JPH04155895A - Heat dissipating device of printed wiring board - Google Patents
Heat dissipating device of printed wiring boardInfo
- Publication number
- JPH04155895A JPH04155895A JP28085690A JP28085690A JPH04155895A JP H04155895 A JPH04155895 A JP H04155895A JP 28085690 A JP28085690 A JP 28085690A JP 28085690 A JP28085690 A JP 28085690A JP H04155895 A JPH04155895 A JP H04155895A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- printed wiring
- wiring board
- connector
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 4
- 241000252233 Cyprinus carpio Species 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、放熱を必要とする電子機器に搭載されるプ
リント配線板の放熱装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a heat dissipation device for a printed wiring board mounted on an electronic device that requires heat dissipation.
第３図は、例えばＥＤＮ誌１９７５年５月号に掲載され
た従来のプリント配線板から筐体へ放熱する装置を示す
断面図である。図において、（１）はプリント配線板で
、絶縁樹脂部（２）に覆われかつ熱を伝える金属板（３
）を有している。（４）はプリント配線板（１）に搭載
された電子部品、（４ａ）は電子部品（４）のリード、
（５）は金属板（３）から熱を放熱するためにプリント
配線板（１）に締めつける構造部品、（６）は筐体の構
造部分、（７）はプリント配線板（１）と構造部品（５
）と筐体の構造部分（６）とを締めつけるためのネジで
ある。FIG. 3 is a sectional view showing a conventional device for dissipating heat from a printed wiring board to a housing, which was published in, for example, the May 1975 issue of EDN magazine. In the figure, (1) is a printed wiring board, which is covered with an insulating resin part (2) and a metal plate (3) that conducts heat.
)have. (4) is the electronic component mounted on the printed wiring board (1), (4a) is the lead of the electronic component (4),
(5) is a structural part that is fastened to the printed wiring board (1) to dissipate heat from the metal plate (3), (6) is the structural part of the casing, and (7) is the printed wiring board (1) and the structural part. (5
) and the structural part (6) of the casing.
次に動作について説明する。プリント配線板（１）に搭
載された電子部品（４）から発生した熱は、絶縁樹脂部
分（２）をとおり、熱を伝導する金属板（３）を経て、
構造部品（５）および筐体構造部（６）に伝わる。Next, the operation will be explained. Heat generated from the electronic components (4) mounted on the printed wiring board (1) passes through the insulating resin part (2), passes through the heat-conducting metal plate (3),
It is transmitted to the structural component (5) and the housing structure (6).
プリント配線板（１）および熱を伝導する金属板（３）
は放熱構造部品（５）や筐体構造部分（６）との熱抵抗
を低くするため、ネジ（７）により締めつける必要があ
る。Printed wiring board (1) and heat conducting metal plate (3)
It is necessary to tighten with screws (7) in order to lower the thermal resistance with the heat dissipation structure part (5) and the housing structure part (6).
従来のプリント配線板の放熱装置は以上のように構成さ
れているので、筐体への放熱をおこなうためには、プリ
ント配線板（１）の筐体実装をする場合、放熱のための
構造部品（５）を設け、この構造部品（５）とプリント
配線板（１）とをネジ締め等により圧接することが必要
で、またその構造部品（５）の必要により重量増や構造
が複雑になるなどの問題点があった。Conventional printed wiring board heat dissipation devices are configured as described above, so in order to radiate heat to the casing, when mounting the printed wiring board (1) on the casing, structural parts for heat dissipation are required. (5), and it is necessary to press the structural component (5) and the printed wiring board (1) together by tightening screws, etc., and the necessity of the structural component (5) increases the weight and complicates the structure. There were problems such as:
この発明は上記のような問題点を解消するためになされ
たもので、放熱のために特に必要な構造部品を必要とせ
ず、構造が簡素化でき小型化かつ軽量化がはかれるプリ
ント配線板の放熱装置を得ることを目的とする。This invention was made to solve the above-mentioned problems, and it is a heat dissipation method for printed wiring boards that does not require any special structural parts for heat dissipation, has a simpler structure, is smaller in size, and is lighter in weight. The purpose is to obtain equipment.
この発明に係るプリント配線板の放熱装置は、電気接続
用のコネクタに熱伝導する構造を有するようにし、プリ
ント配線板に当該コネクタを取りつけ、また筐体部分に
も当該コネクタを取りつけ、コネクタ同志をかんごうす
る構造にしたものである。The heat dissipation device for a printed wiring board according to the present invention has a structure that conducts heat to a connector for electrical connection, and the connector is attached to the printed wiring board, and the connector is also attached to the housing, and the connectors are connected to each other. It has a structure that makes it easy to move.
この発明におけるプリント配線板の放熱装置は、放熱の
ための構造部品をなくし、電気接続用のコネクタにより
放熱する構造としたことにより、構造が簡素化され、軽
量化かつ小型化かはかれる。The heat dissipation device for a printed wiring board according to the present invention eliminates structural parts for heat dissipation and uses a connector for electrical connection to dissipate heat, thereby simplifying the structure and achieving reduction in weight and size.
以下、この発明の一実施例を図について説明する。第１
図は放熱装置を示す断面図であり、前記従来装置と同一
または相当部分には同一符号を付して説明する。図にお
いて、 ＋８＋ 、 ７９１は熱伝導構造をそなえたコ
ネクタ、（ｓａ）、（９ａ）はコネクタ（８） 、 （
９１のリード、（１０）は一般にマザーボードと称され
、筐体部分に設けて複数のプリント配線板間の電気接続
や他の電子機器との接続のための配線をまとめる部分で
あり、多数のコネクタを取りつけたプリント配線板であ
る。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view showing a heat dissipation device, and the same or equivalent parts as in the conventional device will be described with the same reference numerals. In the figure, +8+, 791 are connectors with heat conduction structure, (sa), (9a) are connectors (8), (
Lead 91 (10) is generally called a motherboard, and is a part that is installed in the housing to gather wiring for electrical connections between multiple printed wiring boards and connections with other electronic devices, and is a part that connects many connectors. It is a printed wiring board with attached.
次に動作について説明する。プリント配線板（１）に搭
載された電子部品（４）から発生した熱は、絶縁樹脂部
分（２）をとおり、熱を伝導する金属板（３）を経て、
熱伝導可能なコイ・フタ（８）に伝わる。Next, the operation will be explained. Heat generated from the electronic components (4) mounted on the printed wiring board (1) passes through the insulating resin part (2), passes through the heat-conducting metal plate (3),
The heat is transferred to the carp lid (8), which can conduct heat.
さらに熱はコネクタ（８）から筐体部分（６）に取りつ
けられた熱伝導可能なコネクタ（９）に伝導し、筐体部
分（６）に放熱される。Furthermore, heat is conducted from the connector (8) to a heat conductive connector (9) attached to the housing part (6), and is radiated to the housing part (6).
一般のプリント配線板では電気信号の接続にコネクタを
用いており（従来例では図示省略している）、この実施
例では新たに部品が増加することはない。In general printed wiring boards, connectors are used to connect electrical signals (not shown in the conventional example), and this embodiment does not add any new parts.
放熱性能については、コネクタ（８）とコネクタ（９）
との接触熱抵抗を下げるためにコネクタ間に接触熱抵抗
をさげるための熱伝導シートや熱伝導グリースを設ける
こともよい。Regarding heat dissipation performance, connector (8) and connector (9)
A thermally conductive sheet or thermally conductive grease may be provided between the connectors to reduce the thermal contact resistance.
なお、上記実施例ではマザーボードとして通常のプリン
ト配線板（１０）を用いたが、第２図に示すように絶縁
樹脂部（１２）で覆われた金属板（１３）を有するプリ
ント配線板（１１）を用いてもよい。この場合、コネク
タ（８）のリード（８ａ）およびコネクタ（９）のリー
ド（９ａ）を経由して放熱のための金属板（１３）につ
たわることにより、放熱効果はさらに増大する。また、
第２図に符号（１４）で示すように絶縁樹脂（２）を除
去することにより放熱効果は増大する。In the above embodiment, an ordinary printed wiring board (10) was used as the motherboard, but as shown in FIG. ) may be used. In this case, the heat radiation effect is further increased by being connected to the metal plate (13) for heat radiation via the lead (8a) of the connector (8) and the lead (9a) of the connector (9). Also,
As shown by reference numeral (14) in FIG. 2, the heat dissipation effect is increased by removing the insulating resin (2).
その場合、上記実施例と同様の効果を奏する。In that case, the same effects as in the above embodiment can be achieved.
以上のように、この発明によれば筐体に放熱する部分を
コネクタにより熱伝導する構成にしたので、装置の構造
が簡素化でき、また小型・軽量の電子機器が得られると
いう効果がある。As described above, according to the present invention, since the portion that radiates heat to the casing is configured to conduct heat through the connector, the structure of the device can be simplified and a small and lightweight electronic device can be obtained.
第１図はこの発明の一実施例を示す断面図、第２図はこ
の発明の他の実施例を示す断面図、第３図は従来装置を
示す断面図である。
図において、（１）はプリント配線板、（３）はプリン
ト配線板の金属板、（４）は電子部品、（５）は構造部
品、（６）は筐体構造部分、（８） 、 （９）は熱伝
導構造をそなえたコネクタを示す。
なお、各図中同一符号は同一または相当部分を示す。FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIG. 3 is a sectional view showing a conventional device. In the figure, (1) is a printed wiring board, (3) is a metal plate of the printed wiring board, (4) is an electronic component, (5) is a structural component, (6) is a housing structure part, (8), ( 9) shows a connector equipped with a heat conductive structure. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
接続用のコネクタに熱を伝導し、当該コネクタから筐体
部に取りつけられたコネクタに熱を伝導することにより
放熱することを特徴とするプリント配線板の放熱装置。(1) A printed wiring board with a built-in metal plate, which conducts heat to a connector for electrical connection, and radiates heat by conducting heat from the connector to a connector attached to a casing. Heat dissipation device for wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28085690A JPH04155895A (en) | 1990-10-18 | 1990-10-18 | Heat dissipating device of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28085690A JPH04155895A (en) | 1990-10-18 | 1990-10-18 | Heat dissipating device of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04155895A true JPH04155895A (en) | 1992-05-28 |
Family
ID=17630932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28085690A Pending JPH04155895A (en) | 1990-10-18 | 1990-10-18 | Heat dissipating device of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04155895A (en) |
-
1990
- 1990-10-18 JP JP28085690A patent/JPH04155895A/en active Pending
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