JPH04142050A - Thermocompression bonding tool - Google Patents

Abstract

PURPOSE:To prevent a conductive adhesive from adhering to a thermocompression bonding tool and to prevent an electronic component and a board from being pasted on the thermocompression bonding tool by forming a recessed part which lets a compressed and spread conductive adhesive escape and which is used to prevent the conductive adhesive from adhering. CONSTITUTION:An anisotropic conductive film 7 as a conductive adhesive is sandwiched between connecting terminals 2, 2 and lands 4, 4; the anisotropic conductive film 7 is composed of a thermoset resin adhesive 5 and of conductive particles 6,... which have been dispersed in the resin adhesive 5. A thermo- compression bonding toll 11 is installed so as to be ascended and descended freely; a tool head 12 is heated by using a heater, and its temperature is raised approximately to a value which is required to connect the connecting terminals 2, 2 to the lands 4, 4. At the thermocompression bonding tool 11, a recessed part 14 which is used to prevent the conductive adhesive from adhering is formed, e.g. in the central part of a working face 13. The size of the recessed part 14 is set so as to correspond to the size of a gap 9 between the connecting terminals 2, 2. Thereby, it is possible to prevent the conductive adhesive from adhering and to prevent an electronic component from being pasted on a board.

Description

DETAILED DESCRIPTION OF THE INVENTION [Purpose of the Invention (Industrial Field of Application) The present invention relates to a thermal technology for attaching electronic components such as batteries to a substrate via a conductive adhesive such as an anisotropic conductive film. Regarding crimping tools.

(Prior Art) For example, some electronic devices such as IC cards employ anisotropic conductive film connection as a component mounting method. and,
This anisotropic conductive film connection is also used when connecting the connection terminal 2.2 of the battery 1, which is a thin electronic component, to the land 4.4 of the substrate 3, as shown in FIG.

In other words, as shown in FIG. 3, the anisotropic conductive film connection is performed by using a thermosetting resin adhesive 5 between the connection terminal 2.2 of the battery 1 and the land 4.4 of the substrate 3. This is carried out by sandwiching an anisotropic conductive film 7 made of conductive particles 6 dispersed in a resin adhesive 5. Furthermore, a thermocompression bonding tool 8 is used for connecting the anisotropic conductive film, which is provided so as to be movable up and down and which raises the temperature to the extent necessary to connect the connection terminal 2.2 to the land 4.4, for example.

The thermocompression bonding tool 8 descends and presses the connection terminal 2.2, compressing the anisotropic conductive film 7 by sandwiching it between the connection terminal 2.2 and the land 4.4, as shown in FIG. . Furthermore, the thermocompression bonding tool 8 heats and hardens the anisotropic conductive film 7, thereby mechanically and electrically connecting the connecting terminal 2.2 and the land 4.4.

(Problem to be solved by the invention) By the way, in the anisotropic conductive film connection as described above,
When the anisotropic conductive film 7 was compressed, the resin adhesive 5 sometimes overflowed from the gap 9 formed between the connecting terminals 2.2 and adhered to the work surface 10 of the thermocompression bonding tool 8. In such a case, the work surface 10 of the thermocompression bonding tool 8
becomes dirty, and furthermore, the battery 1 and the substrate 3 stick to the thermocompression bonding tool 8.

Then, when the battery 1 and the substrate 3 are peeled off from the thermocompression bonding tool 8, the connecting portion consisting of the connecting terminal 2.2 and the land 4.4 may be damaged. Moreover, after the battery 1 and the substrate 3 were peeled off from the thermocompression bonding tool 8, it was necessary to clean the thermocompression bonding tool 8 and remove the resin adhesive 5 adhering to the work surface 10.

Further, it was difficult to automate the connection of the anisotropic conductive film because it required peeling off the battery 1 and the substrate 3 from the thermocompression bonding sole 8 and cleaning the thermocompression bonding tool 8.

An object of the present invention is to provide a thermocompression bonding tool that can prevent the adhesion of conductive adhesive and the sticking of electronic components and substrates.

