JPH04152280A - Inspection sequence setting device for mobile probe type circuit board inspection device - Google Patents

Abstract

PURPOSE:To enable an inspection sequence setting time be shortened by serially determining an inspection sequence while sequentially obtaining nearest distant steps after the definition of a step corresponding to the first inspection part. CONSTITUTION:A plurality of measurement points corresponding to every part on an inspected circuit board are grouped as one step, and an inspection first step as a probe start point is determined by an inspection first step determination means 42. A nearest step detection means 44 obtains a distance indicated with maximum axis component data for every probing step, using a step having a newly determined inspection turn as a reference step, and the longest distance obtainable therefrom determines the shortest probing step as the next inspection object. Also, steps for the nearest distance are serially obtained until a step with an uncertain inspection turn disappears via an inspection sequence setting control means 46. The inspection sequence is thereby determined serially and written in memory 36, thereby enabling the final inspection sequence to be established.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a test order setting device for a probe-moving circuit board testing device such as an in-circuit tester equipped with an X-Y unit for moving a probe.

Conventional technology Conventionally, various circuit board inspection devices are used for mounted boards, that is, printed circuit boards to which many electrical components are soldered, and probes are brought into contact with the necessary measurement points on the board as appropriate to measure the quality of each component. The quality of the board is determined by electrical measurement.

In particular, in the case where an X-Y unit driven by a servo motor or the like is installed on the measurement table on which the board to be inspected is placed, the prow 1 is supported by the movable part of the arm that moves on the guide rail. Therefore, by controlling the X-Y unit, the plow 7 can be moved from above the board to the X-axis, Y-axis, and Z-axis.
Since it can move appropriately in the axial direction and sequentially contact each preset measurement point, a dedicated jig is not required, which is convenient for producing a wide variety of products.

Of course, in order to do this, it is necessary to measure the
-Y coordinate data must be detected respectively. Therefore, generally, the XY coordinate data of each measurement point is obtained by teaching by manually operating the probe of the XY unit, by using a digitizer which is a coordinate reading device, or by using CAD data. Furthermore, the testing order of each measurement point to which the probe is brought into contact must be set so as to shorten the testing time per board to be tested.

This is because when the number of parts per sheet increases to about 1,000, most of the inspection time is spent moving the probe.

Problems to be Solved by the Invention However, when setting such an inspection order, it is clear that the shortest path problem generally takes an enormous amount of time to calculate, even if you try to move the shortest distance. . Moreover, with a moving probe type circuit board inspection device, 1
Multiple points must be measured simultaneously for each part. For example, when measuring the resistance of component R1 in the circuit of the tested board shown in FIG. Point 02 is the measurement point on the ground side, but in order to prevent excess current from flowing to the probe on the point 02 side that connects to the measurement circuit, specify point 03 as a guarding point if necessary. Touch the ground potential probe to the Note that the more guard points you have, the better. For this reason, the layer gauge structure becomes complicated and it takes too much time to set the inspection order, so even if the inspection time is shortened, it is meaningless.

The present invention has been made by focusing on these conventional problems, and by taking into consideration both the shortening of the inspection time and the shortening of the inspection order setting control means, it is possible to inspect circuit boards produced in high-mix, low-volume production. It is an object of the present invention to provide an inspection order setting device for a probe movable circuit board inspection device, which is also suitable for use in a moving probe type circuit board inspection device.

Means for Solving the Problems Means for achieving the above object will be explained below with reference to FIGS. 1 and 2 which clearly illustrate the present invention.

This inspection order setting device for a probe moving circuit board inspection device writes the XY coordinate data of each measurement point existing on the board to be inspected in the memory 36, and groups a plurality of measurement points corresponding to each component as one step. The present invention relates to setting the order of steps in which each probe of a plurality of XY units provided in the circuit board inspection apparatus 10 moves during inspection.

