[go: up one dir, main page]

JPH0420716B2 - - Google Patents

Info

Publication number
JPH0420716B2
JPH0420716B2 JP59142227A JP14222784A JPH0420716B2 JP H0420716 B2 JPH0420716 B2 JP H0420716B2 JP 59142227 A JP59142227 A JP 59142227A JP 14222784 A JP14222784 A JP 14222784A JP H0420716 B2 JPH0420716 B2 JP H0420716B2
Authority
JP
Japan
Prior art keywords
processing machine
laser
frame
press
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59142227A
Other languages
Japanese (ja)
Other versions
JPS61154781A (en
Inventor
Ryuji Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amada Co Ltd
Original Assignee
Amada Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amada Co Ltd filed Critical Amada Co Ltd
Priority to JP59142227A priority Critical patent/JPS61154781A/en
Publication of JPS61154781A publication Critical patent/JPS61154781A/en
Publication of JPH0420716B2 publication Critical patent/JPH0420716B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/10Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 a 産業上の利用分野 本発明は、レーザ加工機とプレス加工機とを複
合化したレーザ・プレス複合加工機に関する。
DETAILED DESCRIPTION OF THE INVENTION a. Field of Industrial Application The present invention relates to a combined laser/press processing machine that combines a laser processing machine and a press processing machine.

b 従来技術 従来、レーザ加工機とプレス加工機とを複合化
した技術としては、特公昭58−11318号公報(以
下単に先行例と称す)に記載のごとき構成のもの
がある。
b. Prior Art Conventionally, as a technology that combines a laser processing machine and a press processing machine, there is a structure as described in Japanese Patent Publication No. 11318/1988 (hereinafter simply referred to as a prior example).

c 発明が解決しようとする問題点 前記先行例の構成においては、レーザ加工機に
おけるレーザ発生機とプレス加工機のフレームと
は離間分離した構成であるので、運搬時には別々
に運搬しなければならず、かつ工場に設置時には
レーザビームの光路系の再調整が必要であるなど
の問題点がある。
c Problems to be solved by the invention In the configuration of the preceding example, the laser generator of the laser processing machine and the frame of the press processing machine are separated and must be transported separately. Moreover, there are problems such as the need to readjust the optical path system of the laser beam when installing it in a factory.

d 問題点を解決するための手段 前述のごとき従来の問題点に鑑みて、本発明は
板材にレーザ加工を行なうレーザ加工機のフレー
ムの内側に、前記板材にプレス加工を行なうプレ
ス加工機のフレームを防振ダンパを介して内装し
てなるものである。
d. Means for Solving the Problems In view of the above-mentioned conventional problems, the present invention provides a frame for a press processing machine that performs press processing on the plate material, inside the frame of a laser processing machine that performs laser processing on the plate material. This is done internally via an anti-vibration damper.

e 作用 上記構成により、運搬しようとするときには、
レーザ加工機とプレス加工機とを同時に一体的に
運搬することができると共に、省スペース化、光
学系の調整の容易化を図ることができる。
e Effect With the above configuration, when trying to transport,
The laser processing machine and the press processing machine can be transported simultaneously, and space can be saved and the optical system can be easily adjusted.

f 実施例 第1図は、本発明に係るレーザ・プレス複合加
工機を概略的に示すもので、レーザ加工機のフレ
ーム3の内側にプレス加工機のフレーム(金型ホ
ルダ)7を防振ダンパ9を介して内装した構成を
なしている。
f Embodiment FIG. 1 schematically shows a laser press combined processing machine according to the present invention. 9 is installed internally.

より詳細には、レーザ加工機とプレス加工機と
複合化した複合加工機1においては、レーザ加工
機のフレーム3が高く立ち上つて設けてあり、後
方にはレーザ発診機などのレーザ発生装置5が設
けてある。
More specifically, in a multi-tasking machine 1 that combines a laser processing machine and a press processing machine, the frame 3 of the laser processing machine stands up high, and a laser generator such as a laser diagnosis machine is installed at the rear. 5 is provided.

上記したレーザ加工機のフレーム3の内側に
は、フレーム3と同じようにC形状の金型ホルダ
7が設けてある。
Like the frame 3, a C-shaped mold holder 7 is provided inside the frame 3 of the laser processing machine described above.

金型ホルダ7は前後2ケ所の下で4つの防振ダ
ンパ9で上下方向の振動を吸収してレーザ加工機
のフレーム3には上下方向の振動が伝達されない
ようにしてある。
The mold holder 7 absorbs vibrations in the vertical direction with four vibration dampers 9 at two locations on the front and rear, so that the vibrations in the vertical direction are not transmitted to the frame 3 of the laser processing machine.

