JPH0427890A - Array sensor module - Google Patents
Array sensor moduleInfo
- Publication number
- JPH0427890A JPH0427890A JP2134446A JP13444690A JPH0427890A JP H0427890 A JPH0427890 A JP H0427890A JP 2134446 A JP2134446 A JP 2134446A JP 13444690 A JP13444690 A JP 13444690A JP H0427890 A JPH0427890 A JP H0427890A
- Authority
- JP
- Japan
- Prior art keywords
- array sensor
- base plate
- sensor module
- vertical conversion
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 14
- 230000006735 deficit Effects 0.000 abstract 1
- 239000011295 pitch Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 230000001066 destructive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Measurement Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、例えば医療用Ｘ線撮像装置や産業用非破壊検
査装置等に利用されるアレイセンサモジュール、特に、
アレイセンサとその信号処理回路との接続構造に関する
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an array sensor module used in, for example, a medical X-ray imaging device or an industrial non-destructive inspection device, and in particular,
The present invention relates to a connection structure between an array sensor and its signal processing circuit.
［従来技術］
半導体二次元アレイセンサを利用した医療用Ｘ線撮像装
置等においては、センサアレイとその信号処理回路用の
ＩＣチップとの実装および接続が必要である。従来、こ
の実装および接続方法は、第３図および第４図に示すよ
うな方法で行われている。すなわち、第３図に示すよう
に、配線基板１２の片面側にアレイセンサチップ１３お
よび信号処理回路用のＩＣチップ１４をフリップチップ
法等により実装し、このような構造のモジュールを、第
４図に示すように、アレイセンサチップ１３の幅分シフ
トして階段上に積み重ねて、全体として大規模の面セン
サユニットを構築している。[Prior Art] In a medical X-ray imaging device or the like using a semiconductor two-dimensional array sensor, it is necessary to mount and connect the sensor array and an IC chip for its signal processing circuit. Conventionally, this mounting and connection method has been carried out as shown in FIGS. 3 and 4. That is, as shown in FIG. 3, an array sensor chip 13 and an IC chip 14 for a signal processing circuit are mounted on one side of a wiring board 12 by a flip-chip method or the like, and a module having such a structure is mounted as shown in FIG. As shown in FIG. 2, the array sensor chips 13 are shifted by the width and stacked on a staircase to construct a large-scale surface sensor unit as a whole.
［発明が解決しようとする課題］
従来のアレイセンサは上記のように構成されており、各
アレイセンサチップ１３、・・・１３にどうしても段差
ができるため、Ｘ線像等の画像に段差に相当する部分に
画像切れが生じたり、また、光源あるいは線源から各セ
ンサアＩノイチップ１３、・・・・・・１３までの距離
が異なり、これにより画像ムラができるという問題があ
る。また、ある単位モジュールを交換する際、その交換
モジュールのアレイセンサチップの端面を、隣接するア
レイチップの端面に正確に位置決めする等の作業を必要
とし、その交換作業が困難であるといった問題もある。[Problems to be Solved by the Invention] Conventional array sensors are configured as described above, and each array sensor chip 13, . . . , 13 inevitably has a step, which corresponds to a step in an image such as an X-ray image. In addition, the distances from the light source or the radiation source to the sensor antenna chips 13, . . . 13 are different, which causes image unevenness. In addition, when replacing a certain unit module, it is necessary to accurately position the end face of the array sensor chip of the replacement module to the end face of the adjacent array chip, which makes the replacement work difficult. .
本発明は、上記のような従来技術の欠点を解消するため
に創案されたものであり、画像切れ、画像ムラを防止す
るとともに、交換作業を容易に行うことができるアレイ
センサモジュールを提供することを目的とする。The present invention was devised in order to eliminate the above-mentioned drawbacks of the conventional technology, and provides an array sensor module that can prevent image cutoff and image unevenness and that can be easily replaced. With the goal.
［課題を解決するための手段］
上記目的を達成するために、本発明におけるアレイセン
サモジュールは、アレイセンサと、このアレイセンサに
接続される垂直変換基板と、断面に接続端子が形成され
た多層プリント基板とを有する。[Means for Solving the Problems] In order to achieve the above object, an array sensor module according to the present invention includes an array sensor, a vertical conversion board connected to the array sensor, and a multilayer structure having a connecting terminal formed in a cross section. It has a printed circuit board.