The inspection first step determining means 42 determines the inspection step No. 1 which is the starting point of the probe movement from among all the steps of the board to be inspected, and the step for which the inspection order is newly determined is set as a reference step, and the step is determined as a reference step. Between the step and each other exploration step except for steps for which the inspection order has already been determined, the coordinate positions of multiple measurement points of the reference step and multiple measurement points of the exploration step correspond for each exploration step. X-axis component data between both measurement points for each measurement point,
Calculate each distance indicated by the Y-axis component data, find the distance indicated by the maximum axis component data for each exploration step, compare these distances, and select the exploration step whose longest distance is the shortest. The most recent step detection means 44 for determining the next inspection order and each of these means 42 and 44 sequentially determine the inspection order until there are no steps whose inspection order has not yet been determined, and write the inspection order of each step in the memory 36. The inspection type setting 1Fi 111 [1 means 46 is provided.

Alternatively, for each step of the board to be inspected, arithmetic average data is calculated for each X coordinate data and each Y coordinate data from each X-Y coordinate data of a plurality of measurement points belonging to one step, and step of obtaining X-Y coordinate data of a point representative of the measurement points of the representative coordinate detection means 48; and a first inspection step of determining the first inspection step, which is the starting point of the probe movement, from among all the steps of the board to be inspected. The determination means 50 sets the step for which the inspection order has been newly determined as a reference step, and determines the reference step for each exploration step between that reference step and each exploration step other than the step for which the inspection order has already been determined. Most recent step detection means 52 that calculates the straight-line distance between the representative point and the representative point of the exploration step, compares these distances, and determines the exploration step that is the shortest distance from the reference step for the next inspection order. and an inspection order setting control means 54 that causes the rear two means 50 and 52 to sequentially determine the inspection order until there are no steps whose inspection order is undetermined, and writes the inspection order of each step in the memory 36. be.

Operation After having the above-mentioned structure and grouping a plurality of measurement points corresponding to each component on the board to be inspected as one step, the inspection first step determining means 42 determines the starting point of probe movement (inspection first step). The step No. 1 is determined, and the step for which the inspection order has been newly determined by the recent step detection means 44 is set as the reference step, and the interval between the reference step and each other exploration step except for the step for which the inspection order has already been determined is determined. Then, the distance indicated by the maximum axis component data is determined for each exploration step, and the exploration step with the longest distance and the shortest is determined as the next inspection order.Therefore, the inspection order setting control means 46 controls the inspection order. The inspection order can be set by finding the closest step one after another until there are no undetermined steps, determining the inspection order one by one, and writing the inspection order of each step into the memory 36.

Further, the step representative coordinate detection means 48 obtains the X-Y coordinate data of a point representing a plurality of measurement points for each step of the substrate to be inspected, and the inspection first step determination means 50 determines the X-Y coordinate data of a point representing the plurality of measurement points for each step of the board to be inspected. The first step is determined, and the step for which the inspection order has been newly determined by the recent step detection means 52 is set as the reference step, and the representative point of the reference step and each other exploration except for the steps for which the inspection order has already been determined are determined. The straight line distance from the representative point of the step is determined for each exploration step, and the exploration step with the shortest distance is determined for the next inspection order. Therefore, the inspection order setting control means 54
The steps closest to each other are determined one after another until there are no steps whose inspection order is undetermined.The inspection order of each step is stored in the memory 3.
By writing in 6, you can set the inspection order.

Example Hereinafter, the present invention will be described in detail based on the accompanying drawings.

FIG. 3 is a block diagram showing the configuration of a moving probe in-circuit tester to which the present invention is applied. - They are the first, second, and third probes attached to the Y unit. All of these probes 12, 14, 16 are connected via a scanner 18 to a signal source 20 of voltage, current, etc., a measuring circuit 22,
and can be connected to earth 24. Also, 26 is X
-YZ drive circuit; 28 is an input/output device;

This X-Y-Z drive circuit 26 drives the servo motors etc. provided in each of the three X-Y units, and measures each probe 12, 14, 16 in the X-axis, Y-axis, Z-axis direction, etc. Move appropriately on the table.

The input/output device 28 includes a keyboard, display device, printer, floppy disk driver, and the like.

These scanners 18, signal sources 20. Measuring circuit 22,X
-Y-Z drive circuit 26 and input/output device 28 are each controlled by a controller 30 equipped with a CPU. The controller 30 is necessarily a microcomputer as shown in FIG. 4, for example, and includes a CPU (central processing unit) 32, a ROM
(read-only memory) 34, RAM (read-writable memory) 36, input/output board 3B, pass line 40, and the like. The CPU 32 corresponds to the central brain of a microcomputer, and executes overall control according to program instructions, as well as performing arithmetic,
Performs logical operations and temporarily stores the results. or,
Peripheral devices are also controlled as appropriate. ROM3
4 stores a control program for controlling the entire in-circuit tester. Further, the RAM 36 stores various data such as data input from the outside, data measured using each probe 12, 14, and 16, and data calculated by the CPU 32 from these data. At that time, the X-Y coordinate data of each measurement point on the board to be inspected can be read directly by teaching by manually operating each probe 12, 14, 16, or after being stored on a floppy disk using a digitizer. Input from outside.

Furthermore, three measurement points corresponding to each part are grouped as one step, and sequentially numbered and stored. Furthermore, a step inspection order setting window processing program and the like are also input from the outside. The input/output port 38 has a scanner 18
, signal source 20, measurement circuit 22, x-y-z drive circuit 26
, input device 28, etc. are connected. The path line 40 includes an address bus line, a data bus line, a control path line, etc. for connecting these, and is also connected to peripheral devices as appropriate.

Next, the operation of this embodiment will be explained.

FIG. 5 and FIG. 6 are flowcharts showing a step inspection order setting window processing program based on axis component calculation;
This is executed through the processes of ~P14.

First, the number of the step corresponding to the part to be inspected first from among all the steps of the board to be inspected is input and memorized by key operation at Pl. The first step of this inspection is the starting point of movement of each probe 12, 14, 16, and is specified by the measurer as appropriate. Choose the one that corresponds to the part.

Next, go to P2, and replace all data of step number 1 (all X-Y coordinate data of a plurality of measurement points) with all data of step number designated as inspection No. 1. Therefore, the step number of the first test is 1. Next, the process goes to P3, and the step numbered 1 is determined as the reference step.

Next, go to P4, and determine the first exploration step number by adding 1 to the reference step number. Next, the process goes to P5, and it is determined whether the exploration step number is greater than or equal to the maximum step number. If no, go to P6. In P6, the longest comparison distance is calculated and stored as the maximum axis component value that can be taken by the X-Y coordinates of the board to be inspected. Next, in Pl, calculate each distance between the two measurement points indicated by the X-axis component data and Y-axis component data for each measurement point whose coordinate position corresponds from all the data of the reference step and all the data of the exploration step. do. For example, on the X-Y coordinates of the board to be inspected, as shown in FIG.
Three measurement points: LO, MO, RO.
If M and R exist, the absolute value of the difference in the X-axis direction between the left coordinates (X-Y coordinate data of the two measurement points at the left end) is 1
xLI, ■ Absolute value of the difference in the Y-axis direction between the leftmost coordinates 1y[
1, ■Absolute value of the difference in the X-axis direction between the rightmost coordinates 1xRI,
■Absolute value of the difference in the Y-axis direction between the rightmost coordinates 1yR hip ■Absolute value of the difference in the X-axis direction between the intermediate coordinates IX) l Hip ■Calculate the absolute value +y+ of the difference in the Y-axis direction between the intermediate coordinates, respectively . Next, in P8, the distance indicated by the maximum axis component data from among the X-axis component data or Y-axis component data of ■ to ■ is set. Next, in P9, it is determined whether the longest distance is less than the comparative distance, for example, the distance calculated in P6. If YES, go to Plo. Note that in the case of No, at least one measurement point in that exploration step is outside the XY coordinate area of the board to be inspected, so it is excluded from the inspection type settings. PIO adopts the longest distance as a new comparison distance in P9 and stores its exploration step number. Then Pll
Then, it is determined whether the exploration step number has reached the maximum number of steps. If No, go to P12, add 1 to the exploration step number, and return to P7.

In P7, from all the data of the same reference step and all the data of the new exploration step, each distance between the two measurement points indicated by the X-axis component data and Y-axis component data is calculated for each measurement point whose coordinate position corresponds in the same way. Calculate each. Next, in P8, the distance indicated by the largest axis component data is selected from the X-axis component data or Y-axis component data. Next, in P9, it is determined whether the longest distance is less than the comparison distance, for example, the distance adopted in the previous Plo. If YES, go to Pll via Plo; if No, go directly to P11.

In this way, until Pll determines YES, P
The processes from 7 to P12 are repeated to find the exploration step with the shortest longest distance between each exploration step and the reference step selected at P8.

When the Pll is determined as YES, the number of the exploration step at the shortest distance from the reference step has already been stored.

So I went to PI3. At p13, 1 is added to the previous reference step number, and the process goes to p14. In P14, all the data of that step number is replaced with all the data of the exploration step number that is at the shortest distance that was previously revealed, and that exploration step is made the reference step. Next, return to P4. Similarly, in P4, set the first exploration step number to the reference step number by 1.
Determine by adding. In this way, each process of P4 to P14 is repeated, and the step for which the inspection order has been newly determined is set as the reference step, and the steps between the reference step and each exploration step of Haku except for the steps for which the inspection order has already been determined are , Similarly, find the distance indicated by the maximum axis component data, compare these distances, determine the longest distance or the shortest exploration step for the next inspection order, and select the closest distance one after the other. The test order of each step is written in the memory, and the test types of all steps are set until there are no steps whose test order is undetermined.

Further, FIGS. 8, 9, and 10 are flowcharts showing a step inspection order setting window processing program based on representative point calculation, which is executed by the processing of P20 to P37. First, in P2O, the data of step number 1 is read from the memory, and the process goes to P21. Note that the memory stores the step data shown in the format shown in the 11th (a> figure) for the maximum number of steps.In P21, each Calculate the average data for each Y-coordinate data and obtain the X-Y coordinate data of a point representing that step.For example, on the X-Y coordinates of the board to be inspected, as shown in FIG. If there are three measuring points LO, MO, and RO belonging to that step, then the arithmetic mean data of their X coordinate data and Y coordinate data is calculated as follows: 10, MO, MO,
X-Y coordinate data of the center of gravity NO with RO as the vertex is obtained. Next, go to P22. In P22, the X-Y coordinate data of the representative point (center of gravity) is added to the previous step data, and the 11th (
b) Create a data table as shown in the figure.

Next, in P23, 1 is added to the step number. Next P2
4, it is determined whether the step number has reached the maximum number of steps. If No, return to P21. At p21, XY coordinate data of a point representing that step is similarly obtained.

For example, as shown in FIG.
If measurement points M and R exist, the X-Y coordinate data of the center of gravity N can be obtained.Furthermore, by repeating the process of P21 to P24 via P22, P23, and p24, each step can be obtained in the same way. X-Y coordinate data of each representative point can be obtained, and a data table can be created for each step.

Next, go to P25. Subsequent P25 to P301 and P32
Each process from ~P37 corresponds to P1~P6 and P9~P14 in the previous step inspection order setting window processing program.
This is the same as each process. However, in P31, the linear distance between the two representative points is calculated from the X-Y coordinate data of the representative point of the reference step and the X-Y coordinate data of the representative point of the exploration step using the Pythagorean theorem.

Therefore, each process of P28 to P37 is repeated, and the step for which the inspection order has been newly determined is set as the reference step, and each exploration step is For each step, determine the straight line distance between the representative point of the reference step and the representative point of the exploration step, compare these distances, and determine the exploration step with the shortest distance from the reference step for the next inspection order. , the steps closest to each other are found one after another, and the test order of each step is written in the memory until there are no steps whose test order is undetermined, and the test types of all steps are set. By the way, the inspection order setting connection for all steps, and the X-Y of the representative point from each step data.
Separate the coordinate data and save it in memory.

In addition, after trying the step inspection order setting window by calculating the -degree axis component and the step inspection order setting window by calculating the representative point for the same board to be inspected, we found that the method that shortens the inspection time for the same type of test board It is recommended to perform step inspection @ setting by adopting .

During inspection, the substrate to be inspected is placed on a measurement table and fixed so that its X-axis and Y-axis coincide with the X-axis and Y-axis common to the first, second, and third XY units, respectively. Therefore,
Each probe 12.1 of the first, second, and third X-Y units
Move each probe 12, 14, and 16 and bring them into contact with the preset measurement points on the substrate surface one after another.
A measurement current or measurement voltage is applied to each component through the . Then, the resistance value, capacitance value, inductance value, etc. can be measured, and the quality of the tested board can be determined.

