JPH04143274A - Thin film forming device - Google Patents

Abstract

PURPOSE:To form a thin film on a substrate in uniform thickness by oscillating a substrate holder supporting a substrate directed toward the flying source of a film forming material and rotating the holder in the facial direction orthogonal to the material flying direction. CONSTITUTION:Plural substrates 73 are supported by a substrate holder 51 and directed toward a vaporization source 13 in a vacuum vessel 11, and the flying vapor-deposition material 15 is deposited on the substrate 73 to form a thin film on the substrate 73. In this film forming device, the holder 51 is oscillated with respect to the flying direction A of the material 15 and rotated in the facial direction orthogonal to the flying direction A by an oscillating and rotating mechanism 21. In this case, plural holders 51 are arranged on the circumference through a supporting arm 25 and a supporting lever 39 with a main rotating shaft 23 as the center and revolved along the circumference, the teeth 53 on the periphery of the holder 51 are meshed with the teeth 65 of a guide ring 61 to rotate the holder 51 with a virtual axis 55 as the center, and a guide roller 35 is engaged with a guide groove 63 to oscillate the holder.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin film forming apparatus, and more specifically, it forms a thin film with a uniform thickness on a substrate by forming a thin film while shaking and rotating the substrate. The present invention relates to a thin film forming apparatus that makes it possible to

[40] In a thin film forming apparatus such as a vacuum evaporation apparatus, it is required to form a uniform thin film on a substrate. However, it is often difficult to form a uniform thin film on a large substrate surface or a substrate surface with curvature such as a lens shape.

In a vacuum evaporation system, the evaporation source is ideally considered a point source, and the film thickness distribution can be calculated in exactly the same way as the intensity of the illumination system.

The amount of adhesion from the boiling evaporation source to the microplane is expressed by the following formula (
(See Figure 6).

dM=1・□・d8 4π γ2 ds: Microplane d, 4: Amount of deposition passing through the solid angle m: Amount deposited per unit time θ: Angle between the evaporation source and the perpendicular to the microplane (incident angle) γ:
Distance between evaporation source and microplane Therefore, if the substrates are simply arranged horizontally, the distance from the evaporation source and the angle of incidence will differ for each substrate, making it impossible to form a uniform film thickness.

Therefore, the substrate is supported in a dome shape so that the distance from the evaporation source and the angle of incidence are equal, and the substrate is rotated to achieve uniformity, or the evaporation source is placed between the evaporation source and the substrate. In order to make the film thickness distribution uniform, a correction plate is provided to partially block the vapor deposition material flying from the film.

Furthermore, the substrate holder is divided into multiple areas containing several substrates, and the divided units are rotated (rotated), and the entire substrate holder is rotated (revolutionized) using planetary rotation to ensure uniform film thickness. The mechanism is also known.

However, none of the above methods is necessarily sufficient in terms of making the film thickness uniform, and further improvements are needed. If uniform film thickness is achieved, it will be possible to process many substrates at once and to form uniform thin films on large flat substrates and large curved substrates.

SUMMARY OF THE INVENTION The present invention provides a thin film forming apparatus that is capable of forming a thin film of uniform thickness on a substrate.

A1111 The thin film forming apparatus of the present invention includes: a substrate holder that supports a substrate toward a flying source of thin film forming material; and a substrate holder that supports a substrate in a direction in which the thin film forming material flies, while swinging the substrate holder in a direction that intersects with the flying direction. The substrate holder is characterized in that it includes a swinging rotation mechanism that rotates the substrate holder in the plane direction.

According to the above configuration, the thin film forming material is deposited on the substrate and a thin film is formed while the substrate is oscillated and rotated in the flying direction of the thin film forming material, and the thin film forming material is deposited on the substrate. The distance from the flying source of the forming material changes moment by moment, and the amount of thin film deposited on the substrate can be made uniform.

FIG. 1 is a conceptual diagram showing an embodiment in which the present invention is applied to a vacuum evaporation apparatus, and FIG. 2 is a perspective view showing a swinging and rotating mechanism for a substrate.

An evaporation source 13 (a flying source for the thin film forming material) is provided at the bottom of the vacuum chamber 11, and a substrate swinging and rotating mechanism 2 is provided at the upper right.
1 is provided.

The swinging rotation mechanism 21 includes a substrate holder 51 that supports a mask 71 carrying eleven substrates 73, a swinging member 31 that rotatably supports the substrate holder 51, and a swinging member 31 that swingably supports the swinging member 31. It mainly consists of the main rotating shaft 23 and a guide ring 61 that guides the swinging of the swinging member 31.

The main rotating shaft 23 is provided with four support arms 25, and a swinging member 31 is hung from a support block 27 at the tip of the support arm 25. FIG. 3 is a plan view showing this state, with the substrate holder 51 on the swinging member 31 removed. Two swing shafts 33 are fixed to the ring-shaped swing member 31, and the swing shafts 33 are rotatably fitted to the support block 27. A guide roller 35 is attached to the swinging member 31, and the guide roller 35 is fitted into a guide 63 groove carved on the lower side of the guide ring 61. The guide groove 63 is carved along the entire circumference of the guide ring 61 so as to meander in the flight direction A (see FIG. 1) of the vapor deposition material 15 (thin film forming material).

A ring-shaped substrate holder 51 is placed on the swinging member 31 via a ball bearing 43, as shown in FIG. Four support rods 39 fixed to the swinging member 31
A support roller 41 is rotatably attached to the support roller 41 (see FIG. 5). This support roller 41 allows the substrate holder 5 to
1 is pressed against the swinging member 31, and the substrate holder 5
1 on the ball bearing 43 of the swinging member 31 without sliding down.

