JPH04300084A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPH04300084A JPH04300084A JP3064131A JP6413191A JPH04300084A JP H04300084 A JPH04300084 A JP H04300084A JP 3064131 A JP3064131 A JP 3064131A JP 6413191 A JP6413191 A JP 6413191A JP H04300084 A JPH04300084 A JP H04300084A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- workpiece
- piercing
- laser
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 40
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
[発明の目的] [Purpose of the invention]
【0001】0001
【産業上の利用分野】本発明は被加工物の切断加工を行
うのに好適するレーザ加工機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing machine suitable for cutting a workpiece.
【0002】0002
【従来の技術】レーザ加工機により被加工物の切断加工
を行う場合、通常、切断用の起点を作るために、まずピ
アシングと呼ばれる小さい貫通した穴明け加工を行う。2. Description of the Related Art When cutting a workpiece using a laser beam machine, normally a small penetrating hole called piercing is first formed in order to create a starting point for cutting.
【0003】この穴は、切断形状を形成する上では必要
としないものであるため、貫通していればどの様な形状
でも切断時に利用することができるものである。ところ
が、ピアシング時に照射するレーザ光により被加工物の
穴の周辺が必要以上に加熱されると、加熱された部分と
加熱されていない部分とで切断時の条件が異なるため、
良好な切断加工を行うことが困難になりやすい。このた
め、ピアシングを行う場合には、パルス発振のレーザ光
を使用し、かつ照射時間を短くして、被加工物に対する
加熱を抑えた条件が適用されている。[0003] Since this hole is not necessary for forming the cut shape, any shape can be used for cutting as long as it passes through the hole. However, if the area around the hole in the workpiece is heated more than necessary by the laser beam irradiated during piercing, the cutting conditions will differ between the heated area and the unheated area.
It tends to be difficult to perform good cutting. For this reason, when performing piercing, conditions are applied in which pulsed laser light is used and the irradiation time is shortened to suppress heating of the workpiece.
【0004】そして、このような穴明け加工を行った後
、被加工物の切断条件により、必要とする形状にレーザ
光を走査することによって切断を行い、製品を作り出し
ている。[0004] After performing such drilling, the workpiece is cut into a desired shape by scanning a laser beam according to the cutting conditions of the workpiece, thereby producing a product.
【0005】[0005]
【発明が解決しようとする課題】レーザ加工機から発せ
られるレーザ光は、加工ヘッドの内部に設置された集光
レンズにより集光された状態で被加工物に照射されるた
め、エネルギー密度の高い領域は狭く、集光点近傍に限
られる。従って、ピアシングや切断を行う場合、集光点
を被加工物の表面近傍に設定して実施するが、被加工物
の板厚によって設定条件が異なってくる。[Problems to be Solved by the Invention] Laser light emitted from a laser processing machine is focused by a condensing lens installed inside the processing head and irradiated onto the workpiece, so it has a high energy density. The area is narrow and limited to the vicinity of the focal point. Therefore, when piercing or cutting, the light condensing point is set near the surface of the workpiece, but the setting conditions vary depending on the thickness of the workpiece.
【0006】レーザ光の集光点を被加工物の表面に対し
てどの位置に設定するかが、レーザ加工条件の一つであ
り、一般にこの値をデフォーカス量と称している。この
デフォーカス量は、集光点が被加工物の表面より上方と
なる場合をプラス、下方となる場合をマイナスとしてい
る。[0006] The position of the converging point of the laser beam relative to the surface of the workpiece is one of the laser processing conditions, and this value is generally referred to as the amount of defocus. This defocus amount is positive when the focal point is above the surface of the workpiece, and negative when it is below.
【0007】被加工物の板厚が厚くなる場合、切断時で
のデフォーカス量の最適値は、プラス側であるが、これ
に対してピアシング時でのデフォーカス量は、ピアシン
グに要する時間を最短にするにはゼロからマイナス側の
設定が必要である。すなわち、ピアシング時でのデフォ
ーカス量を最適値に設定すると(ゼロからマイナス側の
設定すると)、その設定値は切断時での最適値(プラス
側)とは異なった値となってしまう。[0007] When the thickness of the workpiece increases, the optimal value for the amount of defocus during cutting is on the plus side, but on the other hand, the amount of defocus during piercing depends on the time required for piercing. To make it the shortest, it is necessary to set it on the negative side from zero. That is, if the defocus amount at the time of piercing is set to the optimal value (setting on the negative side from zero), the set value will be a value different from the optimal value (on the positive side) at the time of cutting.
【0008】従って、両加工を最適条件で実施するには
、それらピアシングと切断との加工を切り換えるごとに
、デフォーカス量、すなわち被加工物の表面に対する集
光点の位置を変更する必要がある。しかしながら、その
ような変更を行うためには加工ヘッドが複雑化し、また
操作が煩雑となるため、一般的には切断時のデフォーカ
ス量に設定してピアシングを行っている。このようにし
た場合には、ピアシング時において穴が貫通するまでの
時間が長くなり、ひいては加工に要する全体の時間が長
くなるため、加工効率が悪くなるという問題点がある。[0008] Therefore, in order to perform both processes under optimal conditions, it is necessary to change the defocus amount, that is, the position of the focal point with respect to the surface of the workpiece, each time the piercing and cutting processes are switched. . However, in order to make such a change, the processing head becomes complicated and the operation becomes complicated, so piercing is generally performed with the defocus amount set at the time of cutting. In this case, there is a problem that the time required for the hole to penetrate during piercing becomes longer, and the overall time required for processing becomes longer, resulting in poor processing efficiency.
【0009】本発明は上記事情に鑑みてなされたもので
あり、その目的は、ピアシング時と切断時とでデフォー
カス量の変更を必要とせずに切断加工を行うことができ
、ひいては加工効率の向上を図り得るレーザ加工機を提
供するにある。
[発明の構成]The present invention has been made in view of the above circumstances, and its object is to be able to perform cutting without changing the amount of defocus between piercing and cutting, thereby improving processing efficiency. The object of the present invention is to provide a laser processing machine that can be improved. [Structure of the invention]
【0010】0010
【課題を解決するための手段】本発明は、上記の目的を
達成するために、レーザ発振器から発せられたレーザ光
を、光伝達系を介してレーザ加工ヘッドに導き、このレ
ーザ加工ヘッド内に設けられた集光レンズを介して被加
工物に照射することによりその被加工物の切断加工を行
うようにしたレーザ加工機において、前記光伝達系中に
焦点距離の長い補助レンズを介在させると共に、前記集
光レンズによるレーザ光の集光点を被加工物の表面より
下方となるように設定したことを特徴とするものである
。[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention guides a laser beam emitted from a laser oscillator to a laser processing head via an optical transmission system. In a laser processing machine that cuts a workpiece by irradiating the workpiece through a condensing lens provided therein, an auxiliary lens with a long focal length is interposed in the light transmission system, and , the condensing point of the laser beam by the condensing lens is set to be below the surface of the workpiece.
【0011】[0011]
【作用】光伝達系中に焦点距離の長い補助レンズを介在
させることにより、切断時でのデフォーカス量の最適値
が、従来プラス側のみであったものが、マイナス側にも
できることがわかった。このことにより、切断時でのデ
フォーカス量の最適値をピアシング時でのデフォーカス
量の最適値と同じマイナス側の値に設定することができ
るようになるから、ピアシング時と切断時とでデフォー
カス量を変更する必要がなくなり、しかもピアシングを
短時間で行うことが可能となり、ひいては切断加工を効
率良く行うことができるようになる。[Action] By interposing an auxiliary lens with a long focal length in the light transmission system, it was found that the optimal value of the amount of defocus during cutting can be changed to the negative side, whereas previously it was only on the positive side. . This makes it possible to set the optimal value of the defocus amount during cutting to the same negative value as the optimal value of the defocus amount during piercing. There is no need to change the focus amount, and piercing can be performed in a short time, which in turn allows efficient cutting.
【0012】0012
【実施例】以下、本発明の一実施例について図面を参照
して説明する。まず図1において、レーザ発振器1から
発せられるレーザ光2は、反射ミラーから成るビームベ
ンダ3により向きを変えられて加工ヘッド4に導かれる
ようになっている。加工ヘッド4内には集光レンズ5が
配設されており、レーザ光2をこの集光レンズ5により
集光した状態で被加工物6に照射することによって、被
加工物6の加工を行うようになっている。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. First, in FIG. 1, a laser beam 2 emitted from a laser oscillator 1 is directed to a processing head 4 after being directed by a beam bender 3 consisting of a reflecting mirror. A condensing lens 5 is disposed within the processing head 4, and the workpiece 6 is processed by irradiating the workpiece 6 with laser light 2 that is focused by the condenser lens 5. It looks like this.
【0013】而して、上記レーザ発振器1と集光レンズ
5との間の光伝達系7において、レーザ発振器1とビー
ムベンダ3との間に、焦点距離の長い凸レンズから成る
補助レンズ8を配設している。またこのとき、上記集光
レンズ5により集光されたレーザ光2の集光点9を、被
加工物6の表面6aより下方(内部)となるように設定
している。In the optical transmission system 7 between the laser oscillator 1 and the condensing lens 5, an auxiliary lens 8 consisting of a convex lens with a long focal length is disposed between the laser oscillator 1 and the beam bender 3. It is set up. Further, at this time, the condensing point 9 of the laser beam 2 condensed by the condensing lens 5 is set below (inside) the surface 6a of the workpiece 6.
【0014】ここで、上述したように光伝達系7中に上
記補助レンズ8を介在させた本実施例構成の場合と、補
助レンズを介在させない従来構成の場合とのレーザ切断
性能を比較した実験結果を図2に示す。実験は、被加工
物6として板厚が16mmの軟鋼材を用い、これを切断
加工したときのものである。また、本実施例においては
、補助レンズ8としては焦点距離が10インチのものを
用いて行った。Here, an experiment was conducted to compare the laser cutting performance between the configuration of this embodiment in which the auxiliary lens 8 is interposed in the optical transmission system 7 as described above, and the conventional configuration in which the auxiliary lens is not interposed. The results are shown in Figure 2. In the experiment, a mild steel material with a plate thickness of 16 mm was used as the workpiece 6, and this was cut. Further, in this example, the auxiliary lens 8 used had a focal length of 10 inches.
【0015】この図2においては、被加工物の表面に対
する集光点の位置、すなわちデフォーカス量を縦軸に取
り、切断加工時にドロスの着かない良好な切断が可能な
場合を白抜きの丸で示し、それ以外の良好な切断が得ら
れない場合を黒塗りの丸で示している。In FIG. 2, the position of the focal point relative to the surface of the workpiece, that is, the amount of defocus, is taken as the vertical axis, and the white circle indicates the case where good cutting without dross is possible during cutting. Other cases in which good cutting cannot be obtained are indicated by black circles.
【0016】この図2から明らかなように、従来構成の
場合には、良好な切断が可能な場合のデフォーカス量の
領域がプラス側に集中しており、マイナス側では良好な
切断が得られないものである。これに対し、本実施例構
成の場合には、良好な切断が可能な場合のデフォーカス
量の領域が、プラス側に加えて、マイナス側にもあるこ
とがわかる。従って、本実施例の構成においては、切断
時の設定デフォーカス量をマイナス側、すなわち集光点
9が被加工物6の表面6aより下方となるように設定し
た場合でも良好な切断を行うことができるのである。As is clear from FIG. 2, in the case of the conventional configuration, the region of defocus amount where good cutting is possible is concentrated on the plus side, and good cutting is not obtainable on the minus side. It's something that doesn't exist. On the other hand, in the case of the configuration of this embodiment, it can be seen that the range of the defocus amount where good cutting is possible exists on the negative side as well as the positive side. Therefore, in the configuration of this embodiment, even when the set defocus amount during cutting is set to the negative side, that is, the focal point 9 is set below the surface 6a of the workpiece 6, good cutting can be performed. This is possible.
【0017】一方、ピアシング時における設定デフォー
カス量と、被加工物を貫通するまでに要する時間との関
係を表す代表的なデータを図3に示す。この場合、貫通
に要する時間を縦軸に取り、設定デフォーカス量を横軸
に取って示している。On the other hand, typical data showing the relationship between the set defocus amount during piercing and the time required to penetrate the workpiece is shown in FIG. In this case, the time required for penetration is plotted on the vertical axis, and the set defocus amount is plotted on the horizontal axis.
【0018】この図3において、設定デフォーカス量が
プラス側からマイナス側になるにしたがって、貫通に要
する時間が短くなっているが、ゼロを境にほとんど一定
となっている。すなわち、ピアシングに要する時間を短
くするデフォーカス量は、ゼロからマイナス側であるこ
とがわかる。In FIG. 3, as the set defocus amount goes from the plus side to the minus side, the time required for penetration becomes shorter, but remains almost constant after zero. That is, it can be seen that the defocus amount that shortens the time required for piercing is on the negative side from zero.
