JPH04159043A - vacuum chuck - Google Patents
vacuum chuckInfo
- Publication number
- JPH04159043A JPH04159043A JP28425790A JP28425790A JPH04159043A JP H04159043 A JPH04159043 A JP H04159043A JP 28425790 A JP28425790 A JP 28425790A JP 28425790 A JP28425790 A JP 28425790A JP H04159043 A JPH04159043 A JP H04159043A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- vacuum
- vacuum chuck
- suction plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Jigs For Machine Tools (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、工作機械での加工物保持用真空チャックある
いは、各種搬送装置用の真空吸着方法に係り、特に、被
吸着材の大小や形状にかかわらず好適な吸着面を得る真
空チャックに関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a vacuum chuck for holding a workpiece in a machine tool or a vacuum suction method for various conveyance devices, and particularly relates to a vacuum chuck for holding a workpiece in a machine tool or a vacuum suction method for various conveyance devices. This invention relates to a vacuum chuck that provides a suitable suction surface regardless of the situation.
従来の真空チャックは、特開昭６２−１９８０３４号公
報および特開昭６３−１６９２８６号公報に記載のよう
に、真空ポンプに接続される貫通孔が各溝に独立に開け
られている形状や、接触をその縁部近傍のみを吸引する
方法が挙げられている。しかし、このような従来の方法
では、大きさの異なる被吸着材に対して対応が難かしく
、真空引用孔の遮蔽の必要がある。Conventional vacuum chucks have a shape in which a through hole connected to a vacuum pump is independently opened in each groove, as described in Japanese Patent Application Laid-open No. 62-198034 and Japanese Patent Application Laid-open No. 63-169286, A method of suctioning contact only near the edge is mentioned. However, with such conventional methods, it is difficult to deal with adsorbed materials of different sizes, and it is necessary to shield the vacuum intake hole.
上記従来技術は、被吸着材８の大きさに合せるように吸
着面上の溝６と真空引用孔５の位置が変えられるような
点については考慮されておらず、吸着面の全体を吸引す
る方法であり、被吸着材８以外の部分は真空引用孔５を
ふさぎ遮蔽する必要があった。本発明は被吸着材８の大
小や形状に合せた吸引ができるように、真空チャックを
多層にし吸着上盤２と吸着下盤１の位相を回転あるいは
平行移動等の相対変位を与えることにより、被吸着材８
の大きさに合せた部分を吸引することができるように溝
４．真空引用孔５を配置し、相対変位を与えることによ
り、被吸着材８以外の部分の遮蔽を必要とせず、作業効
率の良い、真空チャックを提供することができる。The above conventional technology does not take into account the fact that the positions of the groove 6 and the vacuum suction hole 5 on the suction surface can be changed to match the size of the adsorbed material 8, and the entire suction surface is suctioned. method, it was necessary to close the vacuum intake hole 5 and shield the parts other than the adsorbed material 8. The present invention uses a multi-layer vacuum chuck and applies relative displacement such as rotation or parallel movement to the phases of the upper suction plate 2 and the lower suction plate 1 so that suction can be performed in accordance with the size and shape of the adsorbed material 8. Adsorbed material 8
Groove 4. By arranging the vacuum intake hole 5 and applying relative displacement, it is possible to provide a vacuum chuck that does not require shielding of parts other than the adsorbed material 8 and has good working efficiency.