［作用］
上記のように構成されたアレイセンサモジュールは、多
層プリント基板の断面に接続端子を形成しているので、
垂直変換基板と多層プリント基板との縦型接続が可能と
なり、完全平面型アレイセンサモジュールを形成するこ
とができる。[Function] Since the array sensor module configured as described above has connection terminals formed on the cross section of the multilayer printed circuit board,
Vertical connection between the vertical conversion board and the multilayer printed circuit board becomes possible, and a complete planar array sensor module can be formed.
［実施例］
実施例について図面を参照して説明すると、第１図、第
２図において、１はアレイセンサ、２はメタルバンプ、
３はピッチ調整用基板、４はメタルバンプ、５はスルー
ホール、６は垂直変換基板、７は信号処理回路基板、８
はガラスエポキシ多層基板、９は銅箔、１０．１１はメ
タルパッドである。[Example] An example will be described with reference to the drawings. In FIGS. 1 and 2, 1 is an array sensor, 2 is a metal bump,
3 is a pitch adjustment board, 4 is a metal bump, 5 is a through hole, 6 is a vertical conversion board, 7 is a signal processing circuit board, 8
9 is a glass epoxy multilayer board, 9 is a copper foil, and 10.11 is a metal pad.
アレイセンサ１と信号処理回路７とは、ピッチ調整用基
板３と垂直変換基板６を介してメタルバンプ２．４で接
続されている。ピッチ調整用基板３は垂直変換基板６の
積層状態の都合により、センサ１の接続ピッチと合致さ
せられない場合に用いるものであり、このピッチ調整用
基板３は両面配線が施されており、スルーホール５によ
って電気的に接続されている。なお、高密度配線が必要
である場合は、薄いセラミック基板を使用し、タングス
テン等でスルーホール内を埋めることにより、対応する
ことができる。The array sensor 1 and the signal processing circuit 7 are connected by metal bumps 2.4 via a pitch adjustment board 3 and a vertical conversion board 6. The pitch adjustment board 3 is used when the connection pitch of the sensor 1 cannot be matched due to the laminated state of the vertical conversion board 6. They are electrically connected through a hole 5. Note that if high-density wiring is required, this can be achieved by using a thin ceramic substrate and filling the through holes with tungsten or the like.
次に、垂直変換基板６と信号処理回路基板７の製造方法
及びその接続方法を第２図により説明する。Next, a method of manufacturing the vertical conversion board 6 and the signal processing circuit board 7 and a method of connecting them will be explained with reference to FIG.
垂直変換基板６はエポキシ樹脂とガラスクロスを主成分
とするベース８に薄膜銅箔９を張り、積層したガラスエ
ポキシ多層基板の一部分に積層方向に平行に溝を掘り、
研磨処理後、メツキ処理によりメタルパッド１０を形成
する。また、信号処理回路基板７にも垂直変換基板６の
メタルパッド１０に対応したメタルパッド１１を設けて
おく。接続は、信号処理回路基板７に垂直変換基板６を
はめ込み、電気的な接続を得る。その際、接続の確率、
信頼性を向上させるために、垂直変換基板６の溝にテー
パーを付けておいたり、メタルパッド１０．１１のどち
らかをハンダ等の柔らかい金属でコーティングしてもよ
い。さらには、熱処理を加え、ハンダ付けすれば、信号
処理回路基板７に垂直変換基板６がしっかり固定され、
組立工程のハンドリング性も向上する。The vertical conversion board 6 is made by applying a thin copper foil 9 to a base 8 whose main components are epoxy resin and glass cloth, and digging a groove parallel to the lamination direction in a part of the laminated glass epoxy multilayer board.
After the polishing process, the metal pad 10 is formed by plating process. Further, the signal processing circuit board 7 is also provided with metal pads 11 corresponding to the metal pads 10 of the vertical conversion board 6. For connection, the vertical conversion board 6 is fitted into the signal processing circuit board 7 to obtain an electrical connection. In that case, the probability of connection,
In order to improve reliability, the groove of the vertical conversion board 6 may be tapered, or either of the metal pads 10, 11 may be coated with a soft metal such as solder. Furthermore, by applying heat treatment and soldering, the vertical conversion board 6 can be firmly fixed to the signal processing circuit board 7.
It also improves handling in the assembly process.
なお、上記実施例では、ピッチ調整用基板を介してアレ
イセンサと信号処理回路とを接続したが、アレイセンサ
と垂直変換基板の接続ピッチとを合致させられる場合に
は特に必要とはしない。In the above embodiment, the array sensor and the signal processing circuit are connected via the pitch adjustment board, but this is not particularly necessary if the connection pitches of the array sensor and the vertical conversion board can be made to match.
［発明の効果］
本発明は、以上のように構成され、完全平面型アレイセ
ンサを形成することができ、階段状に実装されたアレイ
センサモジュールが引き起こす種々の影響を防止するこ
とができる。また、実装密度を保持したまま信号処理回
路を形成することができ、極めてコンパクトなアレイセ
ンサユニットを提供することができる。さらに、本発明
のユニットを連続してマザーボードに接続することによ
り、装置全体としての有感面積を容易に増加することが
できる。[Effects of the Invention] The present invention, configured as described above, can form a completely flat array sensor, and can prevent various effects caused by array sensor modules mounted in a stepped manner. Further, the signal processing circuit can be formed while maintaining the packaging density, and an extremely compact array sensor unit can be provided. Furthermore, by successively connecting the units of the present invention to the motherboard, the sensitive area of the entire device can be easily increased.
したがって、例えば、医療用Ｘ線撮像装置あるいは産業
用非破壊検査装置等のセンサユニットに本発明を適用す
ると、画像ムラ等のない鮮明な画像を得ることが可能に
なり、また、アレイセンサの単位モジュールの交換も容
易に行うことができる。Therefore, for example, when the present invention is applied to a sensor unit of a medical X-ray imaging device or an industrial non-destructive inspection device, it becomes possible to obtain a clear image without image unevenness, etc. Modules can also be easily replaced.
第１図は本発明にかかるアレイセンサモジュールの接続
構造、第２図は第１図の接続構造の接続部の拡大図、第
３図は従来のアレイセンサモジュールの実装構造を示す
図、第４図は従来の大規模の面センサユニットの構造例
を示す図である。
１・・・・・・アレイセンサ、２・・・・・・メタルバ
ンプ、３・・・−・・ピッチ調整用基板、４・・・・・
・メタルバンプ、５・・・・・・スルーホール、６・・
・・・・垂直変換基板、７・・・・・・信号処理回路基
板、８・・・・・・ガラスエポキシ多層基板、９・・・
−・・銅箔、１０．１１・・・・・・メタルパッド
第
園
第２図FIG. 1 is a connection structure of an array sensor module according to the present invention, FIG. 2 is an enlarged view of a connection part of the connection structure of FIG. 1, FIG. 3 is a diagram showing a conventional mounting structure of an array sensor module, and FIG. The figure is a diagram showing an example of the structure of a conventional large-scale surface sensor unit. 1...Array sensor, 2...Metal bump, 3...Pitch adjustment board, 4...
・Metal bump, 5...Through hole, 6...
... Vertical conversion board, 7 ... Signal processing circuit board, 8 ... Glass epoxy multilayer board, 9 ...
-...Copper foil, 10.11...Metal pad, Figure 2
Claims (1)
垂直変換基板と、断面に接続端子が形成された多層プリ
ント基板とからなり、上記垂直変換基板と上記多層プリ
ント基板とが縦型接続されていることを特徴とするアレ
イセンサモジュール。(1) Consisting of an array sensor, a vertical conversion board connected to the array sensor, and a multilayer printed circuit board with connection terminals formed on its cross section, the vertical conversion board and the multilayer printed board are vertically connected. An array sensor module characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2134446A JP2946639B2 (en) | 1990-05-24 | 1990-05-24 | Array sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2134446A JP2946639B2 (en) | 1990-05-24 | 1990-05-24 | Array sensor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0427890A true JPH0427890A (en) | 1992-01-30 |
| JP2946639B2 JP2946639B2 (en) | 1999-09-06 |
Family
ID=15128545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2134446A Expired - Fee Related JP2946639B2 (en) | 1990-05-24 | 1990-05-24 | Array sensor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2946639B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001318155A (en) * | 2000-02-28 | 2001-11-16 | Toshiba Corp | Radiation detector and x-ray ct device |
| JP2011191245A (en) * | 2010-03-16 | 2011-09-29 | Toshiba Corp | Radioactive ray detecting apparatus, method of manufacturing the same, and imaging system |
-
1990
- 1990-05-24 JP JP2134446A patent/JP2946639B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001318155A (en) * | 2000-02-28 | 2001-11-16 | Toshiba Corp | Radiation detector and x-ray ct device |
| JP2011191245A (en) * | 2010-03-16 | 2011-09-29 | Toshiba Corp | Radioactive ray detecting apparatus, method of manufacturing the same, and imaging system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2946639B2 (en) | 1999-09-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |