JPH04363808A - Semiconducting compositions and power cables - Google Patents
Semiconducting compositions and power cablesInfo
- Publication number
- JPH04363808A JPH04363808A JP3164030A JP16403091A JPH04363808A JP H04363808 A JPH04363808 A JP H04363808A JP 3164030 A JP3164030 A JP 3164030A JP 16403091 A JP16403091 A JP 16403091A JP H04363808 A JPH04363808 A JP H04363808A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductive
- composition
- eva
- parts
- blend
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 67
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 18
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 18
- 229910052918 calcium silicate Inorganic materials 0.000 claims abstract description 13
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000378 calcium silicate Substances 0.000 claims abstract description 11
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920000642 polymer Polymers 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002131 composite material Substances 0.000 abstract 3
- 235000012241 calcium silicate Nutrition 0.000 description 10
- 238000012360 testing method Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 4
- 239000000292 calcium oxide Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229920003020 cross-linked polyethylene Polymers 0.000 description 4
- 239000004703 cross-linked polyethylene Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- -1 fatty acid ester Chemical class 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910018404 Al2 O3 Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- 229910014780 CaAl2 Inorganic materials 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- VXAUWWUXCIMFIM-UHFFFAOYSA-M aluminum;oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Al+3] VXAUWWUXCIMFIM-UHFFFAOYSA-M 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- JHLNERQLKQQLRZ-UHFFFAOYSA-N calcium silicate Chemical compound [Ca+2].[Ca+2].[O-][Si]([O-])([O-])[O-] JHLNERQLKQQLRZ-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052909 inorganic silicate Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、特性的に優れた、特に
耐熱性に優れた半導電性組成物およびこれを半導電層に
用いた電力ケーブルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductive composition having excellent properties, particularly excellent heat resistance, and a power cable using the same in a semiconductive layer.
【０００２】0002
【従来の技術】架橋ポリエチレン絶縁ケーブル（ＣＶケ
ーブル）などの電力ケーブルにあっては、ケーブル間の
接続時などに行われる端末処理作業を容易にするために
、架橋ポリエチレンや架橋ポリエチレンプロピレンゴム
などからなる絶縁層から半導電層を剥ぎ取り易くする必
要がある。また、同時に電力ケーブルに曲げなどの外力
が加わった際に、絶縁層と半導電層とが界面で剥離を起
こさないことも必要である。[Prior Art] Power cables such as cross-linked polyethylene insulated cables (CV cables) are made from cross-linked polyethylene, cross-linked polyethylene propylene rubber, etc. in order to facilitate the terminal processing work performed when connecting cables. It is necessary to make it easy to peel off the semiconducting layer from the insulating layer. At the same time, it is also necessary that the insulating layer and the semiconducting layer do not peel off at the interface when an external force such as bending is applied to the power cable.
【０００３】このため、半導電層の組成物としては、絶
縁層に対して適度の剥離性と適度の密着性を併せ持つこ
とが必要とされる。このような特性を満足する半導電性
組成物、特に外部半導電層をなす性組成物の一つとして
、従来、エチレン酢酸ビニル共重合体に塩化ビニルをグ
ラフト化したポリマ（ＥＶＡ−ＰＶＣ）とエチレン酢酸
ビニル共重合体（ＥＶＡ）とを、ブレンド比９０／１０
〜２０／８０の範囲で配合し、これにカーボンブラック
などの導電性付与剤を添加したブレンド組成物が提案さ
れている。[0003] Therefore, the composition of the semiconducting layer is required to have both appropriate releasability and appropriate adhesion to the insulating layer. As a semiconductive composition that satisfies these characteristics, particularly as a composition for forming an external semiconductive layer, a polymer (EVA-PVC) in which vinyl chloride is grafted onto an ethylene vinyl acetate copolymer has been used. with ethylene vinyl acetate copolymer (EVA) at a blend ratio of 90/10.
A blend composition has been proposed in which a conductivity imparting agent such as carbon black is added to the mixture in a ratio of 20/80 to 20/80.
