JPH04280646A - Tab wiring board - Google Patents

Abstract

PURPOSE:To eliminate an outer bonding failure by a method wherein resin flow preventive means are respectively provided between inner lead opening parts and outer lead opening parts. CONSTITUTION:Holes 9a are respectively provided between inner lead opening parts 1 and outer lead opening parts 7 as resin flow preventive means. As a base material consisting of a material, in which the holes 9a are easily bored, a tape or a tabular material consisting of a polyimide, for example, is used. Accordingly, when a semiconductor chip 2 is sealed with a sealing resin 4, the resin 4 is dammed by its surface tension in the holes 9a, which are used as the resin flow preventive means, and does never flow to the opening parts 7. Thereby, even if the distance between the opening parts 1 and 7 is small and even in the case the viscosity of the resin 4 is low, the flow of the resin 4 is prevented and an outer bonding failure can be eliminated.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is directed to TAB (Tape A).
Regarding automated bonding) wiring boards,
More specifically, the present invention relates to a TAB wiring board that prevents IC sealing resin from flowing into the outer lead portion.

0002

[Prior Art] Conventionally, when a chip of a semiconductor device such as an IC or an LSI is sealed with a sealing resin, FIGS.
As shown in FIG. 2, a chip 2 of a semiconductor device placed in an inner lead opening (device hole) 1 is electrically connected with leads (wiring electrodes) 3, and sealed with a sealing resin 4.

In FIGS. 7 to 9, 5 is a perforation, 6 is a check pad, and 7 is an outer lead opening.

0004

However, since the inner part and the outer part are uniformly connected, the sealing resin penetrates through the leads 3 and reaches the outer lead part.
Resin may adhere to the outer lead portion, resulting in outer bonding failure.

In order to avoid this outer bonding defect, the inner lead opening 1 and the outer lead opening 7 are sealed so that the sealing resin does not exceed the outer lead opening 7.
We had no choice but to adopt methods such as making a sufficiently large distance from the sealing resin or increasing the viscosity of the sealing resin to suppress the flow. These problems have resulted in an increase in product size and difficulty in setting manufacturing conditions.

The present invention aims to solve the above-mentioned problems, and its purpose is to solve the problem even when the distance between the inner lead opening and the outer lead opening is small or when the viscosity of the sealing resin is low. It is an object of the present invention to provide a TAB wiring board in which flow of sealing resin is prevented and outer bonding defects can be eliminated.

[0007]

[Means for Solving the Problems] The TAB wiring board of the present invention is characterized in that a resin flow prevention means is provided between the inner lead opening and the outer lead opening.

[0008]

EXAMPLES Next, the present invention will be explained in more detail with reference to Examples. FIG. 1 is a plan view showing an embodiment of the TAB wiring board of the present invention, and FIG. 2 is a sectional view thereof. TAB in Figure 1
In the wiring board, a hole 9a is provided between the inner lead opening 1 and the outer lead opening 7 as a means for preventing resin flow.
An example is shown in which . In this embodiment, a tape or plate made of polyimide is used as the base material 10, which is made of a material that allows holes 9a to be easily formed.

In the embodiment shown in FIG. 1, when the semiconductor manufacturing chip 2 is sealed with the sealing resin 4, the sealing resin 4 is blocked by the surface tension of the hole 9a, which serves as a resin flow prevention means, and the outer It does not flow to the lead opening 7. Therefore, the distance between the inner lead opening 1 and the outer lead opening 7 can be reduced, and miniaturization becomes possible. In addition, even when the viscosity of the sealing resin 4 is low, it is blocked by the holes 9a as means for preventing resin flow.
There is no need for detailed management and control of the viscosity of the sealing resin.

Next, FIG. 3 is a plan view showing an example in which the resin flow preventing means is a resist 9c with a window 9b formed by printing. Here, by using an epoxy resin as the sealing resin and a silicone resist as the resist, since they have poor mutual wettability, it is possible to more effectively prevent the resin from flowing as if oil were repelled.

Next, FIG. 4 shows an embodiment in which the resin flow preventing means is a dam-shaped resin convex body 9d formed by multiple printing.

Next, FIG. 5 shows an embodiment in which a bent portion 9e is provided on the copper wiring electrode 11 as a means for preventing resin flow, and FIG. 6 shows an embodiment in which a bent portion 9e is provided on the copper wiring electrode 11 as a means for preventing resin flow.
An example in which f is formed is shown.

[0013]

Effects of the Invention As is clear from the above description, according to the TAB wiring board of the present invention, the IC sealing resin is stopped by the resin flow prevention means provided between the inner lead opening and the outer lead opening. It will be done. Therefore, even if the distance between the inner lead opening and the outer lead opening is small, or even if the viscosity of the sealing resin is low, flow of the sealing resin is prevented, and outer bonding defects can be eliminated.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of a TAB wiring board provided with holes as means for preventing resin flow.

FIG. 2 is a cross-sectional view of FIG. 1;

FIG. 3 is a plan view showing an example of a TAB wiring board provided with a resist with windows formed by printing as means for preventing resin flow.

FIG. 4 is a plan view showing an example of a TAB wiring board provided with a dam-shaped resin convex body formed by multiple printing as a resin flow prevention means.

FIG. 5 is a plan view showing an example of a TAB wiring board in which a resin flow prevention means is formed by bending copper wiring electrodes.

FIG. 6 is a plan view showing an example in which a resin flow prevention means is formed by changing the thickness of a copper wiring electrode.

FIG. 7 is a schematic perspective view showing the configuration of a conventional TAB wiring board.

8 is a partially enlarged plan view of the TAB wiring board of FIG. 7; FIG.

FIG. 9 is a partial cross-sectional view of FIG. 7;

[Explanation of symbols]

1 Inner lead opening 2 Semiconductor device chips 3 Lead wiring electrode 4 Sealing resin 5 Perforation 6 Check pad 7 Outer lead opening 9a hole 9b Window 9c Resist 9d Dam-shaped resin convex body 9e Bending part 9f Thickness variation part 10 Base material 11 Lead (wiring electrode)

Claims (6)

[Claims] 1. A TAB wiring board characterized in that a resin flow prevention means is provided between an inner lead opening and an outer lead opening. 2. The TAB wiring board according to claim 1, wherein the resin flow preventing means is a hole bored in the resin tape. 3. The TAB wiring board according to claim 1, wherein the resin flow prevention means is a window resist formed by printing. 4. The T according to claim 1, wherein the resin flow prevention means is a dam-shaped resin convex body formed by multiple printing.
AB wiring board. 5. The TAB wiring board according to claim 1, wherein the resin flow prevention means are arranged and bent copper wiring electrodes. 6. The TAB according to claim 1, wherein the resin flow prevention means is a copper wiring electrode having arranged thickness varying portions.
wiring board.