JPH04199558A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH04199558A JPH04199558A JP2335358A JP33535890A JPH04199558A JP H04199558 A JPH04199558 A JP H04199558A JP 2335358 A JP2335358 A JP 2335358A JP 33535890 A JP33535890 A JP 33535890A JP H04199558 A JPH04199558 A JP H04199558A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- solder
- chip
- lead frame
- suspension lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 239000000725 suspension Substances 0.000 abstract description 15
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 235000011511 Diospyros Nutrition 0.000 description 1
- 244000236655 Diospyros kaki Species 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、リードフレームに関し、詳しくはチップと
ダイパッドを半田付けをしたときに、余剰半田のリード
フレームの吊りリートへの流れ止めに関するものである
。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to lead frames, and more specifically, to preventing excess solder from flowing to a hanging lead of a lead frame when a chip and a die pad are soldered. be.
第５図は従来のリードフレームを示す平面図、第６図は
第５図の側面図である。図において、（１）はチップ、
（２）はダイパッド、（３）は吊り一ド、（４）は半田
の流延を防止するための凹部、（４１）は隙間である。FIG. 5 is a plan view showing a conventional lead frame, and FIG. 6 is a side view of FIG. 5. In the figure, (1) is a chip,
(2) is a die pad, (3) is a hanging rod, (4) is a recessed portion for preventing solder from flowing, and (41) is a gap.
次に動作について説明する。チップ（１）をダイパッド
（２）に半田付けする場合、上記チップ（］）と上記ダ
イパッド（２）との接合には、事実上必要とされる以上
に半田か消費され、この余剰の半田か吊リード（３）を
伝って流延していく。このとき、吊リード（３）に設け
られた半田の流延を防止するための凹部（４）に保留さ
れて、半田の流延が止められることになるが、一部の半
田が隙間（４１）を通って流れることがある。Next, the operation will be explained. When the chip (1) is soldered to the die pad (2), more solder than is actually required is consumed to join the chip (]) and the die pad (2), and this surplus solder is It spreads along the hanging lead (3). At this time, the solder is retained in the recess (4) provided in the suspension lead (3) to prevent the solder from spreading, and the solder is stopped from spreading. ) may flow through.
従来のリードフレームは以上のように構成されているの
で、半田の流延を防止するための凹部（４）は、吊り一
ド（３）上に隙間（４）があり、そこから半田か吊り一
ドの凹部（４）をこえてしまうことと、上記凹部（４）
にはいった半田か溜りきらずに、吊リート（３）上を流
延するなとの問題点があった。Since the conventional lead frame is constructed as described above, the recess (4) for preventing the solder from spreading has a gap (4) above the hanging lead (3), from which the solder or hanging Exceeding the concave part (4) of one door, and the concave part (4)
There was a problem in that the solder that had entered the mold should not be poured onto the hanging leat (3) without being completely collected.
この発明は上記のような問題点を解消するために、なさ
れたもので、この発明はチップとダイパッドを半田付け
するに際し、余剰の半田が吊り一ドに流延することなく
、上記吊リートを保つことができるリードフレームを得
ることを目的とする。This invention was made in order to solve the above-mentioned problems, and this invention prevents excess solder from spreading over the hanging lead when soldering a chip and a die pad. The aim is to obtain a lead frame that can be maintained.
この発明に係るリードフレームは、吊リードのリード幅
全体にわたって、凹凸部を設け、上記凹部で半田を保留
し、上記凸部で半田の流延を防止する構成であることを
特徴とする。The lead frame according to the present invention is characterized in that a concave and convex portion is provided over the entire lead width of the suspension lead, the concave portion retains solder, and the convex portion prevents the solder from spreading.
この発明におけるリードフレームは、吊リートに凹凸部
を設け、上記吊リードのチップから凹凸部より後までの
長さを、上記凹凸部をつけない部分よりも長くすること
により、チップとダイパッドを半田づけしたときに出る
余分な半田か、上記凹凸部のところに留まり、上記半田
の吊り一トへの流れを止める。In the lead frame of the present invention, the hanging lead is provided with an uneven portion, and the length of the hanging lead from the chip to the rear of the uneven portion is longer than the portion without the uneven portion, so that the chip and the die pad are soldered. The excess solder that comes out when the solder is attached stays on the uneven portion and stops the solder from flowing to the hanging part.
以下、この発明を図に基づいて説明する。 Hereinafter, this invention will be explained based on the drawings.
