JPH0421074A - Automatic modification processing method for printed wiring board - Google Patents

Abstract

PURPOSE:To output the information of a disconnected interval as modification instruction information when the modification processing of a printed wiring board is performed by accumulating the information of the disconnected interval by performing the disconnection processing of the wiring pattern of an interval in which the disconnection of wiring is required by the change of a net number. CONSTITUTION:It is decided that the surface packaging component ICs 33-36 are loaded on the printed wiring board 30, and it is decided on which plane, a soldering plane 31 or a component plane 32, the pads of the surface packaging component ICs 33-36 are loaded. The arrangement of all the wiring pattern information connected to the surface packaging component ICs 33-36 for the soldering plane 31 and the component plane 32 are generated, and the change of the net number is extracted by collating the wiring pattern generated last time with that generated this time, and the disconnection of the wiring is required by the change of the net number is performed, and the information of the disconnected interval is accumulated. In such a way, it is possible to output the information of the disconnected interval as the modification instruction information when the modification processing of the printed wiring board 30 is performed.

Description

[Detailed Description of the Invention] [Summary] Regarding a method for modifying a printed wiring board equipped with surface mount devices (SMD), the purpose is to output information on sections where wiring is cut and/or connected as modification instruction information. Then, it is determined that a surface mount component is mounted on the printed wiring board, it is determined whether the pad of the surface mount component is mounted on the solder surface or the component surface, and the pad of the surface mount component is determined to be connected to the surface mount component. Generate an array of all the wiring pattern information for the solder side and component side, compare the previously generated wiring pattern with the currently generated wiring pattern, extract the changes in the net number, and change the wiring by changing the net number. For sections that require cutting, perform wiring pattern cutting processing and store information on the section that was cut, or perform strump line connection processing and connect sections that require wiring connection due to a change in net number. By storing section information,
When modifying a printed wiring board, information on the disconnected section and/or information on the connected section is configured to be output as modification instruction information.

[Industrial Application Field] The present invention relates to a method for modifying printed wiring boards equipped with surface mount devices (SMDs), and particularly relates to printed wiring boards in which the circuits of existing printed wiring boards are modified using a CAD system. The present invention relates to an automatic modification processing method.

Printed wiring boards are generally designed using an automatic design (CAD) system, but after completion of such printed wiring boards, it is necessary to change the circuitry, for example, by cutting the wiring pattern.

Modification processes such as connecting strap wires and outputting drawings showing modification points may be required.

In recent years, with the demand for higher density mounting, surface mount components have become commonly used as components mounted on printed wiring boards, and they have become lighter, have more pins, and have a smaller pitch than before. There is a tendency for narrower ones to be adopted. Therefore, automatic modification of printed wiring boards is becoming increasingly complex and difficult.

Therefore, as a modification processing method for printed wiring boards in such cases, there is no need to manually carry out the modification processing, and the required data on the printed wiring board is stored in the computer to indicate the parts to be modified. It is desired that the information be able to be output automatically.

[Prior Art] Conventionally, the method for mounting components on a printed wiring board is to provide a hole (through hole) in the board and pass the lead wire of the component through this through hole. The mainstream method is to connect and fix the parts by soldering the whole thing after mounting it.

In case 2, the surface of the component to be mounted is constant and the through-hole is a penetrating type, so there is no need to be aware of the layout layer of the through-hole, and you can just focus on the wiring pattern connected to the through-hole. , it was possible to easily perform automatic modification.

[Problem to be solved by the invention]

However, in printed wiring boards using surface mount components, the pads to which the components are connected are connected to the surface on which the components are mounted (
The conventional automatic modification processing method for through-hole type printed wiring boards is
Difficult to deal with. Therefore, ■ When components are mounted on both sides, the solder surface (normally, the L1 surface, which is the bottom surface of an nN printed wiring board, is treated as the component mounting surface, and the top surface, Ln surface, is treated as the solder surface). Pads are no longer recognized. Similarly, even if pads are placed on the same coordinates on both sides, recognition of only one side (component side) makes it impossible to handle the automatic modification process.

■ Since it is no longer possible to handle the automatic remodeling process, it is no longer possible to automate the output of drawings that indicate the areas to be remodeled, and therefore the process must be handled manually. Therefore, the amount of work increases, and errors such as manual entry errors are more likely to occur.

Problems such as this may occur.

