JPH04332870A - Semiconductor acceleration detection device - Google Patents
Semiconductor acceleration detection deviceInfo
- Publication number
- JPH04332870A JPH04332870A JP3102297A JP10229791A JPH04332870A JP H04332870 A JPH04332870 A JP H04332870A JP 3102297 A JP3102297 A JP 3102297A JP 10229791 A JP10229791 A JP 10229791A JP H04332870 A JPH04332870 A JP H04332870A
- Authority
- JP
- Japan
- Prior art keywords
- acceleration detection
- weight
- screw
- detection device
- detection beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001133 acceleration Effects 0.000 title claims abstract description 44
- 238000001514 detection method Methods 0.000 title claims abstract description 37
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 238000005452 bending Methods 0.000 claims description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 230000035939 shock Effects 0.000 abstract 2
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
Landscapes
- Pressure Sensors (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、半導体加速度検出装
置に関し、特に、加速度に対応して、しなり動作をする
加速度検出梁を備えた半導体加速度検出装置に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor acceleration detection device, and more particularly to a semiconductor acceleration detection device equipped with an acceleration detection beam that bends in response to acceleration.
【０００２】0002
【従来の技術】図２は従来の半導体加速度検出装置を示
し、図において、加速度検出梁１の中間部には溝２が形
成されており、加速度検出梁１の一端部は、基板３に配
設された台座４に固定されている。加速度検出梁１の自
由端には、感度を増すための重り５が取付けられている
。基板３にはケース６が結合して加速度検出梁１を収納
している。７は溝２の裏側に配置された伸縮により抵抗
値が変化する半導体でなるひずみ抵抗である。１０は加
速度検出梁１の上下のしなり幅を制限するために重り５
の上下を囲むように基板３に設置された止め具である。
Ｔａは重り５と基板３の側の止め具１０との距離、Ｔｂ
は重り５とケース６の側の止め具１０との距離である。2 shows a conventional semiconductor acceleration detection device. In the figure, a groove 2 is formed in the middle of an acceleration detection beam 1, and one end of the acceleration detection beam 1 is arranged on a substrate 3. It is fixed to a pedestal 4 provided therein. A weight 5 is attached to the free end of the acceleration detection beam 1 to increase sensitivity. A case 6 is coupled to the substrate 3 and houses the acceleration detection beam 1. Reference numeral 7 denotes a strain resistor made of a semiconductor and placed on the back side of the groove 2 and whose resistance value changes due to expansion and contraction. 10 is a weight 5 to limit the vertical bending width of the acceleration detection beam 1.
This is a stopper installed on the board 3 so as to surround the top and bottom of the board. Ta is the distance between the weight 5 and the stopper 10 on the board 3 side, Tb
is the distance between the weight 5 and the stopper 10 on the case 6 side.
【０００３】次に動作について説明する。半導体加速度
検出装置に加速度が印加されると、加速度検出梁１がし
なり、その最も薄い溝２の部分が最もしなる。このしな
りで溝２の裏側に配置されているひずみ抵抗７の抵抗値
が変化し、これを電気信号に変換することで加速度を検
出する。また、溝２は深く掘られており、この部分の加
速度検出梁１は薄くなっていて折れやすいため、加速度
検出梁１がある程度以上しならないようにし、折れない
ようにするために、重り５の上下を囲むように止め具１
０が基板３に取り付けられている。この止め具１０の設
置により加速度検出梁１がある距離Ｔａ，Ｔｂ以上にし
ならないようなっており、耐衝撃性を向上させている。Next, the operation will be explained. When acceleration is applied to the semiconductor acceleration detection device, the acceleration detection beam 1 bends, and the thinnest groove 2 portion thereof bends the most. This bending changes the resistance value of the strain resistor 7 arranged on the back side of the groove 2, and the acceleration is detected by converting this into an electrical signal. In addition, the groove 2 is deeply dug, and the acceleration detection beam 1 in this part is thin and easy to break. Therefore, in order to prevent the acceleration detection beam 1 from bending beyond a certain level and from breaking, a weight 5 is applied. Stopper 1 to surround the top and bottom
0 is attached to the substrate 3. The installation of this stopper 10 prevents the acceleration detection beam 1 from exceeding certain distances Ta and Tb, thereby improving impact resistance.
【０００４】0004
【発明が解決しようとする課題】従来の半導体加速度検
出装置は以上のように構成されているので、重り５と止
め具１０の距離Ｔａ，Ｔｂは半導体加速度検出装置の組
み立てのばらつきにより大きく左右され、正確なある距
離Ｔａ，Ｔｂを保つことは困難であった。[Problems to be Solved by the Invention] Since the conventional semiconductor acceleration detection device is constructed as described above, the distances Ta and Tb between the weight 5 and the stopper 10 are largely influenced by variations in the assembly of the semiconductor acceleration detection device. , it was difficult to maintain accurate certain distances Ta and Tb.
【０００５】この発明は上記のような問題点を解消する
ためになされたもので、止め具と重りとの距離Ｔａ，Ｔ
ｂを所定の値に正確に保つことができる半導体加速度検
出装置を得ることを目的とする。[0005] This invention was made to solve the above-mentioned problems, and the distance between the stopper and the weight Ta, T
An object of the present invention is to obtain a semiconductor acceleration detection device that can accurately maintain b at a predetermined value.
【０００６】[0006]
【課題を解決するための手段】この発明に係る半導体加
速度検出装置は、耐衝撃性向上のための止め具にねじを
用いて、このねじをケースと基板から重り方向に差し込
んだものである。[Means for Solving the Problems] A semiconductor acceleration detection device according to the present invention uses a screw as a stopper for improving impact resistance, and this screw is inserted from the case and the board in the direction of the weight.
【０００７】[0007]
【作用】この発明においては、重りとねじ先端とが触れ
ると加速度を受けた状態となり、電気信号が検出されて
接触が確認でき、その後、必要距離だけねじを戻すこと
により、正確に重りとねじ先端との距離を保つ。[Function] In this invention, when the weight and the screw tip touch, they receive acceleration, an electrical signal is detected and contact can be confirmed, and then by returning the screw by the required distance, the weight and screw are accurately Keep distance from the tip.
【０００８】実施例 １
図１はこの発明の一実施例を示し、図において、８は重
り５の真下の基板３にねじ穴をあけ、重り５の方向にね
じを差し込んだ基板側ねじ止め具である。９は重り５の
真上のケース６にねじ穴をあけ、重り５の方向にねじを
差し込んだケース側ねじ止め具である。その他、図２と
同一の符号は同様の部分である。Embodiment 1 FIG. 1 shows an embodiment of the present invention, and in the figure, reference numeral 8 denotes a screw hole on the substrate 3 directly below the weight 5, and a screw stopper on the substrate side into which a screw is inserted in the direction of the weight 5. It is. Reference numeral 9 designates a case side screw stopper which is made by drilling a screw hole in the case 6 directly above the weight 5 and inserting a screw in the direction of the weight 5. Other than that, the same reference numerals as in FIG. 2 indicate the same parts.
【０００９】次に動作について説明する。半導体加速度
検出装置に加速度が印加されると、加速度検出梁１がし
なり、最も薄い部分である溝２がしなる。このしなりで
溝２の裏面に配置されているひずみ抵抗７の抵抗値が変
化し、これを電気信号に変換することで加速度を検出す
る。Next, the operation will be explained. When acceleration is applied to the semiconductor acceleration detection device, the acceleration detection beam 1 bends, and the groove 2, which is the thinnest part, bends. This bending changes the resistance value of the strain resistor 7 arranged on the back surface of the groove 2, and the acceleration is detected by converting this into an electric signal.
