JPH04166139A - ultrasonic depth probe - Google Patents
ultrasonic depth probeInfo
- Publication number
- JPH04166139A JPH04166139A JP2293276A JP29327690A JPH04166139A JP H04166139 A JPH04166139 A JP H04166139A JP 2293276 A JP2293276 A JP 2293276A JP 29327690 A JP29327690 A JP 29327690A JP H04166139 A JPH04166139 A JP H04166139A
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- micro piezoelectric
- width
- ultrasonic probe
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims description 27
- 238000004804 winding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は柱体とした基台の外表面に微小圧電片を配列し
た超音波探触子を利用分野とし、特に基台を円柱体とし
たラジアル型の微小圧電片の電極導出方法に関する。Detailed Description of the Invention (Industrial Field of Application) The field of the present invention is an ultrasonic probe in which minute piezoelectric pieces are arranged on the outer surface of a cylindrical base. This invention relates to a method for deriving electrodes from a radial type micro piezoelectric piece.
（発明の背景）
超音波探触子は医用関係等の超音波診断装置にＭ−Ｉｆ
波の送受波源として有用される。近年では−例えば体腔
内に挿入してその部分を診断するラジアル型のものがあ
る。(Background of the invention) Ultrasonic probes are used as M-If in ultrasonic diagnostic equipment such as medical equipment.
Useful as a source for transmitting and receiving waves. In recent years, for example, there are radial type devices that are inserted into a body cavity to diagnose that area.
（従来技術）
第４図はこの種の一従来例を説明する超音波探触子の図
で、同図（ａ）はフレキシブル基板を除く平面図、同図
（ｂ）は正面図である。(Prior Art) Fig. 4 is a diagram of an ultrasonic probe illustrating a conventional example of this type, in which Fig. 4(a) is a plan view excluding the flexible substrate, and Fig. 4(b) is a front view.
超音波探触子は、複数の微小圧電片Ｊ−が列設したバッ
キング材２を、円柱状の基台３に周回して構成される。The ultrasonic probe is constructed by surrounding a cylindrical base 3 around a backing material 2 in which a plurality of minute piezoelectric pieces J- are arranged in a row.
各微小圧電片１は短冊状として両主面に電極（未図示）
を有し、二層とした音響整合層４を形成される。また、
各微小圧電片１の一端側にはフレキシブル基板５を接続
し、導電路６により各電極を導出される。なお、これら
はバッキング材２に圧電板を固着して音響整合層４及び
フレキシブル基板５を設けた後、一体的に切新分割され
る。そして、バッキング材２を基台３の外周に周回して
形成される。Each micro piezoelectric piece 1 has a strip shape with electrodes on both main surfaces (not shown).
A two-layer acoustic matching layer 4 is formed. Also,
A flexible substrate 5 is connected to one end of each micro piezoelectric piece 1, and each electrode is led out through a conductive path 6. In addition, after fixing the piezoelectric plate to the backing material 2 and providing the acoustic matching layer 4 and the flexible substrate 5, these are integrally divided. Then, the backing material 2 is formed around the outer periphery of the base 3.
フレキシブル基板５は、第５図に示したように一端側を
微小圧電片１の配列幅Ｗとし、その中頃以降の両＠鱈に
幅広とする突出部を設ける。そして、各微小圧電片１に
接続した導電路６を延出して、突出部に電極ランド７を
設ける。なお、電極ランド７には図示しないケーブルの
各線路が接続される。なお、第５図（ａ）は基台を除く
展開新面図、同図（ｂ）は平面図、同図（Ｃ）は基台の
図である。As shown in FIG. 5, the flexible substrate 5 has an array width W of the micro piezoelectric pieces 1 on one end side, and has protrusions that widen the width on both sides after the middle. Then, the conductive path 6 connected to each micro piezoelectric piece 1 is extended, and an electrode land 7 is provided on the protrusion. Note that each line of a cable (not shown) is connected to the electrode land 7. 5(a) is a developed new view excluding the base, FIG. 5(b) is a plan view, and FIG. 5(C) is a view of the base.
このようなものでは− フレキシブル基板５の長さによ
って、電極ランド７間の間隔を大きくできて、特に電極
ランド７間に入り込む導電路の配線パターンを容易にす
る。そして、微小圧電片１の幅（約２００μ以下）及び
その間隔は非常に小さく（約１００μ以下）でも、ケー
ブルの各線路の接続作業を可能にする。In such a device, the distance between the electrode lands 7 can be increased depending on the length of the flexible substrate 5, and the wiring pattern of the conductive path that intrudes between the electrode lands 7 is particularly facilitated. Even if the width of the micro piezoelectric pieces 1 (approximately 200 μm or less) and the spacing between them are very small (approximately 100 μm or less), each line of the cable can be connected.
（従来技術の問題点）
しかしながら、上記構成の超音波探触子では、フレキシ
ブル基板５の電極ランド７間の間隔を大きくすると、フ
レキシブル基板５は必然的に長くなる。したがって、体
腔内に挿入する探触子としては不適当となる。また、電
極ランド７ｍ＋が重畳して線路の接続作業を不便にし、
作業性を低下させる問題があった。(Problems with the Prior Art) However, in the ultrasonic probe having the above configuration, when the distance between the electrode lands 7 of the flexible substrate 5 is increased, the flexible substrate 5 inevitably becomes longer. Therefore, it is unsuitable as a probe to be inserted into a body cavity. In addition, the electrode land 7m+ overlaps, making line connection work inconvenient.
There was a problem that reduced workability.
（発明の目的）
本発明はフレキシブル基板の長さを小さくして作業性を
良好にする、特にラジアル型に適した超音波探触子を提
供することを目的とする。(Objective of the Invention) An object of the present invention is to provide an ultrasonic probe particularly suitable for a radial type, which improves workability by reducing the length of a flexible substrate.
（解決手段）
本発明は、微小圧電片の一端側に接続するフレキシブル
基板の延出端側の幅を微小圧電片の配列幅より大きくす
るとともに該延出端側に段部を設けて、該各段部に電極
ランドを形成し、前記フレキシブル基板を巻回したとき
、前記電極ランドが露出するようにしたことを解決手段
とする。以下、本発明の一実施例を説明する。(Solution Means) The present invention makes the width of the extending end side of the flexible substrate connected to one end side of the micro piezoelectric pieces larger than the arrangement width of the micro piezoelectric pieces, and also provides a stepped portion on the extending end side. The solution is to form an electrode land at each step so that the electrode land is exposed when the flexible substrate is wound. An embodiment of the present invention will be described below.
（実施例）
Ｉｒ１図は１本発明の一実施例を説明する超音波探触子
の図で−同図（、）は斜視図、同図（ｂ）は断面図であ
る。な駁 前従来例図と同一部分には同番号を付与して
その説明は簡略する。(Embodiment) Figure Ir1 is a diagram of an ultrasonic probe illustrating an embodiment of the present invention - the figure (,) is a perspective view, and the figure (b) is a sectional view. The same parts as those in the previous conventional example figure are given the same numbers and their explanation will be simplified.
超音波探触子は、前述同様に、短冊状とした複数の微小
圧電片１をバッキング材２に固着し、円柱状の基台３に
周回して列設される。微小圧電片は例えば２５６１！と
する。なお、両生面には電極（未図示）を、放射面側に
音響整合層４を形成される。そして、この実施例では、
微小圧電片の一端側に設けるフレキシブル基板１０を次
のようにする。In the same manner as described above, the ultrasonic probe has a plurality of small piezoelectric pieces 1 in the form of strips fixed to a backing material 2, and is arranged in a row around a cylindrical base 3. For example, the micro piezoelectric piece is 2561! shall be. Note that electrodes (not shown) are formed on the amphibodiic surface, and an acoustic matching layer 4 is formed on the radiation surface side. And in this example,
The flexible substrate 10 provided on one end side of the micro piezoelectric piece is made as follows.
