JPH04212497A - Electronic component housing - Google Patents

Abstract

PURPOSE:To obtain an electronic component housing which facilitates the fixing or changing of a desired heat radiating member without the replacement of, or the additional machining of, the body of a control unit. CONSTITUTION:A heat conductive member 6 is situated on the exterior surface of the body of a control unit 1 in such a manner as to face semiconductor heating elements 3, which are located at the interior surface of the unit, with a wall of the unit 1 therebetween. A heat radiating fin 2 is secured to the surface of the heat conductive member in a replaceable manner in response to the heating value of the semiconductor elements 3. Thus, the heat radiating fin can be easily replaced with the desired fin without the removal of the control unit body from the heat conductive member.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing in which electronic components such as an inverter device are housed, and more particularly to the mounting of a cooling structure on the housing.

0002

2. Description of the Related Art For convenience of explanation, a control device will be described as an example of a case in which electronic components are housed. Figure 9, Figure 1
0 relates to a conventional control device, FIG. 9 is a partially sectional perspective view of the control device, and FIG. 10 is a configuration diagram of the control device. Figure 9, Figure 1
0, 1 is a control device main body which is a box-shaped housing, 2
3 is a heat dissipating fin that is a heat dissipating member screwed to the back of the control device main body 1, and 3 is a semiconductor element that is an electronic component that generates heat and is disposed inside the control device main body 1. 4 is the control device main body 1 heat dissipation fin 2;
It is constituted by a semiconductor element 3.

[0003] Next, the operation will be explained. When the semiconductor element 3 in the control device main body 1 is energized, this semiconductor element 3
I get a fever from Then, this heat is transferred from the control device main body 1.
Heat is conducted to the heat dissipation fins 2 attached directly to the control device main body 1, and the heat is dissipated by the heat dissipation fins 2, thereby reducing the amount of heat generated by the semiconductor element 3 and the temperature inside the control device 4.

FIGS. 11 and 12 show other conventional embodiments, and FIG. 11(a) is a partially sectional perspective view of the control device, and FIG.
b) is a partial cross-sectional configuration diagram of the control device, and FIG. 12 is a configuration diagram of the control device. In FIGS. 11 and 12, reference numeral 5 denotes a control device main body serving as a box-shaped housing, and a wall surface 5 of the control device main body 5
A rectangular opening 5b is provided in a. Further, the control device main body 5 is provided with a collar 5c. Reference numeral 2 denotes a heat dissipation fin fixed to the back side of the control device main body 5 (back side of the wall surface 5a) with screws. The semiconductor element 3 is directly attached to the. 6 is a packing disposed on the surface of the collar 5c of the control device main body 5, and 7 is a control cover, which is fixed to the control device main body 5 via the packing 6 with screws. The control device 8 includes the heat dissipation fin 2, the semiconductor element 3, the control device main body 5, the packing 6, and the control cover 7.

Next, the operation will be explained. In FIG. 12, when the semiconductor element 3 in the control device body 5 is energized during natural cooling, the semiconductor element 3 generates heat. and,
This heat is conducted directly to the heat dissipation fin 2 to which the semiconductor element 3 is attached, and is dissipated by the heat dissipation fin 2.
The amount of heat generated by the semiconductor element 3 is reduced, and the temperature inside the control device 8 is also reduced. Next, when the heat dissipation fin 2 is forcibly cooled by the fan 9, the same effect as described above occurs, but the heat dissipation fin 2
is forcedly cooled by the fan 9, which increases heat dissipation.

[0006]

[Problems to be Solved by the Invention] Since the conventional control device 4 shown in FIG. 9 and FIG. If it becomes necessary to change the heat dissipation fins 2, the control device main body 1 can be changed to match the specified mounting pitch of the heat dissipation fins 2, or the heat dissipation fins 2 can be installed by additionally machining the control device main body 1. I was trying to make it possible. However, if you change or replace the control device main body 1,
If additional machining is required, since the semiconductor elements 3 are housed and arranged within the control device main body 1, these semiconductor elements 3 must be removed and replaced, or additional machining must be performed, making the work complicated. There was a problem.