【００１０】また、溝２は深く掘られており、この部分
の加速度検出梁１は非常に薄く折れやすいので、加速度
検出梁１がある程度以上、しならないようにするために
基板３とケース６に重り５の方向にそれぞれねじ穴をあ
け、止め具８，９のねじを差し込む。この基板側ねじ止
め具８は、差し込んでいくと重り５に触れ、接触するこ
とで加速度検出梁１がしなり、電気信号が検出される。
この電気信号が検出されることで基板ねじ止め具８の先
端が重りに到達したことが確認され、その後、加速度検
出梁１がしなっても折れない幅まで基板ねじ止め具８を
元に戻せば基板側ねじ止め具８と重りとの距離Ｔａは正
確に調整することができる。ケース側ねじ止め具９も同
様にする。Furthermore, the groove 2 is deeply dug, and the acceleration detection beam 1 in this part is very thin and easy to break. Therefore, in order to prevent the acceleration detection beam 1 from bending beyond a certain level, the substrate 3 and the case 6 are Drill a screw hole in the direction of the weight 5, and insert the screws of the stoppers 8 and 9. As the board-side screw fastener 8 is inserted, it touches the weight 5, and due to the contact, the acceleration detection beam 1 bends, and an electrical signal is detected. By detecting this electric signal, it is confirmed that the tip of the board screw stopper 8 has reached the weight, and then the board screw stopper 8 can be returned to its original width to a width that will not break even if the acceleration detection beam 1 bends. For example, the distance Ta between the board-side screw stopper 8 and the weight can be adjusted accurately. Do the same for the case side screw stopper 9.
【００１１】[0011]
【発明の効果】以上のように、この発明によれば、基板
側止め具と重りとの距離およびケース側止め具と重りと
の距離、組立てのばらつきを補正して正確に調整できる
ようにしたので、装置が安価にでき、また精度の高いも
のが得られる効果がある。[Effects of the Invention] As described above, according to the present invention, it is possible to accurately adjust the distance between the board-side stopper and the weight, the distance between the case-side stopper and the weight, and the variations in assembly. Therefore, the device can be made at a low cost and can be highly accurate.
【図１】この発明の実施例１の側断面図である。FIG. 1 is a side sectional view of Embodiment 1 of the present invention.
【図２】従来の半導体加速度検出装置の側断面図である
。FIG. 2 is a side sectional view of a conventional semiconductor acceleration detection device.
１ 加速度検出梁 ２ 溝 ３ 基板 ４ 台座 ５ 重り ６ ケース ７ ひずみ抵抗 ８ 基板側ねじ止め具 ９ ふた側ねじ止め具 1 Acceleration detection beam 2 Groove 3 Substrate 4 Pedestal 5 Weight 6 Case 7 Strain resistance 8 Board side screw fastener 9 Lid side screw fastener
Claims (1)
され自由端に重りが取付けられていて、加速度に対応し
てしなり動作をする加速度検出梁と、前記基板に結合さ
れ、前記加速度検出梁を収納しているケースと、前記基
板および前記ケースにそれぞれ設けられたねじ穴に前記
重り方向に差込まれ前記加速度検出梁のしなりを制限す
るための基板側ねじ止め具およびケース側ねじ止め具と
、を備えてなる半導体加速度検出装置。1. An acceleration detection beam having one end fixed to a pedestal disposed on a substrate and a weight attached to a free end, the beam bending in response to acceleration; A case housing an acceleration detection beam, a board-side screw stopper that is inserted in the direction of the weight into screw holes provided in the board and the case, respectively, to limit bending of the acceleration detection beam, and the case. A semiconductor acceleration detection device comprising a side screw fastener.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3102297A JPH04332870A (en) | 1991-05-08 | 1991-05-08 | Semiconductor acceleration detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3102297A JPH04332870A (en) | 1991-05-08 | 1991-05-08 | Semiconductor acceleration detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04332870A true JPH04332870A (en) | 1992-11-19 |
Family
ID=14323686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3102297A Pending JPH04332870A (en) | 1991-05-08 | 1991-05-08 | Semiconductor acceleration detection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04332870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010230459A (en) * | 2009-03-26 | 2010-10-14 | Oki Electric Ind Co Ltd | Vibration sensor |
| JP2011149784A (en) * | 2010-01-20 | 2011-08-04 | Oki Electric Industry Co Ltd | Vibration sensor |
-
1991
- 1991-05-08 JP JP3102297A patent/JPH04332870A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010230459A (en) * | 2009-03-26 | 2010-10-14 | Oki Electric Ind Co Ltd | Vibration sensor |
| JP2011149784A (en) * | 2010-01-20 | 2011-08-04 | Oki Electric Industry Co Ltd | Vibration sensor |
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