[Structure of the Invention] (Means and Effects for Solving the Problems) In order to achieve the above object, the present invention provides a plurality of connection terminals formed on an electronic component and spaced apart from each other with a gap between the connection terminals. The land is placed on the board and has a conductive adhesive between it and the connection terminal, and is heated and pressed, and the connection terminal is thermocompressed onto the land while compressing the conductive adhesive. In a thermocompression bonding tool that attaches electronic components to a board, the size of the tool is set to correspond to the gap between the connection terminals on the work surface that presses against the connection terminals, and the compressed and spread conductive adhesive is released. The reason is that a recessed portion is provided to prevent conductive adhesive from adhering.

By doing so, the present invention makes it possible to prevent the conductive adhesive from adhering to the thermocompression bonding tool and from sticking the electronic component and the board to the thermocompression bonding tool.

(Example) An embodiment of the present invention will be described below with reference to FIG.

Components that are the same as those described in the prior art section are given the same numerals and their explanations will be omitted.

FIG. 1 shows an embodiment of the present invention, and 2.2 in the figure shows an embodiment of the present invention.
1 shows a connection terminal protruding from a battery as an electronic component built into a thin electronic device such as an IC card. The connection terminals 2.2 are each formed into a flat plate shape, and are arranged on a straight line. The connection terminals 2.2 are spaced apart from each other, with a gap 9 interposed between them.

Further, numeral 3 in the figure indicates a substrate, and this substrate 3 has a land 4.4 projecting from one plate surface. The land 4.4 of the substrate 3 is positioned to correspond to the arrangement of the connection terminals 2.2.

Then, the connecting terminal 4.4 of the substrate 3 is aligned with the runt 4.4, so that the land 4.4 faces the connecting terminal 2.2.

Further, an anisotropic conductive film 7 as a conductive adhesive is sandwiched between the connection terminal 2.2 and the land 4.4.

The anisotropic conductive film 7 is composed of a thermosetting resin adhesive 5 and conductive particles 6 dispersed in the resin adhesive 5.

Further, numeral 11 in the figure indicates a thermocompression bonding tool. This thermocompression bonding tool 11 is provided, for example, in a bonding apparatus so as to be able to be raised and lowered freely, and the tool head 12 is heated by a heater (not shown), and the jaw head 12 is connected to the connecting terminal 2.
2 and land 4.4 to an extent necessary for connection.

Further, the thermocompression bonding tool 11 has a substantially flat working surface 13 at the tip of the tool head 12. Additionally, the thermocompression bonding tool 11 has a recess 14 for preventing adhesion of the conductive adhesive, for example, in the center of the work surface 13. The thermocompression bonding tool 11 is set so that the size of the recess 14 corresponds to the size of the gap 9 between the connecting terminals 2.2.

Further, in the thermocompression bonding tool 11, the dimensions of the opening of the recess 14 are set to be approximately equal to the interval of the gap 9.

This thermocompression tool 11 descends towards the connection terminal 2.2 and brings the working surface 13 into contact with the connection terminal 2.2. Also,
The thermocompression bonding tool 11 communicates the recess 14 with the gap 9, presses the connection terminal 2.2, and compresses and crushes the anisotropic conductive film 7. Then, the thermocompression bonding tool 11 is crushed and expanded, allowing the resin adhesive 5 that has protruded from the gap 9 between the connecting terminals 2.2 to escape through the recess 14, thereby increasing the distance between the inner wall surface of the recess 14 and the resin adhesive 5. The resin adhesive 5 is introduced into the recess 14 while maintaining the same state.

Then, the thermocompression bonding tool 11 heats and hardens the anisotropic conductive film 7 via the connection terminal 2.2. Then, the thermocompression bonding tool 11 mechanically and electrically connects the connection terminal 2.2 and the land 4.4, and attaches the battery to the substrate 2.