The present invention aims to solve the problems of the prior art, and aims to enable information on the section to be cut to be output as modification instruction information during automatic modification processing of a printed wiring board. shall be.

Another object of the present invention is to enable output of information on connected sections as modification instruction information during automatic modification processing of a printed wiring board.

Furthermore, it is an object of the present invention to make it possible to output information on a section to be cut and information on a section to be connected as modification instruction information during automatic modification processing of a printed wiring board.

[Means to solve problems]

As shown in FIG. 1, the present invention determines whether a surface-mounted component is mounted on a printed wiring board through a component determination process 5101, and a mounting surface determination process 5.
102, it is determined whether the pad of this surface mount component is mounted on the solder surface or the component surface, and in the information array generation process 5IO3, the array of all wiring pattern information connected to this surface mount component is soldered. A change extraction process 5104 compares the previously generated wiring pattern with the currently generated wiring pattern to extract changes in the net number, and a cutting process 5105 extracts changes in the net number. A wiring pattern cutting process is performed for a section where the wiring needs to be cut, information on the cut section is stored, and when a printed wiring board is modified, the information on the cut section is output as modification instruction information.

Further, in the component determination step 5101, it is determined that a surface mount component is mounted on the printed wiring board, and in the mounting surface determination step 5102, it is determined whether the pad of this surface mount component is mounted on the solder surface or the component surface. In the information array generation process 5103, an array of all wiring pattern information connected to this surface mount component is generated for the solder side and the component side, and in the change extraction process 51
04, the previously generated wiring pattern and the currently generated wiring pattern are compared to extract changes in the net number, and in the connection processing step 5106, strap lines are added for sections where wiring connection is required due to the change in the net number. The connection process is performed and information on the connected sections is stored, and when the printed wiring board is modified, the information on the connected sections is output as modification instruction information.

Further, in a component determination step 5101, it is determined that a surface mount component is mounted on the printed wiring board, and in a mounting surface determination step 5102, it is determined whether the pad of this surface mount component is mounted on the solder surface or the component surface. In the information array generation process 5103, an array of all wiring pattern information connected to this surface mount component is generated for the solder side and the component side, and in the change extraction process 5
In step 104, the previously generated wiring pattern and the currently generated wiring pattern are compared to extract changes in the net number, and in cutting processing step 5105, the wiring pattern is cut for the section where the wiring needs to be cut due to the change in the net number. Stores information on sections that have been processed and disconnected, and stores information on sections that have been connected by performing strap line connection processing on two sections that require wiring connection due to a change in net number in the connection processing step 5106; When modifying a printed wiring board, information on the disconnected section and information on the connected section are output as modification instruction information.

[Operation] Determines whether a surface mount component is mounted on the printed wiring board, determines whether the pad of this surface mount component is mounted on the solder surface or the component surface, and connects to this surface mount component. By generating an array of all the wiring pattern information for the solder side and the component side, comparing the previously generated wiring pattern with the currently generated wiring pattern, and extracting the changes in the net number, the net number can be changed. For sections where wiring needs to be cut due to changes, the wiring pattern is cut and information about the cut section is stored, so when modifying a printed wiring board, the information about the cut section is output as modification instruction information. can do.

It also determines whether a surface mount component is mounted on the printed wiring board, determines whether the pad of this surface mount component is mounted on the solder surface or the component surface, and determines whether the pad of this surface mount component is mounted on the solder surface or the component surface, and determines whether the pad of this surface mount component is mounted on the solder surface or the component surface. By generating an array of all wiring pattern information for the solder side and component side, comparing the previously generated wiring pattern with the currently generated wiring pattern, and extracting the changes in net numbers, For sections where wiring needs to be connected due to number changes, the wiring pattern is connected and information about the connected section is stored, so when modifying a printed wiring board, the information about this connected section is used as modification instruction information. It can be output as

It also determines whether a surface mount component is mounted on the printed wiring board, determines whether the pad of this surface mount component is mounted on the solder surface or the component surface, and determines whether the pad of this surface mount component is mounted on the solder surface or the component surface, and determines whether the pad of this surface mount component is mounted on the solder surface or the component surface. By generating an array of all the wiring pattern information for the solder side and the component side, and comparing the previously generated wiring pattern with the currently generated wiring pattern to extract the changes in the net number, the net number can be changed. In addition to storing information about the sections that were cut by performing wiring pattern cutting processing on sections that required wiring to be disconnected, and storing information on the sections that were disconnected by performing wiring pattern connection processing on sections that required wiring connection due to changing the net number. Since this information is stored, when modifying the printed wiring board, the information on the disconnected section and the information on the connected section can be output as modification instruction information.