Further, the conventional control device 8 shown in FIGS. 11 and 12 is similar to the above, when the heat dissipation fin 2 needs to be changed to another one due to a change in the amount of heat generated from the control device 8. The heat dissipation fins 2 have been installed by changing the control device main body 1 to one that matches the predetermined mounting pitch of the heat dissipation fins 2, or by additionally machining the control device main body 1. In addition, depending on the installation conditions such as the surrounding environment of the control device 8 and the allowable space for installing the heat dissipation fin 2, two types of control devices, natural cooling and forced cooling, as shown in FIG. 12, are required. If it is replaced, it will be necessary to change the control device main body 5 as well. Therefore, it takes time and effort to manufacture the control device body, and since the semiconductor element 3 is directly attached to the heat dissipation fin 2, it is necessary to remove the semiconductor element 3 and then replace the heat dissipation fin 2, or to perform additional work. It becomes complicated. In addition, once it is stored in the control device 8, and after the assembly is completed, the heat dissipation fin 2 is installed as described above.
If the controller was to be replaced, there were problems such as it becoming impossible to seal the inside of the control device 8.

The present invention was made to solve the above-mentioned problems, and provides an electronic component storage that can be easily changed and attached to a specified heat dissipation member without replacing the main body of the control device or performing additional work. The purpose is to obtain a housing.

A further object of the present invention is to provide an electronic component storage case that can maintain the airtightness of a control device even if the heat dissipation member is changed to a predetermined one.

0010

[Means for Solving the Problems] An electronic component storage housing according to a first aspect of the present invention includes: an electronic component that generates heat disposed on an inner wall thereof; and an electronic component that faces the electronic component with a wall of the housing in between. The heat dissipation member includes a heat conduction member disposed on an outer wall surface of the housing, and a heat dissipation member that dissipates the heat generated by the electronic component that is transferred via the housing wall and the heat conduction member. It is fixed to the surface of the conductive member so as to be replaceable according to the heat generation capacity of the electronic member.

[0011] The electronic component storage casing according to the second invention includes a casing in which an opening is formed in the wall surface, and the casing is brought into contact with the casing from the outside so as to close the opening of the casing. The heat dissipation member includes a heat conduction member to which an electronic component is attached from the inside, and a heat dissipation member that dissipates the heat generated by the electronic component that is transferred through the heat conduction member, and the heat dissipation member is attached to the surface of the heat conduction member. The electronic member is fixed and replaceable according to the heat generation capacity of the electronic member.

[0012] The electronic component storage housing according to the third invention includes a housing in which an opening is formed in the wall surface, and the housing is brought into contact with the housing from the outside so as to close the opening of the housing, and The heat dissipation member includes a heat conduction member to which an electronic component is attached from the inside, and a heat dissipation member that dissipates the heat generated by the electronic component that is transferred via the heat conduction member, and when the heat dissipation member is removed, the heat dissipation member The conductive member has a fixing means for fixing it to the wall surface of the casing without needing to remove it.

[0013] An electronic component storage housing according to a fourth aspect of the present invention includes a housing in which an opening is formed in a wall surface, and the housing is brought into contact with the housing from the outside so as to close the opening of the housing, and the opening of the housing is closed. The heat dissipation member includes a heat conduction member to which an electronic component is attached from the inside, and a heat dissipation member that dissipates the heat generated by the electronic component that is transferred via the heat conduction member, and the heat dissipation member is located at a distance from the housing. It has a block structure in which a heat pipe having a dissipation part is embedded in the heat pipe and has a flat part that can be attached to the surface of the heat conducting member.

[0014]

[Operation] In the first and second aspects of the invention, the heat flow generated by the electronic component is radiated to the outside from the heat dissipation member via the housing wall and the heat conduction member, and the heat dissipation member responds to the heat generation capacity of the electronic component. If it becomes necessary to change it, it can be removed from the surface of the heat conductive member and replaced without affecting the electronic components inside the housing.