第１図はこの発明の一実施例によるリードフレームを示
す側面図、第２図は第１図の平面図である。図において
、（１）はチップ、（２）はチップ（１）を装着するダ
イパッド、（３）はリードフレームの吊リート、（４）
は吊リート（３）に装着した凹部、（５）は凸部である
。FIG. 1 is a side view showing a lead frame according to an embodiment of the present invention, and FIG. 2 is a plan view of FIG. 1. In the figure, (1) is the chip, (2) is the die pad on which the chip (1) is mounted, (3) is the lead frame suspension lead, (4)
(5) is a concave portion attached to the hanging leat (3), and a convex portion (5).
次に動作について説明する。チップ（１）とダイ′バッ
ト（２）を接着するだめの半田の余りか、リードフレー
ムの吊リート（３）を伝わって、前記半田は、吊リート
（３）に装着した凹部（４）に入り、上記凹部が前記半
田で満たされても、凸部（５）で前記半田が止まる。Next, the operation will be explained. The remaining solder from bonding the chip (1) and the die butt (2) passes through the suspension leat (3) of the lead frame, and the solder is applied to the recess (4) attached to the suspension leat (3). Even if the concave portion is filled with the solder, the solder stops at the convex portion (5).
なお、上記実施例では、リードフレームの吊り−Ｆに設
ける凹凸部は一組であるか、第３図および第４図に示す
ように、凹凸部を２組連続に設ける、すなわち複数個の
凹凸を設けてもよい。In the above embodiment, the number of uneven portions provided on the suspension -F of the lead frame is one set, or as shown in FIGS. 3 and 4, two consecutive sets of uneven portions are provided, that is, a plurality of uneven portions are provided. may be provided.
以上のように、この発明によれば、リードフレームの吊
リードに凹凸部を設けるように構成したので、リードフ
レームの製造行程に与える影響も少なく、またリードフ
レームの強度に与える影響も少ないという効果かある。As described above, according to the present invention, since the suspension leads of the lead frame are configured to have uneven parts, there is less influence on the manufacturing process of the lead frame, and there is also less influence on the strength of the lead frame. There is.
第１図はこの発明の一実施例によるリードフレームを示
す側面図、第２図は第１図の平面図、第３図はこの発明
の他の実施例によるリードフレームを示す側面図、第４
図は第３図の平面図、第５図は従来のリードフレームを
示す平面図、第６図は第５図の側面図である。
図において、（３）は吊り一ド、（４）、（６）は吊り
−ドに装着した凹部、（５）、 （７）は凸部である。
なお、各図中、同一符号は同一または相当部分を示す。
代 理 人 大 岩 増 雄第１図
５：凸各Ｐ外
第３図
２：凹ｊ部へ
７：凸柿降FIG. 1 is a side view showing a lead frame according to one embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a side view showing a lead frame according to another embodiment of the present invention, and FIG.
3 is a plan view of FIG. 3, FIG. 5 is a plan view showing a conventional lead frame, and FIG. 6 is a side view of FIG. 5. In the figure, (3) is the hanging door, (4) and (6) are the recesses attached to the hanging door, and (5) and (7) are the convex parts. In each figure, the same reference numerals indicate the same or corresponding parts. Agent Dai Iwa Masuo Figure 1 5: Convex outside each P Figure 3 2: Concave j part 7: Convex persimmon drop
Claims (1)
ドのリード幅全体にわたって、凹凸部を設け、上記凹部
で半田を保留し、上記凸部で半田の流延を防止する構成
であることを特徴とするリードフレーム。A lead frame having a suspended lead, characterized in that a concave and convex portion is provided over the entire lead width of the suspended lead, the concave portion retains solder, and the convex portion prevents solder from spreading. flame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2335358A JPH04199558A (en) | 1990-11-28 | 1990-11-28 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2335358A JPH04199558A (en) | 1990-11-28 | 1990-11-28 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04199558A true JPH04199558A (en) | 1992-07-20 |
Family
ID=18287638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2335358A Pending JPH04199558A (en) | 1990-11-28 | 1990-11-28 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04199558A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925927A (en) * | 1996-12-18 | 1999-07-20 | Texas Instruments Incoporated | Reinforced thin lead frames and leads |
| JP2005026370A (en) * | 2003-06-30 | 2005-01-27 | Kyocera Corp | Piezoelectric actuator and ink jet recording head having the same |
-
1990
- 1990-11-28 JP JP2335358A patent/JPH04199558A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925927A (en) * | 1996-12-18 | 1999-07-20 | Texas Instruments Incoporated | Reinforced thin lead frames and leads |
| JP2005026370A (en) * | 2003-06-30 | 2005-01-27 | Kyocera Corp | Piezoelectric actuator and ink jet recording head having the same |
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