上記目的を達成するために、変発明は被吸着材８の大き
さに合った部分を真空吸引するため、真空チャックを多
層とした。吸着下盤１には真空ポンプの吸引を導く貫通
孔３と放射状に等分の溝４を配し、吸着上盤２には径方
向間隔に輪状の溝６を配置する。その輪状の溝６に被吸
着材８の吸着用の真空引用孔５を放射状に設ける。吸着
下盤１に設けられた溝４と吸着上盤２に設けられた円周
上にある真空引用例孔５は吸着上盤２の角度を回転変化
させることにより、吸着下盤１の放射状の溝４と重り合
ってくる。重り合った真空引用孔５の上面には輪状の溝
６が設けられており、吸着下盤１に設けられた貫通孔３
を介して真空ポンプにより吸引される。よって吸着上盤
２に載置される被吸着材８の大きさに合せた部分の近傍
を吸引することができるため、被吸着材８以外の領域の
面の遮蔽を必要とせず、作業の段取時間の短縮や遮蔽用
の板などの部品が不要となり１作業効率の向上が図れる
。In order to achieve the above object, the modified invention employs a multi-layered vacuum chuck in order to vacuum suction a portion that matches the size of the adsorbed material 8. The lower suction plate 1 is provided with grooves 4 radially equally divided by the through holes 3 for guiding the suction of the vacuum pump, and the upper suction plate 2 is provided with annular grooves 6 at radial intervals. Vacuum intake holes 5 for adsorbing the adsorbed material 8 are provided radially in the annular groove 6. The groove 4 provided in the lower suction plate 1 and the vacuum reference hole 5 provided on the circumference of the upper suction plate 2 are formed by changing the angle of the suction upper plate 2 in the radial direction of the lower suction plate 1. It overlaps with groove 4. An annular groove 6 is provided on the upper surface of the overlapping vacuum intake holes 5, and a through hole 3 provided in the suction lower plate 1 is provided.
is suctioned by a vacuum pump through the Therefore, since it is possible to suction the vicinity of a portion corresponding to the size of the adsorbed material 8 placed on the suction upper plate 2, it is not necessary to shield the surface of the area other than the adsorbed material 8, and the work step can be reduced. This reduces assembly time and eliminates the need for parts such as shielding plates, thereby improving work efficiency.
真空ポンプに接続される貫通孔３を設けた放射状に等分
の溝４を持つ吸着下盤１と被吸着材８を吸引すべき真空
引用孔５を配した輪状の溝６を持つ吸着上盤２は面で結
合されている。被吸着材８の吸引は吸着下盤１に設けら
れた貫通孔３を持つ放射状の溝４と吸着上盤２に設けら
れた真空引用孔５．溝６で流路が形成され溝６により行
なわれる。吸着下盤１に円周方向にある角度を持って堀
られた放射状の溝４は、吸着上盤２に設けられた真空引
用孔５と吸着上盤２を円周方向に回転することにより重
り合う。すなわち、吸着下盤１に堀られた放射状の溝４
と吸着上盤２に配した真空引用孔５が重り合う領域が被
吸着材８を吸引する領域となり、重り合う領域を円周方
向への回転で変化させることで、被吸着材８の大小に合
せた領域を吸引することができる。A lower suction plate 1 has a radially equally divided groove 4 with a through hole 3 connected to a vacuum pump, and an upper suction plate 1 has a ring-shaped groove 6 with a vacuum extraction hole 5 for suctioning a material 8 to be sucked. 2 are connected by planes. The material to be absorbed 8 is suctioned through radial grooves 4 with through holes 3 provided in the lower suction plate 1 and vacuum intake holes 5 provided in the upper suction plate 2. A flow path is formed by the groove 6 and carried out by the groove 6. The radial grooves 4 dug at a certain angle in the circumferential direction in the lower suction plate 1 are created by rotating the vacuum intake hole 5 provided in the upper suction plate 2 and the upper suction plate 2 in the circumferential direction. Fit. That is, the radial grooves 4 dug in the suction lower plate 1
The area where the vacuum suction hole 5 arranged on the suction upper plate 2 overlap becomes the area where the material to be adsorbed 8 is sucked, and by changing the overlapping area by rotation in the circumferential direction, the size of the material to be adsorbed 8 can be adjusted. The combined area can be sucked.
以下１本発明の一実施例を第１図、第２図、第３図、第
４図、第５図により説明する。An embodiment of the present invention will be described below with reference to FIGS. 1, 2, 3, 4, and 5.
第１図は、真空ポンプに接続される貫通孔３を設け、放
射状に等分の溝４を持つ吸着下盤１に真空引用孔５を配
し、輪状の溝６を持つ吸着上盤２を重ね合せた平面図で
ある。放射状の溝４は円周方向にある角度で掘込まれて
おり、貫通孔３を介して真空ポンプにより溝４内金体が
吸引される。In Fig. 1, a through hole 3 connected to a vacuum pump is provided, a vacuum outlet hole 5 is arranged in a lower suction plate 1 having grooves 4 equally divided radially, and an upper suction plate 2 having an annular groove 6 is provided. FIG. 4 is a superimposed plan view. The radial grooves 4 are dug at a certain angle in the circumferential direction, and the metal body inside the grooves 4 is sucked through the through holes 3 by a vacuum pump.
吸着上盤２との結合は放射状の溝４以外の部分で面結合
される。面結合される部分の平面度、および表面粗さの
精度を向上させることで結合面からの空気の流出を低く
押えることができ、放射状の溝４内は負圧を保つことが
可能となる。The suction upper plate 2 is joined to the upper suction plate 2 by surface jointing at a portion other than the radial groove 4. By improving the accuracy of the flatness and surface roughness of the parts to be surface-joined, it is possible to suppress the outflow of air from the joint surfaces, and it is possible to maintain negative pressure within the radial grooves 4.
第２図は、第１図の縦断面図で、放射状の溝４を持つ吸
着下盤１と真空引用孔５を配し、輪状の溝６を持つ吸着
上盤２の流路を現わした図で、真空ポンプにより吸引さ
れ、吸着上盤２の面上の被吸着材８を真空吸引する。FIG. 2 is a longitudinal cross-sectional view of FIG. 1, showing the flow path of the lower suction plate 1 with radial grooves 4 and the vacuum intake hole 5, and the upper suction plate 2 with annular grooves 6. In the figure, the material 8 on the surface of the upper suction plate 2 is vacuum-suctioned by a vacuum pump.
第３図は、吸着上盤２と吸着下盤１との間で相対変位を
与えた図で、放射状の溝４と真空引用穴５とが重り合っ
ている領域の吸引ができる。また、吸着上盤２を任意回
転させることが可能なため、被吸着材８の大小に合せた
吸着面を得ることができ、被吸着材８以外の面上の遮蔽
が必要なくなる。FIG. 3 is a diagram showing the relative displacement between the upper suction plate 2 and the lower suction plate 1, and suction can be performed in the area where the radial grooves 4 and the vacuum intake holes 5 overlap. Furthermore, since the suction upper plate 2 can be rotated arbitrarily, a suction surface that matches the size of the adsorbed material 8 can be obtained, and there is no need to shield surfaces other than the adsorbed material 8.
第４図は、吸着上盤２で吸引面の溝形状を変えたもので
あり、吸着上盤２の回転により任意の閉鎖された溝部に
吸引することができる。第５図は、第４図の縦断面図、
尚、実施例は円盤形状で径方向に相対変位を与えている
が、平面上をスライドさせる方法でも実施は可能である
。FIG. 4 shows an upper suction plate 2 with a different groove shape on the suction surface, and by rotating the upper suction plate 2, suction can be drawn into any closed groove. FIG. 5 is a longitudinal cross-sectional view of FIG. 4;
In the embodiment, the disk shape is used to apply relative displacement in the radial direction, but it can also be implemented by sliding on a flat surface.
本発明によれば、真空チャックを多層構造とし周方向、
あるいは、平行移動等により相対変位を与えることによ
り、真空吸引する領域を変えることができるため、被吸
着材８の大きさの違いや形状の違いに合せた真空吸引が
可能なため、被吸着材８以外の面上の遮断を必要とせず
、作業効率が大幅に向上する。また、各種形状の加工品
に対応できるため、専用の遮蔽板を必要とせず、加工品
の価格を下げる効果もある。According to the present invention, the vacuum chuck has a multilayer structure, and in the circumferential direction,
Alternatively, by applying relative displacement through parallel movement, etc., the area to be vacuum-suctioned can be changed, so vacuum suction can be applied to different sizes and shapes of the adsorbed material 8. It does not require blocking on surfaces other than 8, and work efficiency is greatly improved. Additionally, since it can be used with processed products of various shapes, a dedicated shielding plate is not required, which has the effect of lowering the price of processed products.
