JPH04146092A - Noncontact handling device and its method - Google Patents

Abstract

PURPOSE:To make the carrying of a workpiece possible without its slipping largely or falling from a fixed position on the holding face of a holding body by detecting the position of a workpiece held on the holding face of the holding body in a noncontact state, and controlling the inclinating angle of the holding body on the detecting signal of the position of the workpiece. CONSTITUTION:This handling device is provided with a jetting section 27 which is provided on a holding body 23 to jet fluid for holding a plate-shaped workpiece 24 on a holding face 25 in a noncontact state, a supporting mechanism 9 to oscillatably support the holding body 23,and a driving means 14 for driving the supporting mechanism 9 to oscillate the holding body 23. A detecting means 26 for detecting the position of the workpiece 24 held on the holding face 25 in the non-contact state is provided on the holding face 25 of the holding body 23, and the driving means 14 is driven on the detecting signal issued from the detecting means 26 to control the inclinating angle of the holding body 23 through a control means 32.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a non-contact handling device and method for holding and transporting a plate-shaped work such as a semiconductor wafer in a non-contact manner.

(Prior Art) For example, in the manufacturing process of semiconductor devices, there are many steps in which semiconductor wafers housed in recesses such as trays must be taken out and transferred to a predetermined location. As one example of this, in the case of an atmospheric pressure CVD apparatus, there is an operation in which a semiconductor wafer is transferred while being placed on a flat plate, and then transferred to another station. In such a case, a method is used in which the edge of the semiconductor wafer is gripped with a hand having three claws.

By retaining the peripheral edge of the semiconductor wafer, the above-mentioned problems are reduced. However, the semiconductor wafer may be chipped due to impact upon contact.

Therefore, handling devices that hold and transport semiconductor wafers in a non-contact manner have been developed. This handling device is
It consists of a holder with a lower surface serving as a holding surface and a spout hole drilled in the center. When the holding surface of the holding body is brought close to the semiconductor wafer and fluid such as compressed air is jetted out from the jet port, negative pressure is generated between the holding surface and the semiconductor wafer due to the Bernoulli effect. The semiconductor wafer can be held on the holding surface without contact by the negative pressure.

By the way, in such a handling device, since the semiconductor wafer is held on the holding surface in a non-contact state, there is no frictional force between them. Therefore, when a force is applied to the semiconductor wafer in a direction parallel to the holding surface, the semiconductor wafer easily shifts in position in the lateral direction. In other words, unless the holding surface is always perpendicular to the direction of gravity, a force will be applied to the semiconductor wafer in a direction parallel to the holding surface, causing the semiconductor wafer to become misaligned. .

However, even if the holding surface is maintained perpendicular to the direction of gravity, if the holding body is moved at a speed that applies acceleration to the semiconductor wafer in order to transport the semiconductor wafer in this state, the semiconductor wafer will Since no force is applied in the moving direction, the semiconductor wafer is largely displaced from the predetermined position on the holding surface.

To prevent such misalignment of semiconductor wafers,
A guide bin is provided protruding from the periphery of the holding surface, and the semiconductor wafer is placed in contact with the guide bin to prevent the semiconductor wafer from shifting by more than a predetermined amount. however,
If the semiconductor wafer is brought into contact with the guide bin, the semiconductor wafer may be chipped due to the impact upon contact, and the chipping may cause dust to be generated.

(Problems to be Solved by the Invention) As described above, the conventional non-contact handling device is unable to prevent the workpiece held in a non-contact manner from being displaced on the holding surface of the holding body.

This invention has been made based on the above-mentioned circumstances, and its object is to prevent a workpiece held in a non-contact state from the holding surface of the holding body from being significantly displaced from a predetermined position on the holding surface. It is an object of the present invention to provide a non-contact handling device and a method thereof that allow transportation.

C Structure of the invention (Means and effects for solving the problem) In order to solve the above problem, the first means of the invention is to provide a holder having a holding surface and a plate-shaped workpiece provided on the holder. a spouting part that spouts fluid for holding the holding surface in a non-contact manner;
a support mechanism that swingably supports the holding body; a drive means that drives the support mechanism to swing the holding body; Non-contact handling characterized by comprising a detection means for detecting the position of the workpiece, and a control means for controlling the inclination angle of the holding body by driving the drive means based on a detection signal from the detection means. It's in the device.

Further, a second means of the present invention is non-contact handling in which a workpiece is held in a non-contact manner by a negative pressure generated by ejecting fluid from the ejecting part onto a holding surface of a holder having a ejecting part that ejects fluid. In the method, a first step of bringing a holding surface of the holding body close to the workpiece and jetting fluid from the jetting part to hold the workpiece on the holding surface of the holding body in a non-contact manner; a second step of detecting a positional deviation of the workpiece with respect to the holding surface when the workpiece is moved; a third step of controlling the inclination angle of the holding body according to the positional deviation of the workpiece with respect to the holding surface; A non-contact handling method is provided.

According to these first and second means, if a shift occurs in the workpiece with respect to the holding surface of the holder, the inclination angle of the holder is controlled according to the shift, so that the workpiece can be fixed. Misalignment with respect to the holding surface can be corrected.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

1 to 16 show the first embodiment of this invention, and the second embodiment
The figure shows a robot device 1. This robot device 1 has a base 2 . A rotating body 4 rotatably driven by a first drive source 3 is provided on the upper surface of the base 2 . This rotating body 4 is driven to rotate by the first drive source 3 about a direction orthogonal to the horizontal direction.

One end portion of a first arm 5 is rotatably connected to the rotating body 4 . This first arm 5 is driven by a second drive @6 provided on the rotary body 4 as shown by the arrow X in FIG.
It is designed to be oscillated in the direction shown by. One end of a second arm 7 is rotatably connected to the other end of the first arm 5 . This second arm 7 is swing-driven in the direction indicated by arrow Y in FIG. 2 by a third drive source 8 provided at the other end of the first arm 5.

A support mechanism 9 shown in FIGS. 3 and 4 is built into the other end of the second arm 7. As shown in FIGS. This support mechanism 9 has a support main body 11 built into the second arm 7 and having a U-shaped cross section. On both side walls of the support main body 11 are first shafts that rotatably support both ends of the first swing shaft 12.
A bearing 13 is provided. One end of the first swing shaft 12 is connected to a drive shaft 15 of a first motor 14 provided on the outer surface of one side wall of the support body 11 .

Therefore, the first swing shaft 12 is driven to swing by the first motor 14.

A block body 16 formed in the shape of a rectangular frame is provided in the middle of the first swing shaft 12 . The first swing shaft 12 is divided into a first short shaft 12a and a second short shaft 12b, and each short shaft is provided protruding from a pair of opposing side walls of the block body 16.

Both ends of a second swing shaft 17 are rotatably supported by second bearings 18 on a pair of side walls of the block body 16 extending in a direction orthogonal to the axis of the first swing shaft 12. It is provided. That is, the second swing shaft 17 is rotatably supported by the block body 16 with its axis perpendicular to the axis of the first swing shaft 12g. A second motor 19 is provided on the outer surface of the side wall of the block body 16 located on one axial end side of the second swing shaft 17 . A drive shaft 21 of the second motor 19 is connected to one end of the second swing shaft 17. Therefore, the second swing shaft 17 is driven to swing by the second motor 19.

A prismatic mounting shaft 22 is located in the middle of the second swing shaft 17.
One end is connected and fixed. The other end of this mounting shaft 22 is fixed to the upper surface of the central portion of a disc-shaped holder 23. The lower surface of this holder 23 is a holding surface 25 that holds a semiconductor wafer 24 as a plate-shaped workpiece in a non-contact manner as described later. A pair of line sensors 26 are provided on this holding surface 25 at a predetermined interval and serve as detection means for detecting the position of the semiconductor wafer 24 held here in a non-contact state. This line sensor 26 is
As shown in FIG. 5, it has an elongated prismatic body portion 26a. This main body part 26a has a mounting groove 2 that penetrates in the height direction.
6b is formed over almost the entire length in the longitudinal direction.

In this mounting groove 26b, for example, an image input section 26c formed by arranging a large number of solid-state image sensors in a linear manner is provided on the incident side via a cylindrical lens 26d.

A projector 26e is provided on the side of the image input section 26c in the main body section 26a. The output light emitted from this projector 26e is transmitted to the semiconductor wafer 24 held on the holding surface 25.
The light is reflected from the upper surface of the image input section 26c and enters the image input section 26c. Details of the method for detecting the position of the semiconductor wafer 24 using the line sensor 26 will be described later.

A spout 27 is bored in the center of the holder 23 in the thickness direction. This spout 27 communicates with one end of a flow path 28 formed in the mounting shaft 22 . The other end of this flow path 28 opens to the outer circumferential surface of a midway portion of the mounting shaft 22 .

One end of a flexible tube 29 is connected to the other end of this flow path 28 . The other end of the tube 29 is connected to a pump 31 that is a compressed air supply source.

When compressed air is ejected from the spout 27 of the holder 23 and the holding surface 25 is brought close to the semiconductor wafer 24 placed at a predetermined location, the Bernoulli effect causes the contact between the holding surface 25 and the semiconductor wafer 24. Since there is a negative pressure between them, the semiconductor wafer 24 can be held on the holding surface 25 in a non-contact state by the negative pressure.

Further, the holding body 23 is swingably supported by a first swing shaft 12 and a second swing shaft 17, which are provided with their axes orthogonal to each other. Therefore, the holding body 23
can be tilted in the swinging direction of the first swinging shaft 12 and the swinging direction of the second swinging shaft 17. In other words,
The holder 23 can be tilted in any direction with respect to a plane formed by the axes of the first swing shaft 12 and the second swing shaft 17.

Semiconductor wafer 24 held by the pair of line sensors 26 on the holding surface 25 of the holding body 23 in a non-contact state
When the position of the holding surface 25 is detected, the detection signal is input to the arithmetic unit 32 as shown in FIG. This arithmetic unit 32 calculates the position r and sliding speed n of the semiconductor wafer 26 with respect to the holding surface 25 based on the detection signal of the line sensor 26. Based on this calculation result, the semiconductor wafer 24 is attached to the holding surface 25.
If there is a deviation, a drive signal is output to the drive section 33 to drive the first and second motors 14, 19 to correct the deviation.

Based on this drive signal, the first and second motors 14
．． 19 is driven to rotate the first and second swing shafts 12 and 17.
is driven to swing by a predetermined angle, so that the holding body 23 is tilted by a predetermined angle. When the holder 23 is tilted, the semiconductor wafer 24 slides downward in the direction of inclination of the holding surface 25, so that the deviation with respect to the holding surface 25 can be corrected.

The rotation angle θ and rotation speed θ when the first and second swing shafts 12.17 are driven by the drive unit 33 are fed back to the calculation device 32.

When the holder 23 holding the semiconductor wafer 24 is moved in the horizontal direction by driving the eleventh second arm 5.7 of the robot device 1, no force in the moving direction acts on the semiconductor wafer 24, so the semiconductor wafer 24 is displaced from a predetermined position on the holding surface 25. Therefore, in such a case,
As described above, the inclination angle of the holder 23 is controlled so that the semiconductor wafer 24 is held at a predetermined position on the holding surface 25 thereof.

When moving the holder 23, the holder 23 is tilted at a predetermined angle so that the holding surface 25 thereof faces downward with respect to the moving direction in order to reduce the displacement of the semiconductor wafer 24. The inclination angle of the holder 23 can be determined based on a preset movement acceleration of the holder 23. Therefore, the arithmetic device 32
If a set value S is set in accordance with the moving speed of the holding body 23 in It can be tilted at a predetermined angle.

However, when the holder 23 is actually moved, it is inevitable that the semiconductor wafer 24 will shift due to changes in various conditions. Therefore, when moving the holder 23, the inclination angle θ of the holder is controlled as follows.

First, as shown in FIG. 6, in a state where the holder 23 is tilted at an angle θ, the semiconductor wafer 24 is
The position where the semiconductor wafer 24 is deviated is "r", the predetermined position that should be accurately held with respect to the holding surface 25 is r., the difference (displacement amount) between " and ". 23
Let p be the inertia around the center of rotation of J11 and the swing radius of the holding 23. Further, the swing angle of the holder 23 with respect to the vertical line is θ, its rotation speed is δ, its acceleration is i, the moving speed (shift speed) of the semiconductor wafer 24 at the shifted position r is el, its acceleration is e, and the gravitational acceleration The g1 drive section 33
The drive input to U is the friction coefficient (
The equations of motion of the first and second motors 14.19) are given by Equation (1)... Equation (2) From these equations (1) and (2), The linear equation is found as follows. The state equation obtained from this linear equation is as follows. Therefore, in the arithmetic unit 32, e1
By multiplying θ and e1θ by an appropriate feedback gain to create an appropriate driving force U, the system of equation (4) above can be stabilized.

