に示す。
[Background Art] In electronic component mounting equipment that mounts predetermined electronic components on electronic circuit boards, when transferring electronic components from a component supply section onto the electronic circuit board, a visual recognition device is used to detect the electronic components being transferred. A commonly used method is to recognize the position and orientation of components, correct position and orientation deviations, and mount electronic components on electronic circuit boards with high precision. There are two types of visual recognition methods used in electronic component mounting apparatuses in terms of lighting methods: The first method is a transmitted illumination recognition method in which illumination light is applied from the background side of an electronic component as a target object to obtain a contour image of the electronic component and process it. The second method is a reflected illumination recognition method in which illumination light is applied from the surface side of an electronic component as a target object to obtain and process images of the body of the electronic component and the electrode section of the electronic component. The transmitted illumination recognition method has been commonly used in electronic component mounting equipment, and the reflected illumination recognition method has been used in recent years. Examples of each are shown in FIGS. 7 and 8.

【0003】図7は透過照明認識方法の照明方法(以下
、透過照明方法とする。)の例を示しており、電子部品
実装設備の移載部が保持している電子部品を平面上に並
べた複数のLEDにより部品保持部側(つまり電子部品
の背景側)から照明し、電子部品の輪郭画像を得ている
。透過照明方法は実装する電子部品の寸法が移載部の電
子部品保持部に対し十分に大きい場合によく用いられる
FIG. 7 shows an example of an illumination method of the transmitted illumination recognition method (hereinafter referred to as the transmitted illumination method), in which the electronic components held by the transfer section of the electronic component mounting equipment are arranged on a flat surface. A plurality of LEDs are used to illuminate the electronic component from the component holder side (that is, the background side of the electronic component) to obtain an outline image of the electronic component. The transmitted illumination method is often used when the size of the electronic component to be mounted is sufficiently large compared to the electronic component holding section of the transfer section.

【0004】図8は反射照明認識方法の照明方法(以下
、反射照明方法とする。)の例を示しており、TVカメ
ラ側から電子部品の表面を照明し、電子部品のボティ、
および電極部画像を得ている。反射照明方法は実装する
電子部品の寸法が移載部の電子部品保持部より小さい場
合、また電子部品の電極部が輪郭上に現れにくいPLC
C,SOJパッケージ部品の電極部を認識する場合に用
いられ、透過照明方法よりも高精度に電子部品の位置・
姿勢を認識することができる。
FIG. 8 shows an example of an illumination method (hereinafter referred to as reflected illumination method) of the reflected illumination recognition method, in which the surface of the electronic component is illuminated from the TV camera side, and the body of the electronic component,
and an image of the electrode part was obtained. The reflected illumination method is used when the dimensions of the electronic component to be mounted are smaller than the electronic component holding section of the transfer section, and when the electrode part of the electronic component is difficult to appear on the outline of PLC.
It is used to recognize the electrode parts of C, SOJ package parts, and it is used to identify the position and position of electronic parts with higher accuracy than the transmitted illumination method.
Can recognize posture.

【0005】[0005]

【発明が解決しようとする課題】しかしながら上記反射
照明方法において得られた電子部品の画像には、電子部
品のボディ,電極部画像の他に電子部品実装設備の移載
部の電子部品保持部の画像、および電子部品供給体の切
りくずなどの画像が混在している場合が多い(図6参照
)。このため電子部品保持部の画像や電子部品供給体の
切りくずなどによるノイズ画像を電子部品の電極部画像
として誤って認識し、正確な電子部品の位置・姿勢が得
られない場合が少なからず生じている。
[Problems to be Solved by the Invention] However, images of electronic components obtained by the above-mentioned reflected illumination method include images of electronic component holding parts in the transfer section of electronic component mounting equipment, in addition to images of the body and electrode parts of electronic components. Images and images of chips from the electronic component supply body are often mixed together (see FIG. 6). For this reason, there are many cases where images of the electronic component holding part or noise images caused by chips from the electronic component supply body are mistakenly recognized as images of the electrodes of the electronic components, making it impossible to obtain accurate positions and orientations of the electronic components. ing.

