JPH0435053A - Cooling device of ic - Google Patents
Cooling device of icInfo
- Publication number
- JPH0435053A JPH0435053A JP2142645A JP14264590A JPH0435053A JP H0435053 A JPH0435053 A JP H0435053A JP 2142645 A JP2142645 A JP 2142645A JP 14264590 A JP14264590 A JP 14264590A JP H0435053 A JPH0435053 A JP H0435053A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- printed board
- lsi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000011231 conductive filler Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 abstract 4
- 239000000945 filler Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はＬ Ｓ Ｉ、ＭＳＹなど集積回路の冷却装置に
関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a cooling device for integrated circuits such as LSI and MSY.
（従来の技術）
従来、機器に組込まれたプリント基板」二のＬＳＩを冷
却する方Ｙムとして、機器の内部にファンを持ち、ＬＳ
Ｉに風を吹きつけることにより、ＬＳＩの温度を下げ、
又、これに加え多くの熱を発生するＬＳＩには、ＬＳＩ
上に放熱板を付加することで冷却を行なっていた。しか
しプリント基板を実装する上で、ＬＳＩ冷却するために
十分な風の流を考慮する必要があった。又、放熱板を使
用する場合、多くの実装空間が必要であるため、機器を
小型化することが困難である等の問題が必要であるため
、機器を小型化することが困難である等の問題があった
。(Prior art) Conventionally, as a means of cooling the LSI (printed circuit board) built into the device, a fan is installed inside the device, and the LSI
By blowing wind on I, the temperature of LSI is lowered,
In addition, LSIs that generate a lot of heat include LSI
Cooling was achieved by adding a heat sink on top. However, when mounting the printed circuit board, it was necessary to consider sufficient air flow to cool the LSI. In addition, when using a heat sink, it requires a lot of mounting space, which makes it difficult to downsize the device. There was a problem.
（発明が解決しようとする課題）
本発明はプリント基板に実装されるＬＳＩとを、プリン
ト基板のＧ Ｎ Ｄ層に熱伝導率の高い材料を介して接
触させることによりＬＳＩの熱をＧＮＤ層より、放出す
ることで、機器の小型化を実現することを目的とする。(Problems to be Solved by the Invention) The present invention brings the LSI mounted on a printed circuit board into contact with the GND layer of the printed circuit board through a material with high thermal conductivity, thereby dissipating the heat of the LSI from the GND layer. The aim is to realize miniaturization of equipment by emitting .
（課題を解決するための手段）
本発明は集積回路を取り付けて電気回路を構成するプリ
ント基板と、集積回路の裏面側に密着して設けられ熱の
伝達を行なう熱伝導充填材と、一方を熱伝導充填材に他
方をプリント基板に接して設けられ熱の伝導を行なう面
接触介在体と、プリント基板を貫通して設けられた穴と
、この穴を充填して設けられプリント基板に挿入された
接地層に接続された穴充填材とを具備してなる集積回路
の冷却装置である。(Means for Solving the Problems) The present invention provides a printed circuit board on which an integrated circuit is attached to form an electric circuit, a thermally conductive filler that is provided in close contact with the back side of the integrated circuit and conducts heat transfer; A surface contact intervening body is provided on the thermally conductive filler with the other side in contact with the printed circuit board to conduct heat, a hole is provided through the printed circuit board, and the other is provided to fill the hole and is inserted into the printed circuit board. and a hole filler connected to a ground layer.
（作 用）
ＬＳＩを実装するプリント基板のＧＮＤ層と、熱伝導の
優れた素材で作成した多数のスルーホルで接地された面
パターンをプリント基板の表面に形成し、ＬＳＩはこの
面パターンに接触するように固定し、その場合、冷却を
必要とするＬＳＩを実装した時に、ＬＳＩのパッケージ
が面パターンにより効果的に接触するように熱伝導率の
高い材料を両者の間に配置し、機器使用中ＬＳＩが発熱
してきた場合、その熱をこれらを通して、プリント基板
のＧＮＤ層より外に逃がすことで、放熱板の役割りを果
し、実装空間を少なくすることを可能とする。(Function) A surface pattern is formed on the surface of the printed circuit board that is grounded by the GND layer of the printed circuit board on which the LSI is mounted and a large number of through holes made of a material with excellent thermal conductivity, and the LSI comes into contact with this surface pattern. In that case, when an LSI that requires cooling is mounted, a material with high thermal conductivity is placed between them so that the LSI package comes into contact with the surface pattern more effectively. When the LSI generates heat, the heat is dissipated through these to the outside of the GND layer of the printed circuit board, thereby acting as a heat sink and making it possible to reduce the mounting space.