In other words, by inputting an appropriate driving force U to the drive unit 33 and tilting the holder 23, the deviation lie of the semiconductor wafer 24 with respect to the holding surface 25 can be brought close to zero, so that the amount of deviation of the semiconductor wafer 24 can be reduced. e can be kept within a predetermined range.

Detection of the position of the semiconductor wafer 24 by the pair of line sensors 26 provided on the holding surface 25 of the holder 23 is performed as follows. As shown in FIG. 7, the length of the pair of line sensors 26 is set to be greater than or equal to L>2r, where r is the radius of the semiconductor wafer 24. Thereby, one line sensor 26 can detect two boundary points between the position on the semiconductor wafer 24 and the other position. As shown in FIG. 8, if the two points detected by one line sensor 26 are A and B, and the two points detected by the other line sensor 26 are C1D, the coordinate information of these four points is detected. be done.

Since the semiconductor wafer 24 always has an orientation flat 24a formed thereon as shown in FIG. 9, it does not have a perfect circular shape. Assuming that the maximum height dimension of the orientation flat 24a is pl, and the length dimension is C, the arrangement interval of the pair of line sensors 26 is set to (2r-j), )>b>c. In other words, the distance between the pair of line sensors 26 is, among the four points A-D detected by these line sensors 26,
The two points are kept at a distance that is not included in the orientation flat 24a.

Based on the coordinate information of the above four points, the midpoint M of point AB and C
When the midpoint M' between D is calculated and compared, if any of the four points includes the orientation flat 24a, the Y between M and M' is
This can be determined because the coordinates are different.

Semiconductor wafer 24 against holding surface 25 of said holder 23
The position is calculated according to the flowchart shown in FIG. First, when the coordinates of four points are detected by a pair of line sensors 26, the Y coordinate of midpoint M of AB and CD
The Y coordinate of the midpoint M' is calculated. - If the orientation flat 24a is not included in the above four points and M-M', the coordinates (pSq) of the center O' of the semiconductor wafer 24 are calculated as follows. First, to find the X coordinate p of the semiconductor wafer 24, as shown in FIG. think of. In this triangle ABO'', the length between AB is g1, the remaining two sides are r, and the length g is A
It is known from the coordinates of point and point B, and r is also known from the coordinates of point B.
Since the radius is 4, it is known. Therefore, the area Q of triangle ABO'' is given by Heron's formula Q = s (s-
r) (s-r) (s-j) ・= (
5) can be obtained using the formula. Note that 5=(2r+4ri/2).

On the other hand, the area Q of the triangle ABO- can be expressed as Q-pJ/2...Equation (6)%, since its height can be taken as the X coordinate p of the center O', as shown by the broken line in the figure.
From formula % (5) and formula (6), it can be calculated as follows.

Or, according to the Pythagorean theorem, p" + i/2)'-r2 ... (8) formula%
Formula % p-±Vri2N-2- It can be determined by the formula (9). Note that the value of the distance can be determined by comparing the lengths of AB and CD. the above(
By performing calculations based on equation 8) or equation (9), the X coordinate of the center 0゛ of the semiconductor wafer 24 can be determined, and the Y coordinate is the Y coordinate of the midpoint M between points A and B. Same as coordinates. Therefore, the center coordinates of the semiconductor wafer 24 (
p, q) are determined, thereby calculating the amount of deviation between the center O' of the semiconductor wafer 24 and the center of the holding surface 25 of the holder 23. Then, as described above, the inclination angle of the holder 23 is controlled according to this amount of deviation, and the deviation of the semiconductor wafer 24 is corrected.

Next, when the orientation flat 24a is applied to any of the four points A to D, it is determined which of the points A, B, or C1D the orientation flat 24a is applied to. In that case, an isosceles triangle AB with − side AB and two sides r
O, and -side CD.

Consider an isosceles triangle ABO2 whose two sides are ``.

Here, 0. The coordinates of and 02 can be calculated based on the above equations (6) to (9) as in the case where the orientation flat 24a is not included in the four points. Unfortunately, the above 4
If any of the points A to D includes the orientation flat 24a, the coordinates of the 00 and 02 points of each isosceles triangle will not match, and conversely, the orientation flat 24a will be included in the four points above. If not, the coordinates of point 08 and point 02 match.

The equations of two circles can be determined by the isosceles triangles ABO and CDO. That is, 0. The coordinates of 02 are (p+, q+), and the coordinates of 02 are (p2・q2
), then the equation of the circle made from the coordinates of triangle ABO+ (X-p
+ ) + (y-Q+) -r 2- Equation (10) Also, the equation of the circle created from the coordinates of triangle CD○2 is (x-p2) + (y-q2) -r 2
...determined by equation (11). In the above equation (10), 0 point and D
By substituting the coordinates with the points, if the above equation (10) is satisfied, the 0 point and the D point mean that there is no orientation flat 24a, and if either the 0 point or the D point is not satisfied,
It can be determined that the point is not on the circumference.

Similarly, by substituting the coordinates of point A and point B into the above equation (11) and determining whether or not the above equation (11) is satisfied, A
It can be determined whether the orientation flat 24a is included in the point or the point B.

That is, by the above equations (10) and (11), A-
It is possible to determine at which point of point d the orientation flat 24a is applied or not.

Table (1) below shows the determination results when the orientation flat 24a is applied to the 0 point or the D point.

Although the condition is that the orientation flat 24a does not touch two points A-D at the same time, in this example,
The above equation (11) in which the center coordinate is set to 02 contradicts the above condition. Therefore, it can be determined that the center coordinate 0 of the semiconductor wafer 24 is ol(p+, Q+).

FIG. 8 explains a method for detecting the position (rotation angle) when the orientation flat 24a is bent at the 0 point. That is, assuming that the center point of the semiconductor wafer 24 is 0', the angle θ between the straight line 0-N connecting 0' and the midpoint M of the orientation flat 24a and the X axis is determined. Assuming that the intersection point between one line sensor 26 and the orientation flat 24a is C', the angle φ can be determined as follows. Therefore, the orientation flat 24a
The angle θ between the

On the other hand, when separating point C' from point C'' which is line-symmetrical to line segment 0-N, the semiconductor wafer 24 is rotated counterclockwise around center 0', and line segment C'' is separated from point C'. Detect a change in D. If the line segment CD increases, it means that the orientation flat 24a is at point C'', and if it decreases, it means that it is at C=.

When C'' is the boundary with the orientation flat 24a, the angle θ
θ...(14) Formula % Formula % Next, the range that can be determined by the pair of line sensors 26 in this embodiment will be explained with reference to FIGS. 12 and 13. The measurable range means that as long as the center coordinate O of the semiconductor wafer 24 is within that range, the semiconductor wafer 24
This is the range in which the center position O' and the rotational attitude of can be calculated. Note that the upper half will be explained assuming that it is vertically symmetrical.

As shown in FIG. 12, when a straight line indicating one line sensor 26 is defined as A, a line segment connecting the intersection of this straight line A and the outer periphery of the semiconductor wafer 24 with the center O' of the semiconductor wafer 24 and the X-axis The range of θ is 0, θ, and θ1.3. In other words, the other line sensor 26
is on the Y axis, and the distance between the pair of line sensors 26 is b, then when the semiconductor wafer 24 moves to the rightmost side without coming off the other line sensor 26, θ-
The value is θ1.8, and the value θ-0 is when the sensor is moved to the leftmost side without coming off from one line sensor 26. When θ-θ1161, (r cos θmaw =
b r ), so θmhx −cos −′
(br/r)-(15). In order to show the sensing range, considering the evaluation formula (15) above, pm (L/2) - rsln θ - (1B) where p is the semiconductor of the line sensor 26 as shown in Fig. 12. This is the length of the portion that does not cover the wafer 24.

When the semiconductor wafer 24 is a perfect circle, at θ-0, p - L / 2 ... (1
7) Equation becomes. Also, when θ−θ□, pm (
L/2)-rslnθsem-(L/2)-rshidingneeji1l-=7- (L/2)
-1 Equation...Equation (18) When the orientation flat 24a and one line sensor 26 overlap in parallel as shown in FIG. 14, the minimum value of the angle θ' is (r slnθ= −
c/2), so sin θ−−c/2 r ・=(19)
Substituting this equation (19) into the above equation (17), we get p
-(L/2) -(c/2)-(L-C)/2-(2
0) Equation When the center coordinate O' of the semiconductor wafer 24 is on (b/2) as shown in FIG. 15, (r cos θM
-b/2), p-(L/2)-rslnθM-(L/2)-rJ〒Ichonor) 2--<L/2)
-rv'τlr'-b10,000/2r-(L/2)-V'ν1
Sword 12...Formula (21) As shown in FIG. 16, when the wafer 24 moves to the maximum right side without coming off from the other line sensor 26, the angle θ'' becomes the maximum at that time. From this, the formula for finding p is the above (18)
It is determined by the formula and becomes the same as when θ-θ□8.

FIG. 13 is a graph showing the measurable range.

In the figure, curve A shows the measurable range by one line sensor 26 located a distance from the Y-axis, and curve B shows the measurable range by the other line sensor 26 located on the Y-axis. Therefore, the pair of line sensors 26
The measurable range is the shaded area in the figure.

That is, if the center of the semiconductor urchin \24 is within the measurable range shown by the diagonal line, the position and rotational attitude of the center are calculated, and the holding body 23 that holds the semiconductor urchin \24 in a non-contact manner is calculated accordingly. The tilt angle can be controlled. That is, the inclination angle of the holder 23 is controlled so that the center of the semiconductor wafer 24 coincides with the center of the holder 23.

FIGS. 17 and 18 show a second embodiment of the present invention showing a modification of the support mechanism 9a. In this embodiment, the support main body 11a has a disk shape, and a receiving portion 41 made of a concave spherical surface is formed at the center of the lower surface thereof. A spherical part 43 formed at one end of a swing shaft 42 is swingably supported on this receiver part 41. The other end of this swing shaft 42 is connected to the upper surface of the holder 23. The above swing axis 4
2 is formed with a flow path 28a for jetting out compressed air from the jet port 27 of the holder 23.

Further, the holder 23 is made of a magnetic material.

Three electromagnets 44 and three displacement sensors 45 are provided at equal intervals in the circumferential direction on the lower surface of the support body 11a. The currents supplied to the three electromagnets 44 are controlled by the position of the semiconductor wafer 24 held on the holding surface 25 of the holding body 23 in a non-contact manner. This control is performed by the arithmetic unit 32 shown in the first embodiment.

By controlling the current value supplied to each electromagnet 44,
Since the electromagnetic forces generated in these electromagnets 44 are different, the holding body 23 is attracted according to the difference in these electromagnetic forces. Thereby, the holding body 23 is tilted while swinging the swing shaft 42.

When the holder 23 is tilted, the three displacement sensors 45 detect the swing angle and rotational speed of the holder 23, which indicates the inclination state of the holder 23. Detection signals from each displacement sensor 45 are fed back to the arithmetic unit 32.

FIGS. 19 and 20 show a third embodiment of the present invention showing a modification of the support mechanism 9b. In this embodiment, the support main body 11b is formed into a cylindrical shape with an open bottom surface, and a receiving portion 51 made of a concave spherical surface is formed on the bottom surface of the upper wall thereof. A spherical part 53 formed at one end of a swing shaft 52 is swingably supported on this receiver part 51 . This swing shaft 52 is made of a magnetic material, and the other end is connected to the upper surface of the holder 23 .

A flow path 54 for supplying compressed air to the spout 27 of the holder 23 is provided along the entire length of the swing shaft 52 in the axial direction, and one end thereof communicates with the spout 27 . The other end of the flow path 54 communicates with a communication path 55 that is bored in the support body 11b and has a larger diameter than the flow path 54. Compressed air is supplied from this communication path 55 to the flow path 54 and is ejected from the ejection port 27.

Three electromagnets 56 and three displacement sensors 57 are provided at equal intervals in the circumferential direction on the inner peripheral surface of the support body 11b. The current value supplied to each electromagnet 56 is controlled by the arithmetic unit 32 shown in the first embodiment. As a result, the swing shaft 52 swings in a direction corresponding to the magnetic force generated in each electromagnet 56, and tilts the holding body 23, as in the second embodiment. The swing angle and rotational speed at this time are detected by the displacement sensor 57 and fed back to the arithmetic unit 32.

21 and 22 show a fourth embodiment of the present invention showing a modification of the support mechanism 90. FIG. This embodiment has almost the same configuration as the second embodiment, so the same parts are given the same symbols and the explanation will be omitted.

