JPH04321244A - Method and apparatus for manufacturing semiconductor device - Google Patents

Abstract

PURPOSE:To provide the manufacturing method and the manufacturing apparatus, of a semiconductor device, which collectively treat a resin sealing process and an after-curing process in the manufacturing process of the semiconductor device, which enhance its production efficiency and which automate and simplify a lot control operation. CONSTITUTION:A molding apparatus 6 is provided with a curing function so that an after-curing process 17 in an assembly posterior process as the manufacturing process of a semiconductor device can be treated collectively in a molding process 6.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for manufacturing semiconductor devices.

0002

2. Description of the Related Art FIGS. 3 and 4 show conventional semiconductor device manufacturing equipment. In the figures, 1 indicates a lead frame (hereinafter referred to as lead frame) to which a semiconductor element is bonded and electrically connected; 3 is a distribution unit that receives the lead frames 1 supplied from the buffer 2 and supplies them to the next unit; 4 is a buffer in which the lead frames 1 are stored without contacting each other; 4 is a distribution unit that receives the lead frames 1 supplied from the distribution unit 3; An alignment unit 5 receives and aligns the four lead frames 1, and 5 supplies the aligned lead frames 1 and tablets made of resin material (not shown and the method of supplying them to the loading unit is not particularly explained) to a mold for resin sealing. A loading unit 6 is a pair of upper and lower molds for resin-sealing, molding, and curing the semiconductor element of the lead frame 1 supplied by the loading unit 5 (mold clamping and molding methods are not particularly explained); 7 is a mold for molding the molded product; An unloading unit that separates and discards waste materials such as culls and runners taken out from the mold 6 (separation and disposal methods are not particularly explained), 8 is a lead frame after molding from which the above waste materials have been removed, and 9 is a A real magazine stores the molded lead frame 8, 10 is a frame storage unit that receives the molded lead frame 8 and supplies it to the real magazine 9, and 11 is an empty magazine. In addition, in the figure, 12 is called a loader, 13 is called a press, and 14 is called an unloader.

Next, the operation will be explained. The lead frames 1 are discharged one by one from the buffer 2 to the distribution unit 3 (arrow A). The lead frame 1 is then supplied from this distribution unit 3 to the alignment unit 4 (arrows B, B1
, B2 , B3 , B4). The four lead frames 1 on the alignment unit 4 and the tablet of resin sealing material are set into the mold 6 by the loading unit 5 (arrows C and D). After the lead frame 1 and the tablet are set, the upper and lower molds 6 kept at 180°C are clamped by presses (not shown), and injection molding is performed, followed by a curing operation to stabilize the curing of the resin (the mold remains in the clamped state after molding). 45 seconds) is performed. After completing the cure,
The mold 6 is opened, the molded product is taken out by the unloading unit 7 (arrows D and E), the waste material is separated and disposed of, and only the lead frame 8 after molding is delivered to the frame storage unit 10. The lead frames 8 after molding are stored one by one in the actual magazine 9 (
Arrow F). When the molded lead frame 8 in the real magazine 9 becomes full, it is ejected in the direction of arrow G, and the empty magazine 11, which had been previously supplied from arrow H, is moved and set in the direction of arrow J. The molded lead frame 8 in the actual magazine 9 discharged in the direction of arrow G is further heated in a curing furnace (not shown), which is another device, to stabilize the curing of the resin after molding.
It is left to stand at 0°C for 5 hours and then sent to the next step.

0004

[Problems to be Solved by the Invention] Since the conventional semiconductor device manufacturing equipment is configured as described above, after the molding process, the after-cure process must be performed in batches using other equipment, resulting in poor production efficiency. There were problems such as complicated lot management and automation, and disadvantages in terms of clean room space efficiency.

[0005] This invention was made to solve the above-mentioned problems, and by making it possible to perform the after-cure process after molding all at once, it aims to improve production efficiency and simplify lot management and automation. The purpose of the present invention is to obtain a method and apparatus for manufacturing a semiconductor device that can be manufactured using a semiconductor device.

[0006]

[Means for Solving the Problems] A method for manufacturing a semiconductor device according to the present invention is such that the after-cure process in the post-assembly process is performed all at once in a mold process. Further, in the semiconductor device manufacturing apparatus according to the present invention, the molding device is equipped with a function so that the after-cure process in the post-assembly process can be performed all at once in the molding process.