In the third invention, the heat flow generated by the electronic component is radiated to the outside from the heat dissipation member via the housing wall and the heat conduction member, and the heat conduction member dissipates heat according to the heat generation capacity of the electronic component. When it becomes necessary to change the member, the heat dissipating member is removed from the surface of the heat conductive member and replaced without affecting the casing while being fixed to the casing by the fixing means.

In the fourth invention, the heat flow generated by the electronic component is radiated to the outside from the heat dissipation member embedded in the heat pipe forming a block structure through the housing wall and the heat conduction member, and the heat dissipation member is The heat pipe radiates heat generated by the electronic component to a location away from the installation position of the housing.

[0017]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to the drawings. Figure 1
, 2, 1 to 3 are the same as the conventional devices shown in FIGS. 9 and 10, so the same reference numerals are given and the explanation will be omitted. Reference numeral 10 denotes a heat conductive member made of aluminum and disposed between the control device main body 1 and the heat radiation fins 2. The control device body 1 is fixed to the heat conduction member 10 from the control device body 1 side (inside) with screws, and the heat radiation fin 2 is fixed to the heat conduction member 10 from the heat radiation fin 2 side with screws. Therefore, the semiconductor element 3 in the control device main body 1
When changing the heat dissipation fin 2 to another one depending on the amount of heat generated, the control device main body 1 is still attached to the heat conduction member 10, and the heat dissipation fin 2 to be changed is machined with screws with a mounting pitch corresponding to the heat conduction member 10. Install the heat dissipation fin 2 after changing the arrangement.

Example 2. Another embodiment of the present invention will be described below with reference to FIGS. 3 and 4. In FIGS. 3 and 4, 2, 3, and 10 are shown in FIG.
Since it is the same as that shown in FIG. 2, the same reference numerals are given and the explanation will be omitted. Reference numeral 11 denotes a control device main body which is a box-shaped casing with an opening 11b formed in a wall surface 11a, and a heat conductive member is inserted from the outside of the control device main body 11 so as to close the opening 11b of the control device main body 11. 10 are in contact with each other. The heat conductive member 10 is fixed to the control device main body 11 from the control device main body 11 side (inside) with screws. The heat dissipation fin 2 is fixed to the heat conductive member 10 by screws from the heat dissipation fin 2 side. The exposed portion of the opening 11b of the control device main body 11 of the heat conductive member 10 has the heat conductive member 1
A semiconductor element 3 is attached directly to the surface of the semiconductor element 0. Therefore, when changing the heat dissipation fin 2 to another one depending on the amount of heat generated from the semiconductor element 3 in the control device main body 11, the control device main body 11 remains attached to the heat conduction member 10, and the installation corresponding to the heat dissipation fin 2 to be changed is performed. The heat conduction member 10 is threaded with the pitch, and the modified heat dissipation fin 2 is attached.

Example 3. Another embodiment of the present invention will be described below with reference to FIGS. 5 and 6. In FIGS. 5 and 6, 2, 3, and 10 are shown in FIG.
Since it is the same as that shown in FIG. 2, the same reference numerals are given and the explanation will be omitted. Reference numeral 12 denotes a control device main body which is a box-shaped casing with an opening 12b formed in a wall surface 12a, and flanges 12c are provided on both side surfaces of the control device main body 12. A heat conductive member 10 is brought into contact with the control device main body 12 from the outside so as to close the opening 12b of the control device main body 12. The heat conductive member 10 is fixed to the control device main body 12 from the control device main body 12 side (inside) by screws 13 serving as fixing means. The heat dissipation fin 2 is fixed to the heat conductive member 10 by screws from the heat dissipation fin 2 side. Opening 12b of control device main body 12 of heat conductive member 10
A semiconductor element 3 is attached directly to the surface of the heat conductive member 10 at the exposed portion thereof. Collar 1 of control device main body 12
A packing 6 is disposed on the surface of 2c, and the control cover 7 is fixed to the control device main body 12 via the packing 6 with screws. The control device 14 includes the heat dissipation fin 2, the semiconductor element 3, the packing 6, the control cover 7, and the control device main body 12.
It is made up of.