【０００４】0004
【発明が解決しようとする課題】ところが、この半導電
性組成物の場合、特性的に改善すべき余地があった。つ
まり、特に耐熱性が劣る他、その他の特性、例えば押出
加工性、分散性などにおいても劣っていた。また、この
組成物では、安定剤としてＭｇＯやＰｂＯなどの添加が
必要とされるが、これらの物質には毒性があって環境衛
生上好ましくなく、さらに、分散性を悪化させるという
問題もあった。[Problems to be Solved by the Invention] However, in the case of this semiconductive composition, there was room for improvement in terms of characteristics. That is, in addition to being particularly poor in heat resistance, it was also poor in other properties such as extrusion processability and dispersibility. Additionally, this composition requires the addition of stabilizers such as MgO and PbO, but these substances are toxic and undesirable in terms of environmental hygiene, and there is also the problem of worsening dispersibility. .
【０００５】そこで、本発明者等が鋭意研究したところ
、上記ブレンド比が９０／１０〜２０／８０のＥＶＡ−
ＰＶＣとＥＶＡとのブレンド物に適量の導電性付与剤を
混合した組成物に、さらに、アルミン酸カルシウムまた
は／および珪酸カルシウムを添加すると、上記欠点が解
消されることを見出した。[0005] Therefore, the inventors of the present invention conducted extensive research and found that EVA-
It has been found that the above drawbacks can be overcome by adding calcium aluminate and/or calcium silicate to a composition containing a blend of PVC and EVA mixed with an appropriate amount of a conductivity imparting agent.
【０００６】本発明は、このような観点に立ってなされ
たものである。The present invention has been made from this perspective.
【０００７】[0007]
【課題を解決するための手段およびその作用】かゝる本
発明の一つは、ＥＶＡ−ＰＶＣとＥＶＡとを、ブレンド
比９０／１０〜２０／８０で配合し、これに適量の導電
性付与剤を添加したブレンド組成物の１００重量部に、
アルミン酸カルシウムを０．５〜２０重量部配合してな
る半導電性組成物にあり、本発明のもう一つは、この半
導電性組成物を少なくとも外部半導電層に用いた電力ケ
ーブルにある。[Means for Solving the Problems and Their Effects] One of such aspects of the present invention is to blend EVA-PVC and EVA at a blend ratio of 90/10 to 20/80, and impart an appropriate amount of conductivity to the mixture. 100 parts by weight of the blend composition to which the agent was added,
Another aspect of the present invention is a semiconductive composition containing 0.5 to 20 parts by weight of calcium aluminate, and another aspect of the present invention resides in a power cable using this semiconductive composition at least in an outer semiconductive layer. .
【０００８】本発明の別の一つは、ＥＶＡ−ＰＶＣとＥ
ＶＡとを、ブレンド比９０／１０〜２０／８０で配合し
、これに適量の導電性付与剤を添加したブレンド組成物
の１００重量部に、珪酸カルシウムを０．５〜２０重量
部配合してなる半導電性組成物にあり、本発明の別のも
う一つは、この半導電性組成物を少なくとも外部半導電
層に用いた電力ケーブルにある。Another aspect of the present invention is that EVA-PVC and EVA-PVC
0.5 to 20 parts by weight of calcium silicate is added to 100 parts by weight of a blend composition in which VA is blended at a blend ratio of 90/10 to 20/80 and an appropriate amount of conductivity imparting agent is added thereto. Another aspect of the present invention resides in a power cable using this semiconductive composition in at least the outer semiconductive layer.
【０００９】本発明において、上記ＥＶＡ−ＰＶＣとＥ
ＶＡとのブレンド比を、９０／１０〜２０／８０の範囲
にしたのは、この範囲とすることにより、半導電層とし
たとき、絶縁層に対して適度の剥離性と適度の密着性が
保持されるからである。また、本発明で添加されるカー
ボンブラックなどの導電性付与剤の配合量としては、Ｅ
ＶＡ−ＰＶＣとＥＶＡとのブレンド組成物１００重量部
に対して、３０〜１００重量部が好ましい。つまり、３
０重量部未満では所望の半導電性が得られず、また１０
０重量部を越えると導電性が高くなり過ぎると同時に押
出加工性や機械的強度が低下するようになるからである
。In the present invention, the above EVA-PVC and E
The reason for setting the blend ratio with VA to be in the range of 90/10 to 20/80 is that by setting this range, when used as a semiconducting layer, appropriate peelability and appropriate adhesion to the insulating layer can be achieved. This is because it is retained. Furthermore, the blending amount of the conductivity imparting agent such as carbon black added in the present invention is as follows:
It is preferably 30 to 100 parts by weight based on 100 parts by weight of the blend composition of VA-PVC and EVA. In other words, 3
If it is less than 0 parts by weight, the desired semiconductivity cannot be obtained;
This is because if the amount exceeds 0 parts by weight, the conductivity becomes too high and at the same time extrusion processability and mechanical strength decrease.