〔Example〕

The automatic modification process of a printed wiring board according to the present invention is performed by the following procedure.

■ Determine whether surface mount components are mounted on the printed wiring board that should undergo automatic modification processing.

■ Determine whether the pads of the mounted surface mount components are formed on the component side or the solder side,
Collect and store information such as part symbol, part number, pad number, coordinates of the pad placement position, layer where the pad is placed, coordinate information (shape information) that determines the shape and shape of the pad, net number of the pad, etc. . Here, the net refers to a section of wiring. For example, the storage means may be stored as a data array inside the computer.

■ Collect and store all wiring patterns connected to pads for each layer. The storage means in this case is the same as in the case of the above-mentioned part symbols.

■ Compare the information on the wiring pattern of the printed wiring board created last time with the information on the wiring pattern created this time, and extract the difference information.

■ This difference information is checked and summarized based on the following criteria.

(In the case of wiring pattern cutting processing) (a) Collect information on wiring sections that have become sections that should be cut due to net number changes. That is, if different net numbers are given to the same wiring, the wiring in that section should not be connected and must be disconnected.

(c) Check the match between the net number of the wiring pattern to be cut and the net number of the pad to determine in which layer the cutting point is located.

(C) Determine whether the starting point or ending point of the wiring pattern to be cut falls within the shape of the pad.

(d) Cut the wiring pattern that satisfies the conditions of (b) and <C) above.

(e) Store the section where the wiring pattern was cut as a result. (This result will be used later in outputting modified drawings) (In case of wiring pattern cutting process) G) Collect information on the section that has been changed to the section to be connected due to the change of the net number. In other words, if the same net number is given to different wires, the wires in that section must be connected.

(B) Check the match between the net number of the section to be connected and the net number of the pad to determine which layer the cutting point is on.

(h) (f), (For those that satisfy the conditions □□□, a process is performed to stretch a strip line between pads.

(i) Store information on sections connected to the strump line.

(This information will be used later in outputting the modified drawings.) The two methods described above may be applied to reconnect the sections connected by the -degree strap line.

■ Repeat the above process for the changed parts of the circuit.

■ Information on modification results (cut section of wiring pattern).

Strap line connection section) is output.

FIG. 2(a), ff1) shows a printed wiring board according to an embodiment of the present invention, in which FIG. 2(a) shows a top view and FIG. 2(b) shows a side view.

FIG. 2(a) shows a case where SMD components are mounted on both sides, with the solid line showing the component side and the dotted line showing the solder side. Moreover, the bold line indicates a double-sided arrangement.

In the figure, 30 indicates a printed wiring board, 31 indicates a solder surface,
32 is a component surface. 33 to 36 are surface-mounted ICs (ICI to IC4), respectively, and as shown in FIG. 2(b), IC33 and IC35 are connected to the component surface, and
C34 and IC36 are connected to the solder surface. IC3
5. The ICs 36 are arranged on both sides at the same position. Each IC
The rectangular part arranged around the band 37 indicates the band 37;
1 to 12 are pad numbers. Also, the printed wiring board
Numbers 1 to 21 on the coordinate axis and numbers 1 to 7 on the Y coordinate axis each indicate coordinate values.

Figures 3 (a) to (d) illustrate the arrangement of information stored inside a computer, where (a) shows the arrangement, and by applying the numbers of all pages to this arrangement, this arrangement can be made. Generate the corresponding number of pads. The shape of the pad is round. 2 rectangles
．． Others are given a 3. Further, regarding the layers on which the pads are formed, the solder side is the first layer, and the component side is the second layer. (b)
shows the arrangement for TCI, and shows the case where it is arranged on the component surface.

(C) shows the arrangement of IC2, and shows the case where it is arranged on the solder surface. (d) shows the arrangement of IC4, and shows the case where it is arranged on the solder surface.

FIGS. 4A and 4B are flowcharts showing the processing procedure of the method of the present invention, and illustrate the case of a two-layer printed wiring board.

First, it is checked in step S1 whether or not there is a surface mount component among the mounted components, and if there is no surface mount component, the process is terminated.

If a surface mount component exists, check whether the surface mount component is mounted on the component surface or the solder surface (step S2). If the surface mount component is mounted on the component surface, when generating the array, check whether the surface mount component is mounted on the component surface or the solder surface. (2) is set (step S3).

If it is a solder surface, the layer (1) of the solder surface is set when generating the array (step 34). The array here means the array generated inside the computer described above.

Next, information on all wiring patterns connected to the pads is collected (step S5). Then, read the previous wiring pattern and compare it with the current one (step S6).
The net number changes are stored (step S7).

When there is a change in the network, collect the sections to be cut (
Step Knob S8) When cutting is required, the wiring pattern is cut and information about the cut section is stored (Step S9).

When disconnection is not necessary and when the disconnection process is finished, the sections to be connected are collected (step 510), when the connection is not necessary, the process is finished, and when the connection is necessary, the strump line connection process is performed. Save the results (step 5)
ll), the process ends. The processing results are output as modified drawings by the CAD system.

Note that such loops are prepared for the number of pads of the mounted components.

[Effects of the Invention] As described above, according to the present invention, during automatic modification processing of a printed wiring board, information on a section to be cut can be output as modification instruction information. Further, during automatic modification processing of a printed wiring board, information on connecting sections can be output as modification instruction information. Further, during automatic modification processing of a printed wiring board, information on sections to be cut and information on sections to be connected can be output as modification instruction information. Therefore, according to the present invention, when modifying a printed wiring board, the process can be performed automatically without manual intervention, and information indicating the modified parts can be output.

[Brief explanation of drawings]

Fig. 1 is a diagram showing the basic configuration of the present invention, Fig. 2(a),
(b) is a diagram showing a printed wiring board according to an embodiment of the present invention, FIGS. 3(a) to (d) are diagrams illustrating the arrangement of information stored inside the computer, and FIGS. 4A and 4B. The figure is a flowchart showing the processing procedure of the method of the present invention. 5101 is a parts determination process, 5102 is a mounting surface determination process,
5103 is an information array generation process, 5104 is a change extraction process, 5105 is a disconnection process, and 5106 is a connection process.

Claims (3)

[Claims] (1) A component determination step (S101) that determines whether a surface mount component is mounted on the printed wiring board, and determines whether the pad of the surface mount component is mounted on the solder surface or the component surface. Mounting surface determination process (S102
), an information array generation step (S103) that generates an array of all wiring pattern information connected to the surface mount component for the solder side and the component side, and an information array generation process (S103) that generates an array of all wiring pattern information connected to the surface mount component on the solder side and the component side; A change extraction process (S104) that compares and extracts changes in the net number; and a cutting process that performs wiring pattern cutting processing on sections where wiring needs to be cut due to net number changes and stores information on the cut sections. (S105). An automatic modification processing method for a printed wiring board, comprising: outputting information on the cut section as modification instruction information during modification processing of the printed wiring board. (2) A component determination step (S101) that determines whether a surface mount component is mounted on the printed wiring board, and determines whether the pad of the surface mount component is mounted on the solder surface or the component surface. Mounting surface determination process (S102
), an information array generation step (S103) that generates an array of all wiring pattern information connected to the surface mount component for the solder side and the component side, and an information array generation process (S103) that generates an array of all wiring pattern information connected to the surface mount component on the solder side and the component side; A change extraction process (S104) that compares and extracts changes in the net number, and a connection process that performs strap line connection processing for sections where wiring connection is required due to a change in net number and stores information on the connected sections. processing step (S106), and outputting information on the connected sections as modification instruction information when modifying the printed wiring board. (3) A component determination step (S101) that determines whether a surface mount component is mounted on the printed wiring board, and determines whether the pad of the surface mount component is mounted on the solder surface or the component surface. Mounting surface determination process (S102
), an information array generation step (S103) that generates an array of all wiring pattern information connected to the surface mount component for the solder side and the component side, and an information array generation process (S103) that generates an array of all wiring pattern information connected to the surface mount component on the solder side and the component side; A change extraction process (S104) that compares and extracts changes in the net number; and a cutting process that performs wiring pattern cutting processing on sections where wiring needs to be cut due to net number changes and stores information on the cut sections. (S105), and a connection process (S106) in which strap wires are connected for sections where wiring needs to be connected due to a change in the net number and information on the connected sections is stored (S106). An automatic modification processing method for a printed wiring board, characterized in that, during processing, information on the disconnected section and information on the connected section are output as modification instruction information.