JPH04197590A - Laser beam machine - Google Patents

Abstract

PURPOSE:To facilitate machining program by providing a tapping work device constituted so as to execute the tapping work just after executing boring work, in a laser beam machine. CONSTITUTION:The laser beam machine arranging machining head 27 for executing cutting work by applying the laser beam to a work with a Z-axis slider 25 relatively shifted on X-Y plane together with the work to be cut and also freely shifted to Z-axial direction, is constituted by providing the machining head 27 and the tapping work device 37 as exchangeable to a swinging shaft 31 in a tool exchanging device 29 arranged to the Z-axis slider 23 and arranging laser beam machining position and tapping work position in the same axis. By this method, the boring work and the tapping work are reasonably executed and further, without any hinderance to the machining range, the machining program is facilitated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing machine equipped with a processing head and a replaceable tapping device.

(Conventional technology) Conventionally, a pilot hole is formed in a workpiece made of plate material, etc.
This prepared hole may be tapped. One method for such cases is to drill a pilot hole in the workpiece using a laser beam machine, and then move the workpiece with the pilot hole drilled to a tapping processing device that is separate from the laser beam machine, and then tap the pilot hole into the workpiece. It is generally known that processing is carried out.

(Problems to be Solved by the Invention) By the way, in the above-mentioned conventional technology, hole processing using a laser processing machine and tapping processing using a tapping processing device are performed in separate processes, which is very laborious and time-consuming. There is a problem.

Therefore, it is possible to temporarily attach the tapping device to the laser processing machine, but in this case, the tapping device is often placed at a position offset from the position of the laser processing head. Therefore, there are problems in that the processing range is limited and the cannibal program is also complicated.

The object of the present invention is to provide a laser processing machine with a tapping device, to streamline the process so that tapping can be performed immediately after drilling a hole, and to perform laser processing without interfering with the processing range of the machine. The aim is to provide the opportunity.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention provides a method that moves within the X-Y plane relative to the workpiece to be cut and is movable in the z-axis direction. A laser processing machine has a Z-axis slider equipped with a processing head that performs cutting by irradiating the workpiece with a laser beam, and the processing head and tapping are connected to a rotation axis of a tool changer provided on the Z-axis slider. The laser processing apparatus is configured such that the processing apparatus is replaceable, and the laser processing position and the tapping processing position are coaxially provided.

(Function) By employing the laser processing machine of the present invention, a laser beam is irradiated from the processing head to a desired position on a workpiece such as a plate material to form a hole.

Next, the turning shaft of the tool changer is rotated, the tapping device is positioned at the machining position where the machining head was located, and the hole is tapped.

Therefore, hole drilling and tapping processing can be performed rationally without moving the workpiece to another process location.
Furthermore, the addition of a nitrogen program, which would otherwise be a hindrance to the machining range, is not complicated and can be easily performed.

(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.

Referring to FIG. 4, a carbon dioxide laser oscillator 3, for example, is mounted on the rear side of the laser processing machine 1, and is configured to oscillate a laser beam LB toward a laser processing bag W1.

The laser processing machine 1 is composed of a base 5, a post 7 vertically erected on the base 5, and a beam member 9 horizontally supported above the base 5 via the post 7 in a cantilevered manner. There is. A work table 11 on which a work W is placed is provided on the top of the base 5, and a moving positioning device 13 is provided on the right side of the work table 11 to freely position the work W in the X-Y axis directions. It is being

A processing head device 15 is provided at the tip of the beam member 9, and the processing head device 15 transmits the laser beam LB from the laser oscillator 3 through a built-in mirror assembly 17, a focusing lens 19, and a nozzle 21. It is configured to irradiate the workpiece W with the beam.

As shown in FIG. 1, the processing head device 15 is equipped with a Z-axis slider 23 that is movable in the Z-axis direction (vertical direction in FIG. 1). A connecting pipe 25 is provided at the lower part of the pipe. Moreover, a processing head 27 is attached to the lower surface of the connecting pipe 25.

A tool exchange bag a129 is fixed to the two-axis slider 23, and a pivot shaft 31 is rotatably attached to the lower axis of the tool exchanger 29 by a known drive device (not shown). An arm member 33 extending in the left and right direction in FIG. A device t37 is provided.

In the state shown in Fig. 1, a control device (not shown) controls the tool exchange bag [
A command is given to 37 to rotate the pivot shaft 31, and the machining head 27 is attached to the connecting pipe 25. That is, in the state shown in FIG. 1, the workpiece W is irradiated with the laser beam LB from the nozzle 21 of the processing head 27,
For example, as shown in Figure 3, multiple holes (tap pilot holes)
H can be opened.

Next, in response to a command for tapping, the laser oscillator 3 is stopped, and a command is given from the control device to the tool changer 37, so that the pivot shaft 31 rotates, and as shown in FIG. 37 is attached to the lower surface of the connecting pipe 25, and the hole H shown in FIG. 3 is tapped.

At this time, the tap 35 is driven by air to the machining head 27.
After being positioned below the position of the nozzle 21, vertical feeding is performed by vertically moving the Z-axis slider 23. The rotation of the tap 35 itself is performed by air using a known mechanism.

In this way, the two tool changers change the laser processing axis of the processing head 27 and the tapping axis of the tapping processing device 37 (i.e., the axis of the nozzle 21 and the axis of the tap 35).
can be exchanged on the same axis, so there is no restriction on the machining range, and there is no complexity on the machine program.
Preparation hole processing and tapping processing for cutting can be performed rationally.

Note that this invention is not limited to the embodiments described above, and can be implemented in other forms by making appropriate changes.

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, the machining head and the tapping device can be freely exchanged on the rotation axis of the tool changer provided on the Z-axis slider. In addition, by providing the laser processing position and the tapping processing position on the same axis, hole processing and tapping processing can be performed rationally without moving the workpiece to a separate process location. Furthermore, it does not interfere with the processing range, and the cannibalization program is not complicated and can be easily carried out.

[Brief explanation of the drawing]

Fig. 1 shows the main parts of the present invention, with an enlarged detailed view of the laser processing device, Fig. 2 an enlarged detailed view of the laser processing device when the processing head and the tapping processing device have been replaced, and Fig. 3 A plan view of the workpiece for explanation of machining and tapping,
FIG. 4 is a side view of a laser processing machine according to an embodiment of the present invention. 1... Laser processing machine 3... Laser oscillator 1
5... Processing head device 21... Nozzle 23...
Z-axis slider 27... Processing head 29... Tool changer f 31... Rotating axis 35... Tap 37... Tapping processing device agent Patent attorney Hidekazu Miyoshi 1 Laser processing machine 3. Laser Generator 151. Processing gear device 21 Nozzle 23-Z axis nullider
27 Processing head 29...Tool exchange bag ffi
3]-! 10 axes 35・riyl 37-Tapping processing device A

Claims (1)

[Claims] Laser processing in which a Z-axis slider that moves in the X-Y plane relative to the workpiece to be cut and is movable in the Z-axis direction is provided with a processing head that performs cutting by irradiating the workpiece with a laser beam. The machining head and the tapping device are replaceably provided on the rotation axis of the tool changer provided on the Z-axis slider, and the laser processing position and the tapping processing position are provided coaxially. Characteristic laser processing machine.