JPH0414858A - Lead terminal structure for electronic component - Google Patents
Lead terminal structure for electronic componentInfo
- Publication number
- JPH0414858A JPH0414858A JP2117846A JP11784690A JPH0414858A JP H0414858 A JPH0414858 A JP H0414858A JP 2117846 A JP2117846 A JP 2117846A JP 11784690 A JP11784690 A JP 11784690A JP H0414858 A JPH0414858 A JP H0414858A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- lead
- electronic component
- board
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子部品、特に面実装型の集積回路素子の
リード端子構造の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in the lead terminal structure of electronic components, particularly surface-mounted integrated circuit elements.
〔従来の技術］
第４図は例えば実開昭６３−５５５７６号公報に示され
た従来のリード端子構造及び実装図であり、図において
、（１）は電子部品のパッケージ、（２）はり−ト端子
、（３）は基板、（４）は基板上の電極、（５）は半田
接合部である。ここで図のように各々のリード端子（２
）はすべて同形状であり、それに伴ない対応する電極（
４）も基板（３）上に直線的に配置された構造となって
いる。[Prior Art] Fig. 4 is a diagram of a conventional lead terminal structure and mounting shown in, for example, Japanese Utility Model Application Publication No. 63-55576. In the figure, (1) shows an electronic component package, and (2) a beam. (3) is a substrate, (4) is an electrode on the substrate, and (5) is a solder joint. Here, connect each lead terminal (2
) all have the same shape, and corresponding electrodes (
4) is also arranged linearly on the substrate (3).
一般に電子部品及び実装基板は、外的環境による温度変
化を受けたり、通電時に電子部品が発熱を生した場合、
パッケージ（１） と基板（３）の線膨張係数の差によ
り、リード端子（２）と電極（４）の間の半田接合部（
５）に負荷が加わり、半田疲労破壊の原因となる。そこ
で特に面実装基板では、半田接合部（５）の信頼性が重
要視されている。In general, electronic components and mounting boards are subject to temperature changes due to the external environment, or if electronic components generate heat when energized,
Due to the difference in linear expansion coefficient between the package (1) and the substrate (3), the solder joint between the lead terminal (2) and the electrode (4)
5) is loaded, causing solder fatigue failure. Therefore, especially in surface-mounted boards, the reliability of the solder joints (5) is important.
（発明が解決しようとする課題）
従来の電子部品のリード端子（２）は、以上のように各
端子か同形状であり電８ｉ（４）は基板（３）上に直線
的に配置されているため、リード端子（２）の本数を増
加すると、必然的に、隣接するり−ト端子間及び電極間
は狭小化するため、基板実装時の半田ブリッジによる電
極間の短絡が発生しやすくなるなどの問題点があった。(Problems to be Solved by the Invention) As described above, the lead terminals (2) of conventional electronic components have the same shape, and the lead terminals (4) are arranged linearly on the board (3). Therefore, when the number of lead terminals (2) is increased, the distance between adjacent wire terminals and between electrodes will inevitably become narrower, making it more likely that short circuits will occur between electrodes due to solder bridges during board mounting. There were problems such as:
この発明は上記のような問題点を解消するためになされ
たもので、リード本数を増加させても、十分な半田量で
半田接合ができ、余分な半田による隣接する電極間の短
絡を回避することができ、高い信頼性の半田接合を可能
とする電子部品のリード端子構造を得ることを目的とす
る。This invention was made to solve the above problems, and even if the number of leads is increased, solder joints can be made with a sufficient amount of solder, and short circuits between adjacent electrodes due to excess solder can be avoided. The purpose of the present invention is to obtain a lead terminal structure for electronic components that enables highly reliable solder joints.
（課題を解決するための手段）
この発明に係る電子部品のリード端子は、隣接するリー
ド端子の半田接合部位置を交互に異ならせて、基板の各
電極に半田接合したものである。(Means for Solving the Problems) In the electronic component lead terminal according to the present invention, adjacent lead terminals are soldered to each electrode of a substrate, with the solder joint positions of the lead terminals being alternately different.
（作用）
この発明における電子部品のリード端子は、隣接するリ
ード端子の半田接合部位置を交互に異ならせることによ
り、基板上の各リード端子に対応する電極も交互に配置
され電極間を大きくとることができるため、十分な半田
量で接合でき、かつ隣接する電極どうしの短絡を回避す
ることができる。(Function) In the electronic component lead terminals of the present invention, by alternately changing the solder joint positions of adjacent lead terminals, the electrodes corresponding to each lead terminal on the board are also alternately arranged, thereby increasing the distance between the electrodes. Therefore, it is possible to bond with a sufficient amount of solder, and to avoid shorting between adjacent electrodes.
以下、この発明の一実施例を図について説明する。第１
図において、（１）は電子部品のパッケージ、（２ａ）
はガルウィングリード、（２ｂ）はＪり一ト、（３）は
基板、（４）は電極、（５）は半田接合部である。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) is an electronic component package, (2a)
(2b) is a gullwing lead, (2b) is a J-type wire, (3) is a substrate, (4) is an electrode, and (5) is a solder joint.
本実施例では、リード端子（２ａ）はガルウィングリー
ド、（２ｂ）はＪリードに加工され、隣接するリード端
子の半田接合部の延設方向が逆向になるように交互に配
列される。また、リード′端子に対応し、基板上の電極
も、第２図（ａ）に示す従来例のように直線的に配置さ
れるのではなく、第２図（ｂ）に示すように交互に配置
される。In this embodiment, the lead terminals (2a) are processed into gull-wing leads, and the lead terminals (2b) are processed into J-leads, and they are arranged alternately so that the extending directions of the solder joints of adjacent lead terminals are opposite to each other. Furthermore, corresponding to the lead terminals, the electrodes on the substrate are not arranged linearly as in the conventional example shown in Fig. 2(a), but alternately as shown in Fig. 2(b). Placed.
第２図（ａ）から明らかなように、従来例ではリード（
２）の本数を増やすと、隣接するリード間及び電極間が
狭くなる。しかし、本実施例によるリード端子構造にす
ることにより、第２図（ｂ）に示すように電極（４）は
交互に配置されるので、隣接する電極間は広くなり、基
板実装時の半田ブリッジによる短絡を防止することがで
きる。As is clear from FIG. 2(a), in the conventional example, the lead (
When the number of 2) is increased, the distance between adjacent leads and between adjacent electrodes becomes narrower. However, by using the lead terminal structure according to this embodiment, the electrodes (4) are arranged alternately as shown in FIG. This can prevent short circuits caused by
なお、上記実施例では、リード端子（２）をガルウィン
グリード（２ａ）とＪリード（２ｂ）で構成したが、第
３図に示すように、長リード（２Ｃ）、短リード（２ｄ
）と交互にリードの長さを変えたものでも、上記実施例
と同様の効果を奏する。In the above embodiment, the lead terminal (2) was composed of a gullwing lead (2a) and a J lead (2b), but as shown in FIG.
), the same effect as in the above embodiment can be obtained even if the length of the leads is alternately changed.
また、リード形状を交互に変えるだけでなく、数種の異
なった形状を用いても、同様の効果を奏する。Furthermore, the same effect can be obtained not only by alternating the lead shapes but also by using several different shapes.
〔発明の効果］
以上のように、この発明によればリード端子の形状を交
互に変えて構成したので、基板実装時、電極間の半田ブ
リッジによる短絡を回避することができ、信頼性の高い
半田接合が得られる効果がある。また、電子部品の実装
工程における歩留まりの向上が図れる。[Effects of the Invention] As described above, according to the present invention, since the shape of the lead terminals is alternately changed, it is possible to avoid short circuits due to solder bridges between electrodes when mounting on a board, resulting in high reliability. This has the effect of providing solder joints. Furthermore, the yield in the electronic component mounting process can be improved.
第１図はこの発明の一実施例による電子部品実装状態の
斜視図、第２図（ｂ）は本実施例による電子部品の電極
の配置を示した基板の上面図、第２図（ａ）は従来の電
子部品の電極の配置を示した基板の上面図、第３図は他
の実施例による電子部品実装状態の斜視図、第４図は従
来の電子部品実装状態の斜視図である。
（１）はパッケージ、（２）はリード端子、（２ａ）は
ガルウィングリード、（２ｂ）はＪレード、（２ｃ）は
長リード、（２ｄ）は短リード、（３）は基板、（４）
は電極、（５）は半田接合部。
なお、図中、同一符号は同一 または相当部分を示す。FIG. 1 is a perspective view of an electronic component mounted state according to an embodiment of the present invention, FIG. 2(b) is a top view of a board showing the arrangement of electrodes of an electronic component according to this embodiment, and FIG. 2(a) 3 is a top view of a board showing the arrangement of electrodes of a conventional electronic component, FIG. 3 is a perspective view of an electronic component mounted state according to another embodiment, and FIG. 4 is a perspective view of a conventional electronic component mounted state. (1) is the package, (2) is the lead terminal, (2a) is the gullwing lead, (2b) is the J-lade, (2c) is the long lead, (2d) is the short lead, (3) is the board, (4)
is the electrode, and (5) is the solder joint. In addition, the same symbols in the figures indicate the same or equivalent parts.
Claims (1)
ド端子を半田接合するところの面実装型パッケージを有
する電子部品の各リーダ端子の半田接合部位置を交互に
異ならせたことを特徴とする電子部品のリード端子構造
。An electronic component having a surface mount type package in which lead terminals are soldered to each electrode printed on the component mounting surface of a circuit board, and the positions of the solder joints of each leader terminal are alternately different. Component lead terminal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2117846A JPH0414858A (en) | 1990-05-08 | 1990-05-08 | Lead terminal structure for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2117846A JPH0414858A (en) | 1990-05-08 | 1990-05-08 | Lead terminal structure for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0414858A true JPH0414858A (en) | 1992-01-20 |
Family
ID=14721722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2117846A Pending JPH0414858A (en) | 1990-05-08 | 1990-05-08 | Lead terminal structure for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414858A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030053161A (en) * | 2001-12-22 | 2003-06-28 | 삼성전자주식회사 | Semiconductor device and method for manufacturing thereof |
| US7354294B2 (en) | 2003-04-10 | 2008-04-08 | 3M Innovative Properties Company | Coaxial cable connector, and harness unit that utilizes the coaxial cable connector |
-
1990
- 1990-05-08 JP JP2117846A patent/JPH0414858A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030053161A (en) * | 2001-12-22 | 2003-06-28 | 삼성전자주식회사 | Semiconductor device and method for manufacturing thereof |
| US7354294B2 (en) | 2003-04-10 | 2008-04-08 | 3M Innovative Properties Company | Coaxial cable connector, and harness unit that utilizes the coaxial cable connector |
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