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JPH04219999A - Component mounting machine - Google Patents

Component mounting machine

Info

Publication number
JPH04219999A
JPH04219999A JP2404371A JP40437190A JPH04219999A JP H04219999 A JPH04219999 A JP H04219999A JP 2404371 A JP2404371 A JP 2404371A JP 40437190 A JP40437190 A JP 40437190A JP H04219999 A JPH04219999 A JP H04219999A
Authority
JP
Japan
Prior art keywords
component
section
mounting
recognition means
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2404371A
Other languages
Japanese (ja)
Other versions
JP2902486B2 (en
Inventor
Keizo Izumida
圭三 泉田
Masamichi Morimoto
正通 森本
Junichi Hata
純一 秦
Takashi Shimizu
隆 清水
Akio Okada
岡田 昭男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2404371A priority Critical patent/JP2902486B2/en
Publication of JPH04219999A publication Critical patent/JPH04219999A/en
Application granted granted Critical
Publication of JP2902486B2 publication Critical patent/JP2902486B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Automatic Assembly (AREA)
  • Image Input (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、例えば電子回路基板の
所定の位置に所定の電子部品を実装するのに用いられる
部品実装機に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting machine used, for example, to mount predetermined electronic components at predetermined positions on an electronic circuit board.

【0002】0002

【従来の技術】近年、電子回路基板製造分野において、
製品の小型化、高機能化が進むにつれ、電子回路基板へ
の電子部品の実装密度が高くなり、かつ実装する部品の
寸法が例えば第5図に示す部品1を参照して、平面寸法
X×Yが0.5mm×1.0mmと微小なものとなって
いる。さらに部品の形状もさまざまなものが使用される
ようになっている。そして部品の実装を行う電子部品実
装機においても、部品の実装精度、信頼性の向上が図ら
れている。部品の実装精度を向上させる手段の一つとし
て、部品移載実装部で移載中の部品を撮像し、部品移載
実装部の部品保持部での姿勢、位置ずれを認識して実装
の姿勢および位置の補正を所要部に指令する画像認識手
段がある。代表的な画像認識手段としては、第6図(a
)を参照して部品保持部11に保持されている部品1を
その部品保持部11側である背後からの照明光2により
照明し、部品1の影の画像を透過光により取り込み認識
する透過照明認識手段Aと、第6図(b)を参照して部
品1を反部品保持部側である前方からの照明光3により
照明し、部品1の電極部画像13等を取り込み認識する
反射照明認識手段Bとがある。  従来、1つの部品実
装機には上記画像認識手段A、Bのうちどちらか一方の
みが採用されており、大半が透過照明認識手段Aを採用
している。
[Prior Art] In recent years, in the field of electronic circuit board manufacturing,
As products become smaller and more sophisticated, the mounting density of electronic components on electronic circuit boards increases, and the dimensions of the components to be mounted increase, for example, with reference to component 1 shown in FIG. 5, the planar dimension X× Y is as small as 0.5 mm x 1.0 mm. Furthermore, various shapes of parts are being used. Furthermore, efforts are being made to improve component mounting accuracy and reliability in electronic component mounting machines that mount components. One of the ways to improve component mounting accuracy is to image the component being transferred in the component transfer and mounting section, recognize the posture and positional deviation of the component holding section of the component transfer and mounting section, and adjust the mounting posture. There is also an image recognition means for instructing the necessary parts to correct the position. A typical image recognition means is shown in Figure 6 (a).
), the component 1 held in the component holder 11 is illuminated with illumination light 2 from behind on the component holder 11 side, and an image of the shadow of the component 1 is captured and recognized by the transmitted light. Recognition means A and reflected illumination recognition that illuminates the component 1 with illumination light 3 from the front, which is the side opposite to the component holding section, and captures and recognizes the electrode portion image 13 of the component 1, with reference to FIG. 6(b). There is a means B. Conventionally, one component mounting machine employs only one of the image recognition means A and B, and most employ the transmitted illumination recognition means A.

【0003】0003

【発明が解決しようとする課題】しかし上記従来のよう
に1種類の画像認識手段しか持たない部品実装機では、
さまざまな部品に対する実装の精度および信頼性、また
機械の使いやすさの点で対応し切れなくなりつつある。
[Problem to be solved by the invention] However, in the conventional component mounting machine that has only one type of image recognition means,
The accuracy and reliability of mounting various parts, as well as the ease of use of machines, are becoming increasingly difficult to meet.

【0004】例えば、透過照明認識手段Aを持つ部品実
装機では、部品の影の画像を認識するので、単純形状で
色彩のばらつきがある部品にはかなりの対応力と信頼性
があるが、例えば第6図(a)に示すように部品移載実
装部の直径が1.2mmとされた部品保持部11よりも
小さい寸法となる前記の部品1では、部品保持部11の
画像Cは得られても部品1の外形の画像C′を得ること
はできない。このため高い実装精度は得られない。また
第7図に示されるPLCCパッケージである部品4や、
SOJパッケージ等のように部品電極部が部品外形に現
れにくい部品にあっては、第8図(a)に示されるよう
な前記部品4の影の画像Dは得られるが、これによって
は前記電極の状態を認識しにくいものとなる。
For example, a component mounting machine equipped with transmitted illumination recognition means A recognizes images of the shadows of components, so it has considerable ability to handle components with simple shapes and variations in color and is reliable. As shown in FIG. 6(a), the image C of the component holder 11 cannot be obtained for the component 1 whose diameter is smaller than that of the component holder 11 where the diameter of the component transfer mounting section is 1.2 mm. However, it is not possible to obtain an image C' of the external shape of the part 1. For this reason, high mounting accuracy cannot be obtained. In addition, the component 4 which is a PLCC package shown in FIG. 7,
For components such as SOJ packages, in which the component electrodes are difficult to appear on the component outline, an image D of the shadow of the component 4 as shown in FIG. 8(a) can be obtained; The condition becomes difficult to recognize.

【0005】また反射照明認識手段Bを持つ部品実装機
では、第8図(b)を参照してPLCCパッケージ4や
SOJパッケージ等の部品の外形に現れにくい電極5で
あっても、これの画像Eを明瞭に得ることはできる。し
かし部品電極部に似た画像部分を電極部と誤って認識し
やすいので、透過照明認識手段A程の信頼性は得られな
い。また部品の色彩の影響を受けやすく同種の部品でも
色彩が異なると別の部品として取り扱う必要が生じると
いった問題がある。
In addition, in a component mounting machine having a reflected illumination recognition means B, as shown in FIG. It is possible to clearly obtain E. However, since it is easy to mistakenly recognize an image portion resembling a component electrode portion as an electrode portion, it is not as reliable as the transmitted illumination recognition means A. Further, there is a problem that the parts are easily affected by the color of the parts, and if parts of the same type have different colors, it becomes necessary to treat them as different parts.

【0006】そこで本発明は、前記2種の認識手段を部
品の種類に応じて使い分けられるようにして、前記従来
のような問題を解消することができる部品実装機を提供
することを課題とするものである。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a component mounting machine that can solve the conventional problems by allowing the two types of recognition means to be used depending on the type of component. It is something.

【0007】[0007]

【課題を解決するための手段】本発明は上記のような課
題を解決するため、実装する部品を供給する部品供給部
と、部品の実装対象である被実装物の位置決めと保持を
行う被実装物位置決め部と、実装する部品を部品供給部
から被実装物上に移載し被実装物上の所定位置に実装す
る部品移載実装部と、部品移載実装部で移載中の部品を
所定の位置にて撮像し部品移載実装部の部品保持部での
部品の姿勢、位置ずれを認識して実装の姿勢および位置
の補正を所要部に指令し部品が被実装物の所定の位置に
実装されるようにする画像認識部と、上記部品供給部、
被実装物位置決め部、部品移載実装部および画像認識部
の動作を制御する制御部とを備えた部品実装機において
、前記画像認識部に、部品移載実装部の部品保持部に保
持されている部品を部品保持部側から照明して部品の画
像を透過光により取り込み認識する透過照明認識手段と
、前記部品を反部品保持部側から照明してこの部品の画
像を反射光により取り込み認識する反射照明認識手段と
を設け、これら2つの認識手段を実装しようとする部品
の種類に応じて前記制御部により切換え使用するように
したことを特徴とするものである。
[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a component supply section that supplies components to be mounted, and a mounting device that positions and holds an object to be mounted. An object positioning section, a component transfer and mounting section that transfers the components to be mounted from the component supply section onto the object to be mounted and mount them at a predetermined position on the object, and a component transfer and mounting section that transfers the components being transferred. The image is taken at a predetermined position, the posture and positional deviation of the component in the component holding section of the component transfer and mounting section is recognized, and the correction of the mounting posture and position is commanded to the required section, so that the component is placed in the predetermined position on the object to be mounted. an image recognition unit to be implemented in the above-mentioned component supply unit;
In a component mounting machine equipped with a control unit that controls operations of an object positioning unit, a component transfer and mounting unit, and an image recognition unit, the image recognition unit includes a component held by a component holding unit of the component transfer and mounting unit. Transmitted illumination recognition means that illuminates a part from the side of the component holder to capture and recognize an image of the component using transmitted light, and illuminates the component from the side opposite to the component holder to capture and recognize an image of the component using reflected light. The present invention is characterized in that a reflected illumination recognition means is provided, and the use of these two recognition means is switched by the control section depending on the type of component to be mounted.

【0008】[0008]

【作用】本発明の上記構成によれば、実装しようとする
部品の種類に応じて制御部が、透過照明認識手段と反射
照明認識手段とを切換え使用するので、単純形状で色彩
にバラツキのある部品に対しては透過照明認識手段の使
用によって部品の外形画像を取り込むことにより、この
部品の姿勢、位置ずれを適正に認識することができる。 また部品移載実装部の部品保持部よりも小さい部品や、
電極部が部品の外形に現れにくい部品に対しては反射照
明認識手段の使用によって、部品の反部品保持部側の面
の画像を取り込むことにより前記部品の姿勢、位置ずれ
を適正に認識することができる。
[Function] According to the above structure of the present invention, the control section switches between the transmitted illumination recognition means and the reflected illumination recognition means depending on the type of component to be mounted, so that it is possible to use a simple shape with a uniform color. By capturing an external image of the part using transmitted illumination recognition means, the orientation and positional deviation of the part can be appropriately recognized. In addition, parts that are smaller than the component holding section of the component transfer and mounting section,
For parts whose electrode parts are difficult to appear on the outside of the part, the posture and positional shift of the part can be properly recognized by capturing an image of the surface of the part on the side opposite to the part holding part by using a reflected illumination recognition means. I can do it.

【0009】[0009]

【実施例】以下本発明の実施例を図を参照して詳細に説
明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below in detail with reference to the drawings.

【0010】第1図は本発明の一実施例としての部品実
装機を示す模式図であり、第2図はブロック構成図であ
る。これらの図から分かるように、実装しようとする部
品1等を供給する部品供給部6、部品1等の実装対象で
ある電子回路基板7を位置決めする基板位置決め部8、
部品供給部6の部品1等を位置決めされた電子回路基板
7上に移載し実装する部品移載実装部9、この部品移載
実装部9が部品1等を部品供給部6から電子回路基板7
上に移載する途中の所定位置に設けられて部品1等の姿
勢や位置ずれを撮像により認識する画像認識部10を持
っており、これらは制御部12によって動作を制御され
るようになっている。そして画像認識部10には前記し
た透過照明認識手段Aと、反射照明認識手段Bとを装備
しており、これらは実装しようとする部品1等の種類に
応じ制御部12によって切換え使用されるようになって
いる。これら各認識手段A、Bを持った画像認識部10
は第3図に模式的に示してある。
FIG. 1 is a schematic diagram showing a component mounting machine as an embodiment of the present invention, and FIG. 2 is a block diagram. As can be seen from these figures, there are a component supply section 6 that supplies the component 1 and the like to be mounted, a board positioning section 8 that positions the electronic circuit board 7 on which the component 1 and the like are to be mounted;
A component transfer and mounting section 9 transfers and mounts the component 1 etc. from the component supply section 6 onto the positioned electronic circuit board 7; this component transfer and mounting section 9 transfers the component 1 etc. from the component supply section 6 to the electronic circuit board 7; 7
It has an image recognition unit 10 which is installed at a predetermined position during the transfer to the top and recognizes the posture and positional deviation of the component 1 etc. by imaging, and the operation of these units is controlled by the control unit 12. There is. The image recognition unit 10 is equipped with the above-mentioned transmitted illumination recognition means A and reflected illumination recognition means B, which are switched and used by the control unit 12 according to the type of component 1 etc. to be mounted. It has become. Image recognition unit 10 having each of these recognition means A and B
is schematically shown in FIG.

【0011】部品供給部6は制御部12に予め入力され
ている実装データにより示される部品1や部品4を部品
移載実装部9に渡す。部品移載実装部9は部品保持部1
1で部品1等を受取り画像認識部10の部品画像入力部
まで部品1等を移動させる。このとき制御部12は実装
データにより透過照明認識手段Aか反射照明認識手段B
のいずれかを有効とする。透過照明認識手段Aが有効に
なると照明光源21が発光し、反射板22に照明光2が
反射して部品保持部11の先端にある部品1等を部品保
持部11側である背後から照明する。
The component supply section 6 delivers components 1 and 4 indicated by the mounting data inputted in advance to the control section 12 to the component transfer and mounting section 9. The component transfer mounting section 9 is the component holding section 1
1, the part 1, etc. is received and moved to the part image input section of the image recognition section 10. At this time, the control unit 12 selects transmitted illumination recognition means A or reflected illumination recognition means B depending on the mounting data.
Either one is valid. When the transmitted illumination recognition means A becomes effective, the illumination light source 21 emits light, and the illumination light 2 is reflected by the reflection plate 22 to illuminate the component 1 etc. at the tip of the component holder 11 from behind on the component holder 11 side. .

【0012】そして透過照明認識手段Aはテレビカメラ
24によって前記照明による部品1等の影の画像を透過
光により取り込み、部品保持部11と部品1等の姿勢、
位置ずれを認識する。したがじってこの認識方式によれ
ば、部品1等が部品保持部11よりも大きいことを条件
に、その外形を適正に認識することができ、部品1等の
色彩のバラツキの影響は受けにくい。
The transmitted illumination recognition means A uses the television camera 24 to capture an image of the shadow of the component 1 etc. caused by the illumination using transmitted light, and determines the posture of the component holder 11 and the component 1 etc.
Recognize misalignment. Therefore, according to this recognition method, the external shape of the component 1 etc. can be recognized properly on the condition that it is larger than the component holding part 11, and the influence of color variations of the component 1 etc. is not affected. Hateful.

【0013】また反射照明認識手段Bが有効になると、
照明光源23が発光し、部品1等の下面を照明光3によ
って照明する。このとき反射照明認識手段Bはテレビカ
メラ24によって部品1等の下面からの反射光により電
極部画像EやFを取り込み、部品保持部11と部品1の
姿勢、位置ずれを認識する。したがってこの認識方式で
は、部品保持部11よりも小さな部品1や、電極部5が
外形に現れにくい部品4等であっても、第6図(b)、
第8図(b)に示されるように、それらの電極画像E、
Fを明確に認識することができる。
Furthermore, when the reflected illumination recognition means B becomes effective,
The illumination light source 23 emits light and illuminates the lower surface of the component 1 etc. with the illumination light 3. At this time, the reflected illumination recognition means B uses the television camera 24 to capture the electrode part images E and F by the reflected light from the lower surface of the component 1 etc., and recognizes the posture and positional deviation of the component holder 11 and the component 1. Therefore, with this recognition method, even if the component 1 is smaller than the component holding part 11 or the part 4 where the electrode part 5 is difficult to appear in the external shape, as shown in FIG. 6(b),
As shown in FIG. 8(b), those electrode images E,
F can be clearly recognized.

【0014】次に部品移載実装部9は部品1等を実装す
る電子回路基板7上まで移動させる。これとともに基板
位置決め部8は上記データが示す部品実装位置に電子回
路基板7を移動させる。そして制御部12は画像認識部
10が認識した部品保持部11と部品の姿勢、位置ずれ
量に従い、部品移載実装部9と基板位置決め部8に部品
の回転ずれと位置ずれを補正する指令を送る。これによ
り部品保持部11と基板位置決め部8とでは前記指令に
対応する部品の回転および電子回路基板7の位置の補正
動作を行い、部品保持部11が保持している部品1等と
位置決めされた電子回路基板7とを適正に対向する状態
にする。この後部品移載実装部9は保持している部品1
等を電子回路基板7に実装する。これらの動作は全て制
御部12での制御によって遂行される。
Next, the component transfer mounting unit 9 moves the component 1 and the like onto the electronic circuit board 7 on which it is to be mounted. At the same time, the board positioning section 8 moves the electronic circuit board 7 to the component mounting position indicated by the above data. Then, the control unit 12 issues a command to the component transfer and mounting unit 9 and the board positioning unit 8 to correct the rotational shift and positional shift of the component, according to the attitude and positional shift amount of the component holding unit 11 and the component recognized by the image recognition unit 10. send. As a result, the component holding section 11 and the board positioning section 8 perform operations to rotate the component and correct the position of the electronic circuit board 7 in accordance with the command, and the component 1 etc. held by the component holding section 11 are positioned. The electronic circuit board 7 is placed in a state where it faces properly. After this, the component transfer mounting section 9 holds the component 1
etc. are mounted on the electronic circuit board 7. All of these operations are performed under the control of the control section 12.

【0015】次に前記部品の種類に応じた透過照明認識
手段Aと反射照明認識手段Bとの選択を行うための選択
データの作成の手順を第4図のフローチャートを用いて
説明する。実装する部品の寸法、電極部数(リード本数
)、および部品の種別(例えば角チップ、QFP、PL
CC等部品パッケージの特徴により分類) 等を示す部
品データが予め制御部12に入力されている。そこで先
ずこの部品データを呼び出す(ステップ#1)。そして
部品データを予め定めた関数で評価し(ステップ#2)
、透過照明認識手段Aを用いるのか、反射照明認識手段
Bを用いるのかを判定する(ステップ#3)。本実施例
では部品データの評価関数を以下の通りとしている。
Next, the procedure for creating selection data for selecting the transmitted illumination recognition means A and the reflected illumination recognition means B according to the type of component will be explained using the flowchart shown in FIG. The dimensions of the component to be mounted, the number of electrodes (number of leads), and the type of component (e.g. square chip, QFP, PL
Component data indicating classification according to the characteristics of component packages such as CC, etc. is input into the control unit 12 in advance. Therefore, first, this part data is called (step #1). Then, evaluate the component data using a predetermined function (Step #2)
, it is determined whether transmitted illumination recognition means A or reflected illumination recognition means B is used (step #3). In this embodiment, the evaluation function for component data is as follows.

【0016】各チップについて、部品の寸法が部品保持
部11よりも小さい場合反射照明認識手段Bを選択し、
寸法が部品保持部11よりも大きい場合は透過照明認識
手段Aを選択する。またPLCC、SOJ、QFP、S
OP等の各パッケージの場合は、全て反射照明認識手段
Bを選択する。さらに単純形状で色彩のバラツキのある
部品については、部品保持部11よりも小さい部品寸法
ならば反射照明認識手段Bを選択し、部品保持部11よ
しも大きい部品寸法ならば透過照明認識手段Aを選択す
る( ステップ#3)。
For each chip, if the size of the component is smaller than the component holding part 11, the reflected illumination recognition means B is selected;
If the dimensions are larger than the component holding section 11, the transmitted illumination recognition means A is selected. Also PLCC, SOJ, QFP, S
In the case of each package such as OP, reflected illumination recognition means B is selected for all. Furthermore, for a component with a simple shape and color variation, if the component size is smaller than the component holding section 11, the reflected illumination recognition means B is selected, and if the component size is larger than the component holding section 11, the transmitted illumination recognition means A is selected. Select (Step #3).

【0017】このように画像認識部10における使用認
識手段を選択した後は、選択した認識手段にて部品の認
識を行い( ステップ#4または#5)、次でこの認識
が適正に行われたかどうかを判別し(ステップ#6また
は#7)、適正でなければ、使用する認識手段の選択を
変えて今一度認識を行う。
After selecting the recognition means to be used in the image recognition unit 10 in this way, the parts are recognized by the selected recognition means (step #4 or #5), and then it is determined whether this recognition has been performed properly. If it is not appropriate, change the selection of the recognition means to be used and perform recognition again.

【0018】そしてこの手順を実装する全部品について
繰返し行って(ステップ#8)認識手段選択データを作
成する。
This procedure is then repeated for all the parts to be mounted (step #8) to create recognition means selection data.

【0019】作成した認識手段選択データは、部品ごと
に登録される。なお本実施例での部品実装機では、上記
のような認識手段選択データの作成を実装データに従い
最初の同種部品実装動作時に行うようにしている。そし
てステップ#6、#7の判定の確認を部品実装機の操作
者が行って認識手段の選択を切換えることも可能にいて
いる。
The created recognition means selection data is registered for each part. In the component mounting machine of this embodiment, the recognition means selection data as described above is created during the first similar component mounting operation according to the mounting data. It is also possible for the operator of the component mounting machine to confirm the determinations in steps #6 and #7 and switch the selection of the recognition means.

【0020】以上の本発明の部品実装機によれば、部品
移載実装部9の部品保持部11よりも小さい寸法の部品
や部品電極部が外形に現れにくい部品に対して反射照明
認識手段Bを、また部品保持部11よりも大きい寸法で
部品形状が単純で色彩のバラツキの多い部品に対しては
透過照明認識手段Aをそれぞれ用いるので、さまざなな
部品を精度よく、また高い信頼性で実装することができ
る。
According to the above-described component mounting machine of the present invention, the reflected illumination recognition means B is used for components whose dimensions are smaller than the component holding section 11 of the component transfer and mounting section 9, and for components whose component electrodes are difficult to appear on the outside. In addition, since the transmitted illumination recognition means A is used for parts that are larger than the part holding part 11, have a simple part shape, and have many variations in color, various parts can be recognized with high precision and high reliability. Can be implemented.

【0021】[0021]

【発明の効果】本発明によれば、実装しようとする部品
の種類に応じて制御部が、透過照明手段と反射照明手段
とを切換え使用し、単純形状で色彩にバラツキのある部
品に対しては透過照明認識手段の使用によって部品の外
形画像を取り込むことにより、この部品の姿勢、位置の
ずれを適正に認識することができ、また部品移載実装部
の部品保持部よりも小さい部品や、電極部が部品の外形
に現れにくい部品に対しては反射照明認識手段の使用に
よって、部品の下面の画像を取り込むことにより前記部
品の姿勢、位置ずれを適正に認識することができるので
、どのような種類の部品でもその姿勢、位置ずれを確実
かつ適正に補正し、精度のよいかつ信頼性の高い部品実
装が可能となる。
Effects of the Invention According to the present invention, the control section can switch between the transmitted illumination means and the reflected illumination means depending on the type of parts to be mounted, and can be used for parts with simple shapes and variations in color. By capturing an external image of the component using transmitted illumination recognition means, it is possible to properly recognize the posture and positional deviation of this component, and it is also possible to recognize parts that are smaller than the component holding section of the component transfer and mounting section, For parts where the electrode part is difficult to appear on the outside of the part, the posture and positional deviation of the part can be properly recognized by capturing an image of the bottom surface of the part by using reflected illumination recognition means. It is possible to reliably and appropriately correct the posture and positional deviation of various types of components, and to mount components with high precision and reliability.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例としての部品実装機を示す模
式図である。
FIG. 1 is a schematic diagram showing a component mounting machine as an embodiment of the present invention.

【図2】図1の部品実装機のブロック構成図である。FIG. 2 is a block diagram of the component mounting machine shown in FIG. 1;

【図3】画像認識部を拡大して見た概略構成図である。FIG. 3 is an enlarged schematic configuration diagram of an image recognition section.

【図4】画像認識手段選択データを作成する手順を示す
フローチャートである。
FIG. 4 is a flowchart showing a procedure for creating image recognition means selection data.

【図5】微小電子部品を示す平面図および正面図である
FIG. 5 is a plan view and a front view showing a microelectronic component.

【図6】透過照明認識手段および反射照明認識手段によ
る微小部品の取り込み画像の例を示す説明図である。
FIG. 6 is an explanatory diagram showing an example of an image captured by a transmitted illumination recognition means and a reflected illumination recognition means of a microcomponent.

【図7】PLCCパッケージを示す平面図、下面図、お
よび側面図である。
FIG. 7 is a plan view, a bottom view, and a side view showing a PLCC package.

【図8】透過照明認識手段および反射照明認識手段によ
るPLCCパッケージの取り込み画像の例を示す説明図
である。
FIG. 8 is an explanatory diagram showing an example of an image captured by a transmitted illumination recognition means and a reflected illumination recognition means of a PLCC package.

【符号の説明】[Explanation of symbols]

1、4  部品 2、3  照明光 6  部品供給部 7  電子回路基板 8  基板位置決め部 9  部品移載実装部 10  画像認識部 11  部品保持部 12  制御部 A  透過照明認識手段 B  反射照明認識手段 1, 4 Parts 2, 3 Illumination light 6 Parts supply department 7 Electronic circuit board 8 Board positioning part 9 Parts transfer and mounting department 10 Image recognition section 11 Parts holding part 12 Control section A Transmitted illumination recognition means B Reflected illumination recognition means

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  実装する部品を供給する部品供給部と
、部品の実装対象である被実装物の位置決めと保持を行
う被実装物位置決め部と、実装する部品を部品供給部か
ら被実装物上に移載し被実装物上の所定位置に実装する
部品移載実装部と、部品移載実装部で移載中の部品を所
定の位置にて撮像し部品移載実装部の部品保持部での部
品の姿勢、位置ずれを認識して実装の姿勢および位置の
補正を所要部に指令し部品が被実装物の所定の位置に実
装されるようにする画像認識部と、上記部品供給部、被
実装物位置決め部、部品移載実装部および画像認識部の
動作を制御する制御部とを備えた部品実装機において、
前記画像認識部に、部品移載実装部の部品保持部に保持
されている部品を部品保持部側から照明して部品の画像
を透過光により取り込み認識する透過照明認識手段と、
前記部品を反部品保持部側から照明して部品の画像を反
射光により取り込み認識する反射照明認識手段とを設け
、これら2つの認識手段を実装しようとする部品の種類
に応じて前記制御部により切換え使用するようにしたこ
とを特徴とする部品実装機。
Claim 1: A component supply section that supplies components to be mounted, a mounting object positioning section that positions and holds an object to be mounted, and a mounting object positioning section that moves the components to be mounted from the component supply section onto the mounting object. A component transfer and mounting section that transfers the components to a predetermined position on the object to be mounted, and a component holding section of the component transfer and mounting section that images the components being transferred at a predetermined position in the component transfer and mounting section. an image recognition unit that recognizes the orientation and positional deviation of the component and instructs the required unit to correct the mounting orientation and position so that the component is mounted at a predetermined position on the object to be mounted; and the component supply unit; In a component mounting machine equipped with a control section that controls the operations of an object positioning section, a component transfer mounting section, and an image recognition section,
Transmitted illumination recognition means in the image recognition section that illuminates the component held in the component holding section of the component transfer and mounting section from the component holding section side and captures and recognizes an image of the component using transmitted light;
reflected illumination recognition means for illuminating the component from the side opposite to the component holding section and capturing and recognizing an image of the component using reflected light; A component mounting machine characterized in that it can be used in a switching manner.
JP2404371A 1990-12-20 1990-12-20 Component mounting machine Expired - Lifetime JP2902486B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2404371A JP2902486B2 (en) 1990-12-20 1990-12-20 Component mounting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2404371A JP2902486B2 (en) 1990-12-20 1990-12-20 Component mounting machine

Publications (2)

Publication Number Publication Date
JPH04219999A true JPH04219999A (en) 1992-08-11
JP2902486B2 JP2902486B2 (en) 1999-06-07

Family

ID=18514050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2404371A Expired - Lifetime JP2902486B2 (en) 1990-12-20 1990-12-20 Component mounting machine

Country Status (1)

Country Link
JP (1) JP2902486B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09205296A (en) * 1996-01-26 1997-08-05 Matsushita Electric Ind Co Ltd Component mounting method and device
JP2002134996A (en) * 2001-07-26 2002-05-10 Matsushita Electric Ind Co Ltd Component mounting method and device and mounting data creation method and device
JP2009277749A (en) * 2008-05-13 2009-11-26 Panasonic Corp Height measuring device and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09205296A (en) * 1996-01-26 1997-08-05 Matsushita Electric Ind Co Ltd Component mounting method and device
JP2002134996A (en) * 2001-07-26 2002-05-10 Matsushita Electric Ind Co Ltd Component mounting method and device and mounting data creation method and device
JP2009277749A (en) * 2008-05-13 2009-11-26 Panasonic Corp Height measuring device and method

Also Published As

Publication number Publication date
JP2902486B2 (en) 1999-06-07

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