JPH0425243U - - Google Patents
Info
- Publication number
- JPH0425243U JPH0425243U JP6777790U JP6777790U JPH0425243U JP H0425243 U JPH0425243 U JP H0425243U JP 6777790 U JP6777790 U JP 6777790U JP 6777790 U JP6777790 U JP 6777790U JP H0425243 U JPH0425243 U JP H0425243U
- Authority
- JP
- Japan
- Prior art keywords
- blade
- support table
- direction moving
- fixed
- moving table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000003776 cleavage reaction Methods 0.000 claims description 2
- 230000007017 scission Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Description
第１図はこの考案の一実施例の半導体レーザの
劈開装置の要部平面図である。第２図は第１図刃
操作部の要部側面図である。第３図は第２図刃操
作部に固定された刃の動作を示す概念図である。
第４図は半導体レーザのウエーハおよびバーの斜
視図である。第５図は従来の人手による劈開の概
念図である。
１４……支持台、１５……Ｘ方向移動台、１６
……Ｙ方向移動台、１７……回転機能を有するウ
エーハ保持部、１８……刃操作部。
FIG. 1 is a plan view of a main part of a semiconductor laser cleaving apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the main part of the blade operating section shown in FIG. 1. FIG. 3 is a conceptual diagram showing the operation of the blade fixed to the blade operating section shown in FIG. 2. FIG.
FIG. 4 is a perspective view of a wafer and bar of a semiconductor laser. FIG. 5 is a conceptual diagram of conventional manual cleavage. 14... Support stand, 15... X direction moving stand, 16
. . . Y-direction moving table, 17 . . . Wafer holder having a rotation function, 18 . . . Blade operation unit.
Claims (1)
台面上に直交する２方向に移動可能なＸ方向移動
台、Ｙ方向移動台および回転機能を有するウエー
ハ保持部と鋭利な刃を特定方向に平行に固定する
とともに、固定した刃を上下方向、水平方向各々
独立して移動できる刃操作部とを具備する半導体
レーザの劈開装置。 A support table, an X-direction moving table and a Y-direction moving table provided on the support table and movable in two directions orthogonal to the surface of the support table, a wafer holder having a rotating function, and a sharp blade in a specific direction. A semiconductor laser cleavage device is provided with a blade operation unit that is fixed in parallel and can independently move the fixed blade in the vertical and horizontal directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6777790U JPH0425243U (en) | 1990-06-25 | 1990-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6777790U JPH0425243U (en) | 1990-06-25 | 1990-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425243U true JPH0425243U (en) | 1992-02-28 |
Family
ID=31601656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6777790U Pending JPH0425243U (en) | 1990-06-25 | 1990-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425243U (en) |
-
1990
- 1990-06-25 JP JP6777790U patent/JPH0425243U/ja active Pending