JPH04163958A - Semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to semiconductor devices, and particularly to packages that use lead frames, wire bonding, etc. for connection between a semiconductor chip and an external package. More specifically, the present invention relates to a semiconductor device in which a plurality of semiconductor chips for a plurality of power supply systems are housed in one package.

[Summary of the Invention] [Prior Art] As the manufacturing technology of semiconductor devices progresses, the channel length of the transistors used also progresses to miniaturization.
Some transistors are starting to have insufficient breakdown voltage with a single source. In addition, devices that require a power supply of several tens of microseconds from the IOV, such as high-voltage semiconductor devices for liquid crystal drivers,
There are various types, including those that operate on a power supply of about 1.5V, such as those used in watches. Additionally, as personal computers and other systems become more portable, demands for lower power consumption have become stronger, leading to a coexistence of multiple power supply systems, such as one semiconductor device using a 5V system and another semiconductor device using a 3V system. Go ahead. At the same time, in terms of the reliability and cost of the system itself, there is an increasing demand for a reduction in the number of parts and miniaturization.

Under these circumstances, when designing a single system, semiconductor devices for each function were obtained and each was mounted and arranged on a system board to satisfy the functions. In addition, in order to reduce the number of parts and reduce the size due to this effect, as well as to reduce costs and improve reliability, efforts are being made to combine semiconductor devices with multiple functions of the same power supply system into a single semiconductor device. There is. ' The semiconductor device used in this case is a conventional example in which one semiconductor chip is assembled in one package as shown in FIG.

[Problems to be Solved by the Invention] In the future, it is thought that semiconductor devices will be increasingly integrated in order to reduce the number of parts and achieve miniaturization, as well as to reduce costs and improve reliability. However, with current semiconductor chip manufacturing methods, for example,
It is extremely difficult to realize the functions of three semiconductor chips, 3V system, 5V system, and 20V system, with a single semiconductor chip, and it is difficult to achieve the effect of reducing the number of parts and cost by doing so. , which has not been thought of until now,
In order to realize the functions that were previously achieved by multiple semiconductor chips in a single power supply system with a single semiconductor chip, redesigning the entire circuit configuration and layout requires an exponential increase in the operating speed of semiconductor devices and timing problems. In recent years, as design has become increasingly difficult and product cycles have become shorter, this poses a problem in that it involves a large amount of risk.

It is an object of the present invention to provide a method for easily integrating a plurality of semiconductor chips of a single power supply system or a plurality of power supply systems under such circumstances.

[Means for Solving the Problems] In order to solve the above problems, the semiconductor device of the present invention has the following features:
It is characterized in that a plurality of semiconductor chips of a single power supply system or a plurality of power supply systems are arranged in one package, and each semiconductor chip is connected to an input/output bin of the package by wire bonding or the like.

C Embodiment Embodiments of the present invention will be described below based on the drawings. For example, until then, the power supply voltage was 3 V.

Assume that three separate 5V and 20V semiconductor devices are assembled into one semiconductor device.

FIG. 1 is a plan view of a lead frame of a semiconductor device according to the above assumption according to the present invention. Figure 2 shows the conventional
FIG. 2 is a plan view of a lead frame of a semiconductor device in which one semiconductor chip is assembled into one package. 101 is 3
V series semiconductor chip, 102 is a 5V series semiconductor chip,
1o3 is a 2oV semiconductor chip, 104 is an input/output pad of the semiconductor chip, 105 is an inner lead bin of the package, 106 is a tab hanging lead, 1'07 is a bonding wire for connecting the semiconductor chip and the inner lead bin, 108 is an insulating sheet, and 1°9 is a die pad. First, the insulating sheet 108 is attached to the die pad 109 of the r-node frame, and the semiconductor chips 103 of the 3V-based semiconductor chip 101, the 5v-based semiconductor chip 102, and the 20Vi-based semiconductor chip 103 are respectively fixed thereon. This post-process may be similar to the assembly of a normal semiconductor device. With such a simple method, it is possible to easily integrate a plurality of semiconductor chips of a plurality of power supply systems.

Although this example assumes semiconductors with three power supply voltages of 3V, 5V, and 20V, similar effects can be expected with other power supply voltage systems. Further, if the semiconductor chips to be integrated have a single power supply system, an insulating sheet is not necessary, and even if there are multiple power supply systems, as long as the reference potential is the same, there is no need for an insulating sheet.

In the diagram shown in the example, the schematic diagram of the lead frame is modeled after the QFP of the Japan Electronic Machinery Industry Standards, but any other package can be constructed using the same method. You can expect good results.

[Effects of the Invention] As explained above, the semiconductor device of the present invention is capable of assembling a plurality of semiconductor chips into one package by arranging the plurality of semiconductor chips on a die pad equipped with an insulating sheet and then performing wire bonding. It can be easily integrated, and is effective in reducing system size, lowering costs, and improving reliability.

[Brief explanation of drawings]

FIG. 1 is a plan view of a lead frame of a semiconductor device according to the above assumption according to the present invention. FIG. 2 is a plan view of a conventional semiconductor device in which one semiconductor chip is assembled into one package. 101... 3V type semiconductor chip 102... 5V type semiconductor chip 103... 2OV type semiconductor chip 104... Input/output pad 105 of the semiconductor chip...
Package inner lead bin 106...Tab suspension lead 107...Bonding wire 108...Insulating sheet 109...Die pad 201...Semiconductor chip 202...Semiconductor chip input/output pad 203...
Package inner lead pin 204...Tab suspension lead 205...Bonding wire 206...Die pad and above Applicant Seiko Epson Corporation Agent Patent attorney Kizobe Suzuki (1 other person) No. 17

Claims (1)

[Claims] Multiple semiconductor chips for single or multiple power supply systems,
A semiconductor device characterized by being housed in one package.