【0006】本発明は上記課題を解決するもので、電子
部品の位置,姿勢の認識に不要なノイズ画像の発生が少
ない電子部品照明方法を提供することを目的としている
The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an electronic component illumination method that reduces the generation of noise images unnecessary for recognizing the position and orientation of electronic components.

【0007】[0007]

【課題を解決するための手段】本発明は上記目的を達成
するために、対象物である電子部品を中心とする円形状
、もしくは多角形状に、対象物方向に照明光を放つ複数
の発光体を配置し、電子部品の種別,寸法,電極数,電
極方向などの形状特性データをあらかじめ定めた関数に
より処理し、複数の発光体のうち前記関数により定まる
位置の発光体を点灯して電子部品を照明する。また、複
数の発光体を所定の範囲で移動して、照明光の照射角度
、および照射位置をあらかじめ定めた関数に応じて変え
る。また、点灯する発光体の発光強度をあらかじめ定め
た関数に応じて決定し対象物である電子部品を照明する
構成を有する。
[Means for Solving the Problems] In order to achieve the above object, the present invention provides a plurality of light emitters that emit illumination light in the direction of an object in a circular or polygonal shape centered around an electronic component that is an object. , process shape characteristic data such as the type, dimensions, number of electrodes, electrode direction, etc. of the electronic component using a predetermined function, and light up the light emitter at the position determined by the function among the multiple light emitters to display the electronic component. to illuminate. Furthermore, the plurality of light emitters are moved within a predetermined range to change the irradiation angle and irradiation position of the illumination light according to a predetermined function. Moreover, it has a configuration in which the light emission intensity of the light emitting body to be lit is determined according to a predetermined function, and the electronic component that is the object is illuminated.

【0008】[0008]

【作用】本発明は上記した構成により、電子部品を照明
する発光体を制御しているので、電子部品の寸法が電子
部品保持部に対し小さい場合、電子部品の位置・姿勢を
表わす電極部部分のみを照明することが可能となり、位
置・姿勢認識に不要なその他の部分を照明しないため認
識を誤る原因であるノイズ画像の発生を最小にすること
ができ、また例えば1mm×0.5mmといった微小部
品から40mm×40mmという大型部品までの電子部
品の位置・姿勢認識に適した照明を行うことができ、ま
た電子部品を必要以上の明るさで照明せず不要なノイズ
画像の発生を最小にすることができ、認識の誤りを減少
させ、より信頼性の高い、位置・姿勢認識が可能となる
[Operation] Since the present invention controls the light emitting body that illuminates the electronic component with the above-described configuration, when the size of the electronic component is smaller than the electronic component holding part, the electrode part that represents the position and orientation of the electronic component Since it is possible to illuminate only the area that is not needed for position/orientation recognition, it is possible to minimize the generation of noise images that cause recognition errors. It is possible to provide lighting that is suitable for recognizing the position and orientation of electronic components ranging from parts to large components of 40 mm x 40 mm, and also minimizes the generation of unnecessary noise images by not illuminating electronic components with more brightness than necessary. This reduces recognition errors and enables more reliable position and orientation recognition.

【0009】[0009]

【実施例】以下、本発明の一実施例を図面を参照しなが
ら説明する。図4(a)は本発明の電子部品照明方法を
用いた電子部品実装設備の部品照明部の外観斜視図であ
り、図4(b)は電子部品実装設備における部品照明部
の制御を示すブロック図である。本実施例では発光体1
にLEDを使用し、正方形状に1辺に8個、合計32個
のLEDを配置している。使用するLEDの単体発光輝
度により1辺に複数段にLEDを配置する場合もある(
図8の配置参照)。図4(b)において照明発光制御部
2は、電子部品実装設備の主制御部3から、照明する電
子部品10の種別,寸法,電極数,電極方向などの形状
特性データを受け取り、あらかじめ設定してある関数で
処理を行なう。照明発光制御部2の関数によりLED1
個1個の点灯・消灯と、点灯するLED全体の発光強度
(LEDであるので点灯電圧,電流)の決定を行なう。 本実施例では電子部品10の種別,寸法,電極方向,電
極数,電極ピッチにより点灯するLEDを決定する。そ
して電子部品10の種別からLEDの発光強度を決定し
、電子部品10を照明する。nをLEDの番号として、
照明発光制御部2に設定する関数は、点灯関数LED(
n)=f1(種別,寸法,電極方向,電極数,電極ピッ
チ,n)、発光強度関数I(n)=f2(種別,n)で
ある。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 4(a) is an external perspective view of a component lighting section of an electronic component mounting facility using the electronic component lighting method of the present invention, and FIG. 4(b) is a block diagram showing control of the component lighting section in the electronic component mounting facility. It is a diagram. In this embodiment, the light emitter 1
LEDs are used for each side, and 8 LEDs are arranged on each side in a square shape, for a total of 32 LEDs. Depending on the individual luminance of the LED used, multiple LEDs may be arranged on one side (
(See arrangement in Figure 8). In FIG. 4(b), the illumination light emission control unit 2 receives shape characteristic data such as the type, dimensions, number of electrodes, electrode direction, etc. of the electronic component 10 to be illuminated from the main control unit 3 of the electronic component mounting equipment, and sets the data in advance. Processing is performed using a certain function. The LED1 is controlled by the function of the illumination light emission control unit 2.
The LEDs are turned on and off one by one, and the light emission intensity of the entire LED to be lit (the lighting voltage and current since it is an LED) is determined. In this embodiment, the LED to be lit is determined based on the type, size, electrode direction, number of electrodes, and electrode pitch of the electronic component 10. Then, the light emission intensity of the LED is determined based on the type of electronic component 10, and the electronic component 10 is illuminated. Let n be the number of the LED,
The function set in the illumination light emission control unit 2 is the lighting function LED (
n)=f1 (type, size, electrode direction, number of electrodes, electrode pitch, n), and emission intensity function I(n)=f2 (type, n).

【0010】図4(b)において照明位置制御部4は電
子部品実装設備主制御部3から部品の形状特性データを
受け取り、あらかじめ設定してある関数により4辺の各
辺ごとにLEDと電子部品との距離、および照明照射角
度を決定する。dを辺の番号(1〜4)として、照明位
置制御部4に設定する関数は、距離関数L(d)=f3
(種別,寸法,電極方向,d)、照射角度関数θ(d)
=f4(種別,寸法,電極方向,d)である。
In FIG. 4(b), the illumination position control section 4 receives the shape characteristic data of the component from the electronic component mounting equipment main control section 3, and adjusts the LED and electronic component for each of the four sides using a preset function. Determine the distance to and the illumination angle. The function set in the illumination position control unit 4 is the distance function L(d)=f3, where d is the side number (1 to 4).
(type, dimensions, electrode direction, d), irradiation angle function θ(d)
= f4 (type, size, electrode direction, d).

【0011】照明例を図1,図2,図3に示す。図1(
a)は2方向電極を持った小型角チップ部品の例で、電
極方向、および寸法に合わせ斜線部のLEDのみを点灯
している。図1(b)は4方向電極を持ったQFPパッ
ケージ部品の例であり、部品に合わせすべてのLEDを
点灯している。図2(a)は小型電子部品の照明例を示
しており、寸法に合わせて電子部品とLEDとの距離を
短くし、かつ電極部に照明光を照射するようθaの照射
角度としている。図2(b)は大型電子部品の照明例で
あり、寸法の大きな電子部品の電極部(端にある)に合
わせてLEDを移動し、かつ照明光の照射角度をθbと
している。図3(a)は電極部が反射しにくい種別の電
子部品の照明例であり、種別に合わせてLEDの発光強
度を強くしている。図3(b)は電極部が反射しやすい
種別の電子部品の照明例であり、種別に合わせてLED
の発光強度を弱くして照明している。
Examples of illumination are shown in FIGS. 1, 2, and 3. Figure 1 (
A) is an example of a small rectangular chip component with electrodes in two directions, and only the LEDs in the shaded areas are lit according to the electrode direction and size. FIG. 1(b) is an example of a QFP package component with four-way electrodes, and all LEDs are lit according to the component. FIG. 2(a) shows an example of illumination of a small electronic component, in which the distance between the electronic component and the LED is shortened according to the dimensions, and the irradiation angle is set to θa so that the illumination light is irradiated onto the electrode portion. FIG. 2(b) is an example of illuminating a large electronic component, in which the LED is moved in accordance with the electrode portion (located at the end) of the large electronic component, and the irradiation angle of the illumination light is θb. FIG. 3(a) is an example of illumination of an electronic component whose electrode portion is difficult to reflect, and the light emission intensity of the LED is increased depending on the type. Figure 3(b) is an example of lighting for electronic components whose electrode parts tend to reflect.
Illumination is done by reducing the intensity of the light emitted from the light.

【0012】本実施例の電子部品実装設備の照明結果画
像例を図5に示す。図6は同一電子部品を従来の照明方
法で照明した場合の画像例である。部品保持部よりも小
さい電子部品を照明した場合、従来照明方法(図6(a
))では電子部品画像の背景に部品保持部画像が映って
いるのに対し、本実施例の照明方法(図5(a))では
部品保持部画像が背景画像と同一レベルの画像となり、
かつ電子部品の画像自体も電極部画像のみが映る画像が
得られている。大型電子部品を照明した場合でも同様に
、従来照明方法(図6(b))では部品供給体の切りく
ず画像、および電子部品のボディ画像が電極部画像とと
もに映っているのに対し、本実施例の照明方法(図5(
b))では電極部画像のみが得られている。図5に示し
た画像においては正しく電子部品の電極部を認識するこ
とができ精度良く電子部品の位置・姿勢を求めることが
できる。
FIG. 5 shows an example of an image resulting from illumination of the electronic component mounting equipment of this embodiment. FIG. 6 is an example of an image when the same electronic component is illuminated using a conventional illumination method. When illuminating an electronic component smaller than the component holding part, the conventional illumination method (Fig. 6 (a)
)), the component holder image is reflected in the background of the electronic component image, whereas in the lighting method of this embodiment (FIG. 5(a)), the component holder image is at the same level as the background image,
Moreover, the image of the electronic component itself shows only the electrode part image. Similarly, when a large electronic component is illuminated, the conventional illumination method (Fig. 6(b)) shows the chip image of the component supply body and the body image of the electronic component together with the electrode part image. Example lighting method (Figure 5 (
In b)), only the electrode part image is obtained. In the image shown in FIG. 5, the electrode portion of the electronic component can be correctly recognized, and the position and orientation of the electronic component can be determined with high accuracy.

【0013】このように本発明の実施例の電子部品照明
方法によれば、発光体による照明条件を部品に応じて設
定しているので、電子部品の位置,姿勢の認識に不要な
ノイズ画像の発生を減少することができる。
As described above, according to the electronic component illumination method of the embodiment of the present invention, the illumination conditions by the light emitter are set according to the component, so that noise images unnecessary for recognizing the position and orientation of the electronic component are eliminated. occurrence can be reduced.

