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JPH0414189B2 - - Google Patents

Info

Publication number
JPH0414189B2
JPH0414189B2 JP58229206A JP22920683A JPH0414189B2 JP H0414189 B2 JPH0414189 B2 JP H0414189B2 JP 58229206 A JP58229206 A JP 58229206A JP 22920683 A JP22920683 A JP 22920683A JP H0414189 B2 JPH0414189 B2 JP H0414189B2
Authority
JP
Japan
Prior art keywords
lead
plating solution
alkali metal
gold plating
electroless gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58229206A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60121274A (ja
Inventor
Yoshasu Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Original Assignee
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK filed Critical NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority to JP22920683A priority Critical patent/JPS60121274A/ja
Publication of JPS60121274A publication Critical patent/JPS60121274A/ja
Publication of JPH0414189B2 publication Critical patent/JPH0414189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP22920683A 1983-12-06 1983-12-06 自己触媒型無電解金めっき液 Granted JPS60121274A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22920683A JPS60121274A (ja) 1983-12-06 1983-12-06 自己触媒型無電解金めっき液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22920683A JPS60121274A (ja) 1983-12-06 1983-12-06 自己触媒型無電解金めっき液

Publications (2)

Publication Number Publication Date
JPS60121274A JPS60121274A (ja) 1985-06-28
JPH0414189B2 true JPH0414189B2 (xx) 1992-03-12

Family

ID=16888477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22920683A Granted JPS60121274A (ja) 1983-12-06 1983-12-06 自己触媒型無電解金めっき液

Country Status (1)

Country Link
JP (1) JPS60121274A (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3331261B2 (ja) * 1994-08-19 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP3302512B2 (ja) * 1994-08-19 2002-07-15 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP3331260B2 (ja) * 1994-08-19 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948951B2 (ja) * 1978-08-05 1984-11-29 日本特殊陶業株式会社 無電解金メッキ液
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
JPS60121274A (ja) 1985-06-28

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