The differences between this fourth embodiment and the second embodiment are as follows. That is, as shown in FIG. 22, a pair of electromagnets 61 are provided on one end side of the lower surface of the support body 11a, spaced apart from each other at a predetermined interval in the circumferential direction. One end of a pair of coil springs 62 spaced apart from each other at a predetermined interval in the circumferential direction is connected to the other end side of the support body 11a. These coil springs 62 have their other ends connected to the holder 2 when tension is applied.
It is connected to the top surface of 3. Therefore, one end side of the holder 2 is biased in the upward direction by the restoring force of the coil spring 62. Displacement sensors 63 are arranged on the lower surface of the holder 23 near the coil springs 62, respectively.

In such a configuration, the holding body 23 is in a horizontal state at a swing angle O ( This state is the initial state). If the current supplied to the pair of electromagnets 61 is increased to strengthen the electromagnetic force compared to this initial state, the holder 23 is attracted to the electromagnets 61 against the restoring force of the coil spring 62 and tilts. If the current supplied to only one of the pair of electromagnets 61 is increased, the direction of the electromagnet 61 of the holder 23 is tilted higher.

Furthermore, when the current value supplied to the pair of electromagnets 61 is decreased compared to the initial state, the end of the holder 23 on the coil spring 62 side is tilted higher due to the restoring force of the coil spring 62.

Furthermore, if only the current value supplied to one of the pair of electromagnets 61 is decreased, the holder 23 is tilted in such a direction that the end corresponding to the electromagnet 61 becomes lower. That is, the holder 23 can be tilted in a predetermined direction by changing the current value supplied to the pair of electromagnets 61.

FIG. 23 shows a fifth embodiment of the present invention showing a modification of the support mechanism 9d. In this embodiment, the support body 11c is formed into a disk shape. One ends of three or more linear actuators 71 are attached to the lower surface of the support body 11c at equal intervals in the circumferential direction. This linear actuator 71 is formed into a columnar shape using a piezoelectric element or the like.

On the other hand, the support body 11 is located at the center of the upper surface of the holder 23.
A cylindrical portion 72 having approximately the same diameter as C is provided. The support main body 11c has an end surface of a columnar portion 72 joined to a lower end surface of the linear actuator 71. The above cylindrical part 7
A coil spring 73 is stretched between the support body 2 and the support body 11C, and the holder 23 is elastically held by the biasing force of the coil spring 73.

A flow path 74 communicating with the jet nozzle 27 is formed in the cylindrical portion 72 of the holder 23, and compressed air is supplied from this flow path 74.

According to such a configuration, each linear actuator 71
Since the length changes depending on the supplied voltage, the holding body 23 can be tilted in a predetermined direction. The swing angle of the holding body 23 may be detected by a displacement sensor as in the second to fourth embodiments, or may be calculated from the voltage values supplied to each linear actuator 71.

FIGS. 24 and 25 show a sixth embodiment showing a modification of the detection means of the present invention. In this embodiment, a large number of small chip-type pressure sensors 81 are arranged in a matrix on almost the entire holding surface 25 of the holding body 23 except for the central portion corresponding to the ejection port 27 .

When compressed air is ejected from the ejection port 27 and the semiconductor wafer 24 is held in a non-contact state on the holding surface 25, the pressure sensor 81 has a negative pressure in the part facing the semiconductor wafer 24, and in the part not facing the semiconductor wafer 24. Atmospheric pressure. Therefore, the pressure detected by the pressure sensor 81 causes the holding surface 25 to
It is possible to detect the position of the semiconductor wafer 24 relative to the position of the semiconductor wafer 24 .

[Effects of the Invention] As described above, the present invention detects the position of the workpiece held in a non-contact state on the holding surface of the holder, and controls the inclination angle of the holder using the detected signal. . Therefore, when a workpiece is to be transported by the holder, the workpiece can be transported without being significantly displaced from a predetermined position on the holding surface of the holder or falling.