It can rotate (rotate) around its virtual axis 55 (see FIG. 1). Teeth 5 are provided on the outer peripheral surface of the substrate holder 51.
3 is carved in the guide groove 63 of the guide ring 61.
The teeth 65 carved on the inner peripheral surface of the upper side constitute a rack and pinion. A mask 71 with a plurality of substrates 73 mounted on the substrate holder 51 has its central part connected to the evaporation source 13.
It is placed so that it protrudes toward.

During vacuum evaporation, by rotating the main rotation shaft 23, the evaporation source 1 is
By evaporating the deposition material 15 from 3, it is possible to form a thin film with a uniform thickness on many substrates.

When the main rotation shaft 23 is rotated, the support arm 25 and the support block 27 are connected to the four
The two swinging members 31 rotate around the main rotating shaft 23,
A substrate holder 51 placed on this rotates (revolutions). Further, due to the rack and pinion mechanism with the guide ring 61, the substrate holder 51 itself also rotates (rotates) around its virtual axis 55 (see FIG. 1). That is, as shown in FIG. 1, the substrate holder 51 rotates (arrow r) and revolves (arrow R) in a plane that intersects the flight direction (arrow A) of the evaporation material 15, with the substrate surface facing the evaporation source 13. )do. Further, a guide member 6 meandering in the flight direction A of the vapor deposition material 15
The guide roller 35 rotates within the guide groove 63 of No. 1.

By slidingly moving, the swinging member 31 fixed to the guide roller 35 repeats swinging in the direction of the arrow B as it revolves. In FIG. 4, the states before and after the rocking are shown by straight lines and dashed lines.

In this way, by rotating and rocking the substrate 53, the distance between the substrate 53 and the evaporation source 13 changes moment by moment, making it possible to equalize the evaporation conditions, which can be applied uniformly to many substrate surfaces within the same vacuum chamber. It is possible to form a thin film with a thickness of

Note that the present invention is not limited to the above embodiments, and various modifications are possible.

For example, in the above embodiment, the mask 71 with a large number of substrates set thereon is mounted on the substrate holder 31, but one large substrate may be mounted on the substrate holder 31.

Further, the swinging rotation mechanism is not limited to the one shown in FIG. 2. For example, a plurality of swinging arms that repeatedly swing as the main rotating wheel 23 protrudes as the main rotating wheel rotates, and a substrate holder is attached to these swinging arms. It may be attached rotatably.

According to the present invention, the thin film forming apparatus is provided with a swinging rotation mechanism that swings the substrate holder relative to the flying direction of the thin film forming material and rotates the substrate holder in a plane direction intersecting the flying direction. As a result, thin films with uniform thickness can be formed on a large number of substrates or large area substrates that are processed in the same vacuum chamber.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an embodiment of the thin film forming apparatus of the present invention, and FIG. 2 is a perspective view showing its swinging and rotating mechanism. FIG. 3 is a plan view showing how the swinging member 31 is attached to the support arm 25, with the ball bearing 43 mounted on the swinging member 31 and the substrate holder 51 removed. FIG. 4 is a cross-sectional view showing the supported state of the substrate holder 51 on the swinging member 31 and before and after swinging. However, hatching is not added. FIG. 5 is a sectional view showing the vicinity of the support roller 41. However, hatching is not added. FIG. 6 is an explanatory diagram showing the amount of water applied on a microscopic plane from the boiling evaporation source. 11... Vacuum tank 15... Vapor deposition material 23... Main rotating shaft 27... Support block 33... Swing shaft 39... Support rod 43... Ball bearing 51... Substrate holder 61... Guide ring 65... Teeth 73... Substrate 13... Evaporation source 21... Swinging rotation mechanism 25... Support arm 31... Swinging member 35...・Guide roller 41...Support roller 53...Teeth 63...Guide groove 71...Mask patent applicant Shinku Kikai Kogyo Co., Ltd. Patent attorney Representative Usumura Fumi Mi-Te Figure 2 Evaporation source

Claims (1)

[Claims] 1. A substrate holder that supports the substrate toward a flying source of the thin film forming material, and a rocking motion that rotates the substrate holder in a plane direction that intersects with the flying direction while swinging the substrate holder in the flying direction of the thin film forming material. A thin film forming device characterized by being equipped with a rotation mechanism. 2. A plurality of substrate holders are supported so as to be arranged on a circumference in a plane direction intersecting the flight direction, and the substrate holders are rotated along the circumference, and each substrate holder itself is rotated along its virtual axis. 2. The thin film forming apparatus according to claim 1, further comprising a planetary rotation mechanism that rotates about its axis. 3. A plurality of substrate holders that support the substrate toward a flying source of the thin film forming material, and a plurality of swinging members that support the substrate holder so as to be able to rotate about its virtual axis in a plane direction intersecting the flying direction of the thin film forming material. and supporting a plurality of swinging members so as to be swingable in the flight direction so that the swinging members are arranged on a circumference in a plane direction intersecting the flight direction, and supporting these swinging members so as to be swingable in the flight direction. 1. A thin film forming apparatus comprising: a revolving member that rotates along a circumference. 4. The swinging member includes an engagement terminal that engages with the guide member meandering in the flight direction, and swings while being restricted by engagement with the guide member as it rotates along the circumference. Item 3. The thin film forming apparatus according to item 3.