第１図は、本発明の一実施例の真空チャックの正面図、
第２図は、第１図の縦断面図、第３図は、第１図の正面
図の吸着上盤、吸着下盤を回転させた状態の正面図、第
４図は、吸着上盤の吸着部を閉鎖した正面図、第５図は
、第４図の縦断面図、第６図、第７図、第８図、第９図
は従来の真空チャックの正面図および縦断面図である。
１・・・吸着下盤、２・・・吸着上盤、３・・・貫通孔
、４・・・放射状の溝、５・・・真空引用孔、６・・・
輪状の溝、７・・・真空チャック、８・・・被吸着材。FIG. 1 is a front view of a vacuum chuck according to an embodiment of the present invention;
Figure 2 is a longitudinal sectional view of Figure 1, Figure 3 is a front view of the front view of Figure 1 with the upper suction plate and lower suction plate rotated, and Figure 4 is a front view of the upper suction plate. FIG. 5 is a front view with the suction part closed, FIG. 5 is a vertical sectional view of FIG. 4, and FIGS. 6, 7, 8, and 9 are a front view and a vertical sectional view of a conventional vacuum chuck. . 1... Lower suction plate, 2... Upper suction plate, 3... Through hole, 4... Radial groove, 5... Vacuum intake hole, 6...
Annular groove, 7... Vacuum chuck, 8... Adsorbed material.
Claims (1)
チャックにおいて、 前記加工物の大きさや形状に合つた領域を吸引できるよ
うに前記真空チャックを多層にし、吸着上盤と吸着下盤
の位相を変えることにより吸着面を変えられることを特
徴とする真空チャック。 ２、請求項１において、搬送装置のハンドリングとして
使用する真空チャック。 ３、請求項１において、前記吸着上盤の吸着部を任意の
閉鎖された溝により吸引する真空チャック。[Claims] 1. In a vacuum chuck that sucks a workpiece by suctioning through a vacuum source, the vacuum chuck is multi-layered so as to be able to suction an area that matches the size and shape of the workpiece. A vacuum chuck characterized by the ability to change the suction surface by changing the phase of the upper and lower suction plates. 2. A vacuum chuck according to claim 1, which is used as a handling device for a transfer device. 3. The vacuum chuck according to claim 1, wherein the suction portion of the suction upper plate is suctioned by an arbitrary closed groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28425790A JPH04159043A (en) | 1990-10-24 | 1990-10-24 | vacuum chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28425790A JPH04159043A (en) | 1990-10-24 | 1990-10-24 | vacuum chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04159043A true JPH04159043A (en) | 1992-06-02 |
Family
ID=17676187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28425790A Pending JPH04159043A (en) | 1990-10-24 | 1990-10-24 | vacuum chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04159043A (en) |
Cited By (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5545283A (en) * | 1993-09-09 | 1996-08-13 | Xerox Corporation | Apparatus for bonding wafer pairs |
| US7161363B2 (en) | 2002-05-23 | 2007-01-09 | Cascade Microtech, Inc. | Probe for testing a device under test |
| US7233160B2 (en) | 2000-12-04 | 2007-06-19 | Cascade Microtech, Inc. | Wafer probe |
| US7271603B2 (en) | 2003-05-23 | 2007-09-18 | Cascade Microtech, Inc. | Shielded probe for testing a device under test |
| US7285969B2 (en) | 2002-11-13 | 2007-10-23 | Cascade Microtech, Inc. | Probe for combined signals |
| US7298536B2 (en) | 2001-05-04 | 2007-11-20 | Cascade Microtech, Inc. | Fiber optic wafer probe |
| US7321233B2 (en) | 1995-04-14 | 2008-01-22 | Cascade Microtech, Inc. | System for evaluating probing networks |
| US7330041B2 (en) | 2004-06-14 | 2008-02-12 | Cascade Microtech, Inc. | Localizing a temperature of a device for testing |
| US7348787B2 (en) | 1992-06-11 | 2008-03-25 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
| US7352168B2 (en) | 2000-09-05 | 2008-04-01 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
| US7362115B2 (en) | 2003-12-24 | 2008-04-22 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
| US7368927B2 (en) | 2004-07-07 | 2008-05-06 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| US7368925B2 (en) | 2002-01-25 | 2008-05-06 | Cascade Microtech, Inc. | Probe station with two platens |
| US7403025B2 (en) | 2000-02-25 | 2008-07-22 | Cascade Microtech, Inc. | Membrane probing system |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
| US7427868B2 (en) | 2003-12-24 | 2008-09-23 | Cascade Microtech, Inc. | Active wafer probe |
| US7436170B2 (en) | 1997-06-06 | 2008-10-14 | Cascade Microtech, Inc. | Probe station having multiple enclosures |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| US7468609B2 (en) | 2003-05-06 | 2008-12-23 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
| US7492147B2 (en) | 1992-06-11 | 2009-02-17 | Cascade Microtech, Inc. | Wafer probe station having a skirting component |
| US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7498828B2 (en) | 2002-11-25 | 2009-03-03 | Cascade Microtech, Inc. | Probe station with low inductance path |
| US7504842B2 (en) | 1997-05-28 | 2009-03-17 | Cascade Microtech, Inc. | Probe holder for testing of a test device |
| US7504823B2 (en) | 2004-06-07 | 2009-03-17 | Cascade Microtech, Inc. | Thermal optical chuck |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7533462B2 (en) | 1999-06-04 | 2009-05-19 | Cascade Microtech, Inc. | Method of constructing a membrane probe |
| US7541821B2 (en) | 1996-08-08 | 2009-06-02 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US7550984B2 (en) | 2002-11-08 | 2009-06-23 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
| US7554322B2 (en) | 2000-09-05 | 2009-06-30 | Cascade Microtech, Inc. | Probe station |
| US7609077B2 (en) | 2006-06-09 | 2009-10-27 | Cascade Microtech, Inc. | Differential signal probe with integral balun |
| US7616017B2 (en) | 1999-06-30 | 2009-11-10 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
| US7619419B2 (en) | 2005-06-13 | 2009-11-17 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| US7639003B2 (en) | 2002-12-13 | 2009-12-29 | Cascade Microtech, Inc. | Guarded tub enclosure |
| US9429638B2 (en) | 2008-11-21 | 2016-08-30 | Cascade Microtech, Inc. | Method of replacing an existing contact of a wafer probing assembly |
| CN107186518A (en) * | 2017-06-19 | 2017-09-22 | 中国工程物理研究院化工材料研究所 | Flexible fast regulating vacuum cup suitable for Machining energetic materials |
| DE102016106706A1 (en) | 2016-04-12 | 2017-10-12 | Laser Imaging Systems Gmbh | Device for fixing objects by means of vacuum |
-
1990
- 1990-10-24 JP JP28425790A patent/JPH04159043A/en active Pending
Cited By (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7595632B2 (en) | 1992-06-11 | 2009-09-29 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
| US7589518B2 (en) | 1992-06-11 | 2009-09-15 | Cascade Microtech, Inc. | Wafer probe station having a skirting component |
| US7492147B2 (en) | 1992-06-11 | 2009-02-17 | Cascade Microtech, Inc. | Wafer probe station having a skirting component |
| US7348787B2 (en) | 1992-06-11 | 2008-03-25 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
| US5545283A (en) * | 1993-09-09 | 1996-08-13 | Xerox Corporation | Apparatus for bonding wafer pairs |
| US7321233B2 (en) | 1995-04-14 | 2008-01-22 | Cascade Microtech, Inc. | System for evaluating probing networks |
| US7541821B2 (en) | 1996-08-08 | 2009-06-02 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US7504842B2 (en) | 1997-05-28 | 2009-03-17 | Cascade Microtech, Inc. | Probe holder for testing of a test device |
| US7626379B2 (en) | 1997-06-06 | 2009-12-01 | Cascade Microtech, Inc. | Probe station having multiple enclosures |