According to the present invention described in detail, after first determining the step corresponding to the part to be inspected, the steps closest to each other are determined one after another to sequentially determine the inspection order. , the inspection order setting time can be shortened. Furthermore, the inspection time can be shortened during inspection. Therefore, it is convenient for inspecting circuit boards produced in a wide variety of small quantities.

[Brief explanation of the drawing]

1 and 2 are block diagrams respectively showing an inspection order setting device for a moving probe type circuit board inspection device according to the present invention. FIG. 3 is a block diagram showing the configuration of a moving probe in-circuit tester to which the present invention is applied, and FIG. 4 is a block diagram showing the configuration of its controller. 5 and 6 are flowcharts showing a step inspection order window processing program based on axis component calculation stored in the memory of the controller. FIG. 7 is a diagram showing each axis component between corresponding measurement points for two steps existing on the substrate to be inspected. FIG. 8, FIG. 9, and FIG. 10 are flowcharts showing a step inspection order setting window processing program based on representative point calculation stored in the memory of the controller. FIG. 11 is a diagram showing a step data table stored in the memory of the controller. FIG. 12 is a diagram showing representative points of two steps existing on the substrate to be inspected. FIG. 13 is a diagram showing a part of the circuit of the board to be inspected. 10... Circuit board inspection device 12.14.16...
Each probe 36 of the first, second, third X-Y unit...
・Memory 42.50...Inspection first step determining means 44.52...Recent step detection means 46.54
. . . Inspection order setting control means 48 . . Step representative coordinate detection means LO, MOlROlL, M. R...Each measurement point of 2 steps N01N...Each representative point of 2 steps

Claims (2)

[Claims] (1) Write the X-Y coordinate data of each measurement point existing on the board to be inspected into memory, group multiple measurement points corresponding to each component as one step, and prepare it for the circuit board inspection equipment at the time of inspection. In an inspection order setting device for a probe movable circuit board inspection device that sets the order of steps in which each probe of a plurality of X-Y units moves, the inspection order setting device for the probe moving type circuit board inspection device sets the inspection step that is the starting point of probe movement from among all the steps of the board to be inspected. An inspection first step determining means for determining the first step, and a step for which the inspection order has been newly determined as a reference step, and between that reference step and each other exploration step except for the step for which the inspection order has already been determined. in,
For each exploration step, the coordinate positions are indicated by X-axis component data and Y-axis component data between the two measurement points for each of the corresponding measurement points, with multiple measurement points of the reference step and multiple measurement points of the exploration step. Calculate each distance, find the distance indicated by the maximum axis component data for each exploration step, compare these distances, and decide the exploration step with the longest distance and the shortest for the next inspection order. The present invention is characterized by comprising: a recent step detection means; and an inspection order setting control means for causing each of these means to sequentially determine the inspection order until there are no steps whose inspection order is undetermined, and writing the inspection order of each step in a memory. Inspection order setting device for mobile probe circuit board inspection equipment. (2) Write the X-Y coordinate data of each measurement point existing on the board to be inspected into memory, group multiple measurement points corresponding to each component as one step, and prepare it for the circuit board inspection equipment at the time of inspection. In an inspection order setting device for a probe moving type circuit board inspection device that sets the order of steps in which each probe of a plurality of XY units moves, a plurality of measurements belonging to one step are performed for each step of the board to be inspected. From each X-Y coordinate data of the point to each X coordinate data,
Step representative coordinate detection means for calculating arithmetic average data for each Y coordinate data to obtain X-Y coordinate data of a point representing a plurality of measurement points; An inspection first step determining means that determines the first inspection step that is the starting point, and a step for which the inspection order has been newly determined as a reference step, and other steps other than the reference step and steps for which the inspection order has already been determined. For each exploration step, the straight-line distance between the representative point of the reference step and the representative point of the exploration step is calculated for each exploration step, and the distances are compared.
The most recent step detecting means determines the exploration step located at the shortest distance from the reference step as the next inspection order, and the latter two means sequentially determine the inspection order until there are no steps whose inspection order is undetermined. An inspection order setting device for a probe movable circuit board inspection device, comprising an inspection order setting control means for writing an inspection order into a memory.