また環状の防振ダンパ11が前方から見た金型
ホルダ7の左右の中間高さ位置に設けてあり、丸
軸13が左右に出没する振動がレーザ加工機のフ
レーム3に伝わらないように吸収している。
In addition, an annular vibration damper 11 is provided at a mid-height position between the left and right sides of the mold holder 7 when viewed from the front, and absorbs the vibration caused by the round shaft 13 moving left and right so that it is not transmitted to the frame 3 of the laser processing machine. are doing.

更に第1図の環状防振ダンパ11の斜め下方か
ら2本のピストンロツド状の防振ダンパ15が設
けてあつて、前後方向の振動と上下方向の振動に
対して防振の作用を行なつている。
Furthermore, two piston rod-shaped vibration dampers 15 are provided diagonally below the annular vibration damper 11 shown in FIG. There is.

金型ホルダ7のC字形上腕の前端には流体圧シ
リンダ17が設けてあり、C字形ののぞ部に垂直
に設けた回転軸19には本実施例ではセクタ上盤
21とセクタ下盤23が1体的に回動自在に設け
てある。上記したセクタ上盤21とセクタ下盤2
3とは図示を省略した揺動機構によつて金型ホル
ダ7の上下の腕の左右中心位置にパンチ25と対
応するダイ27の中心を位置させることができ
る。
A fluid pressure cylinder 17 is provided at the front end of the C-shaped upper arm of the mold holder 7, and a sector upper plate 21 and a sector lower plate 23 are mounted on a rotating shaft 19 provided perpendicularly to the C-shaped groove in this embodiment. is rotatably provided as a single unit. Above sector upper board 21 and sector lower board 2
3, the center of the die 27 corresponding to the punch 25 can be positioned at the horizontal center position of the upper and lower arms of the mold holder 7 by means of a swinging mechanism (not shown).

また同じ位置にレーザを下向きに通過させて、
セクタ下盤23に配置した加工物をレーザ加工す
る貫通孔29,31を位置させることができるの
である。
Also, pass the laser downward at the same position,
The through holes 29 and 31 for laser processing the workpiece placed on the sector lower plate 23 can be located.

かくてレーザ発生装置5から複合加工機1の上
腕に導かれたレーザ33は、上腕の中の第1ミラ
ー35によつて下向きに方向を変え、上腕に設け
た上下方向の貫通孔37を通過してセクタ上盤2
1に向かう。
In this way, the laser 33 guided from the laser generator 5 to the upper arm of the multitasking machine 1 changes its direction downward by the first mirror 35 in the upper arm, and passes through the vertical through hole 37 provided in the upper arm. Sector upper board 2
Head to 1.

次にレーザ33はセクタ上盤21上に設けた第
2ミラー39と第3ミラー41を経て、セクタ上
盤21とセクタ下盤23の貫通孔29とセクタ下
盤23の貫通孔31と更に金型ホルダ7の下腕に
設けた貫通孔43を通過し、スラツグボツクス4
5に達する。
Next, the laser 33 passes through the second mirror 39 and third mirror 41 provided on the sector upper plate 21, and then passes through the through holes 29 of the sector upper plate 21 and the sector lower plate 23, the through holes 31 of the sector lower plate 23, and then the metal. It passes through the through hole 43 provided in the lower arm of the mold holder 7, and the slug box 4
Reach 5.

セクタ上盤21の貫通孔29の周囲には、アシ
ストガスの噴射ノズルや集塵吸気口などが設けて
あるが図示は省略してある。
An assist gas injection nozzle, a dust collection intake port, etc. are provided around the through hole 29 of the sector upper panel 21, but these are not shown.

前記したパンチ25とダイ27の対を流体圧シ
リンダ17の直下に位置させてパンチング加工を
する時は、前記したスラツグボツクス45は打抜
きかすの収容箱になるのである。
When punching is performed by positioning the punch 25 and die 27 directly below the hydraulic cylinder 17, the slug box 45 becomes a box for storing punching scraps.

g 発明の効果 以上のごとき実施例の説明により理解されるよ
うに、要するに本発明は、板材にレーザ加工を行
なうレーザ加工機のフレーム3の内側に、前記板
材にプレス加工を行なうプレス加工機のフレーム
7を防振ダンパ9を介して内装してなるものであ
る。
g. Effects of the Invention As understood from the description of the embodiments above, in short, the present invention provides a laser processing machine that performs press processing on a plate material inside the frame 3 of a laser processing machine that performs laser processing on a plate material. A frame 7 is installed inside with a vibration damper 9 interposed therebetween.

上記構成より明らかなように、本発明において
は、レーザ加工機のフレーム3とレーザ加工機の
フレーム7とは別個に設けてあつて、上記レーザ
加工機のフレーム3の内側にプレス加工機のフレ
ーム7が防振ダンパ9を介して内装してあるもの
である。
As is clear from the above configuration, in the present invention, the frame 3 of the laser processing machine and the frame 7 of the laser processing machine are provided separately, and the frame of the press processing machine is provided inside the frame 3 of the laser processing machine. 7 is installed internally via an anti-vibration damper 9.