【００１０】また、本発明で用いられるアルミン酸カル
シウムは、酸化カルシウムと二酸化アルミニウムとの結
合した組成物の総称で、いろいろな割合の化合物がある
が、例えば、ＣａＡｌ２ Ｏ４ （＝ＣａＯ・Ａｌ２
Ｏ３ ）やＣａ３ Ａｌ２ Ｏ６ （＝３ＣａＯ・Ａｌ
２ Ｏ３ ）、あるいは、これらとは異なったＣａＯと
Ａｌ２ Ｏ３ の割合からなるもの、さらに、これらに
Ｈ２ Ｏの付加したものなどがある。そして、これらの
表面には、必要により脂肪酸エステルなど施して表面処
理してもよい。[0010] Calcium aluminate used in the present invention is a general term for a composition in which calcium oxide and aluminum dioxide are combined, and there are compounds in various proportions, but for example, CaAl2 O4 (=CaO・Al2
O3 ) and Ca3 Al2 O6 (=3CaO・Al
2 O3), those with a different ratio of CaO and Al2 O3, and those with H2 O added to these. These surfaces may be surface-treated by applying a fatty acid ester or the like, if necessary.
【００１１】また、本発明で用いられる珪酸カルシウム
は、酸化カルシウムと二酸化珪素との結合した組成物の
総称で、いろいろな割合の化合物があるが、例えば、３
Ｃａ２ ＳｉＯ４ （オルト珪酸カルシウム）、メタ珪
酸カルシウム、３ＣａＯ・ＳｉＯ２ （珪酸三石灰）な
どがある。そして、これらの表面には、必要により脂肪
酸エステルなど施して表面処理してもよい。[0011] Calcium silicate used in the present invention is a general term for a composition in which calcium oxide and silicon dioxide are combined, and there are compounds in various proportions, but for example,
Examples include Ca2 SiO4 (calcium orthosilicate), calcium metasilicate, and 3CaO.SiO2 (trilime silicate). These surfaces may be surface-treated by applying a fatty acid ester or the like, if necessary.
【００１２】このようなアルミン酸カルシウムまたは珪
酸カルシウムの添加により、耐熱性、分散性、押出加工
性が改善される。また、このものを添加すると、それ自
体が無毒性のため、従来添加していたＭｇＯやＰｂＯな
どの安定剤は不要となり、毒性の問題は解消される。そ
して、それらの配合量を、ＥＶＡ−ＰＶＣとＥＶＡおよ
び導電性付与剤とのブレンド組成物１００重量部に対し
て、０．５〜２０重量部としたのは、０．５重量部未満
では耐熱性の改善効果が小さく、また２０重量部を越え
ると押出加工性や分散性が悪化するからである。The addition of calcium aluminate or calcium silicate improves heat resistance, dispersibility, and extrusion processability. Furthermore, when this substance is added, it is itself non-toxic, so the conventionally added stabilizers such as MgO and PbO are no longer necessary, and the problem of toxicity is resolved. The blending amount of these components was set at 0.5 to 20 parts by weight with respect to 100 parts by weight of the blend composition of EVA-PVC, EVA, and conductivity imparting agent. This is because the effect of improving properties is small, and if it exceeds 20 parts by weight, extrusion processability and dispersibility deteriorate.
【００１３】なお、本発明の半導電性組成物には、必要
に応じて、通常添加される他の添加剤、例えば老化防止
剤、加工助剤、架橋剤などを添加することができる。The semiconductive composition of the present invention may contain other commonly used additives, such as anti-aging agents, processing aids, crosslinking agents, etc., if necessary.
【００１４】次に、かゝる本発明の半導電性組成物を半
導電層に用いた電力ケーブルの一例を図示すると、図１
の如くである。この図において、１は導体で、この導体
１の外周には内部半導電層２が被覆されている。この内
部半導電層２は、ボンドタイプの半導電層であり、本発
明での半導電性組成物とはタイプが異なるものである。
この内部半導電層２上には、絶縁層３が被覆される。こ
の絶縁層３は、架橋ポリエチレンや架橋エチレンプロピ
レンゴムなどのポリレフィン樹脂を押出被覆した後、加
熱して架橋させた樹脂組成物から構成されている。この
絶縁層３上には、本発明に係る半導電性組成物からなる
外部半導電層４が被覆され、さらにこの上には、遮蔽層
５およびシース６が順次被覆されている。Next, an example of a power cable using the semiconductive composition of the present invention as a semiconductive layer is shown in FIG.