【0014】[0014]

【発明の効果】以上の実施例から明らかなように本発明
によれば、対象物である電子部品の位置・姿勢を認識す
るために、電子部品に合わせて必要な部分のみを照明す
るため、従来の反射照明方法での課題であるノイズ画像
の発生を低減することができ、様々な電子部品において
認識の誤りが少なく、より信頼性の高い位置・姿勢認識
が可能となり、高品質な電子部品実装を実現する電子部
品照明方法を提供できる
Effects of the Invention As is clear from the above embodiments, according to the present invention, in order to recognize the position and orientation of an electronic component as an object, only the necessary portions are illuminated according to the electronic component. The generation of noise images, which is a problem with conventional reflected lighting methods, can be reduced, and recognition errors in various electronic components are reduced, making it possible to recognize the position and orientation of high-quality electronic components with higher reliability. We can provide a lighting method for electronic components that realizes mounting.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明の第1の実施例の電子部品照明方法の模
式図
FIG. 1 is a schematic diagram of a method for illuminating electronic components according to a first embodiment of the present invention.

【図2】本発明の第2の実施例の電子部品照明方法の模
式図
FIG. 2 is a schematic diagram of a method for illuminating electronic components according to a second embodiment of the present invention.

【図3】本発明の第3の実施例の電子部品照明方法の模
式図
FIG. 3 is a schematic diagram of a method for illuminating electronic components according to a third embodiment of the present invention.

【図4】本発明の一実施例の電子部品照明方法における
装置の斜視図およびブロック図
FIG. 4 is a perspective view and a block diagram of an apparatus in an electronic component illumination method according to an embodiment of the present invention.

【図5】同方法による画像例を示す模式図[Figure 5] Schematic diagram showing an example of an image obtained by the same method

【図6】従来
の電子部品照明方法による画像例を示す模式図
[Fig. 6] A schematic diagram showing an example of an image obtained by a conventional electronic component illumination method.

【図7】従来の電子部品照明方法(透過照明法)の模式
[Figure 7] Schematic diagram of a conventional electronic component illumination method (transmission illumination method)

【図8】従来の電子部品照明方法(反射照明法)の模式
[Figure 8] Schematic diagram of conventional electronic component illumination method (reflection illumination method)

【符号の説明】[Explanation of symbols]

1a,1b,1c,1d    発光体2      
照明発光制御部 3      主制御部 4      照明位置制御部 10    電子部品
1a, 1b, 1c, 1d light emitter 2
Illumination light emission control section 3 Main control section 4 Illumination position control section 10 Electronic components

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】  対象物である電子部品を中心とする円
形状、もしくは多角形状に、対象物方向に照明光を放つ
複数の発光体を配置し、前記電子部品の形状特性データ
をあらかじめ定めた関数により処理し、前記複数の発光
体のうち前記関数により定まる位置の発光体を点灯し、
前記電子部品を照明する電子部品照明方法。
[Claim 1] A plurality of light emitters that emit illumination light in the direction of the object are arranged in a circular or polygonal shape centered around an electronic component as the object, and shape characteristic data of the electronic component is predetermined. processing according to a function, and lighting a light emitting body at a position determined by the function among the plurality of light emitting bodies,
An electronic component lighting method for illuminating the electronic component.
【請求項2】  複数の発光体を所定の範囲で移動して
、電子部品に対する照明光の照射角度、および照射位置
をあらかじめ定めた関数に応じて変える請求項1記載の
電子部品照明方法。
2. The electronic component illumination method according to claim 1, wherein the plurality of light emitters are moved within a predetermined range to change the irradiation angle and irradiation position of the illumination light onto the electronic component in accordance with a predetermined function.
【請求項3】  点灯する発光体の発光強度をあらかじ
め定めた関数に応じて決定し電子部品を照明する請求項
1記載の電子部品照明方法。
3. The electronic component lighting method according to claim 1, wherein the electronic component is illuminated by determining the luminous intensity of the light emitting body to be lit according to a predetermined function.
JP3138775A 1991-06-11 1991-06-11 Electronic parts lighting method Pending JPH04364404A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3138775A JPH04364404A (en) 1991-06-11 1991-06-11 Electronic parts lighting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3138775A JPH04364404A (en) 1991-06-11 1991-06-11 Electronic parts lighting method

Publications (1)

Publication Number Publication Date
JPH04364404A true JPH04364404A (en) 1992-12-16