In the control device 14 configured as described above, the cooling of the heat dissipation fins 2 depends on the surrounding environment in which the control device 14 is installed and the allowable space on the back side of the device for the heat dissipation fins 2 of the control device 14. When changing the heat dissipation fins 2a and 2b in FIG. 6 depending on the method, the control device main body 12 is attached to the heat conduction member 10 as shown in FIG. , to the heat dissipation fin 2a or 2b to be changed, and then install the heat dissipation fin 2a or 2b after the change. Thereby, when changing the heat radiation fins 2, the heat radiation fins 2 can be changed while the heat conductive member 10 remains attached to the control device main body 12, so that the control device 14 can be kept airtight.

Example 4. Another embodiment of the present invention will be described below with reference to FIGS. 7 and 8. In FIGS. 7 and 8, reference numeral 11 denotes a control device main body similar to that shown in FIG. 3 above, and an opening 11b is formed in a wall surface 11a. A plate-shaped heat conductive member 10 is brought into contact with the control device main body 11 from the outside so as to close the opening 11b. The heat conductive member 10 is located on the control device main body 11 side (
It is fixed to the control device main body 11 by screws (on the inside). Reference numeral 15 denotes a heat exchange device serving as a heat dissipation member, which has a dissipation portion 15a in which a heat pipe 15b is embedded at a position apart from the control device main body 11, and is attached to the flat surface of the heat conduction member 10. , the heat pipe of the dissipating section 15a is drawn out, and the planar section 15c has a block structure in which the heat pipe is embedded. The flat portion 15c of the heat exchange device 15 is fixed to the heat conductive member 10 with screws from the heat exchange device 15 side. Opening 1 of control device main body 11 of heat conductive member 10
The exposed portion of 1b has an opening 11b of the thermally conductive member 10.
A semiconductor element 3 is attached directly to the surface of the heat conductive member 10 at the exposed portion thereof.

In the control device configured as described above, if the heat exchange device 15 is changed to another one in order to dissipate heat away from the control device main body 11 depending on the ambient conditions of the control device, the control device With the device main body 11 still attached to the heat conductive member 10, thread processing corresponding to the mounting pitch of the heat conductive member 10 is performed on the heat exchange device 15 to be changed, and the heat exchange device 15 after the change is attached to the heat conductive member 10. Attach to.

Although the heat conductive member 10 in the above embodiment is made of aluminum, it is not limited to aluminum, and any material having high thermal conductivity may be used.

Further, although the heat radiation fins 2 and the heat exchange device 15 were used in the above embodiment, the heat radiation fins 2 and the heat exchange device 15
Any type of material that dissipates heat from other conductive materials may be used.

Furthermore, in the above embodiment, for convenience of explanation, a control device was used as an example, but the present invention is not limited to a control device.

In the fourth embodiment, the heat exchanger 15 is used to dissipate the heat generated from the semiconductor elements 3, so that the plurality of semiconductor elements 3 can be easily cooled.

[0027]

As described above, according to the first invention, there is provided a housing in which an electronic component that generates heat is disposed on the inner wall surface, and a housing that faces the electronic component across the wall of the housing. According to the second invention, since the heat conduction member is disposed on the outer wall surface and the heat dissipation member is fixed to the heat conduction member surface in a replaceable manner according to the heat generation capacity of the electronic component, the opening is formed on the wall surface. A heat conductive member is provided, which is abutted against the housing from the outside of the housing so as to close the opening of the housing, and an electronic component is attached to the housing from the inside of the housing. Since the heat dissipation member is fixed so as to be replaceable according to the heat generation method of the electronic component, the heat dissipation member can be easily replaced with a predetermined one without removing the housing from the heat conduction member.

[0028] According to the third invention, there is provided a housing having an opening formed in the wall surface, and an electronic component that is abutted against the housing from the outside so as to close the opening of the housing, and is attached from the inside of the housing. disposing a heat conductive member, the heat conductive member being fixed to the wall surface of the casing by a fixing means, and fixing the heat conductive member to the surface of the heat conductive member so as to be replaceable according to the heat generation capacity of the electronic component; When removing the heat dissipation member, the heat dissipation member is fixed to the wall by the fixing means, so the heat dissipation member can be easily attached to the specified position without removing the housing from the heat conduction member and with the control device in a sealed state. You can change it to something else.

According to the fourth invention, there is provided a housing having an opening formed in the wall surface, and an electronic component that is abutted on the housing from the outside so as to close the opening of the housing, and is attached from the inside of the housing. A heat conductive member is disposed, and a heat pipe having a dissipating portion is embedded in the heat conductive member surface so as to be replaceable according to the heat generation capacity of the electronic component, and the heat pipe has a dissipating portion at a position away from the housing. Since the heat dissipating member having a block structure having a flat surface that can be attached to the heat dissipating member is fixed, the heat dissipating member can be easily replaced with a predetermined one without removing the housing from the surface of the heat conducting member.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional perspective view of a control device according to an embodiment of the present invention.

FIG. 2 is a diagram showing an assembled state of a control device according to an embodiment of the present invention.

FIG. 3 is a partially sectional perspective view of a control device according to another embodiment of the invention.

FIG. 4 is a diagram showing an assembled state of the control device shown in FIG. 3;

FIG. 5 is a partially sectional perspective view of a control device according to another embodiment of the invention.

FIG. 6 is a diagram showing an assembled state of the control device shown in FIG. 5;

FIG. 7 is a partially sectional perspective view of a control device according to another embodiment of the invention.

8 is a diagram showing an assembled state of the control device shown in FIG. 7. FIG.

FIG. 9 is a partially sectional perspective view of a conventional control device.

10 is a diagram showing an assembled state of the control device shown in FIG. 9. FIG.

FIG. 11 is a partially sectional perspective view and a diagram showing an assembled state of a conventional control device.

FIG. 12 is a diagram showing a usage state of the control device shown in FIG. 11;

[Explanation of symbols]

1 Housing (control device main body) 2 Heat dissipation member (heat dissipation fin) 3 Electronic components (semiconductor elements) 4 Control device 5 Housing (control device main body) 5a Wall surface 5b Opening 5c Brim 6 Packing 7 Control cover 8 Control device 9 Fan 10　Heat conductive member 11 Housing (control device main body) 11a Wall surface 11b Opening 12 Housing (control device main body) 12a Wall surface 12b Opening 13 Fixing means (screws) 14 Control device 15 Heat dissipation member (heat exchange device) 15a Dissipation part 15b Heat pipe 15c Plane part

Claims (4)

[Claims] 1. A heat-generating electronic component disposed on an inner wall surface of a casing; a heat conductive member disposed on an outer wall surface of the casing facing the electronic component across a wall of the casing; and a heat dissipation member for dissipating the heat generated by the electronic component that has been transferred through the housing wall and the heat conduction member, and the heat dissipation member is replaceable on the surface of the heat conduction member according to the heat generation capacity of the electronic component. An electronic component storage case characterized by being fixed to. 2. A heat conductor comprising: a housing having an opening formed in a wall surface; and an electronic member attached from the inside of the housing, which is brought into contact with the housing from the outside so as to close the opening of the housing. and a heat dissipation member for dissipating the heat generated by the electronic component that is transferred via the heat conduction member, and the heat dissipation member is replaced on the surface of the heat conduction member according to the heat generation capacity of the electronic component. An electronic component storage housing characterized in that it can be fixed. 3. A heat conductor comprising: a housing having an opening formed in a wall surface; and an electronic member attached from the inside of the housing, which is brought into contact with the housing from the outside so as to close the opening of the housing. and a heat dissipation member for dissipating heat generated by the electronic component that has been transferred via the heat conduction member, and when the heat dissipation member is removed, the heat conduction member does not need to be removed from the wall surface of the housing. An electronic component storage case characterized by having a fixing means for fixing the electronic component. 4. A heat conductor comprising: a housing having an opening formed in a wall surface; and an electronic member attached from the inside of the housing, the housing being in contact with the housing from the outside so as to close the opening of the housing. and a heat dissipation member for dissipating the heat generated by the electronic component transferred via the heat conduction member, the heat dissipation member having a heat pipe embedded therein having a dissipation portion at a position away from the housing. , and has a block structure having a flat part that can be attached to the surface of the heat conductive member.