JPH04220804A - high frequency oscillator - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is directed to forming an inductance element on a dielectric substrate using a similar spiral thin layer conductor so that it can be connected in series with respect to the signal transmission direction in VHF or UHF band radio equipment. This invention relates to a high-frequency oscillator made of stacked circuit boards.

0002

[Prior Art] To construct a high-frequency LC oscillator, a spiral coil is used as an inductor using a dielectric substrate with a thin layer conductor formed as a pattern on the main surface and a ground thin layer conductor formed on the other surface. It was common to construct a transmitter circuit on the main surface. However, oscillators constructed using this method are technically and economically inferior in terms of precision of each component, overall manufacturing time, and performance.
Using stacked dielectric substrates, parts are attached to the first and fifth layers, the second and fourth layers are used for grounding, and the third layer is patterned with a thin layer conductor to create inductance. It has been known.

0003

[Problems with the Prior Art] However, according to the above-mentioned former method of configuring an oscillator, there is a pattern as an inductor on the mounting surface of the component, so it is coupled with neighboring components and receives influence from shielding means, etc. As a result, the transmission frequency becomes unstable, and there is a risk that the electromagnetic coupling, which is the transmission condition including the inductor, may be broken, especially against mechanical vibration.

Furthermore, in the latter method, since the inductor thin-layer conductor is sandwiched between the ground conductors, the Q of the inductance coil is reduced, and in order to prevent this, the pattern is
If the width of the conductor is increased, the total area of the substrate increases, and it is difficult to obtain a predetermined inductance.

[0005]

[Means for Solving the Problems] In view of the above-mentioned conventional technical and economical problems, the present invention provides a structure in which each adjacent substrate becomes a subsequent signal transmission path in order to substantially increase the inductance component. A multilayer stacked board is used in which geometrically similar inductor patterns are formed using thin conductors and stacked on top of each other, and each outermost layer board functions as a component attachment and a ground conductor. The present invention aims to realize a high-frequency LC oscillator that eliminates the conventional obstacles.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows first to fourth substrates 1 mainly composed of a dielectric material 1.
-1, 1-2, 1-3, and 1-4, respectively, have thin layer conductors 41, 42, 43, and 44 formed on the main surface or the other surface, and each substrate is integrally stacked, according to the present invention. It is a side sectional view of the main part of the oscillator, and 21 and 31 are a first inductance element and a second inductance element functioning as inductance elements, and are shown in FIG. 3 (A) on the main surfaces of the second and third substrates, respectively.
) and (B), spiral thin layer conductors similar to each other are formed. Reference numerals 10 and 20 indicate through holes provided at different positions passing through the dielectric from the main surface to the other surface.

FIG. 2 shows first and second inductance elements 21 and 31 formed on the main surfaces of the second and third substrates, respectively.
1, the input terminal T11 of the first inductance element 21 on the second substrate is electrically connected to the through-hole 10 of the first substrate at a predetermined position on the thin layer conductor on the main surface thereof. and the output terminal T2 of the first inductor element.
1 is brazed to the thin layer conductor on the main surface through another through hole 20, and from there conductively passes through another through hole (not shown) on the third substrate. Connected to the input terminal T12 of the second inductance element 31,
Through-hole 2 connects the output terminal T22 of the inductance element.
As a result of being electrically connected to the thin layer conductor 44 on the other side, which serves as a ground electrode, through 0, the two sets of inductance elements are finally connected in series.

[0008] Using a multiple substrate in which the above-mentioned inductance elements are constructed of thin layer conductors, a transistor TR and a capacitor C1 are used to construct an oscillator as shown in FIG.
to C4, placing the electrical components of the resistor R on the thin layer conductor on the main surface of the first substrate and soldering them, or fabricating other electrical components including transistors on the dielectric substrate using semiconductor integration technology; You can also do it.

Furthermore, the present invention is not limited to the above-mentioned embodiments, but has a basic configuration in which a pair of substrates each having an inductance element formed in a spiral shape using a thin layer conductor on the main surface of a dielectric body is disposed adjacent to each other. It goes without saying that the outermost substrate with the support conductor or the ground conductor provides a multilayer structure in which a plurality of pairs of inductance elements are stacked one on top of the other.

0010

As described in detail above, according to the present invention, compared to the conventional 5-layer oscillator in which the inductance element is sandwiched and stacked between the ground electrodes, the outermost substrate is used as a support for mounting components. Since the structure is made up of similar or congruent spiral thin-layer conductors arranged adjacently as inductors that function only as ground electrodes, even though the electromagnetic mutual inductance coupling between the inductances is weak, the inductance component is It can be added in series to provide a high Q, and there is almost no effect of electromagnetic interference with other electrical parts, making electromagnetic shielding easy. In addition, by applying semiconductor integration technology, it becomes possible to form each circuit element on a dielectric material at once, which increases the reliability of soldering and eliminates sources of electromagnetic interference in free space, resulting in stable high performance. This contributes to the creation of a high quality oscillator.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing the configuration of a multilayer dielectric substrate for implementing a high frequency oscillator of the present invention.

FIG. 2 is a secondary electrical connection diagram of an inductance element that forms the main part of an oscillator.

3 is a top view of a pattern of an inductance element formed of a thin conductor on the main surfaces of the second and third substrates in FIG. 1; FIG.

FIG. 4 is an example of an oscillation circuit using transistors.

[Explanation of symbols]

1 Dielectrics 1-1 to 1-4 First to fourth substrates 1
0, 20 through hole 2
1, 31 First and second inductance elements

Claims (1)

[Claims] Claim 1: A thin layer conductor on a substrate mainly composed of a dielectric material.
In a high frequency oscillator having a C element attached thereto, the dielectric substrate includes a thin layer conductor formed on at least one principal surface sandwiching the dielectric and the other opposing surface or both surfaces;
a first substrate having a plurality of through holes penetrating from the main surface to the other surface, the thin layer conductor being formed on the main surface as a signal transmission path and a mounting support for electrical components; The first and second inductance elements have spiral thin layer conductors in the same winding direction on their main surfaces and are arranged adjacent to each other.
and a third substrate and a fourth substrate with the thin layer conductor on the other side as a ground electrode are stacked together, and the input terminal of the first inductance element on the second substrate is connected to one of the first substrates. It connects to the thin layer conductor via two through-holes and the third through-hole.
The output terminal of the second inductance element on the substrate is connected to the thin layer conductor on the other side via another through hole, so that the first and second inductance elements are successively connected. A high frequency oscillator characterized by: