JPH04360564A - Cooling device for semiconductor chip - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip cooling device, and more particularly to a semiconductor chip cooling device that has a simple structure and consumes a large amount of power.

0002

2. Description of the Related Art A conventional semiconductor chip cooling device, as disclosed in Japanese Patent Laid-Open No. 61-226946, includes two bellows for absorbing thermal deformation and assembly errors during use of a semiconductor chip. The cooling parts of the cap and the fins are joined and assembled by soldering or brazing, and one set of them is provided on each semiconductor chip, and the coolant is allowed to flow in from one bellows and flow out from the other bellows. The structure was such that the heat generated by the semiconductor chip was removed through the fins.

0003

SUMMARY OF THE INVENTION In the above-mentioned prior art, there are a large number of joints between each cooling member, such as between a bellows and a cap, and between a cap and a fin, and requires a large number of assembly steps.

Furthermore, since there are many joints, there is a concern that refrigerant may leak due to corrosion of the joints. Therefore, there is a problem in that the reliability of large-sized computers decreases when used for long periods of time.

[0005] An object of the present invention is to provide a semiconductor chip cooling device that has a small number of parts and requires a small number of assembly steps.

[0006]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a telescopic pipe having a straight pipe part and a flexible bellows part alternately in the axial direction of the pipe, between the bellows part and the bellows part. Bend almost 90 degrees near both ends of the straight pipe part,
Using an integrally molded refrigerant supply pipe, the straight part of the refrigerant supply pipe with both ends bent is pressed against the top surface of the semiconductor chip, and the refrigerant flows in from one bellows and flows out from the other bellows. It has a structure that absorbs the heat of the chip and cools it.

[0007] Furthermore, in order to increase the cooling efficiency, a structure is adopted in which the straight pipe part of the refrigerant supply pipe is pressed into contact with the upper surface of the semiconductor chip via thermal conductive grease.

[0008] Furthermore, in order to increase the cooling efficiency, a structure is adopted in which the straight pipe part of the refrigerant supply pipe is metallically joined to the upper surface of the semiconductor chip by soldering or brazing.

Furthermore, in order to increase the cooling efficiency, a structure is adopted in which fins are provided within the straight pipe portion of the refrigerant supply pipe.

0010

[Function] In a semiconductor chip cooling device, by bending both ends of the straight pipe part of a bellows with a straight pipe and using a refrigerant supply pipe manufactured by integral molding, the cooling component called a cap in the conventional method is used. is no longer necessary, and the number of parts can be reduced. Furthermore, since the number of joints is reduced, the number of man-hours required for joining can be reduced, and reliability against refrigerant leakage and the like is improved.

Furthermore, since the straight pipe part of the refrigerant supply pipe and the upper surface of the semiconductor chip are in pressure contact with each other through thermally conductive grease, heat conduction in this part is improved and cooling efficiency is improved.

Furthermore, since the straight pipe part of the refrigerant supply pipe and the upper surface of the semiconductor chip are metallically joined by soldering or brazing, heat conduction in this part is improved and cooling efficiency is improved.

Furthermore, in order to increase the cooling efficiency, a structure is adopted in which plate-shaped fins are joined to the straight pipe part of the refrigerant supply pipe, so that the heat conduction area can be widened, so that the heat conduction in this part is improved. Furthermore, cooling efficiency increases.

[0014] Furthermore, since the structure is such that the fins are directly formed on the straight pipe part of the refrigerant supply pipe, there is no need to increase the number of parts and joints, reducing processing costs, and providing a large heat conduction area and high cooling efficiency. , a semiconductor chip cooling device can be provided.

[0015]

[Examples] The present invention will be explained below with reference to Examples. FIG. 1 is a cross-sectional view of a semiconductor chip cooling device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line A-A in FIG. 1, and FIG.
FIG. 4 is a perspective view showing a bellows with a straight pipe for forming a refrigerant supply pipe; FIG. 4 is a sectional view showing a second embodiment of the present invention; FIG.
is a sectional view showing a third embodiment of the present invention, FIG. 6 is a perspective view showing a fin in the present invention, FIG. 7 is a sectional view showing a fourth embodiment of the present invention, and FIG. It is a sectional view showing a fifth example of the invention.

<Embodiment 1> A cooling device for a semiconductor chip according to a first embodiment will be explained with reference to FIGS. 1, 2, and 3. The amount of heat generated in the semiconductor chip 2 is transferred to the refrigerant 9 flowing from the flow path 6a through the refrigerant supply pipe 1, and the amount of heat generated in the semiconductor chip 2 is transferred to the bellows portion 1a.
, 1b, the straight pipe portion 1c of the refrigerant supply pipe 1 is pressed against the upper surface of the semiconductor chip 2, and the structure is such that the heat is absorbed by conduction and discharged to the outside of the device by flowing out from the flow path 6b. Here, there is an insulating layer on the upper surface of the semiconductor chip 2, and electrical insulation from the refrigerant supply pipe 1 is always maintained.

[0017] As the refrigerant 9, water, Fluorinert, etc. can be used, for example.

The refrigerant supply pipe 1 is made by bending both ends of the straight pipe portion 1c of a bellows with a straight pipe having an oval, elliptical, or square cross-sectional shape to approximately 90° as shown in FIG. It can be manufactured using spring materials such as phosphor bronze, titanium, and stainless steel. The bellows portions 1a and 1b of the refrigerant supply pipe 1 serve as absorbers for warpage of the wiring board 4, height variations in the semiconductor chip 2 during assembly, and displacements such as thermal strain during operation.

