JPH04148541A - Positioning mechanism of probe card - Google Patents

Abstract

PURPOSE:To enable automatic fine adjustment preciser than the position of a probe card by comprising a probe card transfer division 40 mounted on a mother board and transferring the probe card in X, Y and theta directions. CONSTITUTION:A probe card 20 corresponding to an IC chip 60 under test is fitted to a mother board 10 by an automatic device. Next, the tip of a probe 30 and a pad 61 of the IC chip 60 are displayed in enlargement by a CCD camera 70 installed above the opening 11 of the mother board 10, and voltage impressed on these piezoelectric elements 411, 412 and 413 is controlled by a power source 42 so that the tip of the probe 30 may overlap a pad 61 of the IC chip. When the tip of the probe 30 overlap the pad 61 of the IC chip 60, these piezoelectric elements 411, 412 and 413 are kept impressed with that voltage to maintain their positions. Otherwise, the output of the CCD camera 70 may be sent to an image recognizer to automatically control overlap of the tip of the probe 30 of the pad 61.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a positioning mechanism for a probe card used in measuring the electrical characteristics of an IC chip.

<Prior art> The applicant has developed a probe card positioning mechanism as follows:
Application No. 154959 was filed.

Such a mechanism includes a support plate attached to a prober and a probe card attached to the support plate, the support plate is provided with a guide, the probe card has a stepped hole, and the probe card is fitted into the stepped hole. It has a slightly smaller washer, and after adjusting the positional relationship between the washer and the probe card so that the tip of the probe of the probe card is in the specified position with respect to the support plate with the guide inserted into the washer, the washer is removed. are fixed with adhesive.

<Problems to be Solved by the Invention> However, the probe card positioning mechanism described above has the following problems.

That is, the position adjustment of the probe card using such a mechanism is only possible within the range of the difference in size between the washer and the stepped hole, and fine adjustment after positioning and fixing the washer is not possible. Furthermore, the measuring device is capable of position adjustment of about 10 μm, but with the miniaturization and higher density integration of IC chips, position adjustment of about 1.0 am is becoming necessary.

Furthermore, in the case of a measuring device in which multiple types of probe cards are exchanged depending on the object to be measured, an operator must position the probe card each time the probe card is exchanged. Since this positioning work is a manual work, it must be avoided as IC chips become smaller and more densely integrated in the future.

The present invention was devised in view of the above circumstances, and an object of the present invention is to provide a probe card positioning mechanism that can automatically perform more precise fine adjustment of the probe card position.

Means for Solving the Problems> The probe card positioning mechanism according to the present invention is a probe card positioning mechanism that matches the position of the tip of the probe of the probe card and the pad of the IC chip. a motherboard to be attached; a probe card movably attached to the motherboard;
A probe card moving section that moves the probe card in the Y and θ directions is provided.

Function> A probe card corresponding to the IC chip to be measured is attached to the motherboard. That is, the stepped holes of the probe card are made to correspond to the screw holes of the motherboard, and the screws are screwed into the screw holes through the stepped holes. Attachment of this probe card is performed by an automatic device (not shown).

Next, the probe card is moved in the X, Y, and θ directions by the probe card moving unit, and the tip of the probe is aligned with the pad of the IC chip.

<Example> Hereinafter, an example according to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic cross-sectional view of the probe card positioning mechanism according to the first embodiment of the present invention, FIG. 2 is a bottom view of the probe card positioning mechanism, and FIG. 3 is a schematic cross-sectional view of the probe card positioning mechanism according to the first embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing a mechanism for attaching the probe card, FIG. 4 is a schematic cross-sectional view of a probe card positioning mechanism according to a second embodiment of the present invention, and FIG. 5 is a bottom view of the probe card positioning mechanism. be.

In the following description, the X direction refers to the right direction in FIG. 1, the Y direction refers to the direction toward the front of the paper in FIG. 1, and the θ direction refers to the counterclockwise direction in FIG. 2.

The probe card positioning mechanism according to the first embodiment is a probe card positioning mechanism that aligns the tip of the probe 30 of the probe card 20 with the pad 61 of the IC chip 60, and is attached to a measuring device (not shown). The present invention includes a motherboard 10 to be attached, a probe card 20 to be movably attached to the motherboard 10, and a probe card moving unit 40 mounted on the motherboard 10 to move the probe card 20 in the X, Y, and θ directions. The probe card moving unit 40 includes a piezoelectric element 41 attached to the motherboard 10 and a power source 42 that applies a voltage to the piezoelectric element 41 according to the amount of movement of the probe card 20.

The motherboard 10 is attached to a measuring device, and has an opening 11 in its center. This opening 11 is for visually observing the IC chip 60 during measurement.

The probe card 20 has a ring shape as a whole, and includes a ring 22 attached around an opening 21 in a substantially central portion, a plurality of probes 30 attached radially to an inclined surface 221 of this ring 22, and probes. It has a stepped hole 23 for movably attaching the card 20 to the motherboard 10, and a screw 24 that passes through the stepped hole 23 and is screwed into the motherboard 10.

Three stepped holes 23 are formed, and a large diameter part 231 having a slightly larger diameter than the head 241 of the screw 24 and a small diameter part 232 having a slightly larger diameter than the leg part 242 of the screw 24 are integrated. It is something that On the other hand, the screws 24 are adapted to be screwed into screw holes 12 formed in the motherboard 10. Therefore, even if the probe card 20 is attached to the motherboard 10 using the screws 24, there is a gap between the stepped hole 23 and the screw 24, as shown in FIG. This makes it possible to move as much as possible.

