JPH04184966A - Lead frame of semiconductor device - Google Patents

Abstract

PURPOSE:To eliminate resin burrs to spring out form the outer edges of a lead frame to the outside and to contrive to prevent the manufacturing environment of a semiconductor device form being deteriorated by a method wherein a hole part in a resin reservoir is provided in such a way as to penetrate a metal substrate along with patterns, such as outer lead parts, inner lead parts and the like. CONSTITUTION:A resin reservoir with a hole part 16 opened therein is formed in the interior of a metal substrate 11 by a simultaneous processing along with patterns, such as outer leads 12 and the like. A gate 20 is provided on the side, where opposes to the hole part 16, of a molding die and the molding die is provided with an air vent on the eside of the hole part 16. When a melted resin is introduced in the molding die through the gate 20, the resin is extracted in such a way as to push out the air in the die via the air vent and at the same time, is filled in the die and an excess resin flows out outside of an enclosure 18 via the air vent. In the case an outflow resin 21 is much, the tip part 22 of the resin 21 remains in the hole part 16. After the introduction of the resin is completed, the cooling and solidification of the resin are waited and the resin is removed from the die. Thereby, resin burrs to spring out from the outer edges of a lead frame 10 to the outside are eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention applies to lead frames of semiconductor devices whose envelopes are formed by resin molding, for example.

(Prior Art) As is conventionally known, semiconductor devices whose envelopes are made of resin are widely used as consumer semiconductor devices because they are easy to manufacture.

Such a semiconductor device is formed on a lead frame of a metal substrate into which external leads, openings for arranging a semiconductor chip, internal leads, etc. have been processed.

Therefore, one semiconductor device formed using a conventional lead frame will be described with reference to the drawings.
FIG. 4 shows a molded product after resin molding during the formation of a conventional semiconductor device, with FIG. 4(a) being a plan view and FIG. 4(b) being a side view.

In addition, FIG. 4(a) is a drawing seen in the direction of arrow A in FIG. 4(b).

1 is a lead frame made of a metal substrate, and this lead frame 1 has a plurality of external leads 2 and each external lead 2.
Internal leads (not shown) provided correspondingly to the holes, openings for arranging semiconductor chips, etc. are formed. Reference numeral 3 denotes an envelope formed by resin molding, and a semiconductor chip connected to internal leads is sealed inside the envelope 3.

Further, 4 is a launch that serves as a flow path for the molten resin when molding the envelope 3, and 5 is a gate branched from the runner 4, through which the resin is introduced into the mold for the envelope 3. Ru. Furthermore, the resin introduced into the mold of the envelope 3 is
The air inside the mold is pushed out through an air vent provided opposite the gate 5, and the resin filled in the mold and containing the excess air is released outside the envelope 3. It is designed to flow out, and 6 indicates the resin flowing out.

In the semiconductor device manufacturing process, the half-formed semiconductor device shown in FIG.
Then, the external leads 3 are separated or plated.

Furthermore, the external leads 3 are bent into a predetermined shape to complete the semiconductor device.

However, in conventional products configured in this way, the air inside the mold may escape through the air vent depending on the type of resin, design of the mold, manufacturing conditions, molding machine, molding conditions, etc. when molding the envelope 3. In both cases, the resin flows out onto the surface of the lead frame 1, and the resin solidifies and remains in the shape of an air vent. At this time, if there is a large amount of resin 6 flowing out,
The outflowing resin 6 may protrude from the outer edge of the lead frame 1 and form a resin burr 7.

Since the resin burrs 7 of the spilled resin 6 are protruding from the lead frame 1, they cannot be carried on the conveyance system formed according to the external dimensions of the lead frame 1 during the resin molding process or subsequent processes. There is a risk that it may get lost, touch something else, or fall off due to being hit by something else, causing problems in each process and deteriorating the manufacturing environment.

On the other hand, if the amount of resin flowing out from the air vent is reduced to prevent resin burrs from forming, there is a risk that air will be trapped in the resin of the molded envelope 3, which may cause damage to the semiconductor device. Problems arise, such as the inability to maintain stable characteristics and performance.

Furthermore, molding and manufacturing in consideration of the above-mentioned problems requires a lot of effort in starting up the process for the first time and managing the process during production.

(Problems to be Solved by the Invention) The present invention has been made in view of the above-mentioned situation where there is a risk of deteriorating the manufacturing environment or causing problems with the performance of semiconductor devices. A semiconductor device that eliminates resin burrs flying out from the outer edge, prevents deterioration of the manufacturing environment, provides semiconductor devices with good performance, and eliminates the need for a lot of effort for process start-up and process management. Our goal is to provide lead frames for

[Structure of the invention]

(Means for Solving the Problems) A lead frame of a semiconductor device of the present invention includes a metal substrate,
This device having an external lead, an internal lead, and a semiconductor chip arrangement portion formed on a metal substrate is characterized in that the metal substrate is provided with an opening for a resin reservoir formed through the metal substrate. .

(Function) Since the lead frame of the semiconductor device configured as described above is provided with an opening for a resin reservoir, the resin flowing out from the mold through the air vent during resin molding is stored in the opening. This eliminates resin burrs that fly out from the outer edge, eliminates the deterioration of the manufacturing environment, and eliminates the need for a lot of effort to start up and manage the process, making it possible to produce high-quality semiconductor devices. .

(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3.

First, a first embodiment will be explained with reference to FIGS. 1 and 2.

Fig. 1 is a plan view of this example, Fig. 2 shows a molded product after resin molding during the formation of a semiconductor device according to this example, and Fig. 2 Ca) is a plan view. 2(b) is a side view. Note that FIG. 2(a) is a drawing viewed in the direction of arrow B in FIG. 2(b).

In the figure, 10 is a lead frame, which is constructed on a metal substrate 11 made of, for example, Fe--Ni alloy or phosphor bronze. Patterns corresponding to a plurality of semiconductor devices are formed on this metal substrate 11 by pressing, photo-etching, or the like. Note that the figure shows a pattern corresponding to one semiconductor device. Among the patterns formed on the metal substrate 11, 12 are a plurality of external leads provided, and these external leads 12 are connected to each other by a narrow portion, and are connected to the metal substrate 11. It has become.

Furthermore, one end of each of the internal leads 13 provided at a distance is formed so as to be continuous with one end of each external lead 12. The other end portion forms an opening 15 that serves as a placement portion where the semiconductor chip 14 is placed. Note that the terminal of the semiconductor chip 14 disposed in the opening 15 and the other end of a predetermined internal lead 13 are connected by a lead wire.

Reference numeral 16 designates an opening in the interior of the metal substrate 11 for forming a resin reservoir with a through hole along the outer edge of one side, and is formed by simultaneous processing with the pattern of the external lead 12 and the like. Note that 17 is a sprocket hole used for transportation or positioning during process work.

Furthermore, 18 is an envelope made of, for example, epoxy resin or silicone resin, and the internal leads 13 and the semiconductor chip 14 connected thereto are sealed with the resin.

Furthermore, in producing the semiconductor device, the terminals of the semiconductor chip 14 placed in the openings 15 of the lead frame 10 and the other ends of the predetermined internal leads 13 are connected by lead wires, and this is molded with resin. It is fixed to the mold of the envelope 18 of the machine and molded. 19 is a launch that serves as a flow path for molten resin during resin molding, and 20 is a runner 1.
Resin is introduced into the mold of the envelope 18 through the gate 20, which is a gate branched from the gate 9.

Further, in the mold, a gate 20 is provided at a position opposite to the cavity 16 of the lead frame 10 with the semiconductor chip 14 disposed therebetween, and an air vent is provided on the cavity 1B side. . Therefore, when molten resin is introduced into the mold through the gate 20, the resin introduced into the mold is removed by pushing out the air in the mold through the air vent, and is also filled into the mold, and the excess is removed. The resin entrained in the air flows out of the envelope 18 through the air vent. Reference numeral 21 indicates outflowing resin flowing out from the air vent, and when there is a large amount of outflowing resin 21, the tip 22 will accumulate in the cavity 1B. After the introduction of the resin into the mold is completed, the molded product is removed from the mold after waiting for the resin to cool and solidify. In the case formed in this way, the outflowing resin 21 accumulates in the hollow part 16 forming a resin reservoir,
No resin burrs are formed protruding from the outer edge of the lead frame IO.

Therefore, even in the resin molding process and subsequent processes, the metal substrate 11 can be placed on a conveyance system formed according to the external dimensions without equal support, and resin burrs can be avoided by touching or hitting other objects. There is no risk of the particles falling off and causing trouble in each process or deteriorating the manufacturing environment.

In addition, since there is no need to reduce the amount of resin flowing out from the air vent to prevent resin burrs, the envelope 1
No air is trapped in the resin in step 8,
The characteristics and performance of the semiconductor device can be improved.

Furthermore, it is possible to reduce the labor involved in setting delicate molding conditions at the beginning of the molding process, starting up, or managing the process during production.

Next, a second embodiment will be explained with reference to FIG.

FIG. 3 is a plan view showing the molded product after resin molding during the formation of the semiconductor device according to this embodiment.

In the figure, 24 is a lead frame made of a metal substrate 25 made of the same material as in the first embodiment, and patterns corresponding to a plurality of semiconductor devices are formed on the metal substrate 25, and the pattern in the figure is for one semiconductor device. The corresponding part of the pattern is shown. Among the patterns formed on the metal substrate 25, 26 is a plurality of external leads provided, and these external leads 2B are connected to each other by a narrow portion, and are connected to the metal substrate 25. It has become.

Furthermore, one end of an internal lead 27 is formed to be continuous with one end of each external lead 2B. Further, a semiconductor chip 28 of an optical semiconductor is placed in an opening 29 formed by the other end of these internal leads 27.
are arranged, and the terminals of the semiconductor chip 28 and the other ends of the predetermined internal leads 27 are connected by lead wires.

Further, reference numeral 30 denotes a perforation part that forms a resin reservoir by cutting out the outer edge 31 of one side of the metal substrate 25, and a perforation part 30 that forms a resin reservoir.
It is formed by simultaneous processing with other patterns.

Note that 32 is a sprocket hole used for transportation or positioning during process work.

Further, 33 is an envelope made of resin as in the first embodiment, and this envelope 33 includes a cover 34 for the light receiving section.
is provided, and the inner lead 2 is connected by the envelope 33.
7 and the semiconductor chip 28 connected thereto are sealed with resin.

Furthermore, in producing a semiconductor device, the lead frame 24, in which the semiconductor chip 28 is connected to the internal leads 27, is fixed to a mold of a resin molding machine and molded.

Furthermore, the mold is provided with an air vent force on the side of the perforation 30, and a gate 20 is provided on the side facing the perforation 30 with the semiconductor chip 28 disposed therebetween. When molten resin is introduced into the mold, the air inside the mold is pushed out through the air vent, and the resin is filled into the mold, and the excess air is rolled up. The poured resin flows out of the envelope 33 through the air vent. 21 indicates the resin flowing out from the air vent, and if there is a large amount of flowing material or fat 21, the tip 22 will flow out of the perforation 30. After the introduction of the resin into the mold is completed, the molded product is removed from the mold after the resin is cooled and solidified. The outer edge 31 of the lead frame 25 accumulates within the perforation 30 forming a reservoir.
There is no chance of resin burrs popping out from the surface and forming resin burrs.

As described above, in this embodiment, by setting the size of the perforated portion 30 appropriately in advance, there is no risk of it protruding from the outer edge 31 of the lead frame 25, and the same effect as in the first embodiment can be achieved. can be obtained.

It should be noted that the present invention is not limited to the embodiments described above and shown in the drawings, but can be implemented with appropriate modifications within the scope of the invention.

[Effects of the Invention] As is clear from the above description, the present invention provides the following effects by providing patterns for the external leads, internal leads, etc., as well as the perforations for the resin reservoir. In other words, there are no resin burrs flying out from the outer edge, and there are no problems caused by fallen resin burrs.
It is possible to prevent deterioration of the manufacturing environment, to obtain a semiconductor device with good performance, and to eliminate the need for much labor for starting up the process and managing the process.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a first embodiment of the present invention, and FIG.
a) is a plan view showing a molded product in the middle of forming a semiconductor device according to the first embodiment, FIG. 2(b) is a side view of the molded product in FIG. 2(a), and FIG. 3 is a diagram showing the implementation of ff1i2. A plan view showing a molded product in the middle of forming a semiconductor device according to an example, FIG. 4(a)
4(b) is a plan view showing a molded product in the process of forming a semiconductor device according to a conventional example, and FIG. 4(b) is a side view of the molded product shown in FIG. 4(a). lO...Lead frame, 11...Metal substrate, 1
2...External lead, 13...Internal lead,
14... Semiconductor chip, 15... Opening part (placement part), 16... Perforation part. Agent: Patent Attorney Norio Ogo Figure 3 Figure 4

Claims (1)

[Claims] A device having a metal substrate and a portion for arranging external leads, internal leads and a semiconductor chip formed on the metal substrate, characterized in that the metal substrate is provided with a cavity portion for a resin reservoir formed through the metal substrate. Lead frames for semiconductor devices.