【0019】従って、本実施例の構成を採用することに
より、上述したように良好な切断が可能な切断時の設定
デフォーカス量も、ピアシングに要する時間を短くする
デフォーカス量と同じマイナス側に設定することができ
るため、ピアシングと切断とを繰り返して行う切断加工
においてもデフォーカス量を変更する必要がなく、しか
もピアシングに要する時間も短くでき、よって切断加工
を効率良く行うことができるものである。Therefore, by adopting the configuration of this embodiment, the set defocus amount for cutting that allows for good cutting as described above can also be on the negative side, the same as the defocus amount that shortens the time required for piercing. Since it can be set, there is no need to change the defocus amount even when piercing and cutting are repeated, and the time required for piercing can be shortened, so cutting can be performed efficiently. be.
【0020】なお、上記した実施例においては、光伝達
系7中に焦点距離の長い補助レンズ8を1枚介在させた
場合を例示したが、複数枚のレンズを組み合わせて介在
させても良い。[0020] In the above-mentioned embodiment, the case where one auxiliary lens 8 with a long focal length is interposed in the light transmission system 7 is exemplified, but a combination of a plurality of lenses may be interposed.
【0021】[0021]
【発明の効果】以上の記述にて明らかなように、本発明
によれば、レーザ発振器と加工ヘッド内の集光レンズと
の間の光伝達系中に焦点距離の長い補助レンズを介在さ
せることにより、切断時でのデフォーカス量の最適値を
ピアシング時でのデフォーカス量の最適値と同じマイナ
ス側の値に設定して切断加工を行うことが可能となる。
これにより、ピアシング時と切断時とでデフォーカス量
を変更する必要がなくなり、しかもピアシングを短時間
で行うことが可能となるから、切断加工を効率良く行う
ことができるようになる[Effects of the Invention] As is clear from the above description, according to the present invention, an auxiliary lens with a long focal length is interposed in the optical transmission system between the laser oscillator and the condenser lens in the processing head. This makes it possible to perform cutting by setting the optimum value of the defocus amount during cutting to the same negative value as the optimum value of the defocus amount during piercing. This eliminates the need to change the amount of defocus between piercing and cutting, making it possible to perform piercing in a short time, making cutting more efficient.
【図1】本発明の一実施例を示す概略的構成図FIG. 1 is a schematic configuration diagram showing one embodiment of the present invention.
【図2】
切断時におけるデフォーカス量と切断性能との関係を示
す図[Figure 2]
Diagram showing the relationship between defocus amount and cutting performance during cutting
【図3】ピアシング時におけるデフォーカス量と貫通に
要する時間との関係を示す図[Figure 3] Diagram showing the relationship between the amount of defocus during piercing and the time required for piercing
1はレーザ発振器、2はレーザ光、4は加工ヘッド、5
は集光レンズ、6は被加工物、7は光伝達系、8は補助
レンズ、9は集光点を示す。1 is a laser oscillator, 2 is a laser beam, 4 is a processing head, 5
6 is a condensing lens, 6 is a workpiece, 7 is a light transmission system, 8 is an auxiliary lens, and 9 is a condensing point.
Claims (1)
を、光伝達系を介して加工ヘッドに導き、この加工ヘッ
ド内に設けられた集光レンズを介して被加工物に照射す
ることによりその被加工物の切断加工を行うようにした
レーザ加工機において、前記光伝達系中に焦点距離の長
い補助レンズを介在させると共に、前記集光レンズによ
るレーザ光の集光点を被加工物の表面より下方となるよ
うに設定したことを特徴とするレーザ加工機。Claim 1: A laser beam emitted from a laser oscillator is guided to a processing head via an optical transmission system, and is irradiated onto the workpiece through a condensing lens provided in the processing head. In a laser processing machine for cutting a workpiece, an auxiliary lens with a long focal length is interposed in the light transmission system, and the focus point of the laser beam by the condenser lens is set from the surface of the workpiece. A laser processing machine characterized by being set to face downward.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3064131A JPH04300084A (en) | 1991-03-28 | 1991-03-28 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3064131A JPH04300084A (en) | 1991-03-28 | 1991-03-28 | Laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04300084A true JPH04300084A (en) | 1992-10-23 |
Family
ID=13249219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3064131A Pending JPH04300084A (en) | 1991-03-28 | 1991-03-28 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04300084A (en) |
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US8058103B2 (en) | 2003-09-10 | 2011-11-15 | Hamamatsu Photonics K.K. | Semiconductor substrate cutting method |
US8361883B2 (en) * | 2002-03-12 | 2013-01-29 | Hamamatsu Photonics K.K. | Laser processing method |
US8865566B2 (en) | 2002-12-03 | 2014-10-21 | Hamamatsu Photonics K.K. | Method of cutting semiconductor substrate |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
-
1991
- 1991-03-28 JP JP3064131A patent/JPH04300084A/en active Pending
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