JPH04155934A - Production of semiconductor device - Google Patents

Abstract

PURPOSE:To improve working efficiency by providing a plurality of heads for attracting semiconductor chips to mount the chips on a lead frame. CONSTITUTION:A semiconductor chip 3 is supplied to a table 6 while it is loaded on a sheet 8. The lead frame 4 is also supplied on a lead frame base 7. Next, a chip 3 is recognized by a semiconductor chip sensor 5 and the table 6 is positioned so that an attracting part of head 1a is located on a chip 3. Next, the head 1a is moved downward and simultaneously attracts a chip 3 which is pushed up by a pushing jig 9a. The head is then moved upward again to the upper part of the frame 4 and is then moved downward to mount a chip 3. The head 1a moves to the initial position and then starts again the similar operation. Meanwhile, the head 1b starts the simultaneous operation when the head 1a has attracted the chip 3 and both heads repeat this operation until the chip 3 on the sheet 8 is all mounted on the lead frame.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manufacturing semiconductor devices, and particularly to an apparatus for fixing a semiconductor chip to a lead frame.

[Conventional technology]

Conventionally, this type of semiconductor device manufacturing apparatus is shown in FIG. 3 (a>
, has a structure as shown in the side and front views of (b). That is, it is composed of a table 6 for supplying semiconductor chips 3 bonded to a stretched sheet 8, a lead frame stand 6 on which a lead frame 4 is placed, and an apparatus main body 2 having a head 1 and a semiconductor chip sensor 5.
The semiconductor chip 3 pushed up by the push-up jig 9 is adsorbed by a semiconductor chip adsorption jig (hereinafter referred to as head 1), moved onto the lead frame 4, and the semiconductor chip 3 is pressurized and fixed to the lead frame 4 (hereinafter referred to as head 1). This operation is called mounting.

[Problem to be solved by the invention]

The conventional semiconductor device manufacturing equipment described above has a single mechanism including a head that suctions the semiconductor chip and mounts it onto the lead frame, so it is necessary to complete one mounting operation before starting the next mounting operation. It has the disadvantage that it takes time to perform the operation and the working capacity per device is low.

[Means to solve the problem]

The semiconductor device manufacturing apparatus of the present invention has a plurality of heads that perform an operation of sucking a semiconductor chip and mounting it on a lead frame, and is provided with a mechanism that starts the operation of the next head while one head is in operation.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are a side view and a front view of Embodiment 1 of the present invention.

The basic operation of this embodiment will be explained. First, the semiconductor chips 3 mounted on the sheet 8 are supplied onto the table 6. Further, the lead frame 4 is also supplied onto the lead frame stand 7. Next, the table 6 is moved in the X-Y direction, the semiconductor chip 3 is recognized by the semiconductor chip sensor 5, and the suction part of the head 1a is placed on the semiconductor chip 3. Position it so that it is on top.

Next, the head 1a is lowered, and at the same time it adsorbs the semiconductor chip 3 pushed up by the push-up jig 9a, and is raised again.
, lower the suction part of the head 1a, and mount the semiconductor chip 3 on the lead frame 4. Thereafter, the head 1a moves to its original position and starts the same operation again. On the other hand, the head 1b starts a similar operation after the head 1a adsorbs the semiconductor chip 3 pushed up by the push-up jig 9a, and both heads perform this operation until all the semiconductor chips 3 on the sheet 8 are placed on the lead frame. Repeat until mounted.

FIGS. 2(a) and 2(b) are a side view and a front view of Embodiment 2 of the present invention.

Next, the basic operation of this embodiment will be explained.

First, the semiconductor chip 3 mounted on the sheet 8 is supplied onto the table 6. The lead frame 4 is also supplied with the zero-order semiconductor chip sensor 5a on the lead frame stand 7.
Then, the suction part of the head 1a is moved over the semiconductor chip 3 recognized by the semiconductor chip sensor 5a, and the suction part of the head 1a is The semiconductor chip 3 is pushed up by the pushing up jig 9a at the same time as the part is lowered.
adsorbs.

After suction, the suction part of the head 1a is raised and moved to the top of the lead frame 4.The suction part of the head 1a is then lowered to mount the semiconductor chip 3 on the lead frame 4. After mounting, the suction part of the head 1a is moved to its original position and the same operation is started again. On the other hand, the head 1b performs a similar operation from the right side in FIG. The process is repeated separately at the same timing for both heads 1a and 1b until the process is completed.

〔Effect of the invention〕

As described above, the present invention has the effect of improving the working ability of the device by having a plurality of mechanisms that provide the operation of sucking a semiconductor chip and mounting it on a lead frame.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a side view and a front view of Embodiment 1 of the present invention, FIGS. 2(a) and (b) are a side view and a front view of Embodiment 2 of the present invention, and FIG. Figures (a) and (b) are a side view and a front view of a conventional manufacturing device. 1, la, lb...head, 2...device body, 3.
...Semiconductor chip, 4...Lead frame, 5.5a
. 5b...Semiconductor chip sensor, 6...Table,
7... Lead frame stand, 8... Sheet, 9.9a
. 9b... Push-up jig.

Claims (1)

[Claims] A semiconductor device manufacturing apparatus that fixes a semiconductor chip to a lead frame has a plurality of heads that perform the operation of attracting the semiconductor chip and fixing it to the lead frame, and it is possible to start the operation of the next head while one head is operating. Features: Semiconductor device manufacturing equipment.