It's like this. In this figure, 1 is a conductor, and the outer periphery of this conductor 1 is coated with an internal semiconducting layer 2. This internal semiconductive layer 2 is a bond type semiconductive layer, and is of a different type from the semiconductive composition of the present invention. This internal semiconducting layer 2 is coated with an insulating layer 3 . The insulating layer 3 is made of a resin composition obtained by extrusion coating a polyolefin resin such as crosslinked polyethylene or crosslinked ethylene propylene rubber, and then crosslinking it by heating. This insulating layer 3 is coated with an outer semiconducting layer 4 made of a semiconductive composition according to the present invention, and a shielding layer 5 and a sheath 6 are further coated in this order.
【００１５】この本発明になる外部半導電層４は、絶縁
層３に対して適度の剥離性と適度の密着性を併せ持つた
め、端末処理作業の際、絶縁層３から外部半導電層４を
剥ぎ取ることが比較的容易にできる一方、電力ケーブル
に曲げなど外力が加わっても、絶縁層３と外部半導電層
４との間で簡単に界面剥離が起ることはない。さらに、
この外部半導電層４の組成物には、上記アルミン酸カル
シウムまたは珪酸カルシウムが含まれているため、大幅
な耐熱性の向上が図られる他、当該物質の分散性もよく
、また押出加工も良好で、表面を平滑にして押し出すこ
とができる。The outer semiconducting layer 4 of the present invention has both appropriate releasability and adhesion to the insulating layer 3, so that the outer semiconducting layer 4 can be removed from the insulating layer 3 during terminal processing. While it can be peeled off relatively easily, interfacial peeling does not easily occur between the insulating layer 3 and the external semiconducting layer 4 even if an external force such as bending is applied to the power cable. moreover,
Since the composition of the outer semiconducting layer 4 contains the above-mentioned calcium aluminate or calcium silicate, it not only significantly improves heat resistance, but also has good dispersibility of the substance and is also easy to extrude. The surface can then be smoothed and extruded.
【００１６】[0016]
【実施例】先ず、表１に示した配合による、アルミン酸
カルシウムを用いた場合と、用いない場合の種々の半導
電性組成物を作り（実施例１〜５、比較例１〜２）、こ
の組成物の特性試験を行い、その試験結果も、当該表１
に併記した。なお、組成物の特性試験は、次のようにし
て行った。先ず、上記表１の配合による混和物を常法に
従って混練した後、厚さ約１ｍｍのシートに成型した。
そして、この半導電性シートを、表面の不純物を充分に
除去し清澄にした銅板の両面にプレスにより圧着しつつ
、１８０℃×３０分加熱した後、室温で冷却して試料片
を作り、この試料片をＲ，Ｈ１００％、室温のデシケー
タ中にそれぞれの時間放置後取り出し、この半導電性シ
ートを取り除き、銅板表面の変色状態を観察した。また
、その他の物性として、熱安定性、表面平滑性、剥離力
を調べた。なお、ここで、表面平滑性は、１８ｍｍ押出
機によりテープ状に押し出し、その表面の突起を数えた
。この際の評価は、良＝１００ｃｍ２ 当たり０．１ｍ
ｍ以上の突起が２０未満、やや良＝１００ｃｍ２ 当た
り０．１ｍｍ以上の突起が２０〜１００未満、不良＝１
００ｃｍ２ 当たり０．１ｍｍ以上の突起が１００以上
を場合を示す。また、剥離力は、ＤＣＰを２部、ノクラ
ック３００を０．２部を含むポリエチレンの２ｍｍ厚シ
ートと、上記１ｍｍ厚シートとを重ねて、２００℃×３
０分の加圧プレスを行った後、０．５インチ巾で剥離試
験を行った結果を示してある。[Examples] First, various semiconductive compositions with and without calcium aluminate were made according to the formulations shown in Table 1 (Examples 1 to 5, Comparative Examples 1 to 2), Characteristic tests were conducted on this composition, and the test results are also shown in Table 1.