Family

ID=15229909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3138775A Pending JPH04364404A (en) 1991-06-11 1991-06-11 Electronic parts lighting method

Country Status (1)

Country Link
JP (1) JPH04364404A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011377A1 (en) * 1994-10-06 1996-04-18 Advantest Corporation Illuminator for inspecting appearance of device and automatic apparatus for inspecting appearance of device using the illumination device
EP0854671A1 (en) * 1997-01-20 1998-07-22 Yamaha Hatsudoki Kabushiki Kaisha A method for recognizing at least one component, component recogniton device and machine comprising the same
JP2006145272A (en) * 2004-11-17 2006-06-08 Toppan Printing Co Ltd Periodic pattern unevenness inspection device
WO2008053742A1 (en) * 2006-11-02 2008-05-08 Bridgestone Corporation Method and device for inspecting tire surface
WO2011161871A1 (en) * 2010-06-24 2011-12-29 パナソニック株式会社 Parts mounting system, image-recognition data creating apparatus, and image-recognition data creating method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011377A1 (en) * 1994-10-06 1996-04-18 Advantest Corporation Illuminator for inspecting appearance of device and automatic apparatus for inspecting appearance of device using the illumination device
EP0854671A1 (en) * 1997-01-20 1998-07-22 Yamaha Hatsudoki Kabushiki Kaisha A method for recognizing at least one component, component recogniton device and machine comprising the same
JP2006145272A (en) * 2004-11-17 2006-06-08 Toppan Printing Co Ltd Periodic pattern unevenness inspection device
WO2008053742A1 (en) * 2006-11-02 2008-05-08 Bridgestone Corporation Method and device for inspecting tire surface
JP2008116270A (en) * 2006-11-02 2008-05-22 Bridgestone Corp Method and device for inspecting tire surface
US8059279B2 (en) 2006-11-02 2011-11-15 Bridgestone Corporation Method and system for inspecting tire surface
WO2011161871A1 (en) * 2010-06-24 2011-12-29 パナソニック株式会社 Parts mounting system, image-recognition data creating apparatus, and image-recognition data creating method
JP2012008762A (en) * 2010-06-24 2012-01-12 Panasonic Corp Component mounting system, image-recognizing data creation device, and image-recognizing data creation method

Similar Documents

Publication Publication Date Title
CN1300546C (en) Illumination device, recognizing device with the illumination device, and part mounting device
JP2000124700A (en) Lighting equipment for component mounter and component mounting apparatus provided with the lighting equipment
KR100281881B1 (en) cream solder inspection apparatus and the method thereof
JPH0249500A (en) Printed circuit board having surface-mounted component
JPH04364404A (en) Electronic parts lighting method
JP3243385B2 (en) Object shape inspection device
JP2005183148A (en) Lighting system and sorting system
US7365837B2 (en) Vision inspection apparatus using a full reflection mirror
KR100378490B1 (en) Illumination device of CCD camera
WO2004063733A1 (en) Image recognition apparatus and image recognition method
JP3580592B2 (en) Illumination device and device for assembling and inspecting electronic parts using it
US6649926B2 (en) Suction nozzle, and electric-component-position detecting apparatus
JP3597611B2 (en) Illumination device for mark recognition in mounting machine
JP2003229700A (en) Method of imaging suction end face of suction tube and electronic component held thereby
JPH09321494A (en) Illumination device for surface mounting machine
JPH11242002A (en) Observing device
JP3384304B2 (en) Electronic component attitude recognition device
JPH0933445A (en) Lighting equipment for printed wiring board inspection equipment
JP3080749B2 (en) Electronic component mounting machine
JP4194159B2 (en) PCB mark recognition mechanism
JP2001127080A (en) Bonder
JPH0739996B2 (en) Soldering inspection device
KR19980022293A (en) Method for lighting adsorption parts of component mounting machine and apparatus
KR19980054245U (en) Lighting equipment for part inspection
JPH09210652A (en) Lead inspection device for ic package