したがつて本発明によれば、板材のプレス加工
時における振動がレーザ加工機側へ伝達されて悪
影響を受けることを防止できることは勿論のこと
であるが、レーザ加工機のフレーム3の内側にプ
レス加工機のフレーム7を内装したことにより、
レーザ加工機に対してプレス加工機を付加した態
様となり、省スペース化に効果を奏すると共に組
立後における運搬が容易であり、かつ光学系の調
整が容易なものである。
Therefore, according to the present invention, it is of course possible to prevent vibrations during press processing of a plate material from being transmitted to the laser processing machine side and be adversely affected. By installing the frame 7 of the processing machine internally,
This is an embodiment in which a press processing machine is added to a laser processing machine, which is effective in saving space, easy to transport after assembly, and easy to adjust the optical system.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例の斜視図。 図面の主要部を表わす符号の説明、1…レー
ザ、パンチ複合加工機、7…金型ホルダ、9…防
振ダンパ、11…(環状)防振ダンパ、15…
(ピストンロツド状)防振ダンパ、21…セクタ
上盤、25…パンチ、27…ダイ、33…レー
ザ。
FIG. 1 is a perspective view of an embodiment of the invention. Explanation of the symbols representing the main parts of the drawings: 1... Laser, punch multi-tasking machine, 7... Mold holder, 9... Anti-vibration damper, 11... (annular) anti-vibration damper, 15...
(Piston rod type) anti-vibration damper, 21... Sector upper plate, 25... Punch, 27... Die, 33... Laser.

Claims (1)

【特許請求の範囲】 1 板材にレーザ加工を行なうレーザ加工機のフ
レーム3の内側に、前記板材にプレス加工を行な
うプレス加工機のフレーム7を防振ダンパ9を介
して内装してなることを特徴とするレーザ・プレ
ス複合加工機。 2 レーザ加工機により板材に加工を行なうとき
の加工位置と、プレス加工機により板材にプレス
加工を行なうときの加工位置とが同一位置である
ことを特徴とする特許請求の範囲第1項記載のレ
ーザ・プレス複合加工機。
[Claims] 1. A frame 7 of a press processing machine that performs press processing on the plate material is installed inside a frame 3 of a laser processing machine that performs laser processing on the plate material via a vibration damper 9. Features: Laser press combined processing machine. 2. The processing position according to claim 1, characterized in that the processing position when processing the plate material with a laser processing machine and the processing position when press processing the plate material with a press processing machine are the same position. Laser press combined processing machine.
JP59142227A 1984-07-11 1984-07-11 Compound laser beam and punch processing machine Granted JPS61154781A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59142227A JPS61154781A (en) 1984-07-11 1984-07-11 Compound laser beam and punch processing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59142227A JPS61154781A (en) 1984-07-11 1984-07-11 Compound laser beam and punch processing machine

Publications (2)

Publication Number Publication Date
JPS61154781A JPS61154781A (en) 1986-07-14
JPH0420716B2 true JPH0420716B2 (en) 1992-04-06

Family

ID=15310368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59142227A Granted JPS61154781A (en) 1984-07-11 1984-07-11 Compound laser beam and punch processing machine

Country Status (1)

Country Link
JP (1) JPS61154781A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5563636B2 (en) * 2012-09-07 2014-07-30 ファナック株式会社 Injection molding machine with anti-vibration structure of heavy electrical panel
PL3130426T3 (en) 2015-08-13 2019-08-30 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Machine tool with a stamping device and a laser processing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5811318A (en) * 1981-07-13 1983-01-22 Ohbayashigumi Ltd Stack

Also Published As

Publication number Publication date
JPS61154781A (en) 1986-07-14

Similar Documents

Publication Publication Date Title
JPH0420716B2 (en)
JP3157859B2 (en) Laser punch combined machine
JPH08224619A (en) Work bending method and device therefor
US3973427A (en) Mold changing apparatus for a press machine
CA2355858A1 (en) A combination punch press and laser machine
JP2837710B2 (en) Laser / Punch combined processing machine
JP3910719B2 (en) Plate material positioning device and plate material processing machine
JPH06126349A (en) Turret punch press
JPH0353830Y2 (en)
JP2724195B2 (en) Punch / Laser combined processing machine
JPH06315837A (en) Composite machining unit
JP3281401B2 (en) Turret punch press
JP2894503B2 (en) Punch press
JPH07314198A (en) Frame of press machine
JPH05261600A (en) Press die assembly
JP2588820Y2 (en) Wrap film roll support device
JPH065800U (en) Frame structure for press machine
JP2000051973A (en) Plate working machine
JPH07314199A (en) Press machine
JP3092268B2 (en) High rigidity calendar frame
JPH0929363A (en) Work table in plate machine
JPH05192834A (en) Composite machine
JP2000343502A (en) Device for holding material for traveling circular sawing machine and the like
JPH09206850A (en) Punching press
JPH1043897A (en) Punch press