Also listed. In addition, the property test of the composition was conducted as follows. First, a mixture having the formulation shown in Table 1 above was kneaded according to a conventional method, and then molded into a sheet having a thickness of about 1 mm. Then, this semiconductive sheet was pressed onto both sides of a copper plate whose surface had been thoroughly cleaned and impurities removed, heated at 180°C for 30 minutes, and then cooled at room temperature to form a sample piece. The sample pieces were left in a desiccator at 100% R and H at room temperature for respective times and then taken out, the semiconductive sheet was removed, and the state of discoloration on the surface of the copper plate was observed. In addition, thermal stability, surface smoothness, and peeling force were investigated as other physical properties. Here, the surface smoothness was measured by extruding a tape using an 18 mm extruder and counting the protrusions on the surface. The evaluation in this case is Good = 0.1m per 100cm2
Less than 20 protrusions of m or more, Fairly Good = 20 to less than 100 protrusions of 0.1 mm or more per 100 cm2, Poor = 1
The number of protrusions of 0.1 mm or more per 00 cm2 is 100 or more. In addition, the peeling force was determined by stacking a 2 mm thick sheet of polyethylene containing 2 parts of DCP and 0.2 parts of Nocrac 300 with the above 1 mm thick sheet at 200°C x 3
The results are shown in which a peel test was performed on a 0.5 inch width after 0 minutes of pressure pressing.
【００１７】[0017]
【表１】[Table 1]
【００１８】上記表１から、本発明に係る半導電性組成
物（実施例１〜５）は、アルミン酸カルシウムが添加さ
れなかった従来品（比較例１〜２）に比較して、優れた
耐熱性、耐腐食性が得られ、また剥離性や表面平滑性に
関しては、従来品と同等程度であることが判る。From Table 1 above, the semiconductive compositions according to the present invention (Examples 1 to 5) were superior to the conventional products (Comparative Examples 1 to 2) in which calcium aluminate was not added. It can be seen that heat resistance and corrosion resistance are obtained, and the releasability and surface smoothness are on the same level as conventional products.
【００１９】次に、表２に示した配合による、珪酸カル
シウムを用いた場合と、用いない場合の種々の半導電性
組成物を作り（実施例１１〜１５、比較例１１〜１２）
、この組成物の特性試験を行い、その試験結果も、当該
表２に併記した。なお、組成物の特性試験は、上記表１
の場合と同様にして行った。また、その他の物性として
、熱安定性、表面平滑性、剥離力を調べた。その調査方
法は、やはり上記表１の場合と同様にして行った。Next, various semiconductive compositions with and without calcium silicate were made according to the formulations shown in Table 2 (Examples 11-15, Comparative Examples 11-12).
The characteristics of this composition were tested, and the test results are also listed in Table 2. The characteristics test of the composition is shown in Table 1 above.
It was done in the same way as in the case of In addition, thermal stability, surface smoothness, and peeling force were investigated as other physical properties. The investigation method was the same as in Table 1 above.
【００２０】[0020]
【表２】[Table 2]
【００２１】上記表２から、本発明に係る半導電性組成
物（実施例１１〜１５）は、珪酸カルシウムが添加され
なかった従来品（比較例１１〜１２）に比較して、優れ
た耐熱性、耐腐食性が得られ、また剥離性や表面平滑性
に関しては、従来品と同等程度であることが判る。From Table 2 above, the semiconductive compositions according to the present invention (Examples 11 to 15) have superior heat resistance compared to conventional products (Comparative Examples 11 to 12) in which calcium silicate was not added. It can be seen that the material has good properties such as hardness and corrosion resistance, and the peelability and surface smoothness are on the same level as conventional products.
【００２２】なお、上記各実施例では、それぞれアルミ
ン酸カルシウムまたは珪酸カルシウムを単独で使用する
場合であったが、これらを併用して、やはりエチレン酢
酸ビニル共重合体に塩化ビニルをグラフト化したポリマ
（ＥＶＡ−ＰＶＣ）とエチレン酢酸ビニル共重合体（Ｅ
ＶＡ）とを、ブレンド比９０／１０〜２０／８０で配合
し、これに適量の導電性付与剤を添加したブレンド組成
物の１００重量部に、０．５〜２０重量部配合しても、
上記実施例と同様の効果が得られる。[0022] In each of the above examples, calcium aluminate or calcium silicate was used alone, but these were used in combination to form a polymer in which vinyl chloride was grafted onto an ethylene vinyl acetate copolymer. (EVA-PVC) and ethylene vinyl acetate copolymer (E
VA) at a blend ratio of 90/10 to 20/80, and 0.5 to 20 parts by weight of the mixture to 100 parts by weight of a blend composition in which an appropriate amount of conductivity imparting agent is added,
The same effects as in the above embodiment can be obtained.
【００２３】[0023]
【発明の効果】以上の説明から明らかなように本発明に
よれば、特性の改善された、特に耐熱性、押出加工性、
分散性、安全性などの改善された優れた半導電性組成物
およびこれを半導電層に用いた優れた、ＣＶケーブルな
どの電力ケーブルを得ることができる。Effects of the Invention As is clear from the above description, according to the present invention, properties are improved, particularly heat resistance, extrusion processability,
It is possible to obtain an excellent semiconductive composition with improved dispersibility, safety, etc., and an excellent power cable such as a CV cable using the same in a semiconductive layer.
【図１】本発明に係る半導電性組成物を外部半導電層に
用いた電力ケーブルの一例を示した縦断面図である。FIG. 1 is a longitudinal cross-sectional view showing an example of a power cable using a semiconductive composition according to the present invention for an outer semiconductive layer.
１ 導体、 ２ 内部半導電層、 ３ 絶縁層、 ４ 外部半導電層、 ５ 遮蔽層、 ６ シース、 1 Conductor, 2. Internal semiconducting layer, 3 Insulating layer, 4. Outer semiconducting layer, 5. Shielding layer, 6 Sheath,
Claims (4)
ニルをグラフト化したポリマ（ＥＶＡ−ＰＶＣ）とエチ
レン酢酸ビニル共重合体（ＥＶＡ）とを、ブレンド比９
０／１０〜２０／８０で配合し、これに適量の導電性付
与剤を添加したブレンド組成物の１００重量部に、アル
ミン酸カルシウムを０．５〜２０重量部配合してなるこ
とを特徴とする半導電性組成物。Claim 1: A polymer obtained by grafting vinyl chloride onto an ethylene vinyl acetate copolymer (EVA-PVC) and an ethylene vinyl acetate copolymer (EVA) at a blend ratio of 9
It is characterized by blending 0.5 to 20 parts by weight of calcium aluminate to 100 parts by weight of a blend composition in which the blend composition is blended at a ratio of 0/10 to 20/80 and an appropriate amount of conductivity imparting agent is added thereto. semiconductive composition.
少なくとも外部半導電層に用いたことを特徴とする電力
ケーブル。2. A power cable characterized in that the semiconductive composition according to claim 1 is used for at least an outer semiconductive layer.
ニルをグラフト化したポリマ（ＥＶＡ−ＰＶＣ）とエチ
レン酢酸ビニル共重合体（ＥＶＡ）とを、ブレンド比９
０／１０〜２０／８０で配合し、これに適量の導電性付
与剤を添加したブレンド組成物の１００重量部に、珪酸
カルシウムを０．５〜２０重量部配合してなることを特
徴とする半導電性組成物。3. A polymer obtained by grafting vinyl chloride onto an ethylene vinyl acetate copolymer (EVA-PVC) and an ethylene vinyl acetate copolymer (EVA) are blended at a blend ratio of 9.
It is characterized in that 0.5 to 20 parts by weight of calcium silicate is blended to 100 parts by weight of a blend composition in which a suitable amount of conductivity imparting agent is added. Semiconductive composition.
少なくとも外部半導電層に用いたことを特徴とする電力
ケーブル。4. A power cable characterized in that the semiconductive composition according to claim 3 is used for at least an outer semiconductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3164030A JPH04363808A (en) | 1991-06-08 | 1991-06-08 | Semiconducting compositions and power cables |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3164030A JPH04363808A (en) | 1991-06-08 | 1991-06-08 | Semiconducting compositions and power cables |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04363808A true JPH04363808A (en) | 1992-12-16 |
Family
ID=15785477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3164030A Pending JPH04363808A (en) | 1991-06-08 | 1991-06-08 | Semiconducting compositions and power cables |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04363808A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7258736B2 (en) * | 2003-06-24 | 2007-08-21 | Hewlett-Packard Development Company, L.P. | Calcium aluminate cement compositions for solid freeform fabrication |
-
1991
- 1991-06-08 JP JP3164030A patent/JPH04363808A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7258736B2 (en) * | 2003-06-24 | 2007-08-21 | Hewlett-Packard Development Company, L.P. | Calcium aluminate cement compositions for solid freeform fabrication |
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