JPH04207059A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enhance heat dissipation properties by transferring the heat on the top of a semiconductor chip generating a large quantity of heat where there exist junction patterns by way of insulation resin. CONSTITUTION:TAB tape 30 is bonded with a semiconductor chip 24 by an ordinary process. After the bonding the semiconductor chip 24 and the TAB tape are clamped from both sides and bonded with a package main body 22 and a lid 38 with insulation resin 28. Since they are formed in this manner, not only heat can be dissipated from the bottom of the semiconductor chip 24 by way of the insulation resin 28 and the package main body 22 but also directly from the lid 38 heat can be dissipated by way of the insulation resin from the top of the semiconductor chip 24 generating a large quantity of heat where there exist junction patterns, which provides excellent heat dissipation properties.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a semiconductor device with excellent heat dissipation.

(Prior Art) In recent years, semiconductor chips have become increasingly highly integrated and generate a large amount of heat, so the semiconductor package in which they are mounted is required to have excellent heat dissipation.

For this reason, conventional ceramic semiconductor packages are
As shown in the figure, a semiconductor chip 12 is placed on a heat sink 10.
After electrically connecting the semiconductor chip 12 and the internal wiring pattern with wires 14, the semiconductor chip 12 is hermetically sealed with a lid 16 made of metal or ceramic.

(Problems to be Solved by the Invention) According to the above semiconductor device, heat can be radiated from the lower surface side of the semiconductor chip 12 through the heat sink 10.

However, as described above, semiconductor chips 12 are becoming increasingly highly integrated, and depending on the semiconductor chip 12, a problem has arisen in which heat dissipation is insufficient just by dissipating heat to the bottom surface of the chip as described above. In particular, semiconductor chips generate a large amount of heat on the top surface where there is a junction pattern, but as mentioned above, the inside of the package is only hermetically sealed by the lid 16 and there is an air layer inside that has poor heat conductivity. Heat dissipation to the outside through the lid 16 and the side walls of the package was extremely insufficient.

Therefore, the present invention has been made to solve the above-mentioned problems, and its purpose is to provide a semiconductor chip that has a high degree of integration and is equipped with a semiconductor chip that generates a large amount of heat, and that also has excellent heat dissipation properties. We are here to provide you with the equipment.

(Means for Solving the Problems) In the present invention according to the above object, a semiconductor chip is housed in a package body, hermetically sealed by a lid, and the semiconductor chip and external connection leads are electrically connected. In the semiconductor device, the lid is made of a material having a thermal expansion coefficient close to that of the semiconductor chip, and has a protrusion formed on its inner surface that protrudes close to the upper surface of the semiconductor chip, and is made of an insulating resin on the lower surface of the protrusion. The external connection lead, which is joined to the top surface of the semiconductor chip through the TAB tape and is electrically connected to the semiconductor chip, is a TAB tape whose inner lead is connected to the semiconductor chip and whose outer lead is led out to the outside of the package body. The TAB tape is characterized in that a midway portion thereof is sealed in an insulating resin that seals between the lid edge and the package body edge that are opposed to each other.

Preferably, in the semiconductor device, the entire space surrounded by the package body and the lid is filled with an insulating resin.

Furthermore, it is advantageous in terms of cost if the package body is made of ceramic.

(Function) Heat from the upper surface of the semiconductor chip, which has a junction pattern and generates a large amount of heat, is transmitted to the lid via the insulating resin, and the heat can be radiated directly from the lid to the outside, resulting in extremely excellent heat dissipation. Furthermore, since the lid is made of a material whose coefficient of thermal expansion is close to that of the semiconductor chip, thermal stress on the semiconductor chip can be reduced.

(Embodiments) Hereinafter, the present invention will be described in detail based on preferred embodiments and the accompanying drawings.

FIG. 1 shows a cross-sectional view of a semiconductor device 20. As shown in FIG.

In the figure, 22 is a ceramic package body, which has a recess 26 for accommodating a semiconductor chip 24. The semiconductor chip 24 is housed in the recess 26 while being bonded with an insulating resin 28.

30 is T A B (Tape Automated
Bonding) tape (lead for external connection),
The inner 32 is connected to the semiconductor chip 24 by the bump 36.
The outer lead 34 is connected to the package body 22.
Externally derived.

A lid 38 is made of a material that has excellent heat dissipation properties and has a coefficient of thermal expansion close to that of the semiconductor chip 24, such as Mo material, W material, AfN material, SiC material, Cu-W material, etc.

