JPH0423215A - Thin film magnetic head - Google Patents
Thin film magnetic headInfo
- Publication number
- JPH0423215A JPH0423215A JP12758890A JP12758890A JPH0423215A JP H0423215 A JPH0423215 A JP H0423215A JP 12758890 A JP12758890 A JP 12758890A JP 12758890 A JP12758890 A JP 12758890A JP H0423215 A JPH0423215 A JP H0423215A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- plane
- magnetic head
- conductor
- terminal part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 57
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 239000010408 film Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 15
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000007667 floating Methods 0.000 abstract description 10
- 230000001681 protective effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 235000015178 Asplenium bulbiferum subsp bulbiferum Nutrition 0.000 description 1
- 244000178908 Asplenium bulbiferum subsp bulbiferum Species 0.000 description 1
- 206010041235 Snoring Diseases 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 210000004899 c-terminal region Anatomy 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、磁気ディスク装置に用いる薄膜磁気ヘッドに
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film magnetic head used in a magnetic disk device.
本発明は、薄膜磁気ヘッドにおいて、薄膜素子を形成す
る基板に凹部を設け、二の凹部内に埋込んだ導体を端子
部とし、端子部の薄膜形成面に垂直で且つ浮上面に対し
ても垂直な面を介して薄膜素子用導体膜と外部引き出し
リード線との接続を行うことによって、薄膜磁気ヘッド
の小型、軽量化を可能にしたものである。The present invention provides a thin film magnetic head in which a recess is provided in a substrate on which a thin film element is formed, a conductor embedded in the second recess is used as a terminal part, and the conductor is perpendicular to the thin film forming surface of the terminal part and also relative to the air bearing surface. By connecting the thin film element conductor film and the external lead wire through a vertical plane, it is possible to make the thin film magnetic head smaller and lighter.
第３図及び第４図は通常のハードディスク用の薄膜磁気
ヘッドの断面図及び正面図を示す。この薄膜磁気ヘッド
（１）は２素子タイプであり、浮上スライダー（２）の
端面（２ａ）に２つの薄膜素子（所謂薄膜ヘッド素子＞
（３）Ｃ（３Ａ）及び（３Ｂ）］ が形成されて成る
。即ち、浮上スライダー（２）の端面（２ａ）上に下層
磁性膜（４）、非磁性のギャップ材膜（５）、絶縁膜（
６）を介したコイル導体膜（７）を順次積層するように
形成し、下層磁性膜（４）の後部接続部が臨む開口を形
成した後、開口を通して下層磁性膜（４）と接続し且つ
ギャップ材膜（５）を挟んで磁気ギャップｇが形成され
るように上層磁性膜（８）を形成し、さらに、コイル導
体膜（７）の外部引き出しリード線との接続に供する端
子部（７ａ）及び（７ｂ）と保護膜（９）を形成して構
成される。3 and 4 show a sectional view and a front view of a conventional thin film magnetic head for a hard disk. This thin film magnetic head (1) is a two-element type, and two thin film elements (so-called thin film head elements) are attached to the end surface (2a) of the flying slider (2).
(3)C(3A) and (3B)] are formed. That is, on the end surface (2a) of the floating slider (2), a lower magnetic film (4), a non-magnetic gap material film (5), and an insulating film (
The coil conductor films (7) are sequentially laminated through the coil conductor films (7) via the lower magnetic film (4), and after forming an opening through which the rear connecting portion of the lower magnetic film (4) faces, the coil conductor films (7) are connected to the lower magnetic film (4) through the opening. An upper magnetic film (8) is formed so that a magnetic gap g is formed across the gap material film (5), and a terminal portion (7a) is formed to connect the coil conductor film (7) with an external lead wire. ) and (7b) and a protective film (9) is formed.
通常、薄膜素子（３Ａ） （３Ｂ）とコイル導体膜（７
）の端子部（７ａ＞、 （７ｂ） は浮上スライダー
（２）の同一端面（２ａ）上に形成される（例えば特開
昭５７−１０５８１９号公報参照）
〔発明が解決しようとする課題〕
上述の薄膜磁気ヘッド（１）において、その端子部（７
ａ） （７ｂ）は薄膜素子（３）が形成される端面（２
ａ）上で大きな面積を占めている。薄膜磁気ヘッド（１
）に対し外部振動からの影響を少なくするために、この
薄膜磁気ヘッド（１）の更なる小型、軽量化を図る場合
、端子部（７ａ） （７ｂ）の面積を小さくし浮上スラ
イダー（２）を小型化することが考えられるが、端子部
（７ａ） （７ｂ）の面積縮小にも限度があり、薄膜磁
気ヘッド〔１）の小型、軽量化には限界があった。Usually, thin film elements (3A) (3B) and coil conductor film (7
) are formed on the same end surface (2a) of the floating slider (2) (see, for example, Japanese Patent Laid-Open No. 57-105819) [Problems to be Solved by the Invention] As mentioned above. In the thin film magnetic head (1), the terminal portion (7
a) (7b) is the end face (2) on which the thin film element (3) is formed.