The housing 6 is provided with channels 6a and 6b for guiding the refrigerant 9, and the refrigerant supply pipe 1 is joined and fixed by soldering 8a and 8b. Further, a large number of semiconductor chips 1 are housed, and the entire module is sealed by bonding 7 to the wiring board 4.

Further, the semiconductor chip 1 is fixed to a wiring board 4 by solder terminals 3 and is electrically interconnected. Further, the lower surface of the wiring board 4 has a large number of input/output pins 5 for connection to a circuit board (not shown).

The assembly method will be explained. First, both ends of the refrigerant supply pipe 1 are joined to the housing 6 by soldering 8a and 8b. Next, these are attached to the upper surface of the semiconductor chip 1, which is bonded to the wiring board 4 by the solder terminals 3, using the repulsive force of the bellows parts 1a and 1b.
They are placed over each other so that they are in pressure contact with each other, and are sealed by joining 7.

In this embodiment, since the number of parts is small and the number of joints is small, it is possible to provide a semiconductor chip cooling device that can reduce manufacturing costs.

<Embodiment 2> A second embodiment of the present invention will be explained with reference to FIG. In Example 1, the thermally conductive grease 10 having good thermal conductivity was applied to the region where the upper surface of the semiconductor chip 1 and the straight pipe portion 1c of the coolant supply pipe 1 come into pressure contact, that is, the region where heat is conducted. Thereby, a cooling device for the semiconductor chip 1 with high cooling efficiency can be provided. As the material of the thermally conductive grease 10, a mixture of silicone oil and thermally conductive particles can be used.

<Embodiment 3> A third embodiment of the present invention will be explained with reference to FIG. In Example 1, the upper surface of the semiconductor chip 1 and the straight pipe portion 1c of the coolant supply pipe 1 were joined metallically by soldering, brazing, or the like. This results in
Semiconductor chip 1 with better heat conduction and higher cooling efficiency
can provide cooling equipment.

<Embodiment 4> A fourth embodiment of the present invention will be explained with reference to FIGS. 6 and 7. In Examples 1, 2, or 3, a plate-shaped fin 12 as shown in FIG. 6 was metallically joined to the straight pipe portion 1c of the refrigerant supply pipe 1 by soldering or brazing. As a result, the heat conduction area can be increased, so that the heat conductivity is improved, and furthermore, it is possible to provide a cooling device for the semiconductor chip 1 with high cooling efficiency. The material for the fins 12 can be a material with good thermal conductivity, such as copper, aluminum, stainless steel, or highly thermally conductive silicon carbide ceramics. In the process of manufacturing the refrigerant supply pipe 1, the fins 12 are inserted in advance into the straight pipe portion 1c of the straight pipe bellows shown in FIG. By bending both ends of the portion 1c to approximately 90 degrees, the refrigerant supply pipe 1 in this embodiment can be easily manufactured.

<Embodiment 5> A fifth embodiment of the present invention will be explained with reference to FIG. In Examples 1, 2, and 3, the fin portion 1d was formed directly on the straight pipe portion 1c of the refrigerant supply pipe 1. As a result, the heat conduction area can be increased without increasing the number of parts, so that it is possible to provide a cooling device for the semiconductor chip 1 with good heat conductivity and high cooling efficiency.

[0027]

According to the present invention, since the structure uses an integrally molded refrigerant supply pipe, the number of parts and joints can be reduced, and the manufacturing cost of the entire cooling device can be reduced. Furthermore, since the number of joints can be reduced, reliability against refrigerant leakage is improved.

Furthermore, since the cooling fins are directly molded, it is possible to provide a semiconductor chip cooling device with high cooling efficiency without increasing the number of parts.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a semiconductor chip cooling device according to an embodiment of the present invention;

[Fig. 2] A cross-sectional view taken along the line A-A in Fig. 1;

FIG. 3 is a perspective view showing a bellows with a straight pipe for forming a refrigerant supply pipe;

FIG. 4 is a sectional view showing a second embodiment of the present invention;

[Figure 5]
A sectional view showing a third embodiment of the present invention,

FIG. 6 is a perspective view showing a fin in the present invention;

FIG. 7 is a sectional view showing a fourth embodiment of the present invention;

FIG. 8 is a sectional view showing a fifth embodiment of the present invention.

[Explanation of symbols]

1... Refrigerant supply pipe, 2... Semiconductor chip, 3... Solder terminal,
4... Wiring board, 5... Input/output pin, 6... Housing, 9...
Refrigerant.

Claims (5)

[Claims] [Claim 1] Using a refrigerant supply pipe having a stretchable bellows and a cooling member serving as a flow path, the refrigerant is guided from the refrigerant supply pipe close to the semiconductor chip and is brought into pressure contact with the semiconductor chip. A semiconductor chip cooling device for cooling a semiconductor chip, characterized in that the cooling member serving as a flow path and the coolant supply pipe are integrated. 2. In claim 1, the straight pipe part of the refrigerant supply pipe is pressure-welded to the upper surface of the semiconductor chip via thermal conductive grease, so that the straight pipe part of the refrigerant supply pipe is connected from the semiconductor chip to the straight pipe part of the refrigerant supply pipe. A cooling device for semiconductor chips that transfers heat. 3. The semiconductor according to claim 1, wherein the straight pipe part of the refrigerant supply pipe is metallically joined to the upper surface of the semiconductor chip, and heat is transferred from the semiconductor chip to the straight pipe part of the refrigerant supply pipe. Chip cooling device. 4. A semiconductor chip cooling device according to claim 1, wherein a plate-shaped cooling fin is bonded to the straight pipe portion of the coolant supply pipe. 5. The semiconductor chip cooling device according to claim 1, wherein cooling fins are formed on the straight pipe portion of the coolant supply pipe.