フレキシブル基板１０は微小圧電片１の一端側に配列幅
Ｗと等しい幅の接続領域１１−を有する。The flexible substrate 10 has a connection region 11- having a width equal to the array width W at one end of the micro piezoelectric piece 1.
そして、接続領域１１から幅を広げて延出し、第１とｊ
１２の配線領域１２（ａｂ）を設ける。第１とＩｒ２の
配線領域１２（ａｂ）は中央からそれぞれ両端側までと
し、その幅を配列幅Ｗと等しくする。また− 延出端側
に段部を形成されてその長さを異にする。そして、各段
部（上下段）をランド領域とし、それぞれ１２８１１１
の電極ランド１３を均等な間隔として一列に形成される
。各電極ランド１３には各微小圧電片１の電極を導出す
る導電路１４が接続される。そして、バッキング材２を
基台３の外周に固着するとき、第１配線領域１２ａを下
側に、第２配線領域１２ｂを上側にして巻回される。Then, it extends from the connection area 11 with a wider width, and connects the first and j
Twelve wiring areas 12 (ab) are provided. The first and Ir2 wiring regions 12 (ab) extend from the center to both ends, and their widths are made equal to the array width W. Furthermore, a stepped portion is formed on the extending end side and has different lengths. Then, each step (upper and lower steps) is set as a land area, and each 128111
The electrode lands 13 are formed in a line with equal intervals. A conductive path 14 leading out the electrode of each micro piezoelectric piece 1 is connected to each electrode land 13 . When the backing material 2 is fixed to the outer periphery of the base 3, it is wound with the first wiring region 12a on the lower side and the second wiring region 12b on the upper side.
このようなものでは、第１とｊ１！２の各配線領域１２
（ａｂ）の幅を配列幅Ｗに一致させ、しかも上下段部に
電極ランド１３を設けたので５巻回した際、電極ランド
１３は重畳することなく、その外周面に全てを露出する
。そして、各配線領域１２（ａｂ）の幅を微小圧電片１
の配列幅Ｗとして電極ランド１３数を微小圧電片１の半
数としたので、電極ランド１３間を微小圧電片１間の約
２倍にすることができる。したがって、フレキシブル基
板１０の長さを大きくすることなく、電極ランド間１３
を充分にしてケーブルの各線路との接続を容易にし、作
業性を高めることができる。また、各導電路１４の間隔
も同様に約２倍以上にでき、その配線パターンの設計製
作をも容易にする。In such a case, each of the first and j1!2 wiring regions 12
The width of (ab) is made to match the array width W, and the electrode lands 13 are provided at the upper and lower stages, so when the electrode lands 13 are wound five times, they are not overlapped and are completely exposed on the outer circumferential surface. Then, the width of each wiring area 12 (ab) is determined by the minute piezoelectric piece 1
Since the number of electrode lands 13 is set to half the number of micro piezoelectric pieces 1 as the array width W, the distance between the electrode lands 13 can be approximately twice the distance between the micro piezoelectric pieces 1. Therefore, without increasing the length of the flexible substrate 10, the distance between the electrode lands 13
This makes it possible to easily connect each line of the cable and improve work efficiency. Furthermore, the spacing between the conductive paths 14 can also be approximately doubled or more, making it easier to design and manufacture the wiring pattern.
（他の事項）
なお、上記実施例では、フレキシブル基板Ｊ−０に上下
の段部を設けて３１１と第２の配線領域１−２（ａ ｂ
）とし、各段部に電極ランド１３を設けたが、微小圧電
片１の数等により段部を３段以上のｎ段とし、各段部に
電極ランド１３を設けてもよい「第３図（ａ）」。また
、電極ランド１３は各上下段に一列に設けたが５例えば
２列以上の複数列にしたとしてもよいものであるｒｌ！
３図（ｂ）」。また、フレキシブル基板１０には微小圧
電片１の配列幅と等しい接続領域１１を設けたが、この
幅はフレキシブル基板の幅であってもよい「第３図（Ｃ
）」。また、基台は円柱体としたが、柱状体であれば同
様に適用できる９本発明はこのように、その趣旨を逸脱
しない範囲内で適宜に変更可能であり、基本的にはフレ
キシブル基板１０の幅を広げるとともに段部を設けて電
極ランド１３を形成し、巻回したとき電極ランド１３が
露出するように構成したものはその技術適範囲に含まれ
るものである。(Other Matters) In the above embodiment, upper and lower steps are provided on the flexible substrate J-0, and the upper and lower steps 311 and the second wiring area 1-2 (a b
), and an electrode land 13 is provided at each step, but depending on the number of micro piezoelectric pieces 1, etc., the step may be made into three or more n steps, and an electrode land 13 may be provided at each step. (a)”. Further, although the electrode lands 13 are provided in one row on each upper and lower stage, they may be provided in multiple rows, for example, two or more rows.
Figure 3 (b). Further, although the flexible substrate 10 is provided with a connection area 11 that is equal to the array width of the micro piezoelectric pieces 1, this width may be the width of the flexible substrate.
)”. In addition, although the base is a columnar body, any columnar body can be similarly applied.9 The present invention can be modified as appropriate without departing from the spirit of the invention, and basically the flexible substrate 10 A structure in which the electrode land 13 is formed by widening the width and providing a stepped portion so that the electrode land 13 is exposed when it is wound is within the appropriate range of the technology.
（発明の効果）
本発明は、微小圧電片の一端側に接続するフレキシブル
基板の延出＠側の幅を微小圧電片の配列幅より大きくす
るとともに該延出＠側に段部を設けて、該各段部に電極
ランドを形成し、前記フレキシブル基板を巻回したとき
、前記電極ランドが露出するようにしたので、フレキシ
ブル基板の長さを小さくして作業性を良好にする。特に
ラジアル型に適した超音波探触子を提供でき、その実際
上の価値は大きいものである。(Effects of the Invention) The present invention includes making the width of the extension @ side of the flexible substrate connected to one end side of the micro piezoelectric pieces larger than the array width of the micro piezoelectric pieces, and providing a stepped portion on the extension @ side. Since an electrode land is formed on each step and the electrode land is exposed when the flexible substrate is wound, the length of the flexible substrate is reduced and workability is improved. In particular, it is possible to provide an ultrasonic probe suitable for radial type, and its practical value is great.
第１図は本発明の一実施例を説明する図で、同図（ａ）
は斜視図、同図（ｂ）は新面図である。
簗２図は上記実施例中の特徴小圧電片に接続したフレキ
シブル基板の平面図である。
第３図（→ｃｂ％ｐ）は本発明の他の実施例を説明する
特に微小圧電片に接続したフレキシブル基板の図である
。
１１４図は一従来例を説明する超音波探触子の図で。
同図（ａ）はフレキシブル基板を除く平面図、同図（ｂ
）は正面図である。１１！５図（ａ）は同従来例の基台
を除く展開状態の断面図、同図（ｂ）は同平面図、同図
（ｃ）は基台の図である。
第１１２１FIG. 1 is a diagram illustrating an embodiment of the present invention, and FIG.
is a perspective view, and the same figure (b) is a new view. Figure 2 is a plan view of the flexible substrate connected to the characteristic small piezoelectric piece in the above embodiment. FIG. 3 (→cb%p) is a diagram illustrating another embodiment of the present invention, particularly a flexible substrate connected to a micro piezoelectric piece. FIG. 114 is a diagram of an ultrasonic probe illustrating a conventional example. The same figure (a) is a plan view excluding the flexible board, the same figure (b)
) is a front view. Figure 11!5 (a) is a sectional view of the conventional example in an expanded state excluding the base, Figure 11 (b) is a plan view of the same, and Figure 11 (c) is a diagram of the base. No. 1121
Claims (1)
、前記微小圧電片の一端側にフレキシブル基板を設けて
、前記微小圧電片の電極とフレキシブル基板の導電路と
を接続し、該フレキシブル基板を巻回して前記基台の延
出方向に導出した超音波探触子において、 上記フレキシブル基板の幅を上記微小圧電片の配列幅よ
り大きくするとともに延出端側に段部を設けて、該各段
部に電極ランドを形成し、 前記フレキシブル基板を巻回したとき、前記電極ランド
を露出させて構成したことを特徴とする超音波探触子。[Claims] A plurality of micro piezoelectric pieces are arranged on the outer circumferential surface of a columnar base, a flexible substrate is provided on one end side of the micro piezoelectric pieces, and the electrodes of the micro piezoelectric pieces and the flexible substrate are connected to each other. In an ultrasonic probe connected to a conductive path and guided in the extending direction of the base by winding the flexible substrate, the width of the flexible substrate is made larger than the arrangement width of the micro piezoelectric pieces and the ultrasonic probe is extended. An ultrasonic probe characterized in that a stepped portion is provided on an end side, an electrode land is formed on each stepped portion, and the electrode land is exposed when the flexible substrate is wound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2293276A JP2847575B2 (en) | 1990-10-30 | 1990-10-30 | Ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2293276A JP2847575B2 (en) | 1990-10-30 | 1990-10-30 | Ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04166139A true JPH04166139A (en) | 1992-06-12 |
| JP2847575B2 JP2847575B2 (en) | 1999-01-20 |
Family
ID=17792733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2293276A Expired - Fee Related JP2847575B2 (en) | 1990-10-30 | 1990-10-30 | Ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2847575B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19539163A1 (en) * | 1994-10-20 | 1996-05-02 | Olympus Optical Co | Electronic radially scanning ultrasonic probe for e.g. endoscope investigating inside patient |
| FR2740933A1 (en) * | 1995-11-03 | 1997-05-09 | Thomson Csf | ACOUSTIC PROBE AND METHOD FOR PRODUCING THE SAME |
| WO2006040972A1 (en) * | 2004-10-15 | 2006-04-20 | Olympus Medical Systems Corp. | Electronic radial type ultrasonic vibrator, and ultrasonic endoscope and its manufacturing method |
| JP2006167282A (en) * | 2004-12-17 | 2006-06-29 | Hitachi Medical Corp | Ultrasonic probe and ultrasonic diagnostic apparatus using the same |
| WO2007145182A1 (en) * | 2006-06-12 | 2007-12-21 | Olympus Medical Systems Corp. | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
| JP2009147365A (en) * | 2009-03-09 | 2009-07-02 | Ge Medical Systems Global Technology Co Llc | Flexible printed board, ultrasonic probe, and method for manufacturing ultrasonic probe |
| US7757389B2 (en) | 2006-06-28 | 2010-07-20 | Ge Medical Systems Global Technology Company, Llc | Method of manufacturing an ultrasonic probe |
| CN110494084A (en) * | 2017-04-03 | 2019-11-22 | 奥林巴斯株式会社 | Ultrasonic endoscope |
| US11589837B2 (en) | 2017-04-18 | 2023-02-28 | Olympus Corporation | Ultrasound transducer, ultrasound endoscope, and method of manufacturing ultrasound transducer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6758272B2 (en) | 2017-10-24 | 2020-09-23 | オリンパス株式会社 | Ultrasonic oscillator and ultrasonic endoscope |
-
1990
- 1990-10-30 JP JP2293276A patent/JP2847575B2/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19539163A1 (en) * | 1994-10-20 | 1996-05-02 | Olympus Optical Co | Electronic radially scanning ultrasonic probe for e.g. endoscope investigating inside patient |
| US5685311A (en) * | 1994-10-20 | 1997-11-11 | Olympus Optical Company, Ltd. | Image display system |
| DE19539163C2 (en) * | 1994-10-20 | 2001-11-29 | Olympus Optical Co | Ultrasound probe |
| FR2740933A1 (en) * | 1995-11-03 | 1997-05-09 | Thomson Csf | ACOUSTIC PROBE AND METHOD FOR PRODUCING THE SAME |
| WO1997017145A1 (en) * | 1995-11-03 | 1997-05-15 | Thomson-Csf | Acoustic probe and method for making same |
| WO2006040972A1 (en) * | 2004-10-15 | 2006-04-20 | Olympus Medical Systems Corp. | Electronic radial type ultrasonic vibrator, and ultrasonic endoscope and its manufacturing method |
| JP2006167282A (en) * | 2004-12-17 | 2006-06-29 | Hitachi Medical Corp | Ultrasonic probe and ultrasonic diagnostic apparatus using the same |
| WO2007145182A1 (en) * | 2006-06-12 | 2007-12-21 | Olympus Medical Systems Corp. | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
| JP2007330351A (en) * | 2006-06-12 | 2007-12-27 | Olympus Medical Systems Corp | Ultrasound probe with ultrasound probe and ultrasound probe |
| EP2027818A4 (en) * | 2006-06-12 | 2010-03-03 | Olympus Medical Systems Corp | ULTRASONIC PROBE AND ULTRASONIC ENDOSCOPE WITH ULTRASONIC PROBE |
| US7757389B2 (en) | 2006-06-28 | 2010-07-20 | Ge Medical Systems Global Technology Company, Llc | Method of manufacturing an ultrasonic probe |
| JP2009147365A (en) * | 2009-03-09 | 2009-07-02 | Ge Medical Systems Global Technology Co Llc | Flexible printed board, ultrasonic probe, and method for manufacturing ultrasonic probe |
| CN110494084A (en) * | 2017-04-03 | 2019-11-22 | 奥林巴斯株式会社 | Ultrasonic endoscope |
| CN110494084B (en) * | 2017-04-03 | 2022-05-27 | 奥林巴斯株式会社 | Ultrasonic endoscope |
| US11589837B2 (en) | 2017-04-18 | 2023-02-28 | Olympus Corporation | Ultrasound transducer, ultrasound endoscope, and method of manufacturing ultrasound transducer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2847575B2 (en) | 1999-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04166139A (en) | ultrasonic depth probe | |
| KR20010021191A (en) | Multilayer circuit board | |
| US8334462B2 (en) | Wired circuit board assembly sheet including striated portions for enhancing rigidity | |
| KR970030761A (en) | Package with Notched Conductive Layer | |
| TW201942901A (en) | Memory layout fabricated for preventing reference layer from breaking | |
| JPH0469425B2 (en) | ||
| JPH04152800A (en) | Ultrasonic probe | |
| JP3174012B2 (en) | Method for manufacturing photovoltaic device | |
| JPS59165436A (en) | Semiconductor integrated circuit device | |
| JPS5991718U (en) | capacitor array | |
| JPH04287369A (en) | Manufacture of gate array and semiconductor integrated circuit device | |
| JPS601968A (en) | Semiconductor device | |
| JPH048356A (en) | ultrasonic probe | |
| JPH0430452A (en) | Semiconductor integrated circuit device | |
| JPH03243099A (en) | Manufacturing method of ultrasonic probe | |
| JPS62178360A (en) | Thermal head | |
| JPS62103317U (en) | ||
| JPH0327561A (en) | Semiconductor device | |
| JPH02224363A (en) | Pin grid array integrated circuit case | |
| JPH0497599A (en) | Flexible printed wiring board | |
| JPH04186755A (en) | Lead frame | |
| JPS6076156A (en) | Connecting terminal for integrated circuit | |
| JPS63216363A (en) | Semiconductor device | |
| JPS63146698A (en) | Manufacture of two-dimension array transducer | |
| JPH06216273A (en) | Signal line structure of high speed multiple pin package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071106 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081106 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091106 Year of fee payment: 11 |
|
| LAPS | Cancellation because of no payment of annual fees |