a) It occupies a large area on the top. Thin film magnetic head (1
) To further reduce the size and weight of this thin film magnetic head (1), in order to reduce the influence of external vibration on However, there is a limit to the reduction in the area of the terminal portions (7a) (7b), and there is a limit to the reduction in size and weight of the thin film magnetic head [1].
一方、端子部（７ａ） （７ｂ）の形成に際しては、ま
ず選択的なメツキを用いて端子部（７ａ） （７ｂ）を
形成し、しかる後、保護膜（９）として例えばＭ２Ｏ３
をスパッタリング等を用いて形成している。保護膜（９
）は端子部の上部にも付着されるので、ここに付着され
たＭ ２０３膜の除去工程（通常はラップ工程）が必要
となる。このため、端子部（７ａ） （７ｂ）はメツキ
による導体（通常は口ｕ） を上層磁性膜（８）まで
の厚さよりも厚く形成する必要がある。このように端子
部（７ａ） （７ｂ）の形成には無視し得ない工数がか
かり、製造が煩雑となる欠点があった。On the other hand, when forming the terminal parts (7a) (7b), the terminal parts (7a) (7b) are first formed using selective plating, and then the protective film (9) is formed using, for example, M2O3.
is formed using sputtering or the like. Protective film (9
) is also deposited on the top of the terminal portion, so a removal process (usually a lapping process) of the M203 film deposited there is required. Therefore, in the terminal portions (7a) (7b), it is necessary to form the plated conductor (usually the opening U) thicker than the thickness up to the upper magnetic film (8). As described above, the formation of the terminal portions (7a) and (7b) requires a considerable amount of man-hours and has the disadvantage that manufacturing is complicated.
本発明は、上述の点に濫み、小型、軽量化を可能にし、
併せて製造工程の短縮化をも可能にした薄膜磁気ヘッド
を提供するものである。The present invention addresses the above-mentioned points, allows for reduction in size and weight, and
At the same time, the present invention provides a thin film magnetic head that also enables shortening of the manufacturing process.
本発明に係かる薄膜磁気ヘッドは、薄膜素子を形成する
基板（１３）に凹部（１４）を設け、この凹部（１４）
内に埋込んだ導体（１５）を端子部（１６）とし、端子
部（１６）の薄膜素子形成面（１３＾）に垂直で且つ浮
上面（１３Ｃ） に対しても垂直な面を介して薄膜素
子用導体膜（７）と外部引！砿しリード線（１８）との
接続を行うように構成する。In the thin film magnetic head according to the present invention, a recess (14) is provided in a substrate (13) on which a thin film element is formed, and the recess (14)
The conductor (15) embedded therein is used as a terminal part (16), and the terminal part (16) is connected through a plane perpendicular to the thin film element forming surface (13^) and also perpendicular to the air bearing surface (13C). Conductor film for thin film devices (7) and external pull! It is configured to connect with a drilled lead wire (18).
上述の構成においては、面積を占める端子部（１６）を
凹部（１４）内に埋込んだ導体（１５）で形成し、その
端子部（１６）の薄膜素子形成面（１３Ａ） に垂直
で且つ浮上面（１３Ｃ） に対しても垂直な面（即ち
薄膜素子形成面（１３＾）と隣接する側面（１３Ｂ）
に臨む端子部の面）で外部引！飄しリード線（１８）
と接続するようになすので、薄膜素子形成面の面積を小
さくして基板（所謂浮上スライダー） （１３）の小型
化を図ることができ、薄膜磁気ヘッド（１２）の小型、
軽量化が図れる。In the above configuration, the terminal portion (16) occupying an area is formed by the conductor (15) embedded in the recess (14), and the conductor (15) is perpendicular to the thin film element forming surface (13A) of the terminal portion (16). A surface (13B) that is also perpendicular to the air bearing surface (13C) (i.e., a side surface (13B) adjacent to the thin film element forming surface (13^))
(the side of the terminal section facing the terminal) is externally pulled! Drifting lead wire (18)
Since the area of the thin film element forming surface is reduced, the substrate (so-called flying slider) (13) can be made smaller, and the thin film magnetic head (12) can be made smaller.
Lighter weight can be achieved.
また、基板の凹部（１４）に導体（１５）を埋込み、基
板をスライダー単位に分断した際に自動的に端子部（１
６）が形成されるので、この種の薄膜磁気ヘッドの製造
工程も短縮される。In addition, a conductor (15) is embedded in the recess (14) of the board, and when the board is divided into slider units, the terminal part (1
6), the manufacturing process for this type of thin film magnetic head is also shortened.
以下、第１図を用いて本発明による薄膜磁気ヘッドの実
施例を説明する。Embodiments of the thin film magnetic head according to the present invention will be described below with reference to FIG.
本例に係る薄膜磁気ヘッド（１２）においては、浮上ス
ライダー（１３）の前端面（１３Ａ） に形成し゛た
凹部（１４）内に導体（１５）を埋込み、その前端面（
１３＾）と隣接する側面（即ち端面（１３＾）に垂直で
且つ浮上面（１３Ｃ） に対しても垂直な面”） （
１３Ｂ） に臨む導体面をコイル導体膜（７）ノ端子
部（１６） ［（１６ａ） （１６ｂ） ３として形成
する。浮上スライダー（１３）の前端面（１３Ａ）には
浮上面（１３Ｃ） に磁気ギャップｇが臨むように互
に所要の間隔ｄを置いて２つの薄膜素子（３） Ｃ＜
３＾）（３Ｂ）１ を形成する。薄膜素子（３）は前述
の第３図と同様に、下層磁性膜（４）、非磁性のギャッ
プ材膜（５）、絶縁膜（６）を介したコイル導体膜（７
）及び上層磁性膜（８）から成り、コイル導体膜（７）
の夫々の端部が端子部（１６ａ）及び（１６ｂ） の
端面（１３Ａ） 上に臨む面に電気的に接続されるよ
うになされている。さらに薄膜素子（３）を覆って例え
ばＭ、口。等による保護膜（１７）を被着形成する。そ
して、薄膜素子（３）が形成された先端面（１３＾）に
隣接する側面（１３Ｂ＞ に臨む端子部（１６ａ）
（１６ｂ）において外部引き出しリード線（１８） Ｉ
（１８ａ） （１８ｂ）−＝を接続して構成する。In the thin film magnetic head (12) according to this example, a conductor (15) is embedded in a recess (14) formed in the front end surface (13A) of the flying slider (13).
13^) and the adjacent side surface (that is, the surface perpendicular to the end surface (13^) and also perpendicular to the air bearing surface (13C)") (
13B) The conductor surface facing the coil conductor film (7) is formed as a terminal portion (16) [(16a) (16b) 3. On the front end surface (13A) of the floating slider (13), two thin film elements (3) C<
3^) (3B) 1 is formed. The thin film element (3), as shown in FIG.
) and an upper magnetic film (8), and a coil conductor film (7).
The respective ends of the terminal portions (16a) and (16b) are electrically connected to the surface facing the end surface (13A) of the terminal portions (16a) and (16b). Furthermore, covering the thin film element (3), for example, M, a mouth. A protective film (17) is formed using a method such as the following. A terminal portion (16a) faces the side surface (13B>) adjacent to the tip surface (13^) on which the thin film element (3) is formed.
(16b) External lead wire (18) I
(18a) (18b) -= is configured by connecting them.
第２図は上述の薄膜磁気ヘット責１２）の製作例を示す
。浮上スライダーとなる所定の基板として、例えば結晶
化ガラス基板を用いる場合には、第２図Ａ１ 及びＡ２
に示すように結晶化させる前に感光性をもつ基板材料
例えばコーニング社製のフォトセラム（商品名）を用い
、この基板（２１）の主面（２１ａ） に対して所定
パターンのマスクを介して光照射した後、湿式エツチン
グにより、主面（２１ａ）の爾後端子部となる箇所に端
子部の大きさに対応する凹部（深さｔ以上） （１５）
を形成する。凹部（１４）を形成した後、基板（２１）
の結晶化を行う。次に、第２図３１ 及びＢ２ に示す
ようにスクリーン印刷等を用いて、この凹部（１４）内
に導電ペーストを充填する。この導電ペーストは後工程
で変成しないように、この充填後焼結して導体（１５）
とする。FIG. 2 shows an example of manufacturing the above-mentioned thin film magnetic head 12). When using, for example, a crystallized glass substrate as the predetermined substrate that becomes the floating slider, Fig. 2 A1 and A2
As shown in the figure, before crystallization, a photosensitive substrate material such as Photoceram (trade name) manufactured by Corning is used, and the main surface (21a) of this substrate (21) is coated with a mask of a predetermined pattern. After irradiation with light, wet etching is performed to form a recess (depth t or more) corresponding to the size of the terminal portion in the portion of the main surface (21a) that will become the terminal portion (15).
form. After forming the recess (14), the substrate (21)
Perform crystallization. Next, as shown in FIGS. 31 and B2, the recesses (14) are filled with conductive paste using screen printing or the like. After filling, this conductive paste is sintered to form a conductor (15) so that it does not change in the subsequent process.
shall be.
そして、ラップ処理して主面（２１ａ） を平坦にす
ると共に、導体（１５）の深さをｔとする。本例では複
数の薄膜磁気ヘッドを形成するために、複数の薄膜素子
に対応して複数の凹部（１４）を−柄形成している。次
いで、第２図０１ に示すように通常のプロセスを用い
て各対となる薄膜素子（３Ａ） （３Ｂ）を形成する。Then, the main surface (21a) is made flat by lapping, and the depth of the conductor (15) is set to t. In this example, in order to form a plurality of thin film magnetic heads, a plurality of recesses (14) are formed in a pattern corresponding to a plurality of thin film elements. Next, as shown in FIG. 201, each pair of thin film elements (3A) (3B) is formed using a normal process.
このとき、予め形成した端子部となる導体（１５）の主
面（２１ａ） に臨む面にコイル導体膜（７）の端部
が電気的に接続し、所定の動作に阻害とならない位置に
薄膜素子（３Ａ） （３Ｂ）を形成する。そして保護膜
（１７）を形成した後、基板（２１）を鎖線位置（２２
）より各スライダー単位に分断する。これによってこの
分断で自動的にスライダーの側面に端子部（１６ａ）
（１６ｂ）が形成された第１図の薄膜磁気ヘッド（１２
）を得る。At this time, the end of the coil conductor film (7) is electrically connected to the surface facing the main surface (21a) of the conductor (15) which has been formed in advance to serve as the terminal part, and the thin film is placed at a position that does not interfere with the predetermined operation. Elements (3A) (3B) are formed. After forming the protective film (17), the substrate (21) is placed at the chain line position (22).
) to separate each slider. By this, the terminal part (16a) is automatically attached to the side of the slider by this division.
(16b) is formed on the thin film magnetic head (12) of FIG.
).
なお、スライダーとなる基板としてチタン酸カルシウム
等を用いる場合にはレジストマスクを介して例えばパウ
ダービームエツチング（砥粒のジェット流を利用したエ
ツチング）により凹部（１４）を形成するようになす。If calcium titanate or the like is used as the substrate for the slider, the recesses (14) are formed by, for example, powder beam etching (etching using a jet stream of abrasive grains) through a resist mask.
それ以後の工程は上側と同じである。The subsequent steps are the same as above.
上述の構成によれば、凹部（１４）に埋込んだ導体（１
５）を用いて浮上スライダー（１３）の側面（１３Ｂ）
に端子部（１６ａ） （１６ｂ）を形成することに
より、薄膜素子（３Ａ）及び（３Ｂ）間の間隔ｄを狭め
ることができ、その分スライダーの端面（１３＾）の面
積を小さくできるのでスライダー（１３）自身を小型化
できる。この結果、薄膜磁気ヘッド（１２）の更なる小
型、軽量化を図ることができる。従って浮上スライダー
（１３）に取付けられるジンバルの張力を下げることが
できる等、軽量化されることによって外部振動の影響を
少なくすることができる。また、端子部（１６ａ） （
１６ｂ）に従来のようなメツキではなく、凹部（１４）
に埋込んだ導体（１５）を用いることにより、保護膜（
１７）は必要な厚さで済み被着時間の短縮が図れる。さ
らに端子部（１６ａ＞ （１６ｂ）の形成は凹部（１４
）内に導体（１５）を埋込み、スライダー単位に分断し
たときに導体（１５）の分断面によって端子部（１６ａ
）（１６ｂ） が自動的に形成される。従って従来に
比して製造工程が短縮され製造コストの低減をスること
ができる。また、端子部（１６ａ） （１６ｂ）が薄膜
素子形成面に形成されることによる薄膜磁気ヘッドの小
型化及び１枚の基板（２１）からの取り数の向上でさら
に製造コストの低減が図れる。According to the above configuration, the conductor (1) embedded in the recess (14)
5) using the side surface (13B) of the floating slider (13)
By forming the terminal portions (16a) and (16b) in the slider, the distance d between the thin film elements (3A) and (3B) can be narrowed, and the area of the end face (13^) of the slider can be reduced accordingly. (13) It can miniaturize itself. As a result, it is possible to further reduce the size and weight of the thin film magnetic head (12). Therefore, the tension of the gimbal attached to the floating slider (13) can be reduced, and the influence of external vibrations can be reduced by reducing the weight. In addition, the terminal part (16a) (
16b) is not plated like the conventional one, but has a recessed part (14)
By using the conductor (15) embedded in the protective film (
17) requires only the necessary thickness, and the deposition time can be shortened. Furthermore, the terminal portion (16a>(16b)) is formed in the recessed portion (14).
), and when the conductor (15) is divided into slider units, the terminal portion (16a) is separated by the cut surface of the conductor (15)
)(16b) is automatically formed. Therefore, compared to the conventional method, the manufacturing process can be shortened and manufacturing costs can be reduced. Further, since the terminal portions (16a) and (16b) are formed on the thin film element formation surface, the thin film magnetic head can be made smaller and the number of parts that can be removed from one substrate (21) can be increased, thereby further reducing manufacturing costs.
本発明による薄膜磁気ヘッドによれば、小型、軽量化を
促進することができ、例えば外部振動の影響をより少な
く抑えることができる。また、製造工程の短縮化を図る
ことができ、同時に製造コストを低減することができる
。According to the thin film magnetic head according to the present invention, it is possible to promote reduction in size and weight, and for example, it is possible to further suppress the influence of external vibration. Furthermore, the manufacturing process can be shortened, and at the same time, manufacturing costs can be reduced.
第１図は本発明の薄膜磁気ヘッドの一例を示す斜視図、
第２図はその製造工程図、第３図及び第４図は従来の薄
膜磁気ヘッドの断面図及びその正面図である。
（１３）は浮上スライダー、（３Ａ） （３Ｂ）は薄膜
素子、（４）は下層磁性膜、（７）はコイル導体膜、（
８）は上層磁性膜、（１４）ハ凹部、り１５）は導体、
（１６ａ） （１６ｂ） ハ端子部、（１８ａ） （１
８ｂ）は外部引き出しリード線である。
代
理
人
松
隈
秀
盛
χ
、３Ａ、３Ｂ・・・ＪＮ４葉テ
ア ・ ・ コイル３ｇ＃ＦＩＲ
１２・ ・ ・Ｓ穎ａ気へ・ソト
１３ ・ ・；雲上スライタ
１４・・・ｃ！Ｊ部
１５・・・導体
Ｉ６α、ｔｓｂ −鍋予郵
Ｉ７ ・ ・ ・ イが、′ＨＲ員
Ｊｌｌａ、１８ｂ ・ タト郵ダ１５出しり一ト
者裳木実腫９１ ／）鼾′＃ｌ腐
第１図
・ 午ヤツ７−為Ｈ湊
？・
・イ呆ｙ１１′Ｊ
第
図
１１か
従来佳ソの１面図FIG. 1 is a perspective view showing an example of the thin film magnetic head of the present invention;
FIG. 2 is a manufacturing process diagram, and FIGS. 3 and 4 are a sectional view and a front view of a conventional thin film magnetic head. (13) is a floating slider, (3A) (3B) is a thin film element, (4) is a lower magnetic film, (7) is a coil conductor film, (
8) is the upper magnetic film, (14) is the concave portion, and 15) is the conductor.
(16a) (16b) C terminal part, (18a) (1
8b) is an external lead wire. Agent Hidemori Matsukuma χ, 3A, 3B...JN4 Leaf Thea ・ ・ Coil 3g#FIR 12 ・ ・ ・S Ea Kihe・Soto 13 ・ ・; Kumojo Suraita 14...c! J part 15...Conductor I6α, tsb - Pot mail I7 ・ ・ ・ I, 'HR member Jlla, 18b ・ Tato mailer 15 output person Moki Mimuma 91 /) Snore'#l rotten Figure 1: Noon guy 7- Tameh Minato?・ ・I'm sorry y11'J Figure 11 is a front view of the conventional model.
Claims (1)
んだ導体を端子部とし、 上記端子部の薄膜素子形成面に垂直で且つ浮上面に対し
ても垂直な面を介して薄膜素子用導体膜と外部引き出し
リード線との接続を行うことを特徴とする薄膜磁気ヘッ
ド。[Claims] A recess is provided in the substrate on which the thin film element is formed, a conductor embedded in the recess is used as a terminal part, and the terminal part is perpendicular to the thin film element forming surface and also perpendicular to the air bearing surface. A thin film magnetic head characterized in that a conductive film for a thin film element and an external lead wire are connected through a surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12758890A JPH0423215A (en) | 1990-05-17 | 1990-05-17 | Thin film magnetic head |
| US08/034,597 US5293288A (en) | 1990-05-17 | 1993-03-22 | Dual thin-film magnetic head with side surface terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12758890A JPH0423215A (en) | 1990-05-17 | 1990-05-17 | Thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423215A true JPH0423215A (en) | 1992-01-27 |
Family
ID=14963789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12758890A Pending JPH0423215A (en) | 1990-05-17 | 1990-05-17 | Thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423215A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0757419A (en) * | 1993-08-20 | 1995-03-03 | Nec Corp | Floating head slider and its production |
| US5920978A (en) * | 1995-03-01 | 1999-07-13 | Fujitsu Limited | Method of making a thin film magnetic slider |
| US6088908A (en) * | 1997-09-19 | 2000-07-18 | Fujitsu Limited | Method of making a head slider |
| US8547665B2 (en) * | 2008-01-03 | 2013-10-01 | International Business Machines Corporation | Magnetic head having a material formed in one or more recesses extending into the media support surface of at least one of the substrate and the closure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5798120A (en) * | 1980-12-10 | 1982-06-18 | Comput Basic Mach Technol Res Assoc | Thin film magnetic head |
-
1990
- 1990-05-17 JP JP12758890A patent/JPH0423215A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5798120A (en) * | 1980-12-10 | 1982-06-18 | Comput Basic Mach Technol Res Assoc | Thin film magnetic head |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0757419A (en) * | 1993-08-20 | 1995-03-03 | Nec Corp | Floating head slider and its production |
| US5920978A (en) * | 1995-03-01 | 1999-07-13 | Fujitsu Limited | Method of making a thin film magnetic slider |
| US6088908A (en) * | 1997-09-19 | 2000-07-18 | Fujitsu Limited | Method of making a head slider |
| US8547665B2 (en) * | 2008-01-03 | 2013-10-01 | International Business Machines Corporation | Magnetic head having a material formed in one or more recesses extending into the media support surface of at least one of the substrate and the closure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH09102106A (en) | Production of thin-film magnetic head | |
| JPH0423215A (en) | Thin film magnetic head | |
| JPS60157711A (en) | Thin film magnetic head | |
| JP2635670B2 (en) | Thin film magnetic head | |
| US6038109A (en) | Magnetic head and method of manufacturing the same | |
| JPH08287407A (en) | Composite type magnetic head and its production | |
| JP2602021Y2 (en) | Support device for thin film magnetic head | |
| JP2664409B2 (en) | Manufacturing method of hybrid integrated circuit | |
| JPH05182140A (en) | Thin-film magnetic head | |
| JPH05314448A (en) | Bonding pad and forming method of bonding pad section | |
| JP2742298B2 (en) | Thin film magnetic head | |
| JPS63187412A (en) | Manufacturing method of thin film magnetic head | |
| JPH11149622A (en) | Thin film magnetic head and manufacturing method thereof | |
| JPH0676243A (en) | Thin film magnetic head | |
| JPH0395715A (en) | Thin film magnetic head and its manufacturing method | |
| JPH06103527A (en) | Thin film magnetic head | |
| JPH0973609A (en) | Thin-film magnetic head and its production | |
| JPH0727619B2 (en) | Thin film magnetic head | |
| JPH03155067A (en) | soldering terminals | |
| JPH05114659A (en) | Wiring structure | |
| JPH06295416A (en) | Thin-film magnetic head | |
| JPH08329418A (en) | Production of thin film magnetic head | |
| JPH01137419A (en) | Thin film magnetic head | |
| JPH05267748A (en) | Magnetic sensor | |
| JPS6055697A (en) | Ceramic circuit board |