The tip of the probe 30 made of tungsten or the like is a portion that contacts the pad 61 of the IC chip 60, and is bent downward. On the other hand, the rear end of the probe 30 is connected to a printed wiring (not shown) formed on the surface of the probe card 20.
It is connected to the. Note that the end of the printed wiring is
Connected to a connector not shown.

Further, from the edge of the probe card 20, one protrusion 2
5 stands out. This protrusion 25 is abutted by an element 413 for moving in the θ direction, which will be described later.

A piezoelectric element 41 forming a probe card moving section 40 that moves the probe card 20 in the X, Y, and θ directions.
, an X-direction movement element 411 that moves the probe card 20 in the X direction, a Y-direction movement element 412 that moves the probe card 20 in the Y direction, and a θ-direction movement element 413 that rotationally moves the probe card 20 in the θ direction. have.

For example, as shown in FIG. 2, the X-direction moving element 411 is configured to move the motherboard 10 so that the side that extends upon application of a voltage faces the X-direction, and its end surface contacts the side surface of the probe card 20. It is mounted on the back side. The Y-direction moving element 412 is similarly mounted on the back side of the motherboard 10.

On the other hand, the θ-direction moving element 413 has its side, which extends when a voltage is applied, in contact with the side surface of the protrusion 25 . Therefore, when the θ-direction movement element 413 extends, the probe card 20 rotates in the θ-direction.

Next, the operation of the probe card positioning mechanism configured as described above will be explained.

Probe card 2 corresponding to the IC chip 60 to be measured
0 is attached to the motherboard 10. That is, the stepped hole 23 of the probe card 20 corresponds to the screw hole 12 of the motherboard 10, and the screw 24 is screwed into the screw hole 12 through the stepped hole 23. This attachment of the probe card 20 is performed by an automatic device (not shown).

Next, the tip of the probe 30 and the pad 61 of the IC chip 60 are enlarged and displayed on the monitor 71 by the CCD camera 70 installed above the opening 11 of the motherboard 10, and the probe card moving part 4o is displayed so that the two overlap. operate.

That is, the tip of the probe 30 and the pad 6 of the IC chip 6°
Three piezoelectric elements 411, 412 .
The voltage applied to 413 is controlled by power supply 42.

If the tip of the probe 30 and the pad 61 of the IC chip 60 overlap, three piezoelectric elements 411, 412, 413
Continue to apply that voltage to maintain that position.

Note that the output of the CCD camera 70 may be sent to an image recognition device to automatically control the overlap between the tip of the probe 30 and the pad 61.

In the first embodiment described above, the piezoelectric element 41 was used in the probe card moving unit 40, but as shown in FIG.
Direction movement motor 452 and θ direction movement motor 453
It consists of.

In this case, worm gears 451b, 452b, 453b attached to output shafts 451a, 452a, 453a of each motor 451, 452, 453, screw holes 454a (screw holes 454b, 454c (not shown) constitute the probe card moving unit 40.

The X-direction movement motor 451 is located at the same position as the X-direction movement element 411 in the first embodiment, and the Y-direction movement motor 452 is located at the same position as the Y-direction movement element 412 in the first embodiment.
are installed at the same location. On the other hand, the motor 453 for moving the probe card 20 in the θ direction makes the worm gear 453b correspond to the screw hole formed on the side surface of the protrusion 25 protruding from the side surface of the probe card 20.
It can be rotated in any direction.

Note that as the probe card 20 moves, the relative positional relationship between the motor and the probe card 20 shifts, but this shift is absorbed by the distortion of the output shafts 451a, 452a, and 453a of each motor 451, 452, and 453. Ru. Furthermore, if the motors 451, 452, and 453 are rubber-mounted to the motherboard IO, the displacement will be absorbed by the rubber mount, so that the output shafts 451a, 452a, and 453a will not be distorted by the displacement.

<Effects of the Invention> The probe card positioning mechanism according to the present invention includes a motherboard attached to a measuring device, a probe card movably attached to the motherboard, and a probe card mounted on the motherboard that moves the probe card in X, Y and Since the probe card moving part is provided to move the probe card in the θ direction, the tip of the probe can be made to correspond to the pad of the IC chip. In particular, if a piezoelectric element is used in the probe card moving section, fine positioning of about 1.0 .mu.m can be achieved.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view of the probe card positioning mechanism according to the first embodiment of the present invention, FIG. 2 is a bottom view of the probe card positioning mechanism, and FIG. 3 is a schematic cross-sectional view of the probe card positioning mechanism according to the first embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing a mechanism for attaching the probe card, FIG. 4 is a schematic cross-sectional view of a probe card positioning mechanism according to a second embodiment of the present invention, and FIG. 5 is a bottom view of the probe card positioning mechanism. be. 10...motherboard, 20...probe card,
30... probe, 40... probe card moving section, 4
1... Piezoelectric element, 42... Power supply, 451.452.
453...Motor, 60...IC chip, 6 topad.

Claims (3)

[Claims] (1) A motherboard attached to a measuring device in a probe card positioning mechanism that matches the positions of the tips of the probes of the probe card and the pads of the IC chip;
A probe card positioning mechanism comprising: a probe card movably attached to the motherboard; and a probe card moving section mounted on the motherboard to move the probe card in X, Y, and θ directions. (2) The probe according to claim 1, wherein the probe card moving unit includes a piezoelectric element attached to a motherboard and a power source that applies a voltage to the piezoelectric element according to the amount of movement of the probe card. Card positioning mechanism. (3) The probe card according to claim 1, wherein the probe card moving unit includes a motor attached to a motherboard and a power source that supplies current to the motor according to the amount of movement of the probe card. Positioning mechanism.