A protrusion 40 is formed on the inner surface of the lid 38 facing the upper surface of the semiconductor chip 24 so that its lower surface protrudes close to the upper surface of the semiconductor chip 24 . The lid 38 has its protrusion 4
0, the semiconductor chip 24 is covered with an insulating resin 28 on the lower surface.
While being bonded to the upper surface, the peripheral edge of the lower surface is also sealed to the upper peripheral surface of the package body 22 with insulating resin 28 . Further, the TAB tape 30 described above also has its middle portion sealed and fixed in the insulating resin 28.

42 is a radiation fin fixed to the upper surface of the lid 38.

The insulating resin 28 is preferably a polyimide resin which has excellent heat resistance. Further, it is preferable that the insulating resin 28 is filled so as to completely fill the gap between the package body 22 and the lid 38.

The package body 22 is A! It is effective to use a material with excellent heat dissipation properties such as , Cu, and AlN.Furthermore, if a material with a coefficient of thermal expansion close to that of the semiconductor chip 24 is used for the lid 38, the semiconductor chip 24
This is preferable because it can reduce thermal stress on the body.

The method for manufacturing the semiconductor device 20 described above is not particularly limited, but for example, the TAB tape 30 is bonded to the semiconductor chip 24 by a normal process, and then the semiconductor chip 24 and the TAB tape 30 are sandwiched from both sides and packaged with an insulating resin 28. It is preferable that the main body 22 and the lid 38 be bonded together.

Since it is formed as described above, not only can heat be radiated from the bottom surface of the semiconductor chip 24 through the insulating resin 28 and the package body 22, but also the insulating resin 28 can be radiated from the top surface of the semiconductor chip 24, which has a junction pattern and generates a large amount of heat. Since heat can be directly radiated from the lid 38 through the lid 38, the heat radiation performance is extremely excellent.

Furthermore, since the TAB tape 30 is used for the external connection leads, it is possible to cope with highly integrated semiconductor chips 24 and the high heat generated at that time, and the package body 22 also requires an internal wiring pattern. Therefore, it is possible to provide a semiconductor device that has a simple structure, is thin, and is inexpensive.

Note that the upper surface side of the semiconductor chip 24, which generates a large amount of heat, only needs to be bonded to the protrusion 40 of the lid 38, and the lower surface side of the semiconductor chip 24 does not necessarily have to be bonded to the package body 22. A gap may exist between the bottom surface and the bottom surface. In this case as well, there is no particular problem because heat can be dissipated from the upper surface side of the semiconductor chip 24, which generates a large amount of heat.

Although various preferred embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. be.

(Effects of the Invention) As described above, according to the semiconductor device according to the present invention, heat from the upper surface side of the semiconductor chip where a junction pattern is present and which generates a large amount of heat is transmitted to the lid via the insulating resin.
Heat can be dissipated directly from the lid to the outside, providing excellent heat dissipation. Furthermore, since the lid is made of a material whose coefficient of thermal expansion is close to that of the semiconductor chip, thermal stress on the semiconductor chip can be reduced. Furthermore, since TAB tape is used for external connection leads, it can be used with highly integrated semiconductor chips, and the package itself does not require an internal wiring pattern, resulting in a simple and thin structure, providing an inexpensive semiconductor device. I can do it.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an example of a semiconductor device, and FIG. 2 is a sectional view of a conventional ceramic semiconductor device. 22...Package body, 24...Semiconductor chip, 28...Insulating resin, 30...TAB tape, 38...Lid. Figure 1 Figure 2

Claims (1)

[Claims] 1. A semiconductor device in which a semiconductor chip is housed in a package body, hermetically sealed by a lid, and the semiconductor chip and external connection leads are electrically connected, wherein the lid is a semiconductor chip. It is made of a material having a coefficient of thermal expansion close to that of the chip, and has a protrusion formed on its inner surface that protrudes close to the top surface of the semiconductor chip, and a protrusion that protrudes close to the top surface of the semiconductor chip on the bottom surface of the protrusion through an insulating resin. The external connection leads that are bonded and electrically connected to the semiconductor chip are made of a TAB tape whose inner leads are connected to the semiconductor chip and whose outer leads are led outside the package body.
2. A semiconductor device, wherein the tape is sealed in an insulating resin that seals a gap between the lid edge and the package body edge, which are opposite to each other, at a midway portion thereof. 2. The semiconductor device according to claim 1, wherein the entire space surrounded by the package body and the lid is filled with an insulating resin. 3. The semiconductor device according to claim 1 or 2, wherein the package body is made of ceramic.