Here, the volume of the recess 14 of the thermocompression bonding tool 11 is set larger than the volume of the portion of the resin adhesive 5 protruding from the gap 9. In other words, the recess 14 of the thermocompression bonding tool 11
The volume is set to such a value that the resin adhesive 5 does not adhere to the inner wall surface of the recess 14 when the anisotropic conductive film 7 is compressed.

In the thermocompression bonding tool 11 as described above, the resin adhesive 5 protruding from the gap 9 between the connecting terminals 2.2 escapes into the recess 14, so that when the anisotropic conductive film 7 is compressed, the resin adhesive 5 can be prevented from adhering to the work surface 13 of the thermocompression bonding tool 11.

Further, it is possible to prevent the resin adhesive 5 from adhering to the working surface 13 of the thermocompression bonding tool 11 and staining the working surface 13, and further,
It is possible to prevent the battery and the substrate 3 from sticking to the thermocompression bonding tool 8 due to the resin adhesive protruding from the gap 9.

Further, the battery 1 and the substrate 3 are peeled off from the thermocompression bonding tool 11, and after the battery 1 and the substrate 3 are peeled off from the thermocompression bonding tool 8, the thermocompression bonding tool 8 is cleaned to remove any particles that adhere to the work surface 10. It becomes unnecessary to remove the resin adhesive 5, etc.

Then, it becomes possible to easily automate the connection of the anisotropic conductive film.

Note that the present invention is not limited to those used for mounting batteries, but is applicable to various types of thermocompression bonding used for mounting electronic components having connection terminals arranged similarly to the connection terminals 2.2 shown in FIG. Applicable to tools.

Furthermore, the present invention is also applicable to the case where electronic components are mounted using a conductive adhesive having a structure different from that of the anisotropic conductive film 7 in this embodiment.

Further, the shape of the recess 14 of the thermocompression bonding tool 11 may be any shape as long as it can prevent the resin adhesive 5 from adhering to the thermocompression bonding tool 11.

[Effects of the Invention] As explained above, the present invention has a plurality of connection terminals formed on an electronic component and spaced apart from each other with gaps between them, and a plurality of connection terminals arranged on a substrate to correspond to the arrangement of the connection terminals. In a thermocompression bonding tool that attaches an electronic component to a board by heating and pressing it onto a land with a conductive adhesive interposed between the conductive adhesive and thermocompression bonding the connecting terminal to the land without compressing the conductive adhesive. A recess is provided on the work surface that presses against the connection terminal, the size of which corresponds to the gap between the connection terminals, to prevent conductive adhesive from adhering to the conductive adhesive that has been compressed and spread out. It is something.

Therefore, the present invention has the effect of preventing the conductive adhesive from adhering to the thermocompression bonding tool and preventing the electronic component and the board from sticking to the thermocompression bonding tool.

[Brief explanation of the drawing]

Fig. 1 shows an embodiment of the present invention, and is an explanatory diagram of a state in which an anisotropic conductive film is connected, Figs. 2 to 4 show conventional examples, and Fig. 2 shows a state in which a battery and a substrate are connected. The perspective view shown, FIG. 3, and FIG. 4 are explanatory views showing anisotropic conductive film connections, respectively. 1...Battery (electronic component), 2.2...Connection terminal, 3
... Substrate, 4.4... Land, 7... Anisotropic conductive film (conductive adhesive), 9... Gap, 11... Thermocompression bonding tool, 13... Work surface, 14... Concavity for preventing adhesion of conductive adhesive.

Claims (1)

[Claims] A land having a plurality of connection terminals formed on an electronic component and spaced apart from each other with gaps interposed therebetween, and arranged on a substrate to correspond to the arrangement of the connection terminals and having a conductive adhesive interposed between the connection terminals and the connection terminals. In a thermocompression bonding tool for attaching the electronic component to the board by thermocompression bonding the connection terminal to the land while compressing the conductive adhesive, the work surface to be press-contacted to the connection terminal is used. . A thermocompression bonding tool, characterized in that a recess for preventing adhesion of the conductive adhesive is provided, the size of which is set to correspond to the gap, and the conductive adhesive that has been compressed and expanded is released.