（実施例）
次に本発明の一実施例を説明する。第１図は集積回路１
を取り付けて電気回路を構成するプリント基板２と、集
積回路１の裏面側に密着して設けられ熱の伝達を行なう
熱伝導充填材３と、一方を熱伝導充填材３に他方をプリ
ント基板２に接して設けられ熱の伝導を行なう面接触介
在体４と、プリント基板２を貫通して設けられた穴５と
、穴５を充填して設けられプリント基板２に挿入された
接地（以下ＧＮＤと言う）層７に接続された穴充填材と
を具備してなる集積回路の冷却装置を示している。(Example) Next, an example of the present invention will be described. Figure 1 shows integrated circuit 1
A printed circuit board 2 is attached to form an electric circuit, a thermally conductive filler 3 is provided in close contact with the back side of the integrated circuit 1 and conducts heat transfer, and one side is the thermally conductive filler 3 and the other side is the printed circuit board 2. A surface contact intermediary body 4 is provided in contact with and conducts heat, a hole 5 is provided through the printed circuit board 2, and a grounding member (hereinafter referred to as GND 7 shows a cooling device for integrated circuits comprising a hole filling material connected to layer 7 (see FIG. 1).
即ち、プリント基板に実装されたＬＳＩを、冷却する方
法として、プリント基板の表面に、熱伝導率の高い材料
で形成される多数の穴（以下スルホールと言う）５でＧ
ＮＤ層７と接地された面接触介在体（以下面パターンと
言う）４を形成し。That is, as a method of cooling an LSI mounted on a printed circuit board, a large number of holes (hereinafter referred to as "through holes") 5 made of a material with high thermal conductivity are formed on the surface of the printed circuit board to cool the LSI mounted on the printed circuit board.
A surface contact intervening body (hereinafter referred to as surface pattern) 4 which is grounded with the ND layer 7 is formed.
それと充填材をはさんで接触するようにＬＳＩを取りつ
けることで、ＬＳＩが発生する熱をプリン一
１へ基板のＧＮＤ層に伝導させるものであり、プリント
基板の実装空間を少なくし、機器の小型化を可能とする
ことを特徴とする。By mounting the LSI so that it is in contact with the filler material, the heat generated by the LSI is conducted to the GND layer of the board to the printed circuit board 1. This reduces the mounting space on the printed circuit board and makes the device more compact. It is characterized by making it possible to
本発明によりプリント基板実装空間を少なくすることが
可能となる。The present invention makes it possible to reduce the printed circuit board mounting space.
第１図は本発明の一実施例を示す冷却装置の断面図であ
る。
１・・集積回路 ２・・・プリント基板３・
・熱伝導充填材 ４・・・面接触介在体５・・・
六 ６・・・穴充填材７・・・接地層
ぼ
籟
代理人 弁理士 大 胡 典 夫FIG. 1 is a sectional view of a cooling device showing one embodiment of the present invention. 1. Integrated circuit 2. Printed circuit board 3.
・Thermal conductive filler 4... surface contact intervening body 5...
6 6...Hole filling material 7...Ground layer removal agent Patent attorney Norio Ogo
Claims (1)
板と、前記集積回路の裏面側に密着して設けられ熱の伝
達を行なう熱伝導充填材と、一方を前記熱伝導充填材に
他方を前記プリント基板に接して設けられ熱の伝導を行
なう面接触介在体と、前記プリント基板を貫通して設け
られた穴と、この穴を充填して設けられ前記プリント基
板に挿入された接地層に接続された穴充填材とを具備し
てなる集積回路の冷却装置。a printed circuit board on which an integrated circuit is attached to form an electric circuit; a thermally conductive filler that is provided in close contact with the back side of the integrated circuit and transfers heat; one side is the thermally conductive filler and the other side is the printed circuit board. a surface contact intervening member provided in contact with the printed circuit board to conduct heat; a hole provided through the printed circuit board; and a ground layer provided filling the hole and connected to the ground layer inserted into the printed circuit board. A cooling device for an integrated circuit, comprising a hole filling material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2142645A JPH0435053A (en) | 1990-05-31 | 1990-05-31 | Cooling device of ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2142645A JPH0435053A (en) | 1990-05-31 | 1990-05-31 | Cooling device of ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0435053A true JPH0435053A (en) | 1992-02-05 |
Family
ID=15320173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2142645A Pending JPH0435053A (en) | 1990-05-31 | 1990-05-31 | Cooling device of ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0435053A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5543661A (en) * | 1994-05-31 | 1996-08-06 | Sumitomo Metal Ceramics Inc. | Semiconductor ceramic package with terminal vias |
-
1990
- 1990-05-31 JP JP2142645A patent/JPH0435053A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5543661A (en) * | 1994-05-31 | 1996-08-06 | Sumitomo Metal Ceramics Inc. | Semiconductor ceramic package with terminal vias |
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