[Brief explanation of the drawing]

1 to 16 show a first embodiment of this invention,
Fig. 1 is a circuit diagram for controlling the posture of the holding body, Fig. 2 is a schematic diagram of the robot device, Fig. 3 is a vertical cross-sectional view of the support mechanism, Fig. 4 is a cross-sectional view, and Fig. 5 is a schematic diagram of the robot device. An enlarged cross-sectional view of the line sensor, FIG. 6 is a diagram for explaining the state in which the semiconductor wafer is shifted when the holder is tilted, and FIGS.
The figure is a diagram to explain the relationship between the line sensor and the semiconductor wafer, Figure 9 is a diagram to explain the orientation flat formed on the semiconductor wafer, and Figure 10 is a diagram to explain the center position of the semiconductor wafer and the rotation angle of the orientation flat. Flowchart for finding the center of the semiconductor wafer, FIG. 12 is a diagram for explaining the measurable range by a pair of line sensors, and FIG. 13 is a diagram showing the measurable range as well. , FIGS. 14 to 16 are explanatory diagrams of the positional relationship between a pair of line sensors and an orientation flat of a semiconductor wafer, FIG. 17 is a side view of a support mechanism according to a second embodiment of the present invention, and FIG.
The figure is also a cross-sectional view taken along the line X■-X■ in Figure 18.
FIG. 9 is a side view of a support mechanism showing a third embodiment of the invention, FIG. 20 is a sectional view taken along line xx-x in FIG. 19, and FIG. The side view of the support mechanism shown in FIG. 22 is also xxn-xxn in FIG. 21.
23 is a side view of a support mechanism showing a fifth embodiment of the invention, FIG. 24 is a sectional view of a holder showing a sixth embodiment of the invention, and FIG. 25 is a sectional view taken along the line. It is a top view of the holding surface of a holding body similarly. 9.9a to 9d... Support mechanism, 14... First motor (driving means), 19... Second motor (driving means)
, 33... Drive unit (drive means), 23... Holder,
24...Semiconductor wafer (work), 25...Holding surface, 26...Line sensor (detection means), 27...Ejection port (ejection part), 32...Arithmetic device (control means). Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 17 @ 2's old meeting sleeve Figure 3 Figure 4 Figure 5 e Figure 6 Figure 10

Claims (9)

[Claims] (1) A holder having a holding surface, a spout section provided on the holder that spouts fluid for holding a plate-shaped workpiece without contacting the holding surface, and supporting the holder in a swingable manner. a support mechanism that drives the support mechanism to swing the holding body; and a detection device that is provided on a holding surface of the holding body and detects the position of the workpiece that is held in a non-contact manner on the holding surface. A non-contact handling device characterized by comprising: a control means for controlling the inclination angle of the holding body by driving the drive means in response to a detection signal from the detection means. (2) The support mechanism includes a support main body, a first swing shaft rotatably supported by the support main body, and a first swing shaft that is integral with the first swing shaft and whose axis is connected to the first swing shaft. According to claim (1), the second swing shaft is rotatably provided perpendicular to the axis of the swing shaft and has the holding body attached thereto. non-contact handling equipment. (3) The driving means for driving the support mechanism includes a first motor that drives the first swing shaft and a second motor that drives the second swing shaft. The non-contact handling device according to claim (2). (4) The support mechanism is composed of a support body and a swing shaft, one end of which is swingably supported by a spherical bearing and the other end of which is provided with the holder. The non-contact handling device according to claim 1, characterized in that: (5) The driving means for driving the support mechanism includes an electromagnet that is provided at a portion of the support main body facing the holding body and attracts the holding body by electromagnetic force to swing the swing shaft. The non-contact handling device according to claim 4, characterized in that: (6) The drive means for driving the support mechanism comprises an electromagnet that is provided at a portion of the support main body facing the swing shaft and attracts the swing shaft using electromagnetic force to swing the swing shaft. The non-contact handling device according to claim (4). (7) The non-contact handling device according to claim (1), wherein the detection means comprises a pair of line sensors provided parallel to each other at a predetermined interval on the holding surface of the holding body. . (8) The detection means comprises a pressure sensor that detects negative pressure generated between the holding surface of the holding body and the workpiece held on this holding surface. Non-contact handling equipment. (9) In a non-contact handling method in which a workpiece is held in a non-contact manner by negative pressure generated by ejecting fluid from the ejection part on a holding surface of the holder having an ejection part that ejects fluid, the holding body is A first step of bringing the surface close to the workpiece and ejecting fluid from the jetting part to hold the workpiece on the holding surface of the holding body without contact; and a first step of holding the workpiece in a non-contact manner on the holding surface of the holding body. The present invention is characterized by comprising a second step of detecting a positional deviation of the workpiece with respect to the holding surface, and a third step of controlling the inclination angle of the holding body according to the positional deviation of the workpiece with respect to the holding surface. Non-contact handling method.