| US7436170B2 (en) | 1997-06-06 | 2008-10-14 | Cascade Microtech, Inc. | Probe station having multiple enclosures |
| US7533462B2 (en) | 1999-06-04 | 2009-05-19 | Cascade Microtech, Inc. | Method of constructing a membrane probe |
| US7616017B2 (en) | 1999-06-30 | 2009-11-10 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
| US7403025B2 (en) | 2000-02-25 | 2008-07-22 | Cascade Microtech, Inc. | Membrane probing system |
| US7518358B2 (en) | 2000-09-05 | 2009-04-14 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7514915B2 (en) | 2000-09-05 | 2009-04-07 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7352168B2 (en) | 2000-09-05 | 2008-04-01 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7501810B2 (en) | 2000-09-05 | 2009-03-10 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7423419B2 (en) | 2000-09-05 | 2008-09-09 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7554322B2 (en) | 2000-09-05 | 2009-06-30 | Cascade Microtech, Inc. | Probe station |
| US7495461B2 (en) | 2000-12-04 | 2009-02-24 | Cascade Microtech, Inc. | Wafer probe |
| US7456646B2 (en) | 2000-12-04 | 2008-11-25 | Cascade Microtech, Inc. | Wafer probe |
| US7233160B2 (en) | 2000-12-04 | 2007-06-19 | Cascade Microtech, Inc. | Wafer probe |
| US7298536B2 (en) | 2001-05-04 | 2007-11-20 | Cascade Microtech, Inc. | Fiber optic wafer probe |
| US7492175B2 (en) | 2001-08-21 | 2009-02-17 | Cascade Microtech, Inc. | Membrane probing system |
| US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
| US7368925B2 (en) | 2002-01-25 | 2008-05-06 | Cascade Microtech, Inc. | Probe station with two platens |
| US7436194B2 (en) | 2002-05-23 | 2008-10-14 | Cascade Microtech, Inc. | Shielded probe with low contact resistance for testing a device under test |
| US7161363B2 (en) | 2002-05-23 | 2007-01-09 | Cascade Microtech, Inc. | Probe for testing a device under test |
| US7304488B2 (en) | 2002-05-23 | 2007-12-04 | Cascade Microtech, Inc. | Shielded probe for high-frequency testing of a device under test |
| US7482823B2 (en) | 2002-05-23 | 2009-01-27 | Cascade Microtech, Inc. | Shielded probe for testing a device under test |
| US7489149B2 (en) | 2002-05-23 | 2009-02-10 | Cascade Microtech, Inc. | Shielded probe for testing a device under test |
| US7518387B2 (en) | 2002-05-23 | 2009-04-14 | Cascade Microtech, Inc. | Shielded probe for testing a device under test |
| US7550984B2 (en) | 2002-11-08 | 2009-06-23 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
| US7417446B2 (en) | 2002-11-13 | 2008-08-26 | Cascade Microtech, Inc. | Probe for combined signals |
| US7453276B2 (en) | 2002-11-13 | 2008-11-18 | Cascade Microtech, Inc. | Probe for combined signals |
| US7285969B2 (en) | 2002-11-13 | 2007-10-23 | Cascade Microtech, Inc. | Probe for combined signals |
| US7498828B2 (en) | 2002-11-25 | 2009-03-03 | Cascade Microtech, Inc. | Probe station with low inductance path |
| US7639003B2 (en) | 2002-12-13 | 2009-12-29 | Cascade Microtech, Inc. | Guarded tub enclosure |
| US7468609B2 (en) | 2003-05-06 | 2008-12-23 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
| US7271603B2 (en) | 2003-05-23 | 2007-09-18 | Cascade Microtech, Inc. | Shielded probe for testing a device under test |
| US7876115B2 (en) | 2003-05-23 | 2011-01-25 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7501842B2 (en) | 2003-05-23 | 2009-03-10 | Cascade Microtech, Inc. | Shielded probe for testing a device under test |
| US7498829B2 (en) | 2003-05-23 | 2009-03-03 | Cascade Microtech, Inc. | Shielded probe for testing a device under test |
| US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7362115B2 (en) | 2003-12-24 | 2008-04-22 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
| US7427868B2 (en) | 2003-12-24 | 2008-09-23 | Cascade Microtech, Inc. | Active wafer probe |
| US7504823B2 (en) | 2004-06-07 | 2009-03-17 | Cascade Microtech, Inc. | Thermal optical chuck |
| US7330041B2 (en) | 2004-06-14 | 2008-02-12 | Cascade Microtech, Inc. | Localizing a temperature of a device for testing |
| US7514944B2 (en) | 2004-07-07 | 2009-04-07 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| US7368927B2 (en) | 2004-07-07 | 2008-05-06 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
| US8013623B2 (en) | 2004-09-13 | 2011-09-06 | Cascade Microtech, Inc. | Double sided probing structures |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| US7619419B2 (en) | 2005-06-13 | 2009-11-17 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| US7609077B2 (en) | 2006-06-09 | 2009-10-27 | Cascade Microtech, Inc. | Differential signal probe with integral balun |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US9429638B2 (en) | 2008-11-21 | 2016-08-30 | Cascade Microtech, Inc. | Method of replacing an existing contact of a wafer probing assembly |
| US10267848B2 (en) | 2008-11-21 | 2019-04-23 | Formfactor Beaverton, Inc. | Method of electrically contacting a bond pad of a device under test with a probe |
| DE102016106706A1 (en) | 2016-04-12 | 2017-10-12 | Laser Imaging Systems Gmbh | Device for fixing objects by means of vacuum |
| WO2017178005A1 (en) | 2016-04-12 | 2017-10-19 | Laser Imaging Systems Gmbh | Apparatus for fixing objects by means of vacuum |
| JP2019511847A (en) * | 2016-04-12 | 2019-04-25 | レーザー イメージング システムス ゲーエムベーハー | Device for fixing objects using vacuum |
| US11417560B2 (en) | 2016-04-12 | 2022-08-16 | Laser Imagine Systems GmbH | Apparatus for fixing objects by means of vacuum |
| CN107186518A (en) * | 2017-06-19 | 2017-09-22 | 中国工程物理研究院化工材料研究所 | Flexible fast regulating vacuum cup suitable for Machining energetic materials |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04159043A (en) | vacuum chuck | |
| JP5296897B1 (en) | Work processing method using work clamp jig and work clamp jig | |
| WO2018223756A1 (en) | Film-removing device | |
| US5572786A (en) | Method for holding a workpiece by vacuum | |
| CN112828478A (en) | a punching device | |
| TWI737848B (en) | Transport mechanism of processing device | |
| JP2990594B2 (en) | Vacuum chuck | |
| CN110534459A (en) | Integrated Thinning Device | |
| CN213532250U (en) | Positioning tool platform | |
| US20170345700A1 (en) | Vacuum clamping device for gripping workpieces | |
| CN217452984U (en) | Vacuum chuck for fixing sheet part | |
| JP2009076773A (en) | Chuck table mechanism | |
| JP3163675B2 (en) | Mechanical interface device | |
| JPH02131831A (en) | Work holder | |
| CN115985831A (en) | A vacuum suction cup jig | |
| TW201409556A (en) | Sheet sticking device and method for preventing enlargement of the device | |
| JPS62501759A (en) | A device that magnetically holds a workpiece | |
| KR20170088288A (en) | Holding table | |
| JP2017098465A (en) | Processing device | |
| CN210024924U (en) | Vacuum adsorption jig | |
| CN217751676U (en) | Novel aviation part is cut edge and is used vacuum adsorption tool | |
| JP2511945Y2 (en) | Material fixing plate | |
| JP3026677U (en) | Universal chuck table for semiconductor wafers | |
| JPH0248197Y2 (en) | ||
| TW202112634A (en) | Workpiece conveying device and workpiece conveying method including a rotating stage and a suction nozzle device |