[0007]

[Operation] In the present invention, the curing function provided separately from the molding die further stabilizes the curing of the resin after molding.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In the drawings, parts that are the same as or corresponding to those of the conventional one are given the same reference numerals, and explanations thereof will be omitted. In the figure, 15
16 is a heater that serves as a heat source; 16 is a blower that equalizes the indoor temperature; 17 is a high-temperature furnace that is kept at a high temperature by the heater 15 and blower 16; 18 is a cooling furnace that cools the real magazine 9 with a blow nozzle 19; and 20 is an unloader. A shutter 21 separates the cooling furnace 18 from the high temperature furnace 17. A shutter 21 separates the cooling furnace 18 from the high temperature furnace 17.

The process until the molded lead frame 8 is stored in the actual magazine 9 is the same as the conventional one. When the molded lead frame 8 becomes full, the actual magazine 9 is discharged in the direction of arrow K by opening and closing the shutter 20 into a high temperature furnace 17 whose interior is maintained at 180° C. by a heater 15 and a blower 16. The actual magazine 9 supplied into the high-temperature furnace 17 is transported in the direction of arrow L over a period of 5 hours, and then discharged into the cooling furnace 18 by opening and closing the shutter 21, where it is exposed to dry air (5 kgf/cm2) by the blow nozzle 19. ,
20° C.) for a certain period of time to rapidly cool the actual magazine 9. Thereafter, the actual magazine 9 is ejected out of the device (arrow M).

As described above, the lead frame 8 after molding
By performing after-curing with a plurality of lead frames stored in the actual magazine 9, it becomes possible to process a large amount of lead frames, and the device becomes more compact, compared to the conventional method of curing each lead frame 8 one by one. Become. Furthermore, if the actual magazine 9 is cooled by providing a cooling function using the cooling furnace 18 at the end of the after-cure process as described above, handling (and Regardless of whether it is done by machine or by hand, the above difficulties are solved. Furthermore, providing the shutters 20 and 21 as described above is effective because it can reduce changes in the temperature (180° C.) inside the high temperature furnace 17 when the actual magazine 9 is taken out. In other words, since the room temperature inside the unloader 14 and inside the cooling furnace 18 are both approximately 22°C, if the actual magazine 9 is left open during transportation, the high-temperature furnace 18
Since a large amount of cold air always enters the furnace 7, the heater capacity increases in order to keep the temperature inside the furnace constant.

[0011] In the above embodiment, a method of after-curing the molded lead frame 8 stored in the actual magazine 9 was shown, but the after-curing may be performed with the molded lead frame 8 in place. Further, in the above embodiment, a case has been described in which the heater 15 and the blower 16 are used, but other heat source temperature raising devices or heat retention/uniform temperature devices may be used, and the same effects as in the above embodiments can be obtained. Further, in the above embodiment, after molding, curing was carried out at 180° C. for 5 hours, but the temperature and time are arbitrary. Furthermore, although the embodiment described above is configured to cool the actual magazine 9 after after-curing, it may be discharged at a high temperature. Although the cooling method is shown as using air blow, other cooling devices may be used.

0012

As described above, according to the present invention, it is possible to improve production efficiency and simplify lot management and automation by performing the entire process up to the after-cure process after molding.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a front view showing a manufacturing apparatus according to an embodiment of the present invention.

FIG. 3 is a plan view showing a conventional manufacturing apparatus.

FIG. 4 is a front view showing a conventional manufacturing apparatus.

[Explanation of symbols]

1 Lead frame 2 Buffer 3 Distribution unit 4 Alignment unit 5 Loading unit 6 Mold 7 Unloading unit 8 Lead frame after molding 9 Real Magazine 10 Frame storage unit 11 Empty magazine 12 Loader 13 Press 14 Unloader 15 Heater 16 Blower 17 High temperature furnace 18 Cooling furnace

Claims (6)

[Claims] 1. A method for manufacturing a semiconductor device, characterized in that an after-cure process in a post-assembly process that is a semiconductor device manufacturing process is performed all at once in a molding process. 2. The method for manufacturing a semiconductor device according to claim 1, wherein after-curing is performed with a plurality of molded lead frames stored in a magazine. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the magazine is cooled at the end of the after-cure step. 4. A semiconductor device manufacturing apparatus characterized in that a molding device is equipped with a curing function so that an after-cure process in a post-assembly process that is a semiconductor device manufacturing process can be performed all at once in a molding process. 5. The semiconductor device manufacturing apparatus according to claim 4, wherein after-curing is performed with a plurality of molded lead frames stored in a magazine. 6. The semiconductor device manufacturing apparatus according to claim 4, further comprising